CN105282982A - Photosensitive preparation method of holes - Google Patents
Photosensitive preparation method of holes Download PDFInfo
- Publication number
- CN105282982A CN105282982A CN201510823252.9A CN201510823252A CN105282982A CN 105282982 A CN105282982 A CN 105282982A CN 201510823252 A CN201510823252 A CN 201510823252A CN 105282982 A CN105282982 A CN 105282982A
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- China
- Prior art keywords
- photosensitive
- substrate
- drying
- processing
- drilling
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention provides a photosensitive preparation method of holes, comprising following steps: S1. achieving synthesis of photosensitive resin; S2. pretreating substrates; S3. uniformly coating copper foil surfaces of the pretreated substrates with the photosensitive resin in the S1; S4. performing a first-time drying treatment for the substrates coated with the photosensitive resin; S5. performing exposure for the substrates after the first-time drying treatment; S6. performing developing treatment for the substrates after exposure; and S7. performing washing and second time drying treatment for the substrates after developing treatment, and then achieving hole preparation. By use of the photosensitive preparation method of holes, micro holes are obtained; continuous production is achieved; technological process is simplified; cost is saved; process capability of production lines is greatly increased; good economic benefit is achieved.
Description
Technical field
The present invention relates to circuit board hole creating technology field, particularly relate to a kind of photosensitive method for drilling.
Background technology
Flourish along with electron trade, PCB industry have also been obtained swift and violent development, especially high-density interconnect technology (HighDensityInterconnectTechnology, be called for short HDI) appearance, facilitate electronic product to gentlier, the future development that less, thinner, reliability is higher.HDI plate and high density, hachure, small-bore, ultrathin printed board, one of key problem of this technology how to realize micro hole.For this problem, adopt CO at present more
2laser drilling method, but the method cost is higher, and efficiency is not high enough.
Particularly, the HDI micropore of current more than 90% is all adopt CO
2the mode of laser drill realizes, and namely uses the method windowing of chemical etching.It has the advantage of accurate height, process stabilizing, technology maturation, but in above-mentioned lithographic method, equipment investment is large, and efficiency is not high enough.Therefore, considering the factors such as cost, needing at present to seek new method in the hope of replacing CO
2laser drill, but effect is unsatisfactory.
Therefore, for the problems referred to above, be necessary to propose further solution.
Summary of the invention
The object of the present invention is to provide a kind of photosensitive method for drilling, to overcome the deficiencies in the prior art.
For achieving the above object, of the present inventionly provide a kind of photosensitive method for drilling, it comprises the steps:
S1. photosensitive resin is synthesized;
S2. preliminary treatment is carried out to substrate;
S3. at the copper foil surface through pretreated substrate, the photosensitive resin in even coating step S1;
S4. first time drying and processing is carried out to the substrate of coating photosensitive resin;
S5. to the base board to explosure after first time drying and processing;
S6. development treatment is carried out to the substrate after overexposure;
S7. the substrate after development after washing, second time drying and processing, completes micropore and makes successively.
As the improvement of photosensitive method for drilling of the present invention, described step S1 specifically comprises:
There is provided epoxy resin as matrix resin, in epoxy resin, add emulsion, curing agent, solvent and additive according to proportioning, fully after reaction, after filtration, wash and remove impurity, synthesize described photosensitive resin.
As the improvement of photosensitive method for drilling of the present invention, described step S2 specifically comprises: adopt cleaning agents to carry out preliminary treatment to described substrate.
As the improvement of photosensitive method for drilling of the present invention, described cleaning agents is sulfuric acid.
As the improvement of photosensitive method for drilling of the present invention, in described step S3, the thickness of the photosensitive resin of coating is 11 ~ 13 μm.
As the improvement of photosensitive method for drilling of the present invention, in described step S4, described first time drying and processing be segmented drying and processing, described segmented drying and processing, each section of bake out temperature is followed successively by: 80 DEG C, 90 DEG C, 100 DEG C, 90 DEG C, 80 DEG C, and each section of drying time is at least 5min.
As the improvement of photosensitive method for drilling of the present invention, in described step S5, adopt the mode of contact exposure, wherein, light source is ultraviolet light, and exposure energy is 100-300Mj/cm
2.
As the improvement of photosensitive method for drilling of the present invention, described step S6 specifically comprises: by the mode of spray, and be that the developer solution of 4% is sprayed on the substrate after overexposure and carries out development treatment by mass fraction, the time of described development treatment is 5min.
