CN105051759A - Compact IC tag provided with laminated coil antenna, and manufacturing method therefor - Google Patents
Compact IC tag provided with laminated coil antenna, and manufacturing method therefor Download PDFInfo
- Publication number
- CN105051759A CN105051759A CN201480016074.2A CN201480016074A CN105051759A CN 105051759 A CN105051759 A CN 105051759A CN 201480016074 A CN201480016074 A CN 201480016074A CN 105051759 A CN105051759 A CN 105051759A
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- China
- Prior art keywords
- coil
- multilayer coil
- tag
- label
- microminiature
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
- H01Q7/08—Ferrite rod or like elongated core
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- Near-Field Transmission Systems (AREA)
- Credit Cards Or The Like (AREA)
- Details Of Aerials (AREA)
Abstract
This compact integrated circuit (IC) tag is provided with an ultra-compact IC tag and laminated coils. The ultra-compact IC tag has a strip-shaped coil antenna constituting a resonant circuit. The laminated coils comprise: a spiral-shaped laminated coil obtained by winding a coil around an axis a plurality of times in a spiral shape in the same plane; and an open coil in which the starting point of the winding and the ending point of the winding of the laminated coil are not connected. The ultra-compact IC tag and each of the laminated coils are electrically disconnected, and are configured in such a manner that the antenna surface of the laminated coil which is wound a plurality of times is parallel to the antenna surface of the laminated coil and the antenna surface of the ultra-compact IC tag. The outside of the spiral-shaped laminated coil is covered with an insulating member.
Description
Technical field
The present invention relates to the small IC label and method for making thereof that possess multilayer coil antenna, in particular to RFID (radio-frequency (RF) identification) label, above-mentioned RFID label tag be suitable for microwave band, UHF (superfrequency) with communication frequency under cannot utilize in field by using the RFID label tag of adaptation metal that the RFID label tag of half-wavelength antenna be dealt with, that require miniaturization.
Background technology
In order to the miniaturization of IC tag, under the highly sensitive state of the built-in aerial of IC chip power supply, how to reduce size in maintenance and become problem.Can enough little submillimeter wave, the millimeter wave of choice for use wavelength, also carry out using utilize do not rely on the lumped constant of wavelength coil, capacitor part compact electromagnetic wave resonator to realize miniaturization.
Patent Document 1 discloses a kind of RFID label tag adapting to metal, it is formed as follows: possess containing the RFID label tag main body of small tours antenna be connected with IC chip and the arm (arm) covering above-mentioned IC chip across insulation course, said arm is extended on the winding direction of the ring of small tours antenna be only equivalent to the general half-turn of this ring length to cover IC chip.
On the other hand, Patent Document 2 discloses a kind of cartridge, it is built-in aerial in the cartridge of contactless IC card, by strengthening with the electromagnetic coupled of the card internal antenna electric wave that carries out communicating, playing the function as amplifier, thus making the elongations such as communication distance.Describe in patent documentation 2: amplifier communication antenna is set as the aperture area of aerial coil compared with the communication antenna of the non-contact IC card number of turns that is larger or aerial coil is more or antenna pickup zone domain sizes is larger, and carries.In addition describe, amplifier antenna can be any one in coiled type antenna or wire antenna.
And then Patent Document 3 discloses a kind of amplifier antenna, it is made up of Q coil and capacitor, is configured between RFID label tag and rfid interrogator.This Q coil is formed to be spirally wound around repeatedly in the mode that identical radius launches in axial direction conductor.
In addition, Patent Document 4 discloses a kind of RFID label tag, formed as follows: be layered in the table back side and be formed with the antenna substrate of antenna pattern, with through hole etc. to being electrically connected in series between multilayer board, to make each aerial coil pattern be connected with adjacent pattern, form a closed coil.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2011-204130 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2005-332015 publication
Patent documentation 3: Japanese Unexamined Patent Publication 2009-21970 publication
Patent documentation 4: Japanese Unexamined Patent Publication 2010-152449 publication
Summary of the invention
Invent problem to be solved
Half-wavelength in air is the UHF of 15 ~ 16cm, the words of the IC tag rough classification of microwave band have following two kinds.
(1) the common size IC tag of internal wavelength dependence significant half-wavelength resonance dipole keynote antenna, (being about 10cm)
(2) IC tag (while being a few mm degree, such as 2.5mm), the LC resonance of the ultra-small dimensions of the resonant circuit connected into by coil, capacitor not having wavelength dependency is built-in with
Above-mentioned (1) though IC tag be 5m ~ 7m degree leap distance (communication distance) also can realize specify receiving sensitivity, and relative to this, under the detection electric wave of the same terms exports, the IC tag of above-mentioned (2) can only obtain crossing over the receiving sensitivity apart from a few mm.This is that override considers subminiaturized result.
As the demand in market, require: as the small IC label adapting to metal, realize the several times size (rank that a few mm is square at tolerable microminiature label, such as while be 5mm to 8mm, be below " small IC label ") environment under, the small IC label of communication sensitivity that at least tens cm degree cross over distances can be obtained.
Such small IC label is applicable to the narrow part position of the square rank of a few mm such as screw, recess, metal surface, bight being arranged on metal various equipment.Such as needing various public facility, the equipment such as the valve of running water pipe, the iron covering of sewer made regular check on, needing to carry out the leased equipments such as the vehicle of merchandise control, the purposes of small IC label in the various field such as the Medical Devices needed repairing, can be considered.If such small IC label, then the environment that arranges no matter installing the object-based device of this IC tag, facility etc. is metal covering or non-metal surfaces, can both directly arrange.Therefore, these object-based devices, facility are processed on a small quantity, consider environment, the selection degree of freedom arranging position of outward appearance also increases.
The invention of patent documentation 1 is equivalent to above-mentioned (2), although be that small-sized communication distance is short in leap distance.
Even if in order to improve communication distance adopt above-mentioned (1) there is wavelength dependency and dual-purpose protection sheet metal antenna resonance device; if miniaturization is to 1/tens ranks that is a few mm is square of wavelength (such as 30 ~ 32cm); then sensitivity also can significantly decline, and becomes impracticable.Therefore, even the mode of above-mentioned (1), miniaturization is also limited.
On the other hand, the known communication distance being extended IC tag by such amplifier described in patent documentation 2, patent documentation 3.
