CN105246010A - Film speaker having low sound improving effect - Google Patents

Film speaker having low sound improving effect Download PDF

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Publication number
CN105246010A
CN105246010A CN201510734218.4A CN201510734218A CN105246010A CN 105246010 A CN105246010 A CN 105246010A CN 201510734218 A CN201510734218 A CN 201510734218A CN 105246010 A CN105246010 A CN 105246010A
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Prior art keywords
bass
film
improves
conductive film
layer
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CN201510734218.4A
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Chinese (zh)
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李崇
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Individual
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Individual
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Abstract

The present invention discloses a film speaker having a low sound improving effect. The film speaker having the low sound improving effect comprises at least one vibration film having a dipole moment charge distribution characteristic, at least one conductive film coated on the vibration film, at least two conductive terminals attached onto the conductive film and connected with a speaker driving circuit, and at least one low sound improving layer attached onto the vibration film or the conductive film, wherein the low sound improving layer comprises a plurality of groups of micro machining structures. The present invention is an innovation based on a speaker film structure, is simply structured, ultrathin, super-light, flexible, and transparent, not only can be used for replacing traditional speaker products, but also has wide practicability, and various novel applications can be explored based on the present invention.

Description

There is the wafer speaker that bass improves effect
Technical field
The present invention relates to loud speaker, be specifically related to a kind of to there is the wafer speaker that bass improves effect.
Background technology
Loud speaker, also known as " loudspeaker ", is a kind of very conventional electroacoustic conversion electron device.Loud speaker is in automobile industry, and TV, is widely used in the product scopes such as mobile phone, is deep into the every aspect in popular life, affects quality of the life and the convenience of people greatly, is one of most important electric component.
The kind of conventional loudspeakers is a lot, electrodynamic type (i.e. moving-coil type), electrostatic (i.e. condenser type), electromagnetic type (i.e. reed), piezoelectric type (i.e. crystal formula) etc. can be divided into several by its transduction principle, in general, dynamic speaker has that electroacoustic performance is good, sound construction, low cost and other advantages, is most widely used.
Further, conventional loudspeakers is different according to structure, can be divided into boombox and external speaker again, and the audio amplifier of external speaker and general indication.Boombox refers to MP4 player, has built-in loudspeaker, and such user not only can also listen to by boombox the sound that MP4 player sends by earphone jack.Have the MP4 player of boombox, opening can external speaker, also can be avoided the inconvenience of wearing earphone for a long time and bringing.
But above-mentioned various types of conventional loudspeakers, structure relative complex, at least needs electric loop, vibroseis, magnetic circuit system and other such as supports, the auxiliary system components of the parts such as shell.Its manufacture process at least needs 10 multiple working procedures, cannot realize ultra-thin and flexibility simultaneously.
In the prior art, also the wafer speaker occurred that some are ultra-thin, using flexibility material to make, but be limited to the shortcoming of vibration material itself, wafer speaker of the prior art only middle pitch and treble portion voice quality better, sense is then vibrated weak at voice parts, sound is not simple and honest, and brouhaha is many, and sounding effect is poor.
Summary of the invention
In order to improve the deficiencies in the prior art, the invention discloses and a kind of there is the wafer speaker that bass improves effect.
Technical scheme of the present invention is as follows:
There is the wafer speaker that bass improves effect, comprising:
At least one vibration film possessing dipole moment charge distribution characteristics;
At least one conductive film, is coated on described vibration film;
At least two conducting terminals, are attached on described conductive film, connect loudspeaker driving circuit;
At least one bass improves layer, is attached on described vibration film or conductive film, and described bass improves layer and comprises many group microfabrication structures; Often organize microfabrication structure and comprise a microfabrication structure or the identical or not identical microfabrication structure of multiple shape; Described microfabrication structure is hollow bubble, or solid pyramid, taper shape, prismatic, cylindrical, cheese or irregular shape are protruding.
Its further technical scheme for: the length of side that described microfabrication structure occupies is 20 μm ~ 10mm.
Its further technical scheme is: in described many group microfabrication structures, the length of side that often group microfabrication structure occupies is less than 10mm.
Its further technical scheme is: the material that described bass improves layer is paper, nylon, plastics or resin.
Its further technical scheme is: described conductive film comprises conductive polymer film and covers the Nano Silver pulp layer of conductive polymer film periphery, and described conducting terminal is attached in described Nano Silver pulp layer.
Its further technical scheme is: described conductive film is nano metal line film.
Its further technical scheme is: described nano metal line is nano-silver thread, NANO CRYSTAL COPPER WIRE, nanometer iron wire or nanometer aluminum steel.
Its further technical scheme is: also comprise insulating barrier, is attached on described conductive film.
Its further technical scheme is: the shape that described bass improves layer is sheet, thread, strip or netted.
Advantageous Effects of the present invention is:
