CN105208764A - Circuit board and method for checking configuration state of electronic element by means of same - Google Patents
Circuit board and method for checking configuration state of electronic element by means of same Download PDFInfo
- Publication number
- CN105208764A CN105208764A CN201510210455.0A CN201510210455A CN105208764A CN 105208764 A CN105208764 A CN 105208764A CN 201510210455 A CN201510210455 A CN 201510210455A CN 105208764 A CN105208764 A CN 105208764A
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- China
- Prior art keywords
- pad
- circuit board
- joint sheet
- configuration
- electronic component
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Operations Research (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention relates to a circuit board and a method for checking a configuration state of an electronic element by means of the same. The circuit board according to one embodiment of the invention comprises a bonding pad for mounting the electronic element. The bonding pad comprises a first pad and a second pad which is formed separately from the first pad.
Description
Technical field
The present invention relates to circuit board and use circuit board to check the method for the configuration status of electronic component.
Background technology
In recent years, the multifunction of electronic product and high speed advance rapidly.Corresponding to this trend, circuit board develops with very fast speed.And for associated circuit board, be then required compactization, fine circuitry, excellent electrical characteristic, high reliability, high speed transmission of signals etc.
In order to circuit board or the operating stably of chip (Chip) being installed on circuit board, electromagnetic function can be shielded very important.Therefore, circuit board is configured for shielding electromagnetic EMI (ElectroMagneticInterference: electromagnetic interference) shielding product.
Prior art document
Patent documentation
Patent documentation 1: No. 2013-0292164th, US publication
Summary of the invention
The object of an aspect of of the present present invention is to provide a kind of circuit board and use circuit board to check the method for the configuration status of electronic component.
According to one embodiment of present invention, providing package is containing for the circuit board of the joint sheet of installing electronic elements, and this joint sheet possesses the first pad and pads and separate with first second padding of being formed.
Joint sheet configures in the mode in the bight being positioned at electronic component.
First pad is rectangle, and the second pad is positioned at the outside of the first pad, and has the face parallel with at least one face that first pads.
First pad is for rectangle, and the second pad is positioned at the outside of the first pad, and is formed in the mode of separating with the first bight of padding.
According to another embodiment of the present invention, the method for configuration status checking electronic component is provided, comprises: providing package is containing the step for the circuit board of the joint sheet of installing electronic elements, and this joint sheet possesses the first pad and pads and separate with first second padding of being formed; The step of installing electronic elements on joint sheet; Carry out the first pad and second pad between electric checking to check the step of the configuration status of electronic product.
Electronic component is EMI (ElectroMagneticInterference) shielding product.
Checking the step of configuration status of electronic product, when the result of electric checking be the first pad and second pad be short circuit (Short) state, the configuration of electronic product is bad.
Also comprise: when the configuration of electronic product is bad, electronic product is reinstalled to joint sheet, and again carry out the first pad and second pad between the step of electric checking.
Checking the step of configuration status of electronic product, when the result of electric checking be the first pad and second pad be opening (Open) state, the configuration of electronic product is normal.
Accompanying drawing explanation
Fig. 1 is the exemplary plot of the circuit board that one embodiment of the present of invention are shown.
Fig. 2 is the exemplary plot of the circuit board that an alternative embodiment of the invention is shown.
Fig. 3 is the exemplary plot of the method for the configuration status of the inspection electronic component that embodiments of the invention are shown.
Fig. 4 is the exemplary plot of the method for the configuration status of the inspection electronic component that embodiments of the invention are shown.
Fig. 5 is the exemplary plot of the method for the configuration status of the inspection electronic component that embodiments of the invention are shown.
Fig. 6 is the exemplary plot that the situation that the configuration of electronic product is bad is shown.
Fig. 7 is the exemplary plot that the normal situation of the configuration of electronic product is shown.