But the RFID label tag described in patent documentation 2,3 is all not suitable with metal.Namely, these RFID label tag are the structures of placing aerial coil opening surface relative to installed surface abreast, if therefore arranging environment is metal covering, even if the metal covering arranging antenna of then label has insulation course, also electro permanent magnetic can contact and produce short circuit, or built-in aerial is overall and metal covering capacitive coupling, flows through completely reverse high-frequency current in the image antenna projected to metal covering interior parallel.Therefore, the antenna of RFID label tag inside and the electromagnetic induction of image antenna are cancelled out each other, and make electromagnetic wave be difficult to externally radiate, thus cannot obtain sufficient sensitivity.And then these RFID label tag are with premised on the IC-card of electric wave (13.56MHz) by the HF entrained by people, take time to strengthen its sensitivity.When supposing the miniature dimensions HF band amplifier antenna using the square degree of a few mm, there is HF and be with the number of turns of amplifier coil more than situations such as hundred circles, cannot by RFID label tag miniaturization under the rank that a few mm is square.Further, when using that to arrange environment be metal covering, if the coil of amplifier is the coil be spirally wound around repeatedly, then the periphery of the coiled type antenna of amplifier contacts with metal installed surface or close, thus metal covering and coiling produce high frequency short circuit, the inductance value L of coil changes, such as, reduce.Similarly, the stray capacitance C of coil also changes, such as, increase.Therefore, resonant condition disappears, and has the communication sensitivity of IC tag sharply deteriorated such problem.
In RFID label tag described in patent documentation 4, the antenna pattern of sandwich construction is connected with IC chip-in series.According to arranging environment, such as, for the drain cover etc. of the band IC tag assembled portion of equipment on road, also may sometimes because the impact etc. of wheel, sandy soil applies to cut off the such stress of through hole, impact from outside to multilager base plate.In this situation, in the RFID label tag of patent documentation 4, the aerial coil of each substrate is out of shape independently, and antenna pattern likely cuts off between generating layer.Further, be difficult to adapt to metal, be not also equivalent to amplifier coil person, therefore when use arranges environment for metal covering, communication distance can think below a few mm degree.
The object of the invention is to, the small IC label that stably can not obtain the communication sensitivity of crossing over distance at least tens cm degree by arranging environmental impact is provided.
For solving the method for problem
According to representational formation of the present invention, the feature possessing the small IC label of multilayer coil antenna is, possess microminiature IC tag and at least one multilayer coil, above-mentioned microminiature IC tag has the ribbon coil antenna forming resonant circuit and the IC chip be connected with this coil antenna, above-mentioned multilayer coil is repeatedly wrapped in axial swirling coil with swirling at grade, and be the starting point that starts of the winding of this multilayer coil and the opening coil being wound around the terminal that terminates and not being connected, above-mentioned microminiature IC tag and above-mentioned multilayer coil are formed in the non-electric-connecting and mode of electromagnetic coupled, above-mentioned microminiature IC tag is integrated in the mode that the antenna surface of above-mentioned swirling multilayer coil is parallel or overlapping with the antenna surface of above-mentioned microminiature IC tag with above-mentioned multilayer coil, the outside of above-mentioned multilayer coil is coated to by the parts of insulativity.
The effect of invention
According to the present invention, the small IC label that can obtain the communication sensitivity of crossing over distance at least tens cm degree can be realized.Even if arrange environment also can realize high sensitivity for such as metal covering.
Accompanying drawing explanation
Fig. 1 represents the stereographic map being provided with the small IC label involved by the first embodiment of the present invention in metal object.
Fig. 2 A is the vertical view of the microminiature IC tag used in the small IC label of Fig. 1.
Fig. 2 B is the side view of the microminiature IC tag used in the small IC label of Fig. 1.
Fig. 3 is the figure that the example manufacturing the small IC label of the first embodiment to the microminiature IC tag and multilayer coil that use Fig. 2 is described.
Fig. 4 is the figure of the manufacture process of the small IC label of key diagram 3.
Fig. 5 is the figure be described an example of the multilayer coil method for making of Fig. 3.
Fig. 6 is the equivalent electrical circuit of the multilayer coil of key diagram 3 and the figure of resonant condition.
Fig. 7 is the figure of the example represented the read write line that the small IC label involved by the first embodiment uses.
Fig. 8 represents the figure using the read write line of Fig. 7 and the small IC label involved by the first embodiment to carry out the example of communication.
Fig. 9 A is the stereographic map representing the example being provided with the small IC label involved by second embodiment of the invention in metal object.
Fig. 9 B is the stereographic map of the action of the small IC label illustrated involved by the second embodiment.
Figure 10 is the figure representing the example small IC label involved by the second embodiment being obtained by experiment to the result of the quantity (N) of multilayer coil and the relation of sensitivity (cm).
Figure 11 is the longitudinal section of the small IC label involved by the 3rd embodiment of the present invention.
Figure 12 is the stereographic map of the microminiature IC tag used in the small IC label involved by the 3rd embodiment.
Figure 13 is the figure of the manufacture method of the small IC label represented involved by the 3rd embodiment.
Figure 14 is the figure of the manufacture method of the small IC label represented involved by the 3rd embodiment.
Figure 15 is the longitudinal section of the small IC label involved by four embodiment of the invention.
Figure 16 is the figure of the manufacture method of the small IC label represented involved by the 4th embodiment.
Figure 17 is the figure of the manufacture method of the small IC label represented involved by the 4th embodiment.
Embodiment
According to representative embodiments of the present invention, being wound around on the antenna surface of multilayer coil repeatedly with swirling, configure small IC label in the mode that the antenna surface of this multilayer coil is parallel with the antenna surface of microminiature IC tag.As required, electricity consumption insulative resin is coated to their outside.
Multilayer coil is formed and is wound around repeatedly and the starting point of multilayer coil and the unconnected structure of terminal with swirling at grade.That is, be involved in swirling in the mode of starting point and terminal not line by multilayer coil, the structure inside it is protected in the outside forming swirling multilayer coil.
According to this formation; the outermost perimembranous protection of swirling multilayer coil is positioned at the coil layer of inner side in contrast; even if when being provided with microminiature IC tag to object, also can alleviating to play as far as possible and hinder and the electromagnetic induction interference such as the stray capacitance of the resonant interaction of the object such as installed surface is coupled.Resonant frequency conditional stability can be made thus.Therefore, regardless of arranging environment, stable highly sensitive small IC label can both be realized.
Embodiment 1
Below, the small IC label involved by the first embodiment of the present invention is described.Fig. 1 represents the example being provided with the small IC label 10 involved by present embodiment in metal object 300.Small IC label 10 is the LC resonance type labels being provided with microminiature IC tag 100 on the antenna surface of swirling multilayer coil 200 integratedly, and outside is coated to by the resin 240 of electrical insulating property and carries out integration.
The profile of small IC label 10 is the approximate rectangular parallelepiped of long TL, wide TW, high TH.The side of the multilayer coil 200 corresponding with the side (face be made up of long TL, high TH) of small IC label becomes the antenna surface 210 of small IC label.That is, the side of small IC label 10 becomes antenna surface 210.
Small IC label 10 has the core being wound around multilayer coil, and the face outer peripheral face along small IC label being wound around multilayer coil is defined as the coil surface of core.In addition, in small IC label, a face 12 in its outer peripheral face (face of detouring a week along high TH, long TL direction with wide TW) becomes the installation surface to metal object 300 etc.This installation surface 12 is defined as " base " of small IC label.