1, the present invention on the basis of existing technology, by increasing the method that bass improves layer on vibration film or conductive film, greatly strengthen the voice parts voice effect of wafer speaker.Bass improves on layer to be provided with to organize microfabrication structure more, greatly strengthen the voice effect of wafer speaker.It is that the material all different with the material of vibration film and conductive film is made that bass improves layer, after vibration film produces sound, its vibrational energy can be propagated to different directions, on its route of transmission, when existence can vibrate sonorific material, this material vibrates will be caused, because material is different, then the optimum frequency of vibration sounding is different, and the microfabrication structure on it can produce resonance to bass, enhance the sounding effect of bass, difform microfabrication structure can increase the bass concussion effect of different frequency, integrate, just enhance the frequency response range of wafer speaker, the sounding effect of wafer speaker at full frequency band can be improved.
2, as a preferred version, the present invention proposes the method be coated in as conductive film by nano metal line on vibration film, nano metal wire material is relative to traditional metallic film or conducting polymer composite, and the contact resistance between vibration film reduces greatly, so the field decay on conductive film is little, then vibration film vibration evenly, and sound effect is better.Known by experiment, conventional macromolecule conducting material, as pedot material, after contacting with vibration film, the square resistance of its contact-making surface is 1000 Ω/mouth; Common metal material, the square resistance of its contact-making surface is 10 Ω/mouth; And nano metal wire material, the square resistance of its contact-making surface, no less than metal material, substantially reduces resistance, can improve the uniformity of whole electric field, namely adds the uniformity of wafer speaker sounding.Further, if directly smear metal material on vibration film, because the audio frequency characteristics of metal material self, release and the propagation of vibration film sound can be affected greatly, have influence on middle bass effect and become poorer, and metal nano silver wire material coating of the present invention is on the one hand because good surface contact effect and conductivity, guarantee that vibration film is in energising situation, surface forms homogeneous electric field, realize good generation effect, then not causing obstacle to the release of sound on the other hand, obtain good sound transmission effect, is best selection.
And nano metal wire material has a lot of hole in microstructure, so macroscopically, its appearance is transparence, be suitable for loud speaker to be attached to the surface of any object and do not affect the form of object itself, preferablyly loud speaker to be directly attached on image or video display apparatus, increase the scope of application of the present invention, make the present invention have stronger practicality.Fig. 1 is the microstructure schematic diagram of nano metal wire material.
The nano metal wire material in addition vibration film attached, reduces greatly to the obstruction of sound, better can discharge sound, and the sound effect that loudspeaker film is sent is more excellent; And the bending effect of nano metal wire material and pliable and tough effect are also better than traditional metal material, so the wafer speaker produced, be suitablely attached to showing of any object, can bend as required, add practicality of the present invention.
3, for using nano metal line film as conductive film, present invention also adds insulating barrier, to prevent from, in use procedure, electric shock accidents occurs, and insulating barrier can arrange microfabrication structure, the resonance in acoustic transmission path can be increased, and filtering out high-frequency noise in the process, effectively improve tonequality, make sound softer.Simultaneously insulating barrier can available protecting conductive film material, prevents coming off of electric conducting material
4, structure of the present invention is simple, ultra-thin, ultralight amount, can flexibility, can be transparent, is not only and can substitutes traditional speaker product, can also excavate out various new application, have practicality widely on basis of the present invention.
Accompanying drawing explanation
Fig. 1 is the microstructure schematic diagram of nano metal wire material.
Fig. 2 is the schematic diagram of the vibration film possessing dipole moment charge distribution characteristics.
Fig. 3 is the STRUCTURE DECOMPOSITION figure of embodiment 1.
Fig. 4 is the front view of embodiment 1.
Fig. 5 is the bubble structure figure of embodiment 1.
Fig. 6 is the front view of embodiment 2.
Fig. 7 is the schematic diagram that in Fig. 5, bass improves layer.
Fig. 8 is the STRUCTURE DECOMPOSITION figure of embodiment 3.
Fig. 9 is the close-up schematic view that the bass of embodiment 3 improves the trickle processing structure of layer.
Figure 10 is the STRUCTURE DECOMPOSITION figure of embodiment 4.
Embodiment
The present invention includes following several structure:
At least one vibration film possessing dipole moment charge distribution characteristics.Namely the molecule forming vibration film is regularly arranged according to positive-negative polarity, and the two sides of vibration film has the polar character of " just " and " bearing " respectively.
Fig. 2 is the schematic diagram of the vibration film possessing dipole moment charge distribution characteristics, and in fig. 2, it is as follows that molecule H-F has dipole moment:
μ=Q×r
In above formula, μ is dipole moment, and Q is electric charge, and r is distance.
Signal realizes the vibration control to vibration film by electric conducting material, thus realizes sound result of broadcast.Vibration film can be polyvinylidene difluoride film.
At least one conductive film, is coated on described vibration film, and when conductive effect is better, the sounding effect of vibration film is also better.
At least two conducting terminals, are attached on described conductive film, connect loudspeaker driving circuit.
At least one bass improves layer, and bass improves layer and can directly be attached on vibration film, also can be attached on conductive film.