[symbol description]
100,200 circuit boards
110,210 first joint sheets
111,211 1-1 pads
112,212 1-2 pads
213 first edge parts
120,220 second joint sheets
121,221 2-1 pads
122,222 2-2 pads
223 Second Edge edges
130,230 the 3rd joint sheets
131,231 3-1 pads
132,232 3-2 pads
233 the 3rd edge parts
140,240 the 4th joint sheets
141,241 4-1 pads
142,242 4-2 pads
243 the 4th edge parts
250 joint sheets
251 first pads
252 second pads
253 edge parts
300 electronic products
400 probes
Embodiment
By about the following detailed description of accompanying drawing and preferred embodiment, object of the present invention, specific advantage and new feature can become clearly.In this manual, when marking Reference numeral to the inscape of each accompanying drawing, as long as same inscape must be noted, even if display in different figures, also same Reference numeral is marked as far as possible.In addition, the term such as " face ", " another side ", " first ", " second " is in order to distinguish an inscape and other inscapes and use, and inscape is not by preceding terms is limited.Below, when illustrating of the present invention, omitting and likely making the indefinite detailed description for related known technology of purport of the present invention.
Below, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 is the exemplary plot of the circuit board that one embodiment of the present of invention are shown.
According to embodiments of the invention, form the first joint sheet the 110 ~ four joint sheet 140 at the outermost layer of circuit board 100.
First joint sheet the 110 ~ four joint sheet 140 of embodiments of the invention is made up of conductive material, is formed in the region of configuration electronic component (not shown).Such as, the first joint sheet the 110 ~ four joint sheet 140 is formed in and directly contacts with each bight of electronic component (not shown) or the position of electrical ties.
According to embodiments of the invention, the first joint sheet 110 comprises 1-1 pad 111 and 1-2 pad 112.In addition, the second joint sheet 120 comprises 2-1 pad 121 and 2-2 pad 122.In addition, the 3rd joint sheet 130 comprises 3-1 pad 131 and 3-2 pad 132.In addition, the 4th joint sheet 140 comprises 4-1 pad 141 and 4-2 pad 142.
According to embodiments of the invention, in the first joint sheet 110,1-1 pad 111 and 1-2 pad 112 are formed in separated mode, do not contact.Second joint sheet the 120 ~ four joint sheet 140 is adopted in this way too.
According to embodiments of the invention, 1-1 pad 111 ~ the 4-1 pad 141 is formed as square, and 1-2 pad 112 ~ the 4-2 pad 142 is formed as rectangle.In addition, 1-2 pad 112 ~ the 4-2 pad 142 lays respectively at the outside of 1-1 pad 111 ~ the 4-1 pad 141.
In an embodiment of the present invention, for ease of understanding, using the medial surface of 1-1 pad 111 ~ the 4-1 pad 141 and 1-2 pad 112 ~ the 4-2 pad 142 as the side in direction of installing electronic product, the side in direction is in addition lateral surface.
According to embodiments of the invention, 1-1 pad 111 ~ the 4-1 pad 141 is formed in the mode of the allocation position in design comprising electronic component.In addition, the medial surface of 1-2 pad 112 ~ the 4-2 pad 142 is formed with the electronic component according to design configurations mode that face separates on the horizontal line of preset distance to be positioned at.Here, the preset distance configuration institute tolerance scope that is electronic component.That is, the benchmark that the configuration of the medial surface formation electronic component of 1-2 pad 112 ~ the 4-2 pad 142 is bad.Such as, when more than any one or its in electronic component and 1-2 pad 112 ~ the 4-2 pad 142 there is electrical ties, this electronic component is the bad electronic component of configuration.Like this, the position of 1-2 pad 112 ~ the 4-2 pad 142 of the benchmark that the configuration of formation electronic component is bad according to the requirement of client or can judge that bad benchmark changes.
According to embodiments of the invention, 1-2 pad 112 is formed as parallel with the 3-2 pad 132 of diagonal.That is, the medial surface of 1-2 pad 112 is parallel with the medial surface of 3-2 pad 132.In addition, 1-2 pad 112 is formed in the mode be positioned on the vertical line of 2-2 pad 122 and 4-2 pad 142.That is, the medial surface of 1-2 pad 112 is formed in the mode be positioned on the vertical line of the medial surface of 2-2 pad 122 and 4-2 pad 142.