In multilayer coil 200, electric conductor at grade, namely on the same plane centered by the axle at a right angle with small IC label 10 side, is wound around repeatedly with whirlpool (VORTEX) shape.Microminiature label 100 and multilayer coil 200 are formed in the non-electric-connecting and mode of electromagnetic coupled.In addition, " stacked " herein refers to, centered by above-mentioned axle, carry out " stacked " around it.
Fig. 2 A represents the vertical view of the microminiature IC tag 100 of Fig. 1, and Fig. 2 B represents side view.Microminiature IC tag 100 has the IC tag main part 101 arranged in the face side of flat-shaped substrate and the IC tag insulated substrate 104 formed at substrate back.About IC tag main part 101; its flat shape is approximating square, by be fixed therein centre IC chip 110, around this IC chip 110, be wound around planar coil antenna 102 on the same face of use printed wiring repeatedly etc. and protective material etc. with swirling formed.The inner of coil antenna 102 is connected with IC chip 110 by wire-bonded etc. with outer end.
In Fig. 3, an example of the method for making of the small IC label 10 of the first embodiment is described.Multilayer coil 200 has rectangular-shaped core (core material) 220, in the side of this core and the bonding microminiature IC tag 100 of antenna surface.In the coil surface periphery of core 220, be wound around (stacked) repeatedly ribbon coil 230.That is, swirling multilayer coil 200 by will be made up of conductive material and insulation-coated after ribbon coil 230, round core (insulation course) 220, be repeatedly wrapped in around axle with swirling at grade and formed.Ribbon coil 230 is that the winding of coil starts and terminate unconnected open coil.
Core 220 is by magnetic loss angle (magnetic loss angle tangent (magneticlosstangent), tan δ
0) little material forms.As the material that magnetic loss angle is little, can enumerate such as with the material that the plastic materials such as fluororesin, nylon, vinyl chloride, PET, ABS, epoxy resin are main material.In other words, as long as the material of core 220 is at the material of the contour band region of UHF as the insulating element performance function of " loss is few ".
In addition, whirlpool (VORTEX) is normally defined the curve at the close center (or away from center) along with rotation at grade.As an example, can enumerate in polar coordinates, mark with the level and smooth monotonic quantity (monotonically increasing function or monotonic decreasing function) of θ with the distance r at center, and be equally spaced spiral of Archimedes between line.
In the present invention, the whirlpool of multilayer coil 200 not only comprises the curve of above-mentioned monotonic quantity, also comprises the whirlpool be formed by straight lines at least partially.Such as, comprising the flat shape be made up of with the minor face being connected them many straight lines is the whirlpool of rectangle.Ribbon coil 230 shown in Fig. 3, extends many parallel lines along the limit relative across core (core material) 220.In addition, in the present invention, it is parallel that " parallel " not only comprises in mathematical meaning, also comprises substantial parallel.Further, formed with many parallel lines in coil during the coil that swirling is stacked, the distance apart from the center of core (core material) 220 periodically reduces, and connect in bight, entirety defines the whirlpool of rectangle.Banded coil 230 is opening coils that the starting point of its winding beginning is not connected with the terminal that winding terminates.This multilayer coil 200 is also non-electric-connecting with microminiature IC tag 100.
Measure-alike or larger than it preferably with the antenna surface of the microminiature IC tag 100 be overlapped thereon of the size of the antenna surface 210 of the multilayer coil 200 formed in the side of core.Make the antenna surface 210 of multilayer coil 200 relative and parallel with the antenna surface surrounded by coil antenna 102, microminiature IC tag 100 is formed integratedly with multilayer coil 200 (this said parallel allow be such as 10 degree from two antenna angulations within etc. strict mathematical parallel to undemanding parallel).The outside of ribbon coil 230 is coated to by the resin 240 of electrical insulating property, becomes protective seam.A part for this protective seam outside surface, the face in direction namely at a right angle with antenna surface 210, is formed (with reference to Fig. 1) in the mode playing function as the installed surface 12 for arranging microminiature IC tag to metal parts.
That is, the outside surface in direction at a right angle with the axle O-O (with reference to Fig. 4) of multilayer coil, the metal installed surface as small IC label 10 plays function, and the coil surface of microminiature IC tag 100 and metal covering are roughly at a right angle.Therefore, for the high frequency electric current I such as standing wave (with reference to Fig. 1) being distributed in metal covering, even if across insulating element, the outermost of multilayer coil 200 is also coupled by electromagnetic induction, as the amplifier work be generally called.Thereby, it is possible to realize stably to obtain crossing over apart from large communication sensitivity by the impact arranging environment, and the small IC label that can arrange at narrow and small position.In addition, when arranging environment and being non-metal surfaces, owing to not having standing wave electric current, high-frequency current, therefore mounting means is freely.In this case, self-evident, the outside surface in the direction parallel with the axle of multilayer coil also can be used as installed surface.But, even if also arrange environment to seem nonmetal, the situation of metal object also can be had in the inside near surface.Therefore, when only specifying the relation of the axle of its outside surface and multilayer coil according to the outward appearance of rectangular-shaped small IC label, it is the expression adapting to metal covering also can to carry out identifiable design in a part for outside surface.
As the microminiature IC tag 100 being applicable to such miniaturized applications, such as physical dimension is had to be the microminiature label (Hitachi Chemical Co., Ltd.'s (registered trademark) IM5-PK2525 type label) of the UHF band of 2.5mm × 2.5mm.
In addition, if paracentral swirling coil need not be leaned on along with rotation, and make amplifier with the spiral winding that the such radius r of spring is fixing, and be arranged on metal covering, then on metal covering, all can there is the position of carrying out electromagnetic coupled with metal at each circle of the coil of amplifier.This means that first electromagnetic coupled point and next Coupling point can produce high frequency short circuit.That is, the resonant condition when coil of amplifier being placed in free space is greatly departed from.Therefore, adapting to the label of metal to make, needing the marginal layer (Vela Layer around by spring) size is set to the large-size can ignoring electromagnetic induction degree of coupling.This miniaturization for small IC label 10 is disadvantageous characteristic.
Fig. 4 is the figure of the manufacture process of the small IC label of key diagram 3.
First, about multilayer coil 200, in order to the band resonant used at it, the belt metal foil after ribbon coil 230 is that is insulation-coated is wrapped in stipulated number around the central shaft O-O of core 220 at grade.Core 220 sets according to the size of microminiature label 100, and at 920MHz band, coil 230 although also depend on coil width, is at least 2 times to the winding number of times (stacked number of times) of this core 220, wishes to be 3 to 4 times.
Then, make the antenna surface 210 of multilayer coil 200 consistent with the end face of core (core material) 220, this antenna surface and the coil antenna 102 of microminiature label 100 on common axle O-O is made to surround the antenna surface formed relative, bonding both inciting somebody to action with adhesives etc.Then, use the resin 240 (with reference to Fig. 1) of insulativity to be coated to outside multilayer coil 200 and microminiature label 100 as required, carry out integration, form multilayer coil 200.