The vibration film with dipole moment charge distribution characteristics high pitch and middle pitch expression effect good, but not good enough for the expression effect of bass, friction sense when playing bass effect more music, sound is unstable.In order to address this problem, bass of the present invention improves layer surface and is also provided with the protruding microfabrication structure of many groups, often organizes microfabrication structure and comprises at least one microfabrication structure or the identical or different microfabrication structure of multiple shape.The length of side that microfabrication structure occupies is 20 μm ~ 10mm, and namely for each microfabrication structure, it is in the square of 20 μm ~ 10mm that the position shared by its bottom surface can be placed on a length of side.Microfabrication structure can be that solid pyramid, taper shape, prismatic, cylindrical, cheese or irregular shape are protruding.Also can be hollow bubble.Pyramid is specifically as follows pyramid, triangular pyramid etc., is prismaticly specifically as follows side is placed, triangular prism etc. in roof shape.In order to prevent the shape of microfabrication structure too mixed and disorderly, negative effect can be caused to sound effect on the contrary, so the present invention is by repeatedly testing, limits the length of side that often group microfabrication structure occupies and being less than 10mm for preferably to select.Often organize in microfabrication structure, the length of side of the position shared by difformity can be different.Microfabrication structure can be coated on corresponding film by wet technological method for processing or additive method.Microfabrication structure can produce resonance to bass, and different microfabrication structures can strengthen the bass concussion effect of different frequency, enhances the frequency response range of wafer speaker, can improve the sounding effect of wafer speaker at full frequency band.
Bass improves layer and may be selected to be sheet, thread, strip, the different shape such as netted.The combination that bass improves layer and vibration film can be: bass improves layer and embeds in the middle of upper and lower two-layer vibration film, glued together with vibration film; Or bass improves layer and is glued on individual layer vibration film; Or bass improves mode that layer alternately exists with matrix or dot matrix and vibration film is glued together.What bass improved layer and vibration film also can select gummed form like other and above-mentioned gummed form class.
Operation principle of the present invention is: the loudspeaker driving circuit that conducting terminal connects provides drive current, audio signal is passed to conductive film, drive current is transmitted on whole vibration film by conductive film, the character of vibration film determined afterwards, vibration film occurs vibrate and sound, sound improves layer through bass, and bass part is enhanced, and loud speaker finally sends all good high-quality music of middle high bass effect.
Wafer speaker of the present invention can be the rectangle of rule, square, and circular, polygon, the forms such as star, also can be irregular form, this point also embodies wafer speaker external morphology feature freely.
Hereafter by four embodiments, technical scheme of the present invention is described.
Embodiment 1.
Fig. 3 is the STRUCTURE DECOMPOSITION figure of embodiment 1.Embodiment 1 comprises:
One vibration film 1 possessing dipole moment charge distribution characteristics,
One conductive film 2, is coated on vibration film 1.In the present embodiment, conductive film 2 comprises conductive polymer film, is specially PEDOT material; Also comprise the nanometer silver paste 4 covering conductive polymer film periphery.
Two conducting terminals 5, are attached on nanometer silver paste, connect loudspeaker driving circuit;
One bass improves layer 3, is attached on conductive film 2, and in the present embodiment, bass improves layer 3 and comprises multiple regularly arranged, each bubble that is self-enclosed, contain air as microfabrication structure, and the size of bubble is 10mm.In actual production technique, packaging plastic bubble film can be directly used to improve layer as bass.
Fig. 4 is the front view of embodiment 1, and as shown in Figure 5, in the present embodiment, bass improves layer 3, vibration film 1, conductive film 2, conducting terminal 5 are attached to together, from down to up in order successively particular by strong double-face glue glued adhesion between different materials.Conducting terminal 5 is attached on the nanometer silver paste 4 on conductive film 2, and connects loudspeaker driving circuit.Electric conductivity due to nanometer silver paste is better than conductive polymer film, so drive current is transferred to the nanometer silver paste 4 on conductive film 2 by conducting terminal 5, drive current is transferred to conductive polymer film by nanometer silver paste 4 again, and cause vibration film 1 vibration sounding, after sound improves layer 3 by bass, the high-quality more of change.
Fig. 5 is the bubble structure figure of embodiment 1.The bass of embodiment 1 improves layer and forms for the bubble structure shown in multiple Fig. 5 is regularly arranged, and bubble structure 6 contain air, is provided with borderline structure 7 around each bubble structure, closed by bubble structure 6.
Embodiment 2.
Fig. 6 is the front view of embodiment 2.Embodiment 2 comprises:
One vibration film 1 possessing dipole moment charge distribution characteristics.
One conductive film 2, is coated on vibration film 1.In the present embodiment, conductive film 2 comprises conductive polymer film, is specially PEDOT material.Also comprise the nanometer silver paste 4 covering conductive polymer film periphery.
Two conducting terminals 5, are attached on nanometer silver paste 4, connect loudspeaker driving circuit.
One bass improves layer 3, is attached on vibration film 1.That in the present embodiment, bass improves the microfabrication structure that layer 3 is provided with multiple identical solid dome-shaped projection, and the basal diameter of cheese projection is 1mm with embodiment 1 difference.In the present embodiment, bass improves the material of layer is resin.
