CN105174195A - WLP (wafer-level packaging) structure and method for cavity MEMS (micro-electromechanical system) device - Google Patents
WLP (wafer-level packaging) structure and method for cavity MEMS (micro-electromechanical system) device Download PDFInfo
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Abstract
The invention provides a WLP (wafer-level packaging) structure and method for a cavity MEMS (microelectromechanical system) device. The structure comprises a cover plate wafer, an integrated circuit wafer and a connecting part, wherein the cover plate wafer comprises a first horizontal plane, a second horizontal plane, a first groove, a first redistribution layer and a second redistribution layer, and bulges are arranged on the redistribution layer; the integrated circuit wafer comprises a third horizontal plane and a fourth horizontal plane, a second groove is formed in the third horizontal plane, and pads are arranged on the third horizontal plane; the connecting part is connected with the cover plate wafer and the integrated circuit wafer, and the first groove and the second groove form a cavity. The reliability of the cavity MEMS device is improved, the size of the device is reduced, the wafer utilization rate is high, the cost is lower, the shape of the device is regular, TSV (through silicon vias)/RDl (redistribution layer) processes are separated from Asic (application specific integrated circuit)/MEMS wafers on a cap, the process yield can be controlled separately, and no complex integration design requirement exists.
Description
Technical field
The present invention relates to field of semiconductor package, particularly relates to a kind of wafer level packaging structure and method for packing of cavity MEMS.
Background technology
Wafer-level packaging (WLP) obtains the growth be exceedingly fast due to advantages such as encapsulation process efficiency are high, package dimension is compact, electric heating property is good in IC/MEMS device, and the interconnection line in its encapsulation is usually without wire bonding (WB).Interior interconnection has various ways, common are: (1) directly makes redistributing layer (RedistributionLayer on the dielectric layer of die front side, i.e. RDL), pad on tube core is distributed as again encapsulation I/O array pad above, such as common IC does not have the MEMS of movable member with some.(2) on tube core bulk material, make groove or slope, then by plane printed line, die front side pad is connected to side or the back side, make I/O (input/output) exit afterwards again, the CIS encapsulation technology of such as Shellcase.(3) TSV (ThroughSiliconVias) technology, directly passes perpendicularly through bulk material from die front side pad and is connected to the back side.But above interconnection mode is for cavity MEMS and be not suitable for; (1) mode needs protection due to cavity or has the reasons such as movable member directly to apply; (2) there is the defects such as packaging appearance is abnormal, reliability is not high, die front side/backside area utilization rate is low in mode; (3) mode is when through hole thickness is larger, will face the problems such as process costs is high, technical difficulty is large.
A lot of MEMS is all containing movable member, encapsulation is needed to provide cavity (Cavity) to protect it or this part as functional realiey of cavity, and the vacuum in cavity or gaseous environment will be kept, a lid (Cap) is so just needed to form bonding (bonding), various ways is bonded with in WLP encapsulation, common are Direct Bonding (directwaferbonding), anode linkage (anodicbonding), binder bonding (adhesivebonding), metal bonding, glass solder bonding etc., wherein binder bonding (as some epoxy) is particularly suitable for the device of very low technological temperature requirement, but bonding itself cannot provide interconnect function, although metal bonding can provide interconnection but its technological temperature is higher relative to epoxy, be not suitable for the device to technological temperature sensitivity, other bonding pattern technological temperature is higher and effects on surface pattern or material have particular/special requirement.
For some thermally sensitive cavity devices, need the encapsulation of filling specific gas in such as chamber, the bonding technology according to higher temperature can cause gas and escapes and cause cavity pressure not enough, faces the challenge of above-mentioned interconnect design simultaneously.
Therefore, be necessary to propose a kind of new scheme.
Summary of the invention
An object of the present invention is the defect overcoming prior art, provides a kind of wafer level packaging structure of cavity MEMS, and it has cavity MEMS for temperature sensitive, realizes the requirement of low cost, high reliability and air seal.