In the small IC label 10 manufactured thus, respectively multilayer coil 200 is considered as 1 secondary coil, when the coil of microminiature label 100 is considered as 2 secondary coil, two coils form electromagnetic coupled relation by mutual induction, can work as in structure with all integrated IC tag 10 in electro permanent magnetic.
In addition, for convenience of explanation, in Fig. 4, microminiature label 100 is adhered to the side of core 220, but also the direction of arrow in the drawings can puts into core inside (omitting diagram) abreast.Also such as core 220 can be set to the first core, the second core that are divided into two, left and right along antenna surface.Then, form at the central portion of the relative antenna surface of two cores the recess holding microminiature label 100.Ribbon coil 230 is wound around (stacked) repeatedly by the first core, the second core respectively.Then, configuring microminiature label 100 at the recess of the first core, the second core in the center of each antenna surface (axle O-O) consistent mode, carrying out integration by being coated to entirety with insulative resin, thus form small IC label.
Then, for multilayer coil 200, with reference to Fig. 5, Fig. 6 while be described.
Fig. 5 is the stretch-out view of multilayer coil.Coil 230 is the flat-shaped parts be made up of intercoil insulation materials 232 such as the adhesivess of the belt metal foil 231 after insulation-coated and its lower floor.About coil 230, when the frequency band that will use at it is wound around with swirling to obtain resonance, also can will to crack it open on the contrary and the length launched is set to the specified length P producing resonance when being wound around for the first time
l.That is, about having specified length P
lcoil 230, it is wound around starting point 233 and the distance be wound around between terminal 234 determines according to resonant frequency.
When resonant frequency is set to f, coil 230 demand fulfillment following formula (1).
Wherein, L
2the mainly inductive capacity of multilayer coil, C is mainly present in the stray capacitance waited between the coil of multilayer coil.
Fig. 6 represents the equivalent electrical circuit of coil 230.About the inductive capacity L of multilayer coil
2and the stray capacitance C between the coil being present in multilayer coil, as known in electromagnetics, being connected in series, in arbitrary situation of being connected in parallel, the structure of coil 230 all meets above-mentioned formula (1).That is, although the equivalent LC resonant circuit of coil mainly has Series FPB and parallel FPB two kinds, owing to being identical resonant condition, therefore make multilayer coil be easily with the opening coil realized at a low price.
Wish that the winding terminal 234 of multilayer coil 200 is configured to, the limit beyond the base 12 being positioned at small IC label 10 when core (core material) 220 is wound around, to the face beyond the installation surface of metal object 300 etc.
According to the small IC label 10 of the present embodiment, by installing microminiature label to the antenna surface 210 of multilayer coil 200 be wound around with swirling at grade, and coating overall with insulative resin, thus by microminiature IC tag 100 and multilayer coil 200 integration.
Therefore, when such as insulation-coated peeled off, even if the winding part bottom the base 12 of the IC tag of integration 10, multilayer coil 200 and circinate metal contact with the metal covering 300 of mounting object, the resonant frequency f of multilayer coil 200 also not easily changes.This is because the outermost perimembranous covering protection of the multilayer coil 200 be wound around with swirling is at grade than the winding part of its inner laminated coil in the inner part.Namely be because, as shown in the installment state of Fig. 1, even if the part 12 bottom multilayer coil most peripheral contacts and the L of this part with metal object 300
2, C produces the variation of locality, electromagnetics protection is also carried out by the coil of most peripheral in the inner side of the multilayer coil be wound around with swirling, and the impact of Metal Contact also not easily involves the resonance constant (L of inner side
2, C), therefore L as a whole
2extremely small with the variation of C value.
Similarly, even if the environment that arranges of IC tag is in water, also not easily to the resonance constant (L inside multilayer coil
2, C) have an impact, therefore L as a whole
2extremely small with the variation of C value, can high sensitivity be maintained.
Then, Fig. 7 is the figure of the example represented the read write line that the small IC label involved by the first embodiment uses.
IC tag communication read-and-write device 400 possesses the operating portion 420, the display part 430 that are arranged at body surfaces, be arranged at the power supply of body interior and control circuit portion (omitting diagram), and the antenna (antenna that paster antenna, microstrip antenna etc. are general) 410 be wholely set with body interior.
Fig. 8 enables IC tag communication read-and-write device 400 close to until the state of distance that communicates of small IC label.Under this state, the IC tag communication coil generating electromagnetic of the antenna 410 of the test section of read-and-write device 400 with the multilayer coil 200 of small IC label and microminiature label 100 is coupled.If only illustrate the such as magnetic flux of the radiation electric wave from antenna, then radiate electric wave and the wavelength being made up of one-period Φ with-Φ is formed chain and is connected.To a magnetic flux phi of this connection chain, multilayer coil 200 is set to coil L2, the coil antenna 102 of microminiature label 100 is set to coil L1, by mutual induction (M), electromagnetic coupled is carried out to two coils L1, L2, as structurally with electro permanent magnetic on all integration IC tag work.Namely, by mutual induction, if multilayer coil 200 is set to 1 side, then become induction current I2 with 1 primary current, 2 sides corresponding with it become coil L1, and the mode that 2 primary currents corresponding with it become induction current I1 responds to the coil antenna 102 of microminiature IC tag 100.With the microminiature label 100 of this induction current work, the signal of the identifying informations such as its ID is back to the antenna 410 of IC tag communication read-and-write device 400.Its result is presented at the display part 430 of IC tag communication read-and-write device.Thus, microminiature label 100 only has separately the sensitivity of about 3cm, but promotes to resonate by combining with multilayer coil 200, can realize the sensitivity of such as about 10 times.
As an example, about the small IC label 10 of the present embodiment, inventor is using with the coil 230 of insulation-coated banded aluminum metallic foil (PL=40mm) as multilayer coil 200, rectangular-shaped magnetic rubber as the wide 3.5mm of core, long 3.5mm, high 2.0mm is wound around 3 ~ 4 times with swirling at grade, makes the small IC label of approximate rectangular parallelepiped that profile is long TL=5.8mm, wide TW=4.2mm, high TH=4.0mm.Then, confirm by experiment: when arranging this small IC label on a metal plate, the IC tag communication electric wave for 920MHz, 30dBm exports, and responds in the overhead of distance metal sheet surface 20cm ~ 30cm.
The self-evident general field that also can be arranged on beyond metal covering of IC tag of the present invention.Such as, what use the IC tag of common-use size to carry out equipment makes regular check on when waiting management, as the environment that arranges of object-based device, can be contemplated to narrow and small and according to either party situation about arranging of situation selection metal covering or non-metal surfaces.For supvr, even if under such circumstances, by adopting the present invention, also there is the advantage that the IC tag of common-use size can be utilized to tackle freely.In this situation, when non-metal surfaces arranges IC tag, installation surface is not limited.On the other hand, when metal covering arranges IC tag, arrange in the mode that the coil surface of each aerial coil is vertical with installing metal covering.Like this, most peripheral and the metal covering side of swirling aerial coil are close, strengthen, can obtain large sensitivity with the electromagnetic coupled of the high-frequency currents such as the standing wave flow through in metal surface.Therefore, even if the resonant condition of aerial coil slightly deviation, sensitivity also not easily reduces.Therefore, in order to the interaction for high-frequency currents such as the standing waves that communicates with RFID label tag carried out more with flow through in metal surface, about the coil surface shape of swirling aerial coil, compared with circle more preferably with straight line, link the approximate rectangle of their minor face (circular arc).And then this shape is the shape that also can stably arrange physically.