Fig. 2 is the exemplary plot of the circuit board that an alternative embodiment of the invention is shown.
According to embodiments of the invention, form the first joint sheet the 210 ~ four joint sheet 240 at the outermost layer of circuit board 200.
First joint sheet the 210 ~ four joint sheet 240 of embodiments of the invention is made up of conductive material, is formed in the region of configuration electronic component (not shown).Such as, the first joint sheet the 210 ~ four joint sheet 240 is formed in and directly contacts with each bight of electronic component (not shown) or the position of electrical ties.
According to embodiments of the invention, the first joint sheet 210 comprises 1-1 pad 211 and 1-2 pad 212.In addition, the second joint sheet 220 comprises 2-1 pad 221 and 2-2 pad 222.In addition, the 3rd joint sheet 230 comprises 3-1 pad 231 and 3-2 pad 232.In addition, the 4th joint sheet 240 comprises 4-1 pad 241 and 4-2 pad 242.
In an embodiment of the present invention, for ease of understanding, using the medial surface of 1-1 pad 211 ~ the 4-1 pad 241 and 1-2 pad 212 ~ the 4-2 pad 242 as the side in direction of installing electronic product, the side in direction is in addition lateral surface.
According to embodiments of the invention, in the first joint sheet 210,1-1 pad 211 and 1-2 pad 212 are formed in separated mode, do not contact.Second joint sheet the 220 ~ four joint sheet 240 is adopted in this way too.
According to embodiments of the invention, 1-1 pad 211 ~ the 4-1 pad 241 is formed as square.In addition, 1-2 pad 212 ~ the 4-2 pad 242 is formed in the mode of the structure respectively with the lateral surface bending along 1-1 pad 211 ~ the 4-1 pad 241.
In addition, according to embodiments of the invention, the first joint sheet the 210 ~ four joint sheet 240 comprises the first edge part the 213 ~ four edge part 243 respectively.
Be described for the first joint sheet 210, the first edge part 213 is link with the 1-1 pad 211 of the first joint sheet 210, and separates the outside along 1-2 pad 212 with 1-2 pad 212 and formed.First edge part 213 of embodiments of the invention and 1-1 pad 211 link, and do not contact with 1-2 pad 212.First edge part 213 of such formation by linking with 1-1 pad 211, when carrying out later for confirming the bad electric checking of the configuration of electronic component, can play increase probe can the function of contact area.Second Edge edge 223, the 3rd edge part 233 of embodiments of the invention are formed in the mode identical with the first edge part 213 respectively with the 4th edge part 243 in the second joint sheet the 220 ~ four joint sheet 240.
The optional component part of first edge part the 213 ~ four edge part 243 of embodiments of the invention, can omit according to the selection of those skilled in the art.
According to embodiments of the invention, 1-1 pad 211 ~ the 4-1 pad 241 is formed in the mode of the allocation position in design comprising electronic component.In addition, the benchmark that the configuration of the medial surface formation electronic component of 1-2 pad 212 ~ the 4-2 pad 242 is bad.Like this, the position of 1-2 pad 212 ~ the 4-2 pad 242 of the benchmark that the configuration of formation electronic component is bad according to the requirement of client or can judge that bad benchmark changes.
Although see figures.1.and.2 the structure of joint sheet illustrates and illustrated, the present invention is not limited to the structure of the joint sheet of Fig. 1 and Fig. 2.That is, the structure of the joint sheet of Fig. 1 and Fig. 2 is example, if can play the function of above-mentioned joint sheet, its structure can carry out various change.
Fig. 3 ~ Fig. 5 is the exemplary plot of the method for the configuration status of the inspection electronic component that embodiments of the invention are shown.
With reference to Fig. 3, providing package is containing the circuit board 200 of joint sheet 250.