Two of object of the present invention is the wafer-level packaging method providing a kind of cavity MEMS.It has cavity MEMS for temperature sensitive, realizes the requirement of low cost, high reliability and air seal.
For reaching one of aforementioned object, the wafer level packaging structure of cavity MEMS of the present invention, it comprises:
One cover plate disk, it has the first horizontal plane and the second horizontal plane, described first horizontal plane is formed with the first groove, from the bottom of described first groove, extremely described second horizontal plane offers TSV through hole, bottom part from described first horizontal plane to described first groove is furnished with the first redistributing layer, described first redistributing layer covers described TSV through hole, the first redistributing layer on described first horizontal plane is provided with lug boss, described second horizontal plane is distributed with the second redistributing layer, described second redistributing layer covers described TSV through hole, described second horizontal plane is provided with I/O exit,
One integrated circuit wafer, it has the 3rd horizontal plane and the 4th horizontal plane, and described 3rd horizontal plane is formed with the second groove, and described 3rd horizontal plane is provided with liner;
A junction, it is arranged between the first horizontal plane of described cover plate disk and the 3rd horizontal plane of integrated circuit wafer, there is the first connecting portion and the second connecting portion, described cover plate disk and integrated circuit wafer are connected to form physical connection by the first connecting portion, described first groove and the second groove form a cavity simultaneously, while described cover plate disk is connected with integrated circuit wafer, described lug boss and liner are also joined together to form the second connecting portion, realize cover plate disk and are connected with the conduction of integrated circuit wafer.
As the present invention one preferred embodiment, it also comprises sensor or actuator, and it is arranged in described cavity.
As the present invention one preferred embodiment, described first connecting portion is macromolecular compound layer, only seals cavity, does not participate in electrical connection; Described second connecting portion, as metal or metal alloy weld layer, only realizes electrical connection, does not participate in sealing.
As the present invention one preferred embodiment, the material of described cover plate disk is one or more in silicon, glass, quartz, pottery.
As the present invention one preferred embodiment, can be that gas is filled or vacuum in described cavity.
As the present invention one preferred embodiment, the degree of depth of described TSV through hole is 50-100um.
As the present invention one preferred embodiment, described first connecting portion can be airtight or non-hermetically sealed to the sealing of cavity.
Further, for reaching aforementioned object two, the wafer-level packaging method of cavity MEMS of the present invention, it comprises the steps:
S1: a cover plate disk is provided, it has the first horizontal plane and the second horizontal plane, and described first horizontal plane is formed with the first groove;
S2: extremely described second horizontal plane offers TSV through hole from the bottom of described first groove;
S3: the bottom part from described first horizontal plane to described first groove is furnished with the first redistributing layer, and described first redistributing layer covers described TSV through hole;
S4: the first redistributing layer on described first horizontal plane arranges lug boss;
S5: apply the first connecting portion on described first horizontal plane, described first connecting portion is macromolecular compound layer;
S6 a: integrated circuit wafer is provided, it has the 3rd horizontal plane and the 4th horizontal plane, and described 3rd horizontal plane is formed with the second groove, and described 3rd horizontal plane is provided with liner;
S7: step S5 is connected with S6 by the first connecting portion, first horizontal plane of described cover plate disk and the 3rd horizontal plane of integrated circuit wafer are connected to form sealing, while described cover plate disk is connected with integrated circuit wafer, described lug boss and liner bonding form the second connecting portion, described second connecting portion connects as conduction, and after connecting, described first groove and the second groove form a cavity;
S8: the second redistributing layer is set on the second horizontal plane of described cover plate disk and covers insulating barrier.
Further, described step S2 can also before S1 or after S3.
Further, also comprise after described step S8: on the second redistributing layer of described cover plate disk, I/O exit is set.
Further, also comprise after described step S7 that to carry out abrasive disc to cover plate disk as required thinning.
Beneficial effect of the present invention: compared with prior art, tool of the present invention has the following advantages:
(1) reliability of cavity MEMS is made to promote.
