CN105224928B - Fingerprint recognition sensing device further, electronic equipment and mobile device - Google Patents
Fingerprint recognition sensing device further, electronic equipment and mobile device Download PDFInfo
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- CN105224928B CN105224928B CN201510650265.0A CN201510650265A CN105224928B CN 105224928 B CN105224928 B CN 105224928B CN 201510650265 A CN201510650265 A CN 201510650265A CN 105224928 B CN105224928 B CN 105224928B
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- Prior art keywords
- sensing device
- fingerprint
- fingerprint recognition
- device assembly
- device further
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- 108091027981 Response element Proteins 0.000 claims abstract description 52
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 40
- 229910052710 silicon Inorganic materials 0.000 claims description 40
- 239000010703 silicon Substances 0.000 claims description 40
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 229910052594 sapphire Inorganic materials 0.000 claims description 7
- 239000010980 sapphire Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 230000004044 response Effects 0.000 abstract description 12
- 230000009471 action Effects 0.000 abstract description 2
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- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 210000002615 epidermis Anatomy 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000005352 galvanomagnetic phenomena Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention discloses a kind of fingerprint recognition sensing device further and there is its electronic equipment and mobile device.Fingerprint recognition sensing device further includes：Equipment component；Fingerprint sensing device assembly, the fingerprint sensing device assembly are located at below equipment component, and the fingerprint sensing device assembly can be coupled to the user fingerprints of user's finger；To user's finger close to sensitive response element, the response element is connected with the equipment component and at least a portion of the response element is higher than the fingerprint sensing device assembly.Fingerprint recognition sensing device further according to embodiments of the present invention, not only with preferable fingerprint identification function, and response element response is good, and control action is good.
Description
Technical field
The present invention relates to identification and detection technology field, more particularly, to a kind of fingerprint recognition sensing device further and have
The electronic equipment and mobile device of the fingerprint recognition sensing device further.
Background technology
In the related art, the equipment component of fingerprint recognition sensing device further, fingerprint Identification sensor and response element layer
It is folded to set.When fingerprint Identification sensor is located between equipment component and response element, response element is apart from contact arrangement element
User's finger farther out, response element response is poor；When response element is located between fingerprint Identification sensor is inversely related to the component
When, apart from user's finger farther out, fingerprint recognition performance can be deteriorated fingerprint Identification sensor component again, cause fingerprint recognition and response
There is contradiction, the structure of fingerprint recognition sensing device further between control to have much room for improvement.
The content of the invention
It is contemplated that at least solves one of technical problem in correlation technique to a certain extent.Therefore, the present invention carries
Going out a kind of fingerprint recognition sensing device further, the fingerprint recognition sensing device further not only has preferable fingerprint identification function, and
Response element response performance is good.
The invention also provides a kind of electronic equipment with above-mentioned fingerprint recognition sensing device further.
The invention also provides a kind of mobile device with above-mentioned fingerprint recognition sensing device further.
Fingerprint recognition sensing device further according to embodiments of the present invention, including：Equipment component；Fingerprint sensing device assembly, it is described
Fingerprint sensing device assembly is located at below equipment component, and the user that the fingerprint sensing device assembly can be coupled to user's finger refers to
Line；To user's finger close to sensitive response element, the response element is connected with the equipment component and the response element
At least a portion of part is higher than the fingerprint sensing device assembly.
Fingerprint recognition sensing device further according to embodiments of the present invention, not only with preferable fingerprint identification function, and ring
Answer element responds good, control performance is good.
In addition, fingerprint recognition sensing device further according to embodiments of the present invention can also have technical characteristic additional as follows：
According to some embodiments of the present invention, fingerprint recognition sensing device further also includes pedestal, and the pedestal is provided with assembling
Hole, the equipment component and the fingerprint sensing device assembly are located in the pilot hole, the response element and the pedestal phase
Even and positioned at the periphery of the fingerprint sensing device assembly.