As mentioned above, according to the present invention, multilayer coil is at grade with the structure that swirling is wound around, and therefore has following feature.
(feature 1), according to the present invention, even if the Metal Contact of the winding part bottom the IC tag of integration bottom the metal covering of mounting object and multilayer coil, the resonant frequency of this multilayer coil also not easily changes.This is because, for the value of L and C, protect the winding part of inner laminated coil by the outermost perimembranous of multilayer coil.
(feature 2) is according to the present invention; based on the defencive function described in feature 1; ground current (electric welding, thunder etc.) or discharge current flow to from the outermost perimembranous of multilayer coil the metal covering becoming the mounting object of ground side, and the microminiature IC tag of relaying configuration inside outermost perimembranous affects from surge.
(feature 3), according to the present invention, multilayer coil is that the core few to electromagnetic consumable is wound around from the off, terminates to be wound around, the opening coil that starting point is not connected with terminal at terminal.The manufacture of the coil that starting point connects with terminal with the amplifier coil described in patent documentation 2,3 by opening coil is like that compared, and has the advantage that there is no need for the cross-over connection distribution connected.When considering the stray capacitance C be present between the coil of multilayer coil, the equivalent LC resonant circuit of coil mainly has Series FPB and parallel FPB two kinds, but owing to being identical resonant condition on electromagnetics, is therefore formed easily with the opening coil realized at a low price.
Embodiment 2
Then, the small IC label involved by second embodiment of the invention is described.Fig. 9 A is the stereographic map representing the example being provided with the small IC label involved by second embodiment of the invention in metal object.In small IC label 10 involved by second embodiment, relative to a microminiature IC tag 100 of the small IC label 10 involved by the first embodiment, on the axle O-O direction at a right angle with this antenna surface, multiple multilayer coil 200 (A ~ N) is being overlapped near its antenna surface.In other words, multilayer coil 200 (A ~ N) arranged in parallel in axial direction.Multiple multilayer coil is non-electric-connecting and produces electromagnetic coupled.Therefore, the effect that the permanance of the external stress of the mechanicalness likely cutting off coil is increased is had, the effect of the sensitivity of the small IC that is improved largely in addition label 10.This is equivalent at the resonator (coil) near microminiature IC tag 100 place multiple same shape arranged side by side.Namely, in second embodiment, axle is arranged with a microminiature label 100 and multiple multilayer coil 200 (A ~ N), and each multilayer coil is integrated by the adhesives 250 of insulativity, forms a small IC label 10 of wide TWn, high TH, long TL.The material that insulativity adhesives 250 uses magnetic loss angle little.To multilayer coil 200 (A ~ N), when resonant frequency is set to f, coil 230 is the above-mentioned formula of demand fulfillment (1) all.
In addition, in the example of Fig. 9 A, microminiature IC tag 100 is positioned at left end, but also can be configured at right-hand member or the centre of multiple multilayer coil 200 (A ~ N).That is, microminiature IC tag 100 can be in any position on axle.When mounting object is metal, one of outer peripheral face of the small IC label 10 parallel with axle, such as base 12 become installed surface.
Multiple multilayer coils 200 (A ~ N) are the opening coils of the amplifier work as microminiature IC tag 100.That is, multiple amplifier plays function as promoting winding that resonate, coil to start and being wound around the opening resonator terminating not to be connected separately.Thus, more electromagnetic wave is sent into microminiature label 100 by multilayer coil 200 (A ~ N), therefore becomes highly sensitive small IC label 10.
The outside of microminiature label 100 and multiple multilayer coil 200 (A ~ N), uses the resin-coated of electrical insulating property as required.Between each opening coil of microminiature label 100 and multiple multilayer coil 200 (A ~ N) and each opening coil of multiple multilayer coil 200 (A ~ N) each other, all formed in the non-electric-connecting and mode of electromagnetic coupled.That is, small IC label 10 defines overlapping open type coil and multiple stratification make a coil of the equivalence of adjoining course electromagnetic coupled under non-contacting state.
The width of each multilayer coil is little, and therefore by them, on axle O-O direction, arranged in parallel and the width of small IC label 10 entirety that formed can for equal with long TL, high TH or for below it.As an example, inventor etc. adopt the microminiature label of the UHF band of above-mentioned 2.5mm × 2.5mm, first by a multilayer coil 200, achieve the small IC label 10 that physical dimension is the cubic shaped of TWn=TH=TL=3mm × 3mm × 3mm.
Fig. 9 B is the stereographic map of the action of the small IC label illustrated involved by the second embodiment.For the small IC label 10 of Fig. 9 B, when making the IC tag communication read-and-write device 400 shown in Fig. 8 approach to the distance that can communicate, the test section antenna 410 of IC tag communication read-and-write device 400 is coupled with the coil generating electromagnetic of multiple multilayer coils 200 (A ~ N) of small IC label and microminiature IC tag 100.For a magnetic flux phi of connection chain, multiple multilayer coil 200 (A ~ N) is set to coil L2
1~ L2
n, the coil antenna 102 of microminiature IC tag 100 is set to coil L1, make two coil L1 and L2 by mutual induction (M)
1~ L2
ncarry out electromagnetic coupled, as structurally with the IC tag work of equal integration in electro permanent magnetic.That is, by mutual induction, 1 primary current of multilayer coil 200 (A ~ N) becomes induction current I2
1~ I2
n, the induction current I1 of 2 primary currents corresponding with it responds to the coil antenna 102 of microminiature IC tag 100.Thus, by making multiple multilayer coil 200 resonate as the amplifier of the coil antenna 102 of microminiature IC tag 100, high sensitivity can be realized.
In addition, multilayer coil needs to have the structure be wound around with swirling, and meets above-mentioned formula (1), but the flat shape of its antenna not necessarily needs with the flat shape of the antenna of microminiature IC tag completely the same.
Multilayer coil is at grade with the structure that swirling is wound around, even if therefore the metal of winding part of arbitrary bottom of multiple multilayer coil 200 (A ~ N) contacts with the metal covering 300 of mounting object, the resonant frequency f of each multilayer coil also not easily changes.This is because; the outermost perimembranous of each multilayer coil all covering protection than the winding part of its inner laminated coil more in the inner part; therefore electromagnetics protection is carried out by the coil of most peripheral in the inner side of multilayer coil, and the impact of Metal Contact not easily involves the resonance constant (L2, C) of inner side.