(2) device dimensions shrink, disk utilization rate is high.
(3) cost is lower.
(5) device shape rule, promotes client SMT performance.
(6) TSV/RDL technique is on cap (cover plate), with Asic (ApplicationSpecificIntergratedCircuits, integrated circuit)/MEMS (MicroelectromechanicalSystems, MEMS) disk separation, can Controlling Technology yield separately, without complex fusion designing requirement.
Accompanying drawing explanation
Figure 1A-1H is the wafer level packaging structure of cavity MEMS of the present invention and the flow chart of method for packing;
Fig. 2 is the wafer level packaging structure structural representation in one embodiment of cavity MEMS of the present invention;
Fig. 3 is the wafer level packaging structure structural representation in another embodiment of cavity MEMS of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is described in further detail.
Alleged herein " embodiment " or " embodiment " refers to special characteristic, structure or the characteristic that can be contained at least one implementation of the present invention.Different local in this manual " in one embodiment " occurred not all refers to same embodiment, neither be independent or optionally mutually exclusive with other embodiments embodiment.
Refer to Figure 1A-1H, flow chart that Fig. 2 and Fig. 3, Fig. 1-1H is the wafer-level packaging method of cavity MEMS of the present invention.Fig. 2 is the wafer level packaging structure structural representation in one embodiment of cavity MEMS of the present invention.Fig. 3 is the wafer level packaging structure structural representation in another embodiment of cavity MEMS of the present invention.As Figure 1-3, the wafer level packaging structure of described cavity MEMS comprises a cover plate disk 100, integrated circuit wafer 200 and the first connecting portion 108 by described cover plate disk 100 and integrated circuit wafer 200 phase physical connection.Described cover plate disk 100 and integrated circuit wafer 200 form a cavity 111, accommodate sensor or actuator 300 in described cavity 111.
Described cover plate disk 100, it has the first horizontal plane 101 and the second horizontal plane 102, described first level 101 is formed with the first groove 103, from the bottom of described first groove 103, extremely described second horizontal plane 102 offers TSV through hole 104, bottom part from described first horizontal plane 101 to described first groove 103 is furnished with the first redistributing layer 105, described first redistributing layer 105 covers described TSV through hole 104, the first redistributing layer 105 on described first horizontal plane 101 is provided with lug boss 107 (bump), in described second level, 102 are distributed with the second redistributing layer 106, described second redistributing layer 106 covers described TSV through hole 104.In the present invention, the degree of depth of described TSV through hole 104 can be reduced to 50-100um, this not only process costs and technical difficulty significantly lower, but also improve the stability of structure.In the present invention, the material of described cover plate disk is one or more in silicon, glass, quartz, pottery.
Refer to Fig. 2, described second horizontal plane 102 is provided with I/O exit 109.The quantity of described I/O exit 109 is one or more.Refer to Fig. 3, on described second horizontal plane 102, the both sides of I/O exit 109 are coated with insulating barrier 110.
Please continue to refer to Figure 1A-1H.Described integrated circuit wafer 200, it has the 3rd horizontal plane 201 and the 4th horizontal plane 202, and described 3rd horizontal plane 201 is formed with the second groove 203, and described 3rd horizontal plane 201 is provided with liner (pad) 204.In other embodiments, described integrated circuit wafer the 3rd horizontal plane can not also arrange the second groove, the 3rd horizontal plane only has the holding tank holding sensor or actuator 300.
In one embodiment, the first redistributing layer 105 on described first horizontal plane 101 has preset distance to the edge of described first horizontal plane 101; The second redistributing layer 106 on described second horizontal plane 102 has preset distance to the edge of described second horizontal plane 102.