As shown in Figure 6, in the present embodiment, bass improves layer 3, vibration film 1, conductive film 2, conducting terminal 5 are attached to together from down to up in order successively, glues together mutually between different materials particular by strong double-face glue.Conducting terminal 5 is attached on the nanometer silver paste 4 on conductive film 2, and connects loudspeaker driving circuit.Electric conductivity due to nanometer silver paste is better than conductive polymer film, so drive current is transferred to the nanometer silver paste 4 on conductive film 2 by conducting terminal 5, drive current is transferred to conductive polymer film by nanometer silver paste 4 again, and cause vibration film 1 vibration sounding, after sound improves layer 3 by bass, the high-quality more of change.
Fig. 7 is the schematic diagram that in Fig. 6, bass improves layer.Bass improves on layer 3 and is attached with multiple dome-shaped solid projection as can be seen from Fig. 7.
In like manner, solid projection also can be that solid pyramid, taper shape, prismatic, cylindrical, cheese or irregular shape are protruding, pyramid is specifically as follows pyramid, triangular pyramid etc. or other pyramidal shape, prismaticly being specifically as follows side is placed, triangular prism in roof shape, also can be other prism shape.
Embodiment 3.
Fig. 8 is the STRUCTURE DECOMPOSITION figure of embodiment 3.Embodiment 3 comprises:
One vibration film 1 possessing dipole moment charge distribution characteristics.
One conductive film 2, is coated on vibration film 1.Conductive film 2 is metallic film, and metallic film is preferably nano metal wire material, as nano-silver thread, nanometer aluminum steel, and nanometer iron wire, NANO CRYSTAL COPPER WIRE etc.In the present embodiment, use nano-silver thread as metallic film.Nano-silver thread is better than other nano metal lines, because its conductance is the highest.
One bass improves layer 3, is attached on vibration film 1.Fig. 9 be the bass of embodiment 3 improve layer partial enlarged drawing, comprise many group microfabrication structures, often organize microfabrication structure and comprise three microfabrication structures, be respectively and be followed successively by that diameter is that the solid dome of 80 μm is protruding respectively, bottom side length to be the protruding and diameter of the solid pyramid of 20 μm the be solid cylindrical protrusions of 50 μm.Fig. 9 amplifies and shows bass and improve 6 groups of microfabrication structures in layer, and whole bass improves layer surface and has all been paved with structure as shown in the figure.In the present embodiment, bass improves the material of layer 3 is nylon.
In like manner, microfabrication structure also can be other types, and one group of microfabrication structure can comprise a microfabrication structure, also can comprise the microfabrication structure that multiple shape is identical or different; Can be that solid pyramid, taper shape, prismatic, cylindrical, cheese or irregular shape are protruding, also can be hollow bubble, or the combination of above-mentioned arbitrary shape different order, often organizes in microfabrication structure, the size of each microfabrication structure also can be different.Two conducting terminals 5, on pasted conductive film 2, connect loudspeaker driving circuit.
As shown in Figure 8, in the present embodiment, bass improves layer 3, vibration film 1, conductive film 2, conducting terminal 5 are attached to together from down to up in order successively, glues together between different materials especially by the adhesive curing of UV epoxy resin.Conducting terminal 5 is attached on conductive film 2, and connects loudspeaker driving circuit.Because conductive film 2 is nano metal line film, so drive current is transferred to whole conductive film 2 by conducting terminal 5, and cause vibration film 1 vibration sounding, after sound improves layer 3 by bass, the high-quality more of change.And be better than conductive polymer film due to the conductivity of metallic film, in this embodiment, the audio signal received by the entire area of vibration film 1 is also undamped, and sounding effect is better.
Embodiment 4.
Figure 10 is the STRUCTURE DECOMPOSITION figure of embodiment 4, and embodiment 4 comprises:
One vibration film 1 possessing dipole moment charge distribution characteristics.
Two-layer conductive film 2, is coated in vibration film about 1 both sides respectively, improves between layer 3 at vibration film 1 and bass.In the present embodiment, conductive film 2 is metallic film, and metallic film can be nano metal wire material.In the present embodiment, use nanometer aluminum steel as metallic film.
Multiple conducting terminal 5, on pasted conductive film 2, connects loudspeaker driving circuit.
Two-layer bass improves layer 3, and two-layer bass improves layer 3 and is attached at respectively on two-layer conductive film 2.In the present embodiment, bass improves the microfabrication structure that layer 3 comprises multiple regularly arranged, each bubble that is self-enclosed, contain air, and bubble diameter is 10mm, in actual production technique, can directly use packaging bubble chamber film to improve layer as bass.
As shown in Figure 10, in the present embodiment, bass improves layer 3, conducting terminal 5, conductive film 2, vibration film 1, conductive film 2, conducting terminal 5, bass improve layer 3 and are attached to successively together in order from down to up, especially by the method gummed adding hot pressing between different materials.Conducting terminal 5 is attached on conductive film 2, and connects loudspeaker driving circuit.Because conductive film 2 is nano metal line film, so drive current is transferred to whole conductive film 2 by conducting terminal 5, and cause vibration film 1 vibration sounding, after sound improves layer 3 by bass, the high-quality more of change.And be better than conductive polymer film due to the conductivity of metallic film, in this embodiment, the audio signal received by the entire area of vibration film 1 is also undamped, and sounding effect is better.
Be provided with two-layer bass in this embodiment and improve layer and two-layer conductive film, sound can transmit along the both sides of vibration film 1, and range of voice is wider.
Above-described is only the preferred embodiment of the present invention, the invention is not restricted to above embodiment.Be appreciated that the oher improvements and changes that those skilled in the art directly derive without departing from the spirit and concept in the present invention or associate, all should think and be included within protection scope of the present invention.

