CN105246291A - Mobile device heat dissipation structure - Google Patents
Mobile device heat dissipation structure Download PDFInfo
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- CN105246291A CN105246291A CN201410327707.3A CN201410327707A CN105246291A CN 105246291 A CN105246291 A CN 105246291A CN 201410327707 A CN201410327707 A CN 201410327707A CN 105246291 A CN105246291 A CN 105246291A
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- China
- Prior art keywords
- mobile device
- heat dissipating
- dissipating layer
- radiator structure
- device radiator
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a mobile device heat dissipation structure. The mobile device heat dissipation structure comprises a bearing body provided with a first accommodating space. Multiple electronic elements are accommodated in the first accommodating space. A heat dissipation layer is formed on at least one side of each electronic element through any one of the following methods: micro arc oxidation (MAO) or plasma electrolytic oxidation (PEO), anodic spark deposition (ASD) and anodic oxidation by spark deposition (ANOF), and heat dissipation of the electronic elements is accelerated through the heat dissipation layers.
Description
Technical field
The present invention relates to a kind of mobile device radiator structure, particularly relate to a kind of mobile device radiator structure promoting hand-held device internal electronic element radiating efficiency.
Background technology
Existing mobile device (as slim pen electricity, flat board, smart mobile phone etc.) along with arithmetic speed faster, the heat that its internal calculation performance element produces also significantly promotes relatively, and it can prerequisite easy to carry be considered down to have again, these devices more do more thinning, in addition described mobile device is for can prevent foreign matter and aqueous vapor from entering inside, these mobile devices are except the providing holes of earpiece holes or connector, seldom have and form convection current in open aperture and outside air, therefore because of under the innate factor of thinning, the heat that these mobile devices inside produce because of calculation execution unit and battery cannot outwardly be discharged fast, and again because the inside of mobile device is confined space, therefore be difficult to produce heat loss through convection, and then be easy to situation such as mobile device inside generation accumulated heat or heat build-up etc., have a strong impact on the operating efficiency of mobile device or heat and the problem such as to work as.
Moreover, also have for arranging passive heat radiation element such as hot plate in these mobile device inside owing to there being the problems referred to above, temperature-uniforming plate, the passive heat dissipation element such as radiator carries out antipyretic, but still cause device inherent space constraints due to the reason of mobile device thinning, therefore set heat dissipation element certainly will be reduced to ultra-thin dimensional thickness, can be arranged in limited inner space, but along with the hot plate of size-constrained reduction, the capillary structure of temperature-uniforming plate inside and steam channel are because be arranged to ultra-thin then because of the limited reduction of above-mentioned requirement, make these hot plates, temperature-uniforming plate is had a greatly reduced quality in the heat conducting operating efficiency of entirety, cannot effectively reach heat radiation usefulness, therefore, when the internal compute unit power of mobile device is too high, prior art hot plate, temperature-uniforming plate all effectively cannot carry out antipyretic or heat radiation because tackling it, therefore how to arrange in narrow confined space and effectively separate thermal element.
Again, not easily the heat that electronic component produces is passed to external cooling because the narrow and tight storehouse of internal electronic element of inner first accommodation space of hand-held device is arranged, how easy accumulated heat in inside first accommodation space of handheld apparatus, is then carried out antipyretic being and firstly before this Project Technical personnel heavy is treated improving technology.
Summary of the invention
Therefore, for effectively solving the problem, main purpose of the present invention is to provide a kind of mobile device radiator structure, comprise: a supporting body, there is one first accommodation space, this first accommodation space has been installed with multiple electronic component, these electronic components at least side are formed with a heat dissipating layer, wherein heat dissipating layer is by differential arc oxidation (MicroArcOxidation, or electricity slurry electrolytic oxidation (PlasmaElectrolyticOxidation MAO), PEO), anodic spark deposition (AnodicSparkDeposition, ASD), spark deposition anodic oxidation (AnodicOxidationbySparkDeposition, ANOF) wherein either type is formed at these electronic component sides.
Described electronic component is that transistor or battery or central processing unit or flash memory are wherein arbitrary.
Described supporting body be an aluminium sheet, the plate body of aluminium copper plate body, stainless steel plate body or other powder metallurgy and plastic rubber shaping.
Described heat dissipating layer is that a ceramic material or graphite material are wherein arbitrary.
Described heat dissipating layer is a kind of loose structure or how rice structure is wherein arbitrary.