In addition, owing to can not connect between the substrate of multilager base plate inside with through hole, therefore the process number on not only manufacturing reduces, cost reduction, even if applying stress to multilager base plate from outside, impact such environment is set under, there is no the possibility cut off between antenna pattern generating layer, be also improved the effect of reliability yet.
Figure 10 represents the figure of an example of the result of the quantity (N) of the multilayer coil of the small IC label obtained by experiment involved by the second embodiment and the relation of sensitivity (cm).The microminiature label that small IC label adopts the UHF of above-mentioned 2.5mm × 2.5mm to be with, in central authorities' configuration microminiature IC tag 100 of multiple multilayer coil 200 (A ~ N), makes multiple sample to the quantity (N) of each multilayer coil.Then, the communication distance (cm) in metal sheet surface overhead when they being arranged on a metal plate is measured, as communication sensitivity.In addition, their mean value is shown with solid line.As shown in Figure 10, for the situation (N=0) only having microminiature IC tag 100, the quantity (N) of multilayer coil more increases, and sensitivity (cm) more raises.But the increase of sensitivity has increase along with (N) and saturated tendency.
According to the example of Figure 10, if (N) is set to 3, then obtain the communication sensitivity of crossing over about distance 30cm, if (N) is set to 4, then obtain the communication sensitivity of crossing over about distance 40cm.On the other hand, if (N) is set to 8 ~ 10, then obtain the sensitivity of about 50cm, in other words, can obtain is the sensitivity of about 2.5 times relative to (N)=1.But the manufacturing cost that the quantity (N) also existed with multilayer coil increases and produces raises, arranges volume and increase such shortcoming.Therefore, consider the permissible range that environment is set, in other words consider required sensitivity, cost and allow that installation surface size etc. decides (N).In practicality, make (N) to be 1 ~ 6, be more preferably 2 ~ 4 for good.
According to the present embodiment, the small IC label that stably can not obtain the communication sensitivity of highly sensitive leap distance by arranging environmental impact can be realized.Even if can realize such as arranging environment is metal covering, also there is the small IC label of the square rank of several mm of the communication sensitivity of crossing over distance tens cm degree.
Embodiment 3
Then, the small IC label involved by third embodiment of the invention is described.Small IC label 10 involved by 3rd embodiment, uses printed base plate to make the small IC label 10 that form same with the small IC label 10 involved by the second embodiment.That is, in the 3rd embodiment, make with this point of the ribbon coil of swirling winding different from the second embodiment on substrate by printed wiring.
Figure 11 is the longitudinal section of the small IC label involved by third embodiment of the invention.Figure 12 is the stereographic map of the microminiature IC tag used in the small IC label involved by the 3rd embodiment.Be called multilayer coil by with the coil of swirling winding of band-type coil before this, for the object of consistency keeping illustrating, the coil be entwined with swirling at grade formed on substrate with printed wiring pattern is also referred to as multilayer coil.Below, the quantity that multilayer coil 200 arranged in parallel of this broad sense carries out lamination is set to N, the situation of this N=3 is described.
In small IC label 10 involved by 3rd embodiment, by a microminiature IC tag 100 and multiple multilayer coil 200 (A ~ C) arranged in parallel and carry out lamination on axle O-O direction.Microminiature IC tag 100 comprises: the IC chip 110 arranged at the central portion (on axle) of tabular insulated substrate 104 face side, on the direction at a right angle with this axle at the coil antenna 102 of arranged outside, the closing line 108 that both are connected and the protective material 242 protecting them.When mounting object is metal, one of outer peripheral face of the small IC label 10 parallel with axle, such as base 12 become installed surface.
Each multilayer coil 200 (A ~ C) has the coil antenna 102 (this is equivalent with the situation of the ribbon coil 230 being equivalent to be formed multilayer coil 200) arranged in insulated substrate 104 face side.Microminiature IC tag 100 and each multilayer coil 200 (A ~ C) are undertaken attaching by insulativity adhesives 250 and integrated.That is, in the 3rd embodiment, common axle is arranged with a microminiature label 100 and multiple multilayer coil 200 (A ~ C), with insulativity adhesives 250 by each multilayer coil integration, forms a small IC label 10.Protective material 242 and adhesives 250 can be identical materials.The material that protective material 242, insulativity adhesives 250 use magnetic loss angle little.
The coil antenna 102 of each multilayer coil 200 is opening coils that starting point is not connected with above-mentioned terminal.On the other hand, as shown in figure 12, the coil antenna 102 of microminiature label 100 is in the same manner as each multilayer coil 200 i.e. coil antenna 102, formed and be wound around from the off, terminate the swirling shape that is wound around at terminal, but its inner and outer end is connected this by closing line 108 from IC chip 110 puts with the coil antenna 102 of multilayer coil 200 different.
For each multilayer coil 200, when resonant frequency is set to f, coil 230 (in this case coil antenna 102) all above-mentioned formulas of demand fulfillment (1).In addition, in the example of Figure 11, microminiature IC tag 100 is positioned at left end, but also can be configured in the centre of multiple multilayer coil 200 (A ~ C).That is, microminiature IC tag 100 can be in any position on axle.
Then, with reference to Figure 13, Figure 14, while be described an example of the manufacture method of the small IC label involved by the 3rd embodiment.
First, as shown in figure 13, the printed base plate (hereinafter referred to as plate) 500 being configured with multiple microminiature IC tag 100 and the plate 501,502,503 being configured with multiple coil substrate 200 (A ~ C) is made.Now, when (at direction of principal axis) this 4 blocks of plates overlapping, in the mode of the location overlap of the coil antenna of the position of the coil antenna of microminiature IC tag 100 and coil substrate 200, the position that each coil substrate 20 in the position that the microminiature IC tag 100 in decision plate 500 is respective and plate 501,502 and 503 is respective.
Then, as shown in Figure 14, attach made plate 500,501,502,503 by adhesives 250 and carry out integration.Then, cut as dotted line, can be possessed the small IC label 10 of a microminiature IC tag 100 and three multilayer coils 200 (A ~ C) thus separately, be 30 small IC labels 10 in the example of figure.
In addition, Tu13Zhong, also can be configured in plate 500 between other plates 501,502,503.In this situation, the small IC label 10 having microminiature IC tag 100 in the intermediate configurations of multiple multilayer coil 200 (A ~ N) can be obtained.
According to the present embodiment, can to realize the small IC label that stably can not obtain the communication sensitivity of highly sensitive leap distance by arranging environmental impact at a low price.Such as, even if realizing arranging environment by general printed wiring technology is the small IC label that metal covering also can obtain the square rank of several mm of the communication sensitivity of crossing over distance tens cm degree.
In addition, by adopting printed wiring technology, mass production can be carried out to the small IC label that can not obtain stable communication sensitivity by arranging environmental impact, and can to provide at a low price.
Embodiment 4
Then, the small IC label involved by four embodiment of the invention is described.In 4th embodiment, as printed base plate (plate), be used in two sides and be formed with the glass epoxy substrate etc. of such as Copper Foil as conductor foil, form coil on the two sides of substrate, then apply gold-plated etc. at coil surface.