Described connecting portion, it to be arranged between the first horizontal plane 101 of described cover plate disk 100 and the 3rd horizontal plane of integrated circuit wafer 200 201, has the first connecting portion 108 and the second connecting portion 112.Described cover plate disk 100 and integrated circuit wafer 200 are connected to form physical connection by the first connecting portion 108, and described first groove 103 and the second groove 203 form a cavity 111 simultaneously, and sensor or actuator 300 are arranged in described cavity 111.While described cover plate disk 100 is connected with integrated circuit wafer 200, described lug boss 107 and liner also 204 are joined together to form the second connecting portion 112, thus realize cover plate disk 100 and be connected with the conduction of integrated circuit wafer 200.The sealing of described first connecting portion 108 pairs of cavitys 111 can be airtight or non-hermetically sealed.
In this embodiment, described first connecting portion 108 macromolecular compound layer, it only seals cavity, does not participate in electrical connection; Described second connecting portion 112, as metal or metal alloy weld layer, only realizes electrical connection, does not participate in sealing.This macromolecular compound can for but be not limited to epoxy resin layer (Epoxy), the material of described second connecting portion be but be not limited in Ti/Pt, Ti/W and Cr/Pt one or more.In one embodiment, be that gas is filled or vacuum in described cavity 111, described gaseous matter is including but not limited to one or more in sulfur hexafluoride, xenon, 2,3,3,3-tetrafluoeopropenes and propane.
Please continue to refer to Figure 1A-1H.The wafer-level packaging method of cavity MEMS of the present invention is as follows:
S1: provide a cover plate disk 100, it has the first horizontal plane 101 and the second horizontal plane 102, and described first horizontal plane 101 is formed with the first groove 103.
S2: extremely described second horizontal plane 102 offers TSV through hole 104 from the bottom of described first groove 103.
S3: the bottom part from described first horizontal plane 101 to described first groove 103 is furnished with the first redistributing layer 105, and described first redistributing layer 105 covers described TSV through hole 104.
S4: the first redistributing layer 105 on described first horizontal plane 101 arranges lug boss 107.Liner with integrated circuit wafer is carried out bonding by described lug boss, forms metal bonding layer or weld layer.The material of described lug boss 107 be but be not limited in CuSn, AuSn and AuIn one or more.
S5: apply the first connecting portion 108 on described first horizontal plane 101, described in be the first macromolecular compound layer, this macromolecular compound can for but be not limited to epoxy resin (epoxy).Coating after epoxy surface or higher than/or lower than bump height.
S6: provide an integrated circuit wafer 200, it has the 3rd horizontal plane 201 and the 4th horizontal plane 202, and described 3rd horizontal plane 201 is formed with the second groove 203, and described 3rd horizontal plane 201 is provided with liner 204.Described liner 204 carries out bonding with the lug boss 107 of cover plate disk 100, forms metal bonding layer or weld layer.The material of described liner 204 be but be not limited in Au, Sn, CuSn, AuSn and AuIn one or more.
S7: be connected with S6 by step S5 by the first connecting portion 108, the first horizontal plane 101 of described cover plate disk 100 and the 3rd horizontal plane 201 of integrated circuit wafer 200 are connected to form sealing.While described cover plate disk 100 is connected with integrated circuit wafer 200, described lug boss 107 and liner 204 bonding form the second connecting portion 112, and described second connecting portion 112 connects as conduction.After connecting, described first groove 103 and the second groove 203 form a cavity 111.In this step S7, when described cover plate disk 100 and integrated circuit wafer 200 are carried out bonding, bump is out of shape under pressure, and auxiliary temperature realizes good contact simultaneously, and epoxy realizes filling and sealing.By selecting suitable epoxy/bump height, realize the bonded layer thickness (BLT, bondlinethickness) needed.Epoxy first solidifies at lower temperature (such as 100 DEG C), realizes cavity air seal, is warming up to metal bonding temperature further, in one-time process, realize sealing and interconnection simultaneously.By controlling temperature rate, promoting epoxy glue connection intensity and reducing internal stress.
S8: the second redistributing layer 106 is set on the second horizontal plane 102 of described cover plate disk 100.
In one embodiment, described step S2 also can before S1 or after S3.