Described heat dissipating layer is that the color of black or sub-black or dark color is wherein arbitrary.
Described heat dissipating layer is that a kind of high radiation ceramic structure or high-hardness ceramic structure are wherein arbitrary.
Described first accommodation space has an open sides and a closed side, these electronic component sides are corresponding with this closed side, opposite side is corresponding with this open sides, and these electronic components side corresponding with this open sides is free end face and described heat dissipating layer is formed at this side.
The present invention reaches the effect promoting these electronic component quick heat radiatings by this heat dissipating layer.
Accompanying drawing explanation
Fig. 1 is the first embodiment three-dimensional exploded view of mobile device radiator structure of the present invention;
Fig. 2 is the first embodiment assembled sectional view of mobile device radiator structure of the present invention;
Fig. 3 is the second embodiment cutaway view of mobile device radiator structure of the present invention;
Fig. 4 is the 3rd embodiment stereogram of mobile device radiator structure of the present invention;
Fig. 5 is the 4th embodiment stereogram of mobile device radiator structure of the present invention.
Symbol description
Supporting body 1
First accommodation space 11
Open sides 111
Closed side 112
Electronic component 12
Heat dissipating layer 13
Embodiment
Below in conjunction with the characteristic on accompanying drawing object and structure and fuction thereof, the preferred embodiment according to institute's accompanying drawings is explained.
Refer to Fig. 1,2, be the first embodiment stereogram and cutaway view of mobile device radiator structure of the present invention, as shown in the figure, described hand-held device radiator structure, comprises a supporting body 1;
Described supporting body 1 has one first accommodation space 11, this first accommodation space 11 can be installed with multiple electronic component 12, these electronic components 12 at least side are formed with a heat dissipating layer 13, wherein heat dissipating layer 13 is by differential arc oxidation (MicroArcOxidation, or electricity slurry electrolytic oxidation (PlasmaElectrolyticOxidation MAO), PEO), anodic spark deposition (AnodicSparkDeposition, ASD), spark deposition anodic oxidation (AnodicOxidationbySparkDeposition, ANOF) wherein either type is formed at these electronic component sides, described supporting body 1 is a gold medal body plate body, and as the plate body of aluminium sheet, aluminium copper plate body, stainless steel plate body or other powder metallurgy and plastic rubber shaping, described electronic component 12 is central processing unit or MCU.
Described first accommodation space 11 has open sides 111 and a closed side 112, these electronic component 12 sides are corresponding with this closed side 112, opposite side is corresponding with this open sides 111, and these electronic components 12 side corresponding with this open sides 111 is in open free end face, and described heat dissipating layer 13 is formed at this side, and these electronic components 12 be arranged in this first accommodation space 11 can be made to reach the effect of quick heat radiating by the setting of this heat dissipating layer 13.
Described heat dissipating layer 13 is a ceramic material or graphite material or loose structure or how rice structure is wherein arbitrary, described heat dissipating layer 12 in black or the color of sub-black or dark color wherein arbitrary, the present embodiment is using ceramic material as explanation embodiment, but do not regard it as and be limited, and this ceramic material also may be selected to be a kind of high radiation ceramic structure or high-hardness ceramic structure is wherein arbitrary.
Refer to Fig. 3, for the second embodiment cutaway view of mobile device radiator structure of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, therefore will repeat no more at this, only not the existing together for described electronic component 12 is a battery of the present embodiment and aforementioned first embodiment, and form described heat dissipating layer 13 in the side of this battery in opening, and reach by this heat dissipating layer 13 effect that rapid diffusion dispels the heat.
Refer to Fig. 4, for the 3rd embodiment stereogram of mobile device radiator structure of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, therefore will repeat no more at this, only not the existing together for described electronic component 12 is a transistor of the present embodiment and aforementioned first embodiment, and form described heat dissipating layer 13 in this transistor in open side, and reach effect of rapid diffusion heat radiation by this heat dissipating layer 13.
Refer to Fig. 5, for the 4th embodiment stereogram of mobile device radiator structure of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, therefore will repeat no more at this, only not the existing together for described electronic component 12 is a flash memory of the present embodiment and aforementioned first embodiment, and form described heat dissipating layer 13 in this flash memory in open side, and reach effect of rapid diffusion heat radiation by this heat dissipating layer 13.