According to some embodiments of the present invention, the pilot hole includes the first hole section and the second hole section, first hole section
Radial dimension be more than the radial dimension of second hole section, the equipment component is located in first hole section, the fingerprint
At least a portion of sensor cluster is located in second hole section.
According to some embodiments of the present invention, the response element is located in first hole section, the response element
One end is connected with the lower surface of the equipment component, and the other end is connected with the wall surface or side wall of first hole section.
According to some embodiments of the present invention, the fingerprint sensing device assembly includes that user can be capacitively coupled to
One group of capacitive element of the fingerprint of finger.
According to some embodiments of the present invention, the fingerprint sensing device assembly includes silicon wafer and sensor circuit, described
Sensor circuit is arranged on the top of the close user's finger of the silicon wafer.
Formed with least one through hole and/or at least one opened according to some embodiments of the present invention, in the silicon wafer
Groove, the sensor circuit couple with the closing line being located in the through hole and/or fluting.
According to some embodiments of the present invention, the fingerprint sensing device assembly also includes the encapsulated layer with upper opening,
The sensor circuit is located in the encapsulated layer, and the circuit of the sensor circuit or the sensor circuit is from the top
Expose in opening.
According to some embodiments of the present invention, welding member of the fingerprint sensing device assembly also including at least one compression
Part, the sensor circuit couple with the soldered elements.
According to some embodiments of the present invention, the equipment component is by least one in glass, ceramics and sapphire material
Kind is made.
According to the electronic equipment of the present invention, including the fingerprint recognition sensing device further according to the present invention.
According to the mobile device of the present invention, including the fingerprint recognition sensing device further according to the present invention.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
Fig. 1 is the structural representation of fingerprint recognition sensing device further according to an embodiment of the invention；
Fig. 2 is the structural representation of fingerprint recognition sensing device further in accordance with another embodiment of the present invention.
Reference：
Fingerprint recognition sensing device further 100；
Equipment component 10；
Fingerprint sensing device assembly 20；Silicon crystal 21；Sensor circuit 22；
Response element 30；
Pedestal 40；Pilot hole 41；First hole section 411；Second hole section 412；Wall surface 401；Side wall 402.
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings.Below with reference to
The embodiment of accompanying drawing description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
Fingerprint recognition sensing device further 100 according to embodiments of the present invention is described in detail below in conjunction with the accompanying drawings.
Shown referring to Figures 1 and 2, fingerprint recognition sensing device further 100 according to embodiments of the present invention can include equipment member
Part 10, fingerprint sensing device assembly 20 and response element 30.Fingerprint sensing device assembly 20 can be located at the lower section of equipment component 10, fingerprint
Sensor cluster 20 can be coupled to the user fingerprints of user's finger.Response element 30 is inversely related to the component 10 connected and response elements
30 at least a portion is higher than fingerprint sensing device assembly 20.Close sensitivity of the response element 30 to user's finger.
In other words, equipment component 10 is located above fingerprint sensing device assembly 20, when user's finger is placed on equipment component
When on 10, fingerprint sensing device assembly 20 can recognize the fingerprint of user's finger, and now response element 30 also acts.Specifically
For, response element 30 can externally send control signal, control miscellaneous part, realize response control function.
Because fingerprint sensing device assembly 20 is located at the lower section of equipment component 10, fingerprint sensing device assembly 20 and user's finger are more
It is close, preferably the fingerprint of user's finger can be identified, recognition performance is good.Meanwhile response element 30 is no longer arranged on
The lower section of fingerprint sensing device assembly 20, response element 30 are arranged on than fingerprint sensing device assembly 20 closer to the position of user's finger
Place, the response performance of response element 30 improve, and response control performance is good.