Claims (9)

1. there is the wafer speaker that bass improves effect, it is characterized in that, comprising:
At least one vibration film possessing dipole moment charge distribution characteristics;
At least one conductive film, is coated on described vibration film;
At least two conducting terminals, are attached on described conductive film, connect loudspeaker driving circuit;
At least one bass improves layer, is attached on described vibration film or conductive film, and described bass improves layer and comprises many group microfabrication structures; Often organize microfabrication structure and comprise a microfabrication structure or the identical or not identical microfabrication structure of multiple shape; Described microfabrication structure is hollow bubble, or solid pyramid, taper shape, prismatic, cylindrical, cheese or irregular shape are protruding.
2. there is wafer speaker that bass improves effect as claimed in claim 1, it is characterized in that: the length of side that described microfabrication structure occupies is 20 μm ~ 10mm.
3. there is wafer speaker that bass improves effect as claimed in claim 1, it is characterized in that: in described many group microfabrication structures, the length of side that often group microfabrication structure occupies is less than 10mm.
4. there is wafer speaker that bass improves effect as claimed in claim 1, it is characterized in that: the material that described bass improves layer is paper, nylon, plastics or resin.
5. as described in any one of Claims 1-4, there is the wafer speaker that bass improves effect, it is characterized in that: described conductive film comprises conductive polymer film and covers the Nano Silver pulp layer of conductive polymer film periphery, and described conducting terminal is attached in described Nano Silver pulp layer.
6. as described in any one of Claims 1-4, there is the wafer speaker that bass improves effect, it is characterized in that: described conductive film is nano metal line film.
7. there is wafer speaker that bass improves effect as claimed in claim 6, it is characterized in that: described nano metal wire material is nano-silver thread, NANO CRYSTAL COPPER WIRE, nanometer iron wire or nanometer aluminum steel.
8. there is wafer speaker that bass improves effect as claimed in claim 6, it is characterized in that: also comprise insulating barrier, be attached on described conductive film.
9. there is wafer speaker that bass improves effect as claimed in claim 1, it is characterized in that: the shape that described bass improves layer is sheet, thread, strip or netted.
CN201510734218.4A 2015-11-02 2015-11-02 Film speaker having low sound improving effect Pending CN105246010A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109714685A (en) * 2017-10-26 2019-05-03 华一声学股份有限公司 Wafer speaker