In an embodiment of the present invention, be described for the circuit board 200 of Fig. 2.
For ease of illustrating and understanding, in Fig. 3 ~ Fig. 5, first joint sheet the 210 ~ four joint sheet 240 of Fig. 2 is collectively referred to as joint sheet 250.In addition, in Fig. 3 ~ Fig. 5, the 1-1 pad 211 of Fig. 2,2-1 pad 221,3-1 pad 231 and 4-1 pad 241 are collectively referred to as the first pad 251.In addition, in Fig. 3 ~ Fig. 5, the 1-2 pad 212 of Fig. 2,2-2 pad 222,3-2 pad 232 and 4-2 pad 242 are collectively referred to as the second pad 252.In addition, in Fig. 3 ~ Fig. 5, first edge part the 213 ~ four edge part 243 of Fig. 2 is collectively referred to as edge part 253.
Four joint sheets 250 are formed at the outermost layer of the circuit board 200 of embodiments of the invention.In addition, joint sheet 250 comprise the first pad 251, second pad 252 and edge part 253, first pad 251 and second pad 252 to be separated from each other and the mode of discontiguous state is formed to become.
About the explanation that the detailed content reference of the circuit board 200 of embodiments of the invention is relevant to Fig. 2.
With reference to Fig. 4, circuit board 200 is installed electronic product 300.
According to embodiments of the invention, electronic product 300 is directly to contact with joint sheet 250 or the mode of electrical ties is installed.The electronic product 300 of embodiments of the invention is made up of conductive material.Such as, being EMI (ElectroMagneticInterference) shielding product, is band (Tape) formula or film (Film) formula.
According to embodiments of the invention, in order to improve cementability, electronic product 300 is bonded on circuit board 200 by conductive adhesive.
With reference to Fig. 5, carry out electric checking.
According to embodiments of the invention, electric checking be for check electronic product 300 configuration status and carry out.
According to embodiments of the invention, the probe (Probe) 400 being used for electric checking is padded with first respectively and 251, second pads 252, edge part 253 or electronic product 300 contact.Then, the probe 400 via contact applies the signal of telecommunication to the first pad 251, second pad 252, edge part 253 or electronic product 300.Such as, the signal of telecommunication can be electric current.
By the electric checking of embodiments of the invention, utilize the electrical characteristic of electronic product 300, can confirm that the first pad 251 and second pads short-circuit condition or the open state of 252.
Such as, when the signal of telecommunication from the second pad 252 of identical joint sheet 250 being detected when applying the signal of telecommunication via the first pad 251, edge part 253 or electronic product 300, the first pad 251 and second pad 252 with regard to be electric on short-circuit condition.Should illustrating, can also be confirmed whether when applying the signal of telecommunication to electronic product 300 signal of telecommunication from four second pads 252 to be detected simultaneously.
According to embodiments of the invention, as long as any one when carrying out electric checking in four joint sheets 250 is short-circuit condition, then the configuration of electronic product 300 is just bad.That is, make because the configuration of electronic product 300 is bad electronic product 300 and second pad 252 contact time, first pads 251 and second pads 252 and is in electrical ties state via electronic product 300.Therefore, when carrying out electric checking, the signal of telecommunication of the second pad 252 from this joint sheet 250 can be detected, can confirm that the first pad 251 and second pads 252 for short circuit (Short) state.Here, the second pad 252 becomes the bad benchmark of the configuration of electronic product 300.
According to embodiments of the invention, when carrying out electric checking, four joint sheets 250 are all open state, the configuration of electronic product 300 is just normal.That is, when electronic product 300 does not contact with four second any one pad in 252, the first pad 251 and second pads 252 whole non-electrical ties.Therefore, when carrying out electric checking, all can not the signal of telecommunication be detected from four second pads 252, can confirm that the first pad 251 and second pads 252 for open (Open) state.