In one embodiment, also comprise after described step S7 that to carry out abrasive disc to cover plate disk 100 thinning.
Refer to Fig. 2, as shown in Figure 2, also comprise after described step S8: I/O exit 109 is set on the second redistributing layer 106 of described cover plate disk 100.The present invention does not limit described I/O exit 109.
Refer to Fig. 3, as shown in Figure 3, on the second horizontal plane 102 of described cover plate disk 100, the surrounding of I/O exit 109 is coated with insulating barrier 110.
Tool of the present invention has the following advantages:
(1) reliability of cavity MEMS is made to promote.
(2) device dimensions shrink, disk utilization rate is high.
(3) cost is lower.
(5) device shape rule, promotes client SMT performance.
(6) TSV/RDL technique is on cap, is separated with Asic/MEMS disk, can Controlling Technology yield separately, without complex fusion designing requirement.
Above-mentioned explanation fully discloses the specific embodiment of the present invention.It is pointed out that the scope be familiar with person skilled in art and any change that the specific embodiment of the present invention is done all do not departed to claims of the present invention.Correspondingly, the scope of claim of the present invention is also not limited only to previous embodiment.
Claims (11)
1. a wafer level packaging structure for cavity MEMS, is characterized in that: it comprises:
One cover plate disk, it has the first horizontal plane and the second horizontal plane, described first horizontal plane is formed with the first groove, from the bottom of described first groove, extremely described second horizontal plane offers TSV through hole, bottom part from described first horizontal plane to described first groove is furnished with the first redistributing layer, described first redistributing layer covers described TSV through hole, the first redistributing layer on described first horizontal plane is provided with lug boss, described second horizontal plane is distributed with the second redistributing layer, described second redistributing layer covers described TSV through hole, described second horizontal plane is provided with I/O exit,
One integrated circuit wafer, it has the 3rd horizontal plane and the 4th horizontal plane, and described 3rd horizontal plane is formed with the second groove, and described 3rd horizontal plane is provided with liner;
A junction, it is arranged between the first horizontal plane of described cover plate disk and the 3rd horizontal plane of integrated circuit wafer, there is the first connecting portion and the second connecting portion, described cover plate disk and integrated circuit wafer are connected to form physical connection by the first connecting portion, described first groove and the second groove form a cavity simultaneously, while described cover plate disk is connected with integrated circuit wafer, described lug boss and liner are also joined together to form the second connecting portion, realize cover plate disk and are connected with the conduction of integrated circuit wafer.
2. the wafer level packaging structure of cavity MEMS according to claim 1, it is characterized in that: it also comprises sensor or actuator, it is arranged in described cavity.
3. the wafer level packaging structure of cavity MEMS according to claim 1, is characterized in that: described first connecting portion is macromolecular compound layer, only seals cavity, does not participate in electrical connection; Described second connecting portion, as metal or metal alloy weld layer, only realizes electrical connection, does not participate in sealing.
4. the wafer level packaging structure of cavity MEMS according to claim 1, is characterized in that: the material of described cover plate disk is one or more in silicon, glass, quartz, pottery.
5. the wafer level packaging structure of cavity MEMS according to claim 1, is characterized in that: can be that gas is filled or vacuum in described cavity.
6. the wafer level packaging structure of cavity MEMS according to claim 1, is characterized in that: the degree of depth of described TSV through hole is 50-100um.
7. the wafer level packaging structure of cavity MEMS according to claim 1, is characterized in that: described first connecting portion can be airtight or non-hermetically sealed to the sealing of cavity.