Figure 15 is the longitudinal section of the small IC label involved by four embodiment of the invention.Be formed with conductor foil on the two sides of glass epoxy substrate 104, be formed with coil antenna 102 on the two sides of this substrate 104.Be configured with IC chip 110 at the central portion on glass epoxy substrate 104 surface of left end, be connected with the coil antenna 102 in its arranged outside by closing line 108, IC chip 110.Thus, microminiature IC tag 100 is formed in the left-hand face of this substrate 104.On other surfaces of glass epoxy substrate 104, do not have IC chip 110, these surfaces become multilayer coil 200.
Then, with reference to Figure 16, Figure 17, while be described an example of the manufacture method of the small IC label involved by the 4th embodiment.
In 4th embodiment, also, in the same manner as the 3rd embodiment, the one side being produced on glass epoxy substrate 104 is configured with multiple microminiature IC tag 100 and is only configured with the printed base plate 500 of multiple coil substrate 200 (A ~ C) overleaf and is only configured with the plurality of plates of multiple coil substrate 200 (A ~ C) on two sides.Below, mainly the difference with the 3rd embodiment is described.
Have shown in Figure 16 the glass epoxy substrate 104 of microminiature IC tag 100, be equivalent to the sectional view of part after burst cutting.Do not have shown in Figure 17 the glass epoxy substrate 104 of microminiature IC tag 100, be equivalent to the sectional view of part after burst cutting.Then, contraposition is carried out to make the location overlap of coil antenna to multiple glass epoxy substrate 104, carry out hot pressing by entirety integration across reinforcing material (buildupmaterial) 260.Then, they are cut, thus multiple small IC labels 10 of a microminiature IC tag 100 and three multilayer coils 200 (A ~ C) can be possessed separately.
When utilizing the manufacture method of the 4th embodiment, the use amount of glass epoxide base material reduces, and process number also reduces, therefore, it is possible to low cost volume production small IC label, can make the advantage that the lower thickness of small IC label is so in addition in addition.
According to the present embodiment, by adopting printed wiring technology, the small IC label mass production of stable communication sensitivity can will can not be obtained by arranging environmental impact, and can to provide at a low price.
Embodiment 5
In embodiment 3 and embodiment 4, the antenna surface size of multilayer coil 200 and the antenna surface size of microminiature IC tag 100 are identical, but also can replace and make the size of the antenna surface of multilayer coil 200 be greater than the size of the antenna surface of microminiature IC tag 100.In this situation, in the same manner as embodiment 1, embodiment 2, the 1st layer of multilayer coil of multilayer coil 200 is formed in the outside of the antenna surface of microminiature IC tag 100.Such as, Tu13Zhong, plate 500 is formed the swirling resonance coil that the swirling aerial coil of microminiature IC tag 100 and size are greater than it.On the other hand, plate 501,502,503 is only formed the resonance coil of multilayer coil 200.
According to the present embodiment, can to provide the small IC label that can not obtain stable communication sensitivity by arranging environmental impact at a low price.
Symbol description
10: small IC label, 12: the base of small IC label, 100: microminiature IC tag, 101:IC tag body portion, 102: coil antenna, 104:IC label insulated substrate, 108: closing line, 110:IC chip, 200: swirling multilayer coil, 210: antenna surface, 220: core (core material), 230: ribbon coil, 240: insulative resin, 242: protective material, 250: insulativity adhesives, 260: insulative resin, 300: metal object, 400:IC tag communication read-and-write device, 500 ~ 503: printed base plate (plate), I: high-frequency current, I1: induction current, I2: induction current, φ: magnetic flux.
Claims (15)
1. possess a small IC label for multilayer coil antenna, it is characterized in that,
Possess microminiature IC tag and at least one multilayer coil,
Described microminiature IC tag has the ribbon coil antenna forming resonant circuit and the IC chip be connected with this coil antenna,
Described multilayer coil is repeatedly wrapped in axial swirling coil with swirling at grade, and be the starting point that starts of the winding of this multilayer coil and the opening coil being wound around the terminal that terminates and not being connected,
Described microminiature IC tag and described multilayer coil are formed in the non-electric-connecting and mode of electromagnetic coupled,
In the mode that the antenna surface of described swirling multilayer coil is parallel or overlapping with the antenna surface of described microminiature IC tag, by described microminiature IC tag and the integration of described multilayer coil,
The outside of described multilayer coil is coated to by insulativity parts.
2. possess the small IC label of multilayer coil antenna as claimed in claim 1, it is characterized in that,
There is the multiple described multilayer coil be arranged in together with described microminiature IC tag on common described axle,
Described each multilayer coil is mutually non-electric-connecting.
3. possess the small IC label of multilayer coil antenna as claimed in claim 1, it is characterized in that,
Described multilayer coil is at used band resonant, and being wound around number of times is 2 to 4.
4. possess the small IC label of multilayer coil antenna as claimed in claim 1, it is characterized in that,
Described multilayer coil is wrapped on core with swirling by ribbon coil to form,
Described core is made up of the material that electromagnetic consumable is few,
Described ribbon coil to be wound around in the mode of used band resonant, along total length have insulation-coated after belt metal foil and intercoil insulation material,
Described microminiature IC tag is provided with integratedly in the side of described core.
5. possess the small IC label of multilayer coil antenna as claimed in claim 4, it is characterized in that,
The size of the described antenna surface formed by described multilayer coil is greater than the size of the antenna surface of described microminiature IC tag.
6. possess the small IC label of multilayer coil antenna as claimed in claim 1, it is characterized in that,
At the antenna surface of described multilayer coil, described microminiature label is installed, the entirety of described multilayer coil and described microminiature label is coated to by insulative resin and is integrated, and the outside surface in the direction at a right angle with the axle of described multilayer coil is configured to play function as metal installed surface.
7. possess the small IC label of multilayer coil antenna as claimed in claim 2, it is characterized in that,
The quantity N of described multilayer coil is 1 to 6.
8. possess a small IC label for multilayer coil antenna, it is characterized in that,
Possess the installation surface that microminiature IC tag, at least one multilayer coil and the outside surface at described multilayer coil are formed,
Described microminiature IC tag has the coil antenna forming resonant circuit,
Described multilayer coil, to be wound around in the mode of used band resonant, is repeatedly be wrapped in axial swirling coil with swirling in the plane, and is the starting point that starts of the winding of this multilayer coil and the opening coil being wound around the terminal that terminates and not being connected,
Described microminiature IC tag and described multilayer coil are formed in the non-electric-connecting and mode of electromagnetic coupled,
In the mode that the antenna surface of described multilayer coil is parallel or overlapping on described direction of principal axis with the antenna surface of described microminiature IC tag, by described microminiature IC tag and the integration of described multilayer coil,
The described installation surface in the direction at a right angle with the axle of described multilayer coil is configured to play function as metal installed surface.