It is understood that the set location of response element 30 can have it is a variety of, as long as meet make response element 30 extremely
A few part is higher than the requirement of fingerprint sensing device assembly 20.Alternatively, as depicted in figs. 1 and 2, in some realities of the present invention
Apply in example, response element 30 can also include pedestal 40, and pedestal 40 is provided with pilot hole 41, equipment component 10 and fingerprint sensor
Component 20 is located in pilot hole 41, and response element 30 is connected with pedestal 40 and positioned at the periphery of fingerprint sensing device assembly 20.
Thus, response element 30 and the installation of fingerprint sensing device assembly 20 are independent of each other, fingerprint sensing device assembly 20 and sound
Answer element 30 simultaneously relatively near apart from equipment component 10, i.e., with preferable fingerprint identification function, it may have preferably response
Control action, assembly structure design is reasonable and is easy to manufacture.
Further, shown referring to Figures 1 and 2, pilot hole 41 can include the first hole section 411 and the second hole section 412, the
The radial dimension of one hole section 411 can be more than the radial dimension of the second hole section 412, and equipment component 10 can be located at the first hole section
In 411, at least a portion of fingerprint sensing device assembly 20 can be located in the second hole section 412.Thus, it is not only convenient for installing, and
And equipment component 10 and the accuracy that fingerprint sensing device assembly 20 is installed can be ensured.
Alternatively, response element 30 can be located in the first hole section 411, and one end of response element 30 can be inversely related to the component
10 lower surface is connected, and the other end can be connected with the wall surface 401 or side wall 402 of the first hole section 411.For example, in Fig. 1 institutes
In the example shown, the lower surface that one end of response element 30 is inversely related to the component 10 is connected, the other end of response element 30 and first
The wall surface 401 of hole section 411 is connected.For another example in the illustrated example shown in fig. 2, one end of response element 30 is inversely related to the component 10
Lower surface be connected, the other end of response element 30 is connected with the side wall 402 of the first hole section 411.
In both structures, when user's finger is pressed when on equipment component 10, one end of response element 30 can be first
Experience, and then respond response element 30, response performance is good and is easy to manufacture and assembles.
Alternatively, pedestal 40 can use the anodized aluminum of such as SOS aluminium etc to build.In actual use, fingerprint is known
Other sensing device further 100 can according to shown in Fig. 1 and Fig. 2 placed angle use, can also the certain angle of integral-rotation make
With for example, fingerprint recognition sensing device further 100 can integrally 90 degree of uses clockwise or counterclockwise.Equipment component 10 and base
Sunk structure can be cooperatively formed between seat 40, as shown in figure 1, chamfering can be set on pedestal 40, a part for sunk structure
It can be formed by chamfering.
Sunk structure can guide user's finger into button, user's finger is positioned well, to be referred to
Line identifies.Meanwhile pedestal 40 can be used for provide electric insulation or be used to shield galvanomagnetic-effect, band be provided with Capacitor apart or
The effect of other electromagnetic isolations, the electric capacity for making to measure are between user's finger and fingerprint sensing device assembly 20, rather than appoint
What between his object and fingerprint sensing device assembly 20, fingerprint detection is more accurate.
It is understood that the shape of response element 30 can be formed as a variety of, for example, can be formed as shown in Fig. 1
Straight rod-shaped, the L-shaped shown in Fig. 2 can also be formed as.Certainly, response element 30 may be formed as other shapes, herein
It is not described in detail.
The concrete structure of response element 30 be formed as it is a variety of, for example, the present invention some specific examples in, response element
The sensitive control element of the coupling being inversely related to the component to user's finger between 10, such as control circuit can be provided with part 30, should
Control element is connected with miscellaneous part.When user's finger contacts equipment component 10, response element 30 can be experienced and right
Control signal is sent outside, so as to realize response control function.Response element 30 can also have the part that can be deformed, and work as pressing
During equipment component 10, response element 30 can deform, and with response apparatus element 10, have user and push sense of touch.