In an embodiment of the present invention, although to apply the signal of telecommunication to the first pad 251 or electronic product 300, and be that example is illustrated at the second pad 252 detection signal of telecommunication, also can be contrary with it.That is, electric checking also can apply the signals of telecommunication to the second pad 252, and detects the signal of telecommunication to confirm via the first pad 251 or electronic product 300 short-circuit condition or the open state that first pad 251 and second pads 252.
According to embodiments of the invention, the joint sheet 250 comprising the first pad 251 and the second pad 252 can be used by electric checking method to be checked the configuration status of electronic product 300.The inspection of the configuration status of related electronic products 300 with on circuit board 200, attached to electronic product 300 after the confirmation circuit pattern that carries out and electronic product carry out with or without bad electric checking simultaneously.Therefore, it is possible to do not increase the inspection that operation, cost and time just carry out the configuration status of electronic product 300.
According to embodiments of the invention, when the configuration confirming electronic product 300 is bad, the step of Fig. 4 and Fig. 5 can also be repeated to this electronic product 300.Such as, when confirmed by electric checking electronic product 300 be configured to bad, this electronic product 300 can be reinstalled.In addition, after reinstalling electronic product 300, carry out the configuration status that electric checking can check electronic product 300 again.In this case, the inspection of state also only can be configured to the electronic product 300 reinstalled and this joint sheet 250.
Fig. 6 is the exemplary plot that the situation that the configuration of electronic product is bad is shown.
According to embodiments of the invention, due to electronic product 300, make 3-1 pad 231 and 3-2 pad 232 be in electrical ties state, 4-1 pad 241 and 4-2 pad 242 are in electrical ties state.In this case, if carry out electric checking, the signal of telecommunication from 3-2 pad 232 and 4-2 pad 242 will be detected.Like this, when the signal of telecommunication being detected, the 3rd joint sheet 230 and the 4th joint sheet 240 are short-circuit condition, and being configured to of electronic product 300 is bad.
Fig. 7 is the exemplary plot that the normal situation of the configuration of electronic product is shown.
According to embodiments of the invention, because the configuration of electronic product 300 is normal, electronic product 300 not with any one electrical ties in 1-2 pad 212 ~ the 4-2 pad 242.In this case, if carry out electric checking, all the signal of telecommunication can not be detected from 1-2 pad 212 ~ the 4-2 pad 242.In this case, the first joint sheet the 210 ~ four joint sheet 240 is all open state, and electronic product 300 is configured normally.
The quantity of the joint sheet of embodiments of the invention and structure are example, and the present invention is not limited to this.That is, the quantity of joint sheet and structure can change according to the selection of those skilled in the art.
Above, although based on specific embodiment to invention has been detailed description, but this is that the present invention is not limited to this in order to specifically describe the present invention, can carry out being out of shape and/or improving in technological thought of the present invention if the people with this field general knowledge understands.
All belong to scope of the present invention to simple distortion of the present invention or change, concrete protection range of the present invention can be clear and definite according to claims.
Claims (18)
1. a circuit board, is characterized in that, comprises the joint sheet for installing electronic elements, and this joint sheet possesses the first pad and pads and separate with described first second padding of being formed.
2. circuit board according to claim 1, is characterized in that,
Described joint sheet is multiple.
3. circuit board according to claim 1, is characterized in that,
Described joint sheet configures in the mode in the bight being positioned at described electronic component.
4. circuit board according to claim 1, is characterized in that,
Described first pad is rectangle, and described second pad is positioned at the outside of described first pad, and has the face parallel with at least one face that described first pads.
5. circuit board according to claim 1, is characterized in that,
Described first pad is for rectangle, and described second pad is positioned at the outside of described first pad, and is formed in the mode of separating with the described first bight of padding.
6. circuit board according to claim 5, is characterized in that,
Described second pad is formed in the mode parallel with two faces that described first pads.
7. circuit board according to claim 1, is characterized in that,
The position of medial surface of the second pad is the position forming the bad benchmark of the configuration of described electronic component.