8. a wafer-level packaging method for cavity MEMS, is characterized in that: it comprises the steps:
S1: a cover plate disk is provided, it has the first horizontal plane and the second horizontal plane, and described first horizontal plane is formed with the first groove;
S2: extremely described second horizontal plane offers TSV through hole from the bottom of described first groove;
S3: the bottom part from described first horizontal plane to described first groove is furnished with the first redistributing layer, and described first redistributing layer covers described TSV through hole;
S4: the first redistributing layer on described first horizontal plane arranges lug boss;
S5: apply the first connecting portion on described first horizontal plane, described first connecting portion is macromolecular compound layer;
S6 a: integrated circuit wafer is provided, it has the 3rd horizontal plane and the 4th horizontal plane, and described 3rd horizontal plane is formed with the second groove, and described 3rd horizontal plane is provided with liner;
S7: step S5 is connected with S6 by the first connecting portion, first horizontal plane of described cover plate disk and the 3rd horizontal plane of integrated circuit wafer are connected to form sealing, while described cover plate disk is connected with integrated circuit wafer, described lug boss and liner bonding form the second connecting portion, described second connecting portion connects as conduction, and after connecting, described first groove and the second groove form a cavity;
S8: the second redistributing layer is set on the second horizontal plane of described cover plate disk and covers insulating barrier.
9. the wafer-level packaging method of cavity MEMS according to claim 8, is characterized in that: described step S2 can before S1 or after S3.
10. the wafer-level packaging method of cavity MEMS according to claim 8, is characterized in that: the second redistributing layer being also included in described cover plate disk after described step S8 arranges I/O exit.
The wafer-level packaging method of 11. cavity MEMS according to claim 8, is characterized in that: also comprise after described step S7 that to carry out abrasive disc to cover plate disk thinning.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552054A (en) * | 2016-02-03 | 2016-05-04 | 美新半导体（无锡）有限公司 | Wafer-level package structure and manufacturing method thereof |
| CN105668502A (en) * | 2016-03-24 | 2016-06-15 | 美新半导体（无锡）有限公司 | Airtight encapsulating structure with cavity device and manufacturing method thereof |
| CN106986300A (en) * | 2016-01-21 | 2017-07-28 | 中国科学院上海微系统与信息技术研究所 | The wafer-level encapsulation method and structure of micro-nano mechanical wafer |
| WO2017164816A1 (en) * | 2016-03-24 | 2017-09-28 | Agency For Science, Technology And Research | A through silicon interposer wafer and method of manufacturing the same |
| CN107749400A (en) * | 2017-11-27 | 2018-03-02 | 华天科技（西安）有限公司 | A kind of fingerprint recognition chip-packaging structure and method for packing |
| CN108217579A (en) * | 2017-12-29 | 2018-06-29 | 中国科学院半导体研究所 | Wafer level high vacuum leadless packaging method based on silica glass anode linkage |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6630725B1 (en) * | 2000-10-06 | 2003-10-07 | Motorola, Inc. | Electronic component and method of manufacture |
| US20060094158A1 (en) * | 2004-10-28 | 2006-05-04 | Samsung Electronics Co., Ltd. | Fabrication method of packaging substrate and packaging method using the packaging substrate |
| US20060175707A1 (en) * | 2005-02-04 | 2006-08-10 | Samsung Electronics Co., Ltd | Wafer level packaging cap and fabrication method thereof |
| CN1851888A (en) * | 2006-03-23 | 2006-10-25 | 美新半导体（无锡）有限公司 | Round-grade packing integrated-circuit method |
| US20070164410A1 (en) * | 2006-01-16 | 2007-07-19 | Samsung Electronics Co., Ltd. | Wafer level packaging cap and fabrication method thereof |