Alternatively, one group of capacitive element can be included according to some embodiments of the present invention, fingerprint sensing device assembly 20,
This group of capacitive element can be capacitively coupled to the fingerprint of user's finger, so as to realize the fingerprint progress to user's finger
Identification, recognition performance are good.
According to some embodiments of the present invention, fingerprint sensing device assembly 20 can include sensor circuit 22 and silicon wafer
21, sensor circuit 22 is located on silicon wafer 21.Sensor circuit 22 can be used for fingerprint (such as user for measuring user's finger
Electric capacity between the supracutaneous ridge of finger and paddy), band is provided with the information in fingerprint of the ridge and paddy on user's finger
Effect.Wherein, sensor circuit 22 can be arranged on the top of the close user's finger of silicon wafer 21.
Specifically, equipment component 10 can be located at the top of silicon wafer 21, and sensor circuit 22 can be arranged on silicon wafer
On the top surface of piece 21.Thus, fingerprint Identification sensor circuit 22 can be placed closer together user's finger, and can have phase
More preferable resolution ratio and validity for.For example, sensor circuit 22 can be directly printed on the top surface of silicon wafer 21, pass
Sensor circuit 22 can overlap with button part, or all overlap.
Further, at least one through hole and/or at least one fluting 201, sensor are could be formed with silicon wafer 21
Circuit 22 can couple with the closing line 23 being located in through hole and/or fluting 201.That is, can be independent on silicon wafer 21
Set through hole to be either separately provided fluting 201 or through hole and fluting 201 to be respectively provided with, when being provided with through hole on silicon wafer 21,
It can also be multiple that through hole, which can be one, and when being provided with fluting 201 on silicon wafer 21, fluting 201 can be one and also may be used
Think multiple.The closing line 23 being connected with miscellaneous part or circuit is provided with fluting 201 and through hole, when sensor circuit 22
The connection with miscellaneous part or circuit can be realized by the connection with closing line 23.
Thus, it is possible to easily realize the connection of sensor circuit 22 and other circuits or part, attachment structure is more regular.
Meanwhile closing line 23 is arranged in the through hole and/or fluting 201 of silicon wafer 21, without being arched upward from the surface of silicon wafer 21, with
Sensor circuit 22 is connected to other places from silicon wafer 21.Thus, joint line will not occupy silicon wafer 21 and adjacent silicon wafer 21
Vertical space between the object of top, you can sensor circuit 22 is connected to another location, for example, in the bottom of silicon wafer 21
Circuit or the side of silicon wafer 21 circuit), fingerprint Identification sensor component need the vertical blank area of a room it is smaller.
Wherein, other circuits or the position of part that through hole can connect as needed are configured, for example, through hole can be with
In silicon wafer 21, and the side or bottom surface of silicon wafer 21 can be extended to, with realize with the side of silicon wafer 21 or
Other circuits on top surface are connected.Fluting 201 can be arranged on the top or top and sidepiece of silicon wafer 21, to realize
It is connected with other circuits on the side or bottom surface of silicon wafer 21.As shown in figure 1, fluting 201 is located on the top surface of silicon wafer 21
And the side of silicon wafer 21 is extended to, closing line 23 is connected circuit of sensor circuit 22 and sidepiece etc..
Alternatively, according to some embodiments of the present invention, fingerprint sensing device assembly 20 can also include having upper opening
Encapsulated layer, sensor circuit 22 can be located in encapsulated layer, and the circuit of sensor circuit 22 or sensor circuit 22 can
To expose from upper opening.Specifically, at least part on the top of encapsulated layer can open wide to form upper opening, sensor electricity
Road 22 includes logicalnot circuit part and circuit, and circuit can expose from upper opening, and logicalnot circuit part can reveal out of upper opening
Go out, or do not expose.Thus, encapsulated layer can protect sensor circuit 22, while can also ensure the finger of sensor circuit 22
Line identification function.