8. a circuit board, is characterized in that, comprising:
Electronic component;
Joint sheet, configures in the mode in the bight being positioned at described electronic component, and the second pad possessing the first pad and separately formed in the outside of described first pad,
Wherein, described first pad is rectangle, and described second pad is positioned at the bight of described first pad, and is formed in the mode parallel with two faces that described first pads.
9. circuit board according to claim 8, is characterized in that,
Described joint sheet is multiple.
10. circuit board according to claim 8, is characterized in that,
The position of medial surface of the second pad is the position forming the bad benchmark of the configuration of described electronic component.
11. circuit boards according to claim 8, is characterized in that,
Described electronic component is EMI shielding product.
12. 1 kinds of methods checking the configuration status of electronic component, is characterized in that, comprising:
Providing package is containing for the step of the circuit board of the joint sheet of installing electronic elements, and this joint sheet possesses the first pad and pads and separate with described first second padding of being formed;
The step of installing electronic elements on described joint sheet;
Carry out described first pad and second pad between electric checking to check the step of the configuration status of electronic product.
The method of the configuration status of 13. inspection electronic components according to claim 12, is characterized in that, is providing the step of described circuit board, and described joint sheet is multiple.
The method of the configuration status of 14. inspection electronic components according to claim 12, is characterized in that, is providing the step of described circuit board, and the position of medial surface of described second pad is the position forming the bad benchmark of the configuration of described electronic component.
The method of the configuration status of 15. inspection electronic components according to claim 12, is characterized in that, installing the step of described electronic component, described electronic component is EMI shielding product.
The method of the configuration status of 16. inspection electronic components according to claim 12, it is characterized in that, checking the step of configuration status of described electronic product, when the result of described electric checking be described first pad and second pad be short-circuit condition, the configuration of electronic product is bad.
The method of the configuration status of 17. inspection electronic components according to claim 16, it is characterized in that, also comprise: when the configuration of described electronic product is bad, described electronic product is reinstalled to joint sheet, and again carry out described first pad and second pad between the step of electric checking.
The method of the configuration status of 18. inspection electronic components according to claim 12, it is characterized in that, checking the step of configuration status of described electronic product, when the result of described electric checking be described first pad and second pad be open state, the configuration of electronic product is normal.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140076691A KR102297284B1 (en) | 2014-06-23 | 2014-06-23 | Circuit board and method for placement state test of electric component using the same |
| KR10-2014-0076691 | 2014-06-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105208764A true CN105208764A (en) | 2015-12-30 |
| CN105208764B CN105208764B (en) | 2018-10-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510210455.0A Active CN105208764B (en) | 2014-06-23 | 2015-04-29 | The method that circuit board and use circuit board check the configuration status of electronic component |
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| Country | Link |
|---|---|
| JP (1) | JP2016009864A (en) |
| KR (1) | KR102297284B1 (en) |
| CN (1) | CN105208764B (en) |
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- 2014-06-23 KR KR1020140076691A patent/KR102297284B1/en active IP Right Grant
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- 2015-04-29 CN CN201510210455.0A patent/CN105208764B/en active Active
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| US20050265009A1 (en) * | 2004-06-01 | 2005-12-01 | Nokia Corporation | Detecting short circuits and detecting component misplacement |
| US20070170945A1 (en) * | 2006-01-26 | 2007-07-26 | Paul Skow | Printed circuit board and method of use thereof |
| TW201021239A (en) * | 2008-11-20 | 2010-06-01 | Everlight Electronics Co Ltd | Circuit structure of package carrier and multi-chip package |
| CN202425196U (en) * | 2011-12-26 | 2012-09-05 | 福建联迪商用设备有限公司 | Inductive bonding pad and PCB (printed circuit board) |
| CN103354072A (en) * | 2013-02-20 | 2013-10-16 | 友达光电股份有限公司 | display device and detection method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150146293A (en) | 2015-12-31 |
| CN105208764B (en) | 2018-10-30 |
| JP2016009864A (en) | 2016-01-18 |
| KR102297284B1 (en) | 2021-09-02 |
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