| US20100019393A1 (en) * | 2008-07-23 | 2010-01-28 | Industrial Technology Research Institute | Packaging structure for integration of microelectronics and mems devices by 3d stacking and method for manufacturing the same |
| CN101878527A (en) * | 2007-11-30 | 2010-11-03 | 斯盖沃克斯瑟路申斯公司 | Wafer level packaging using flip chip mounting |
| CN101941673A (en) * | 2010-09-10 | 2011-01-12 | 北京航天时代光电科技有限公司 | Micro electro mechanical system wafer-level vacuum packaging method |
| CN204022464U (en) * | 2014-06-30 | 2014-12-17 | 华天科技（昆山）电子有限公司 | Three-dimensional MEMS encapsulating structure |
| CN104445046A (en) * | 2014-06-24 | 2015-03-25 | 华天科技（昆山）电子有限公司 | Novel wafer-level MEMS chip packaging structure and packaging method thereof |
| CN205087913U (en) * | 2015-10-12 | 2016-03-16 | 美新半导体（无锡）有限公司 | Wafer -level package structure of cavity MEMS device |
-
2015
- 2015-10-12 CN CN201510656865.8A patent/CN105174195A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6630725B1 (en) * | 2000-10-06 | 2003-10-07 | Motorola, Inc. | Electronic component and method of manufacture |
| US20060094158A1 (en) * | 2004-10-28 | 2006-05-04 | Samsung Electronics Co., Ltd. | Fabrication method of packaging substrate and packaging method using the packaging substrate |
| US20060175707A1 (en) * | 2005-02-04 | 2006-08-10 | Samsung Electronics Co., Ltd | Wafer level packaging cap and fabrication method thereof |
| US20070164410A1 (en) * | 2006-01-16 | 2007-07-19 | Samsung Electronics Co., Ltd. | Wafer level packaging cap and fabrication method thereof |
| CN1851888A (en) * | 2006-03-23 | 2006-10-25 | 美新半导体（无锡）有限公司 | Round-grade packing integrated-circuit method |
| CN101878527A (en) * | 2007-11-30 | 2010-11-03 | 斯盖沃克斯瑟路申斯公司 | Wafer level packaging using flip chip mounting |
| US20100019393A1 (en) * | 2008-07-23 | 2010-01-28 | Industrial Technology Research Institute | Packaging structure for integration of microelectronics and mems devices by 3d stacking and method for manufacturing the same |
| CN101941673A (en) * | 2010-09-10 | 2011-01-12 | 北京航天时代光电科技有限公司 | Micro electro mechanical system wafer-level vacuum packaging method |
| CN104445046A (en) * | 2014-06-24 | 2015-03-25 | 华天科技（昆山）电子有限公司 | Novel wafer-level MEMS chip packaging structure and packaging method thereof |
| CN204022464U (en) * | 2014-06-30 | 2014-12-17 | 华天科技（昆山）电子有限公司 | Three-dimensional MEMS encapsulating structure |
| CN205087913U (en) * | 2015-10-12 | 2016-03-16 | 美新半导体（无锡）有限公司 | Wafer -level package structure of cavity MEMS device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106986300A (en) * | 2016-01-21 | 2017-07-28 | 中国科学院上海微系统与信息技术研究所 | The wafer-level encapsulation method and structure of micro-nano mechanical wafer |
| CN105552054A (en) * | 2016-02-03 | 2016-05-04 | 美新半导体（无锡）有限公司 | Wafer-level package structure and manufacturing method thereof |
| CN105552054B (en) * | 2016-02-03 | 2018-02-27 | 美新半导体（无锡）有限公司 | A kind of wafer level packaging structure and its manufacture method |
| CN105668502A (en) * | 2016-03-24 | 2016-06-15 | 美新半导体（无锡）有限公司 | Airtight encapsulating structure with cavity device and manufacturing method thereof |
| WO2017164816A1 (en) * | 2016-03-24 | 2017-09-28 | Agency For Science, Technology And Research | A through silicon interposer wafer and method of manufacturing the same |
| US10882737B2 (en) | 2016-03-24 | 2021-01-05 | Agency For Science, Technology And Research | Through silicon interposer wafer and method of manufacturing the same |
| CN107749400A (en) * | 2017-11-27 | 2018-03-02 | 华天科技（西安）有限公司 | A kind of fingerprint recognition chip-packaging structure and method for packing |
| CN108217579A (en) * | 2017-12-29 | 2018-06-29 | 中国科学院半导体研究所 | Wafer level high vacuum leadless packaging method based on silica glass anode linkage |
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