Wherein, when sensor circuit 22 exposes out of encapsulated layer, i.e. the circuit of sensor circuit 22 and logicalnot circuit portion
When point exposing upwards out of encapsulated layer, the silicon wafer 21 of manufacture can be made reasonably to use vertical space less as far as possible, because hand
The amount that the silicon wafer 21 of finger identification sensor encapsulates used extra vertical space is comparatively limited.Wherein, for preparing
The material of encapsulated layer is not limited, for example, can be plastics, resin or ceramics etc..
Alternatively, fingerprint sensing device assembly 20 can also include the soldered elements of at least one compression, sensor circuit 22
It can be coupled with soldered elements.For example, in certain specific embodiments of the invention, silicon wafer 21 is constructed to include one group
Soldered ball, randomly (or pseudorandomly) couples this group of soldered ball with silicon wafer 21.Alternatively, soldered ball need not include actual solder, but
It is that can include other conductive materials, such as golden, other deformable metals, or the physical process in response to such as pressure etc
Other the conductive or semi-conducting materials that can be deformed.
For the fingerprint sensing device assembly 20 with encapsulated layer, soldered ball can be encapsulated in encapsulated layer, next compression
Soldered ball and encapsulated layer, the degree compressed to soldered ball and encapsulated layer.Thus, encapsulated layer is substantially extruded away from soldered ball, and
And soldered ball can be positioned between the other elements of silicon wafer 21 and such as button etc, to conduct electric signal.Due to soldered ball
Or other materials flatly disperses in their layer, therefore this also has the effect that：Their layer operation is with from top
One layer be transmitted to following one layer, not across their layer or any horizontal conductive in their layer.
In the case where silicon wafer 21 is coupled to button, this has the effect that：The capacitor plate of silicon wafer 21 and press
Conductive enhancing between the surface of button；Simultaneously as the distance between epidermis and silicon wafer 21 of user's finger shorten, user's hand
Refer to the electric capacity increase between silicon wafer 21, this can be such that fingerprint sensing device assembly 20 realizes to the information in fingerprint of user again
Remarkable capacitance sensing, fingerprint recognition are more accurate.
Alternatively, equipment component 10 can be made up of at least one of glass, ceramics and sapphire material.It is specific to use
What material, can be configured as needed.Further, in order to preferably identify fingerprint, equipment component 10 be suitable to
The part of user's finger contacts can be made of anisotropic dielectric material.For example, in some embodiments of the invention,
Equipment component 10 can include button and display element in it is at least one, suitable for the part with user's finger contacts can be by
Splenium, press section can be located on button, can also be set on the display element.Press section can use sapphire system
Into.Wherein, sapphire can be that monocrystalline can also be polycrystalline.
Sapphire has anisotropy, and sensor circuit 22 can be made, which preferably to sense the epidermis of user's finger, (or can appoint
Selection of land, the subcutaneous part of the finger of user).Thus, sensor circuit 22 can be shown by means of sapphire anisotropy
Comparatively remarkable Capacitance Coupled, sensor circuit 22 will obtain one group of comparatively remarkable fingerprint image with user's finger
Information.
Certainly,, can also be by one in llowing group of materials or its equivalent for example, button with the part of user's finger contacts
It is individual or multiple be made：Aluminum oxide, glass have its at least some of feature by chemically treated glass, by chemically treated
Compound, or with similarity another compound.Similarly, under applicable circumstances, sensor circuit 22 may be used also
To utilize the electromagnetic property of other materials, by means of these electromagnetic propertys, to show comparatively remarkable with user's finger
Capacitance Coupled.
According to some embodiments of the present invention, equipment component 10 can be formed as flat with the parts of user's finger contacts
Face.Thus, it is easy to the placement of user's finger and the collection of user fingerprints.
Electronic equipment according to embodiments of the present invention includes fingerprint recognition sensing device further 100 according to embodiments of the present invention.