Compared with prior art, the invention has the beneficial effects as follows: photosensitive method for drilling of the present invention can realize micro hole, can consecutive production, in turn simplify technological process, save cost, thus, significantly improve the process capability producing line, achieve good economic benefit.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, the accompanying drawing that the following describes is only some embodiments recorded in the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the method flow schematic diagram of an embodiment of photosensitive method for drilling of the present invention.
Embodiment
Below in conjunction with each execution mode shown in the drawings, the present invention is described in detail; but should be noted that; these execution modes are not limitation of the present invention; those of ordinary skill in the art are according to these execution mode institute work energy, method or structural equivalent transformations or substitute, and all belong within protection scope of the present invention.
As shown in Figure 1, photosensitive method for drilling of the present invention comprises the steps:
S1. photosensitive resin is synthesized.
Particularly, described photosensitive resin synthesizes in the following way: provide epoxy resin as matrix resin, adds emulsion, curing agent, solvent and additive according to proportioning in epoxy resin, fully after reaction, after filtration, wash and remove impurity, synthesize described photosensitive resin.
S2. preliminary treatment is carried out to substrate.
Particularly, carry out pretreated object and be, increase the adhesion between photosensitive material and substrate.In step S2, cleaning agents is adopted to carry out preliminary treatment to described substrate.Preferably, described cleaning agents is sulfuric acid.
S3. at the copper foil surface through pretreated substrate, the photosensitive resin in even coating step S1.
Particularly, in described step S3, the THICKNESS CONTROL of the photosensitive resin of coating is at 11 ~ 13 μm.
S4. first time drying and processing is carried out to the substrate of coating photosensitive resin.
Particularly, the object of carrying out first time drying and processing is, eliminates the solvent in photosensitive material, thus, increase the adhesiveness between resin and substrate copper face, good with imaging during development to ensure the reappearance exposed.Wherein, the mode of described first time drying and processing employing segmented drying and processing, described segmented drying and processing, each section of bake out temperature is followed successively by: 80 DEG C, 90 DEG C, 100 DEG C, 90 DEG C, 80 DEG C, and each section of drying time is at least 5min.
S5. to the base board to explosure after first time drying and processing.
During exposure, photoresist under light illumination, decomposes obtained micropore by photocuring or light.Particularly, in described step S5, adopt the mode of contact exposure, namely under the condition of photomask and substrates into intimate contact, select directional light to expose.It is high which has resolution, advantage easy and simple to handle.In addition, in contact exposure mode, light source is ultraviolet light, and exposure energy is 100-300Mj/cm
2.
S6. development treatment is carried out to the substrate after overexposure.
Particularly, described step S6 specifically comprises: by the mode of spray, and be that the developer solution of 4% is sprayed on the substrate after overexposure and carries out development treatment by mass fraction, the time of described development treatment is 5min.
S7. the substrate after development after washing, second time drying and processing, completes micropore and makes successively.
In sum, photosensitive method for drilling of the present invention can realize micro hole, can consecutive production, in turn simplify technological process, has saved cost, thus, significantly improve the process capability producing line, achieve good economic benefit.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present invention or essential characteristic, the present invention can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present invention is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the present invention.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, and the technical scheme in each embodiment also through appropriately combined, can form other execution modes that it will be appreciated by those skilled in the art that.
Claims (8)
1. a photosensitive method for drilling, is characterized in that, described photosensitive method for drilling comprises the steps:
S1. photosensitive resin is synthesized;
S2. preliminary treatment is carried out to substrate;
S3. at the copper foil surface through pretreated substrate, the photosensitive resin in even coating step S1;
S4. first time drying and processing is carried out to the substrate of coating photosensitive resin;
S5. to the base board to explosure after first time drying and processing;
S6. development treatment is carried out to the substrate after overexposure;
S7. the substrate after development after washing, second time drying and processing, completes micropore and makes successively.
2. photosensitive method for drilling according to claim 1, is characterized in that, described step S1 specifically comprises:
There is provided epoxy resin as matrix resin, in epoxy resin, add emulsion, curing agent, solvent and additive according to proportioning, fully after reaction, after filtration, wash and remove impurity, synthesize described photosensitive resin.
3. photosensitive method for drilling according to claim 1, is characterized in that, described step S2 specifically comprises: adopt cleaning agents to carry out preliminary treatment to described substrate.
4. photosensitive method for drilling according to claim 3, is characterized in that, described cleaning agents is sulfuric acid.
5. photosensitive method for drilling according to claim 1, is characterized in that, in described step S3, the thickness of the photosensitive resin of coating is 11 ~ 13 μm.
6. photosensitive method for drilling according to claim 1, it is characterized in that, in described step S4, described first time, drying and processing was segmented drying and processing, described segmented drying and processing, each section of bake out temperature is followed successively by: 80 DEG C, 90 DEG C, 100 DEG C, 90 DEG C, 80 DEG C, and each section of drying time is at least 5min.