The main inside for solving mobile device of the present invention is installed with the solution heat problem of the electronic component 12 that can produce heat, and by forming the heat dissipating layer 13 with better heat loss through radiation effect in open side in these electronic components 12, significantly increased the radiating efficiency of these electronic components 12 by this heat dissipating layer 13, and then reduce these electronic components 12 produce accumulated heat problem in mobile device inside.
Although the present invention discloses as above with execution mode; so itself and be not used to limit the present invention, any person skilled in the art person, without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations, therefore protection scope of the present invention is when being decided to be standard with claims.
Claims (8)
1. a mobile device radiator structure, comprising:
One supporting body, there is one first accommodation space, this first accommodation space has been installed with multiple electronic component, these electronic components at least side are formed with a heat dissipating layer, wherein heat dissipating layer is by differential arc oxidation or electricity slurry electrolytic oxidation, anodic spark deposition, and spark deposition anodic oxidation wherein either type is formed at these electronic component sides.
2. mobile device radiator structure as claimed in claim 1, wherein said electronic component is that transistor or battery or central processing unit or flash memory are wherein arbitrary.
3. mobile device radiator structure as claimed in claim 1, wherein said supporting body be an aluminium sheet, the plate body of aluminium copper plate body, stainless steel plate body or other powder metallurgy and plastic rubber shaping.
4. mobile device radiator structure as claimed in claim 1, wherein said heat dissipating layer is that a ceramic material or graphite material are wherein arbitrary.
5. mobile device radiator structure as claimed in claim 1, wherein said heat dissipating layer is a kind of loose structure or how rice structure is wherein arbitrary.
6. mobile device radiator structure as claimed in claim 1, wherein said heat dissipating layer be in black or the color of sub-black or dark color wherein arbitrary.
7. mobile device radiator structure as claimed in claim 1, wherein said heat dissipating layer is that a kind of high radiation ceramic structure or high-hardness ceramic structure are wherein arbitrary.
8. mobile device radiator structure as claimed in claim 1, wherein said first accommodation space has an open sides and a closed side, these electronic component sides are corresponding with this closed side, opposite side is corresponding with this open sides, and these electronic components side corresponding with this open sides is free end face and described heat dissipating layer is formed at this side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410327707.3A CN105246291A (en) | 2014-07-10 | 2014-07-10 | Mobile device heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410327707.3A CN105246291A (en) | 2014-07-10 | 2014-07-10 | Mobile device heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
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| CN105246291A true CN105246291A (en) | 2016-01-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201410327707.3A Pending CN105246291A (en) | 2014-07-10 | 2014-07-10 | Mobile device heat dissipation structure |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM327054U (en) * | 2007-01-17 | 2008-02-11 | Hua-Hsin Tsai | Radiation heat dissipation structure |
| US20100321897A1 (en) * | 2009-06-17 | 2010-12-23 | Laird Technologies, Inc. | Compliant multilayered thermally-conductive interface assemblies |
| CN102187297A (en) * | 2008-09-05 | 2011-09-14 | 苹果公司 | Handheld computing device |
| CN103078975A (en) * | 2005-07-07 | 2013-05-01 | 格拉弗技术国际控股有限公司 | Thermal solution for portable electronic devices |
| CN203633052U (en) * | 2013-12-27 | 2014-06-04 | 奇鋐科技股份有限公司 | Heat radiation structure applied to mobile device |
| CN203934268U (en) * | 2014-07-10 | 2014-11-05 | 奇鋐科技股份有限公司 | Mobile device radiator structure |
-
2014
- 2014-07-10 CN CN201410327707.3A patent/CN105246291A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103078975A (en) * | 2005-07-07 | 2013-05-01 | 格拉弗技术国际控股有限公司 | Thermal solution for portable electronic devices |
| TWM327054U (en) * | 2007-01-17 | 2008-02-11 | Hua-Hsin Tsai | Radiation heat dissipation structure |
| CN102187297A (en) * | 2008-09-05 | 2011-09-14 | 苹果公司 | Handheld computing device |
| US20100321897A1 (en) * | 2009-06-17 | 2010-12-23 | Laird Technologies, Inc. | Compliant multilayered thermally-conductive interface assemblies |
| CN203633052U (en) * | 2013-12-27 | 2014-06-04 | 奇鋐科技股份有限公司 | Heat radiation structure applied to mobile device |
| CN203934268U (en) * | 2014-07-10 | 2014-11-05 | 奇鋐科技股份有限公司 | Mobile device radiator structure |
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Application publication date: 20160113 |
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| WD01 | Invention patent application deemed withdrawn after publication |