Wherein, electronic equipment can be desktop computer etc..Mobile device according to embodiments of the present invention includes according to embodiments of the present invention
Fingerprint recognition sensing device further 100.Mobile device can be mobile phone or tablet personal computer etc..Wherein, fingerprint recognition sensing device further 100
Installation on electronic equipment or mobile device and with the annexation of miscellaneous part for those skilled in the art
It is appreciated that and easily realizes, will not be repeated here.
Electronic equipment according to embodiments of the present invention and other compositions of mobile device and operation are for this area
It is knowable for those of ordinary skill, is not described in detail herein.
In the description of the invention, it is to be understood that term " " center ", " on ", " under ", "front", "rear", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom ", " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, it is for only for ease of and describes the present invention and simplify description, rather than indicates or imply that signified device or element must have
Specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the invention, " multiple " are meant that at least two, such as two, three
It is individual etc., unless otherwise specifically defined.
In the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be that machinery connects
Connect or electrically connect or can communicate each other；Can be joined directly together, can also be indirectly connected by intermediary, can be with
It is connection or the interaction relationship of two elements of two element internals, is limited unless otherwise clear and definite.For this area
For those of ordinary skill, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature
It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " top " and " above " can be fisrt feature directly over second feature or oblique upper, or to be merely representative of first special
Sign level height is higher than second feature.Fisrt feature second feature " lower section " and " below " can be fisrt feature special second
Immediately below sign or obliquely downward, or be merely representative of fisrt feature level height and be less than second feature.
In the description of this specification, the description of reference term " embodiment " or " specific embodiment ", " example " etc. means
At least one implementation of the present invention is contained in reference to specific features, structure, material or the feature that the embodiment or example describe
In example or example.In this manual, identical embodiment is necessarily directed to the schematic representation of above-mentioned term or shown
Example.Moreover, specific features, structure, material or the feature of description can close in any one or more embodiments or example
Suitable mode combines.In addition, in the case of not conflicting, those skilled in the art can be by described in this specification
Different embodiments or example and the feature of different embodiments or example are combined and combined.
Although embodiments of the invention have been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, one of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changed, replacing and modification.
Claims (11)
- A kind of 1. fingerprint recognition sensing device further, it is characterised in that including：Equipment component, the equipment component include at least one in button and display element；Fingerprint sensing device assembly, the fingerprint sensing device assembly are located at below equipment component, and the fingerprint sensing device assembly can It is coupled to the user fingerprints of user's finger；To user's finger close to sensitive response element, the response element is connected with the equipment component and the response element At least a portion of part is higher than the fingerprint sensing device assembly；Pedestal, the pedestal are provided with pilot hole, and the equipment component and the fingerprint sensing device assembly are located at the pilot hole Interior, the response element is connected with the pedestal and positioned at the periphery of the fingerprint sensing device assembly.
- 2. fingerprint recognition sensing device further according to claim 1, it is characterised in that the pilot hole include the first hole section and Second hole section, the radial dimension of first hole section are more than the radial dimension of second hole section, and the equipment component is located at institute State in the first hole section, at least a portion of the fingerprint sensing device assembly is located in second hole section.
- 3. fingerprint recognition sensing device further according to claim 2, it is characterised in that the response element is located at described first In hole section, one end of the response element is connected with the lower surface of the equipment component, the other end and the bottom of first hole section Wall or side wall are connected.
- 4. fingerprint recognition sensing device further according to claim 1, it is characterised in that the fingerprint sensing device assembly includes energy Enough it is capacitively coupled to one group of capacitive element of the fingerprint of user's finger.
- 5. fingerprint recognition sensing device further according to claim 1, it is characterised in that the fingerprint sensing device assembly includes silicon Chip and sensor circuit, the sensor circuit are arranged on the top of the close user's finger of the silicon wafer.
- 6. fingerprint recognition sensing device further according to claim 5, it is characterised in that formed with least one in the silicon wafer Individual through hole and/or at least one fluting, the sensor circuit couple with the closing line being located in the through hole and/or fluting.