7. photosensitive method for drilling according to claim 1, is characterized in that, in described step S5, adopt the mode of contact exposure, wherein, light source is ultraviolet light, and exposure energy is 100-300Mj/cm
2.
8. photosensitive method for drilling according to claim 1, it is characterized in that, described step S6 specifically comprises: by the mode of spray, and be that the developer solution of 4% is sprayed on the substrate after overexposure and carries out development treatment by mass fraction, the time of described development treatment is 5min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510823252.9A CN105282982A (en) | 2015-11-24 | 2015-11-24 | Photosensitive preparation method of holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510823252.9A CN105282982A (en) | 2015-11-24 | 2015-11-24 | Photosensitive preparation method of holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105282982A true CN105282982A (en) | 2016-01-27 |
Family
ID=55151068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510823252.9A Pending CN105282982A (en) | 2015-11-24 | 2015-11-24 | Photosensitive preparation method of holes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105282982A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107231757A (en) * | 2016-03-23 | 2017-10-03 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and preparation method thereof |
| CN109407472A (en) * | 2018-12-20 | 2019-03-01 | 张家港康得新光电材料有限公司 | Preparation method, making apparatus and the product of light microchannel plate |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4673773A (en) * | 1984-02-27 | 1987-06-16 | Ube Industries, Ltd. | Multilayer printed circuit board |
| CN1124912A (en) * | 1994-07-27 | 1996-06-19 | 株式会社日立制作所 | Photosensitive resin composition and method for using the same in manufacture of circuit boards |
| US5830563A (en) * | 1995-11-29 | 1998-11-03 | Nec Corporation | Interconnection structures and method of making same |
| US20030129536A1 (en) * | 1998-12-15 | 2003-07-10 | International Business Machines Corporation | Method of fabricating circuitized structures |
| CN1474961A (en) * | 2000-11-15 | 2004-02-11 | ���ƹɷ�����˾ | Positive type photosensitive epoxy resin composition and printed circuit board using same |
| CN101063832A (en) * | 2006-04-28 | 2007-10-31 | 乐凯集团第二胶片厂 | Preparation method for light sensitive planographic printing plate material |
| CN102970835A (en) * | 2011-09-02 | 2013-03-13 | 悦虎电路(苏州)有限公司 | Manufacturing method for blind hole on high density interconnect (HDI) circuit board |
| CN103618212A (en) * | 2013-12-10 | 2014-03-05 | 北京燕园中镓半导体工程研发中心有限公司 | Method for preparing GaN basal keel type laser diode |
| CN103945651A (en) * | 2014-05-06 | 2014-07-23 | 东莞生益电子有限公司 | Circuit board manufacturing method |
-
2015
- 2015-11-24 CN CN201510823252.9A patent/CN105282982A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4673773A (en) * | 1984-02-27 | 1987-06-16 | Ube Industries, Ltd. | Multilayer printed circuit board |
| CN1124912A (en) * | 1994-07-27 | 1996-06-19 | 株式会社日立制作所 | Photosensitive resin composition and method for using the same in manufacture of circuit boards |
| US5830563A (en) * | 1995-11-29 | 1998-11-03 | Nec Corporation | Interconnection structures and method of making same |
| US20030129536A1 (en) * | 1998-12-15 | 2003-07-10 | International Business Machines Corporation | Method of fabricating circuitized structures |
| CN1474961A (en) * | 2000-11-15 | 2004-02-11 | ���ƹɷ�����˾ | Positive type photosensitive epoxy resin composition and printed circuit board using same |
| CN101063832A (en) * | 2006-04-28 | 2007-10-31 | 乐凯集团第二胶片厂 | Preparation method for light sensitive planographic printing plate material |
| CN102970835A (en) * | 2011-09-02 | 2013-03-13 | 悦虎电路(苏州)有限公司 | Manufacturing method for blind hole on high density interconnect (HDI) circuit board |
| CN103618212A (en) * | 2013-12-10 | 2014-03-05 | 北京燕园中镓半导体工程研发中心有限公司 | Method for preparing GaN basal keel type laser diode |
| CN103945651A (en) * | 2014-05-06 | 2014-07-23 | 东莞生益电子有限公司 | Circuit board manufacturing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107231757A (en) * | 2016-03-23 | 2017-10-03 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and preparation method thereof |
| CN109407472A (en) * | 2018-12-20 | 2019-03-01 | 张家港康得新光电材料有限公司 | Preparation method, making apparatus and the product of light microchannel plate |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160127 |
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| RJ01 | Rejection of invention patent application after publication |