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EP0015886A1 (en) * 1979-03-13 1980-09-17 Toray Industries, Inc. An improved electro-acoustic transducer element
CN1909747A (en) * 2005-08-03 2007-02-07 精工爱普生株式会社 Electrostatic ultrasonic transducer, ultrasonic speaker, and electrode manufacturing method for use in ultrasonic transducer
CN1956603A (en) * 2005-10-29 2007-05-02 梦想音速技术有限公司 Thin film speaker using piezoelectricity thin film as vibration component
CN1997243A (en) * 2005-12-31 2007-07-11 财团法人工业技术研究院 Pliable loudspeaker and its making method
CN101599268A (en) * 2008-06-04 2009-12-09 北京富纳特创新科技有限公司 Sound-producing device and sounding component
CN101729965A (en) * 2008-10-24 2010-06-09 财团法人工业技术研究院 Flat speaker unit and speaker device therewith
CN102271303A (en) * 2010-06-04 2011-12-07 台湾驻极体电子股份有限公司 Flexible loudspeaker structure
CN104937952A (en) * 2012-10-26 2015-09-23 康宁股份有限公司 Structure with integrated acoustics function

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0015886A1 (en) * 1979-03-13 1980-09-17 Toray Industries, Inc. An improved electro-acoustic transducer element
CN1909747A (en) * 2005-08-03 2007-02-07 精工爱普生株式会社 Electrostatic ultrasonic transducer, ultrasonic speaker, and electrode manufacturing method for use in ultrasonic transducer
CN1956603A (en) * 2005-10-29 2007-05-02 梦想音速技术有限公司 Thin film speaker using piezoelectricity thin film as vibration component
CN1997243A (en) * 2005-12-31 2007-07-11 财团法人工业技术研究院 Pliable loudspeaker and its making method
CN101599268A (en) * 2008-06-04 2009-12-09 北京富纳特创新科技有限公司 Sound-producing device and sounding component
CN101729965A (en) * 2008-10-24 2010-06-09 财团法人工业技术研究院 Flat speaker unit and speaker device therewith
CN102271303A (en) * 2010-06-04 2011-12-07 台湾驻极体电子股份有限公司 Flexible loudspeaker structure
CN104937952A (en) * 2012-10-26 2015-09-23 康宁股份有限公司 Structure with integrated acoustics function

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109714685A (en) * 2017-10-26 2019-05-03 华一声学股份有限公司 Wafer speaker

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