- 7. fingerprint recognition sensing device further according to claim 5, it is characterised in that the fingerprint sensing device assembly also includes Encapsulated layer with upper opening, the sensor circuit are located in the encapsulated layer, the sensor circuit or the sensing The circuit of device circuit exposes from the upper opening.
- 8. fingerprint recognition sensing device further according to claim 5, it is characterised in that the fingerprint sensing device assembly also includes The soldered elements of at least one compression, the sensor circuit couple with the soldered elements.
- 9. the fingerprint recognition sensing device further according to any one of claim 1-8, it is characterised in that the equipment component by At least one of glass, ceramics and sapphire material are made.
- 10. a kind of electronic equipment, it is characterised in that including the fingerprint recognition sensing according to any one of claim 1-9 Device.
- 11. a kind of mobile device, it is characterised in that including the fingerprint recognition sensing according to any one of claim 1-9 Device.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510650265.0A CN105224928B (en) | 2015-10-09 | 2015-10-09 | Fingerprint recognition sensing device further, electronic equipment and mobile device |
| CN201710975492.XA CN107862250B (en) | 2015-10-09 | 2015-10-09 | Fingerprint identification sensing device, electronic equipment and mobile equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510650265.0A CN105224928B (en) | 2015-10-09 | 2015-10-09 | Fingerprint recognition sensing device further, electronic equipment and mobile device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
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| CN109389108B (en) * | 2017-08-08 | 2022-03-01 | 金佶科技股份有限公司 | Image capturing device |
| CN105740764B (en) * | 2016-01-21 | 2018-07-06 | 广东欧珀移动通信有限公司 | Mobile equipment and fingerprint recognition sensing device further |
| CN105512648A (en) * | 2016-01-21 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile equipment and fingerprint recognizing and sensing device |
| CN105512652A (en) * | 2016-01-26 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile terminal and fingerprint recognizing and sensing device |
| CN105740811B (en) * | 2016-01-28 | 2018-02-13 | 广东欧珀移动通信有限公司 | Electronic equipment, mobile device and fingerprint recognition sensing device further |
| CN107832706B (en) * | 2017-11-09 | 2021-10-22 | 深圳市蓝海经略科技有限公司 | Accurate capacitanc fingerprint identification equipment of discernment with drying function |
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| CN103425965A (en) * | 2012-05-18 | 2013-12-04 | 苹果公司 | Capacitive sensor packaging |
| CN205193824U (en) * | 2015-10-09 | 2016-04-27 | 广东欧珀移动通信有限公司 | Fingerprint identification sensing apparatus, electronic equipment and mobile device |
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| JP4266363B2 (en) * | 2004-09-27 | 2009-05-20 | 日本開閉器工業株式会社 | Pressure sensitive fingerprint sensor |
| US8456330B2 (en) * | 2008-09-26 | 2013-06-04 | Apple Inc. | Configurable buttons for electronic devices |
| US10359857B2 (en) * | 2013-07-18 | 2019-07-23 | Immersion Corporation | Usable hidden controls with haptic feedback |
| CN104751124A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103425965A (en) * | 2012-05-18 | 2013-12-04 | 苹果公司 | Capacitive sensor packaging |
| CN104700102A (en) * | 2012-05-18 | 2015-06-10 | 苹果公司 | Capacitive sensor packaging |
| CN104951776A (en) * | 2012-05-18 | 2015-09-30 | 苹果公司 | Capacitive sensor packaging |
| CN205193824U (en) * | 2015-10-09 | 2016-04-27 | 广东欧珀移动通信有限公司 | Fingerprint identification sensing apparatus, electronic equipment and mobile device |
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| CN105224928A (en) | 2016-01-06 |
| CN107862250B (en) | 2021-06-11 |
| CN107862250A (en) | 2018-03-30 |
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