9. possess the small IC label of multilayer coil antenna as claimed in claim 8, it is characterized in that,
The winding number of times of described multilayer coil is 2 to 4,
Described multilayer coil arranged in parallel on described direction of principal axis has 1 to 6.
10. possess the small IC label of multilayer coil antenna as claimed in claim 8, it is characterized in that,
Described microminiature IC tag is arranged at the face side of one piece of insulated substrate,
Described multilayer coil is arranged at the face side of other at least one piece of insulated substrate and the position corresponding with described microminiature IC tag,
Described each insulated substrate carries out integration by insulativity adhesives.
The 11. small IC labels possessing multilayer coil antenna as claimed in claim 8, is characterized in that,
Described microminiature IC tag is arranged at the face side of one piece of insulated substrate,
Described multilayer coil is arranged at the rear side of described one piece of insulated substrate, and the surface of other at least one piece of insulated substrate and the back side and the position corresponding with described microminiature IC tag,
Described each insulated substrate carries out integration by insulativity adhesives.
12. 1 kinds of method for makings possessing the small IC label of multilayer coil antenna, is characterized in that,
Described small IC label possesses microminiature IC tag and at least one multilayer coil,
The coil antenna that described microminiature IC tag has the formation resonant circuit formed on insulated substrate and the IC chip be connected with this coil antenna,
Electric conductor at used band resonant is repeatedly wrapped in around axle with swirling in the plane, the swirling multilayer coil of the style of opening that the starting point forming winding beginning is not connected with the terminal being wound around end,
Under the antenna surface of described multilayer coil becomes parallel position relationship with the antenna surface of described microminiature IC tag, by described microminiature IC tag and described multilayer coil with non-electric-connecting and the state of electromagnetic coupled carries out integration.
13. method for makings possessing the small IC label of multilayer coil antenna as claimed in claim 12, is characterized in that,
Belt metal foil after insulation-coated is wound around 2 to 4 times at grade around the central shaft of core, forms described multilayer coil,
To make the antenna surface of described multilayer coil consistent with the end face of described core, and mode relative with the antenna surface of the coil antenna of described microminiature label on the shaft, both are carried out integration with adhesives is bonding.
14. method for makings possessing the small IC label of multilayer coil antenna as claimed in claim 12, is characterized in that,
Be produced in face the printed base plate being configured with multiple described microminiature IC tag, and in the position corresponding with the described microminiature IC tag in face, there are multiple coil substrates of described multilayer coil respectively,
Described printed base plate and described multiple coil substrate is overlapping in the mode of the position consistency of described correspondence, and carry out integration by adhesives,
Cut in units of described each microminiature IC tag, thus make multiple described small IC label.
15. method for makings possessing the small IC label of multilayer coil antenna as claimed in claim 12, is characterized in that,
Be produced on and one side be configured with multiple described microminiature IC tag and be only configured with multiple printed base plate with multiple coil substrates of described multilayer coil overleaf, and be only configured with multiple multiple printed base plates with multiple coil substrates of described multilayer coil on two sides
Described printed base plate and described multiple coil substrate is overlapping in the mode of the position consistency of described correspondence, and carry out integration by adhesives,
Cut in units of described each microminiature IC tag, thus make multiple described small IC label.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013054007 | 2013-03-15 | ||
| JP2013-054007 | 2013-03-15 | ||
| PCT/JP2014/055122 WO2014141906A1 (en) | 2013-03-15 | 2014-02-28 | Compact ic tag provided with laminated coil antenna, and manufacturing method therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105051759A true CN105051759A (en) | 2015-11-11 |
| CN105051759B CN105051759B (en) | 2018-06-12 |
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| CN201480016074.2A Expired - Fee Related CN105051759B (en) | 2013-03-15 | 2014-02-28 | Have the small-sized IC tag and its preparation method of multilayer coil antenna |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5927337B2 (en) |
| CN (1) | CN105051759B (en) |
| WO (1) | WO2014141906A1 (en) |
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| FR3053165A1 (en) * | 2016-06-28 | 2017-12-29 | Smartinst | IMMERSE BIDIRECTIONAL COMMUNICATION DEVICE |
| JP6957962B2 (en) * | 2017-04-28 | 2021-11-02 | 株式会社村田製作所 | RFID tag manufacturing method |
| JP6562193B1 (en) * | 2018-01-23 | 2019-08-21 | 株式会社村田製作所 | RFID tag, article provided with RFID tag, and method of manufacturing article |
| WO2020122228A1 (en) * | 2018-12-14 | 2020-06-18 | 株式会社村田製作所 | Wireless communication system, electronic device, and wireless communication tag |
| JP7049981B2 (en) * | 2018-12-17 | 2022-04-07 | 長野計器株式会社 | Physical quantity measuring device |
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| JP2005332015A (en) * | 2004-05-18 | 2005-12-02 | Toppan Printing Co Ltd | Card case with booster |
| CN102027637A (en) * | 2008-05-13 | 2011-04-20 | 户田工业株式会社 | Composite magnetic antenna and RF tag, metal part and metal instrument having the composite magnetic antenna or the RF tag |
| CN102201073A (en) * | 2010-03-26 | 2011-09-28 | 株式会社日立情报系统 | RFID tag equipped with RFID boradband protective metal member |
| CN102376010A (en) * | 2010-07-20 | 2012-03-14 | 欧贝特科技公司 | Microcircuit equipment comprising device used for amplifying gain of antenne |
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| US7119693B1 (en) * | 2002-03-13 | 2006-10-10 | Celis Semiconductor Corp. | Integrated circuit with enhanced coupling |
| EP3367500B1 (en) * | 2006-01-19 | 2021-08-11 | Murata Manufacturing Co., Ltd. | Wireless ic device |
| CN102273012B (en) * | 2009-01-09 | 2013-11-20 | 株式会社村田制作所 | Wireless IC device, wireless IC module and wireless IC module manufacturing method |
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2014
- 2014-02-28 JP JP2015505395A patent/JP5927337B2/en not_active Expired - Fee Related
- 2014-02-28 WO PCT/JP2014/055122 patent/WO2014141906A1/en active Application Filing
- 2014-02-28 CN CN201480016074.2A patent/CN105051759B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005332015A (en) * | 2004-05-18 | 2005-12-02 | Toppan Printing Co Ltd | Card case with booster |
| CN102027637A (en) * | 2008-05-13 | 2011-04-20 | 户田工业株式会社 | Composite magnetic antenna and RF tag, metal part and metal instrument having the composite magnetic antenna or the RF tag |
| CN102201073A (en) * | 2010-03-26 | 2011-09-28 | 株式会社日立情报系统 | RFID tag equipped with RFID boradband protective metal member |
| CN102376010A (en) * | 2010-07-20 | 2012-03-14 | 欧贝特科技公司 | Microcircuit equipment comprising device used for amplifying gain of antenne |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014141906A1 (en) | 2014-09-18 |
| CN105051759B (en) | 2018-06-12 |
| JP5927337B2 (en) | 2016-06-01 |
| JPWO2014141906A1 (en) | 2017-02-16 |
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