CN105050325A - Rigid-flex printed circuit board milling method - Google Patents
Rigid-flex printed circuit board milling method Download PDFInfo
- Publication number
- CN105050325A CN105050325A CN201510383836.9A CN201510383836A CN105050325A CN 105050325 A CN105050325 A CN 105050325A CN 201510383836 A CN201510383836 A CN 201510383836A CN 105050325 A CN105050325 A CN 105050325A
- Authority
- CN
- China
- Prior art keywords
- rigid
- adhesive tape
- board
- flex combined
- milling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses a rigid-flex printed circuit board milling method. the method comprises steps: A, a layer of adhesive tape with the thickness between 0.025mm to 0.5mm is attached to the flexible face of the rigid-flex printed circuit board; B, a roller pressing mode is used for enabling the adhesive tape and the flexible face to be tightly attached, wherein the pressing roller has a pressure of 0.5 to 4kg/cm2; and C, board milling and gong appearance shaping are carried out on the rigid-flex printed circuit board, and after milling and shaping, the adhesive tape is removed. As the adhesive tape is attached to the flexible face, the roller pressing mode is used for pressing to enable the adhesive tape and the flexible face to be tightly attached, board milling and gong appearance shaping are carried out in a conventional board milling mode, and finally the adhesive tape is removed, the problems of rough board edges and flexible board burr remaining can be effectively solved.
Description
Technical field
The present invention relates to PCB manufacture technology field, particularly relate to a kind of method of rigid-flex combined board milling plate.
Background technology
Rigid-flex combined board changes the design concept of traditional plane formula, expands 3 three-dimensional dimension space concepts to, bring to product design huge simultaneously easily, also bring huge challenge.The designer of rigid-flex combined board can utilize single component to substitute the complex printed-circuit board connected into by multiple connector, many cables and flat cable, performance is stronger, stability is also higher, also the scope of design is limited in an assembly simultaneously, as stacker swan, optimize free space by bending, folding circuit, rigid-flex combined board is more and more used in recent years.But for soft board at outer field rigid-flex combined board, PI material due to soft board easily remains in milling cutter when milling plate not easily to be removed, cause affecting cutting ability, on the other hand, soft board surface compresses without FR4, cause the outline edge of soft board during milling plate to be subject to pullling of milling cutter, produce a large amount of soft board burrs.
For solving soft board burrs on edges residue problem, make primarily of the method using mould punching and pad light central layer when milling plate on soft board face at present.But these two kinds of methods all fail effectively to deal with problems.Punching mode can cause outline edge coarse; Soft board face is padded light central layer, and because light central layer and soft board fail closely to be adjacent to, effect is also little, and soft board still produces burr and remains.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of method of rigid-flex combined board milling plate, be intended to solve the problem that rigid-flex combined board produces soft board burr.
Technical scheme of the present invention is as follows:
A method for rigid-flex combined board milling plate, wherein, comprises step:
A, stick one layer tape in the one side of the soft board of rigid-flex combined board, tape thickness is between 0.025mm ~ 0.5mm;
The mode of B, use roller pressing makes adhesive tape and soft board face fit closely, and pinch roller pressure is 0.5 ~ 4kg/cm
2;
C, again milling plate gong profile is carried out to rigid-flex combined board, after the complete profile of milling, tear adhesive tape.
The method of described rigid-flex combined board milling plate, wherein, the raw material of described adhesive tape is PET and silica gel.
The method of described rigid-flex combined board milling plate, wherein, the raw material of described adhesive tape is PVC and silica gel.
The method of described rigid-flex combined board milling plate, wherein, tape thickness is between 0.25mm ~ 0.35mm.
The method of described rigid-flex combined board milling plate, wherein, pinch roller pressure is 1 ~ 2kg/cm2.
Beneficial effect: the present invention sticks adhesive tape by the one side at soft board, then uses the pressing of roller pressing mode, makes adhesive tape and soft board face fit closely, then carry out milling plate gong profile by conventional milling plate mode; Finally tear adhesive tape, the present invention effectively can solve the coarse and soft board burr residue problem of edges of boards.
Accompanying drawing explanation
Fig. 1 is the structural representation of rigid-flex combined board of the present invention when taping.
Embodiment
The invention provides a kind of method of rigid-flex combined board milling plate, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The method of a kind of rigid-flex combined board milling plate provided by the present invention, it comprises step:
S101, stick one layer tape in the one side of the soft board of rigid-flex combined board, tape thickness is between 0.025mm ~ 0.5mm;
The mode of S102, use roller pressing makes adhesive tape and soft board face fit closely, and pinch roller pressure is 0.5 ~ 4kg/cm
2;
S103, again milling plate gong profile is carried out to rigid-flex combined board, after the complete profile of milling, tear adhesive tape.
As shown in Figure 1, central layer 100, prepreg 200, soft board 300, adhesive tape 400 is followed successively by from bottom to up.The present invention sticks one layer tape 400 in the one side of soft board 300, then makes adhesive tape 400 and soft board 300 fit closely, finally carries out milling plate gong profile, then tear adhesive tape 400.The invention solves the problem that traditional punching mode causes outline edge coarse, also solve pad light central layer simultaneously and still produce the residual problem of burr, thoroughly solve soft board burrs on edges residue problem, and effective.
Described tape thickness is preferably between 0.25mm ~ 0.35mm, and it can ensure to have good anti-burr residual effect, and more easily laminating is tight.Preferred, tape thickness is 0.3mm.
In the present invention, use the mode of roller pressing to come pressing adhesive tape and soft board, make the two laminating closely, pinch roller pressure is 0.5 ~ 4kg/cm
2, preferably, described pinch roller pressure is 1 ~ 2kg/cm
2, it can ensure to have effect of fitting preferably, also tears as being difficult in subsequent handling simultaneously.Through test of many times, pinch roller pressure more preferably 1.5kg/cm
2.
Further, the raw material of described adhesive tape is PET and silica gel.
Further, the raw material of described adhesive tape is PVC and silica gel.
Silica gel wherein can be inorganic silica gel or organic silica gel, such as, adopt inorganic silica gel xSiO
2.yH
2o(is 2 if x is 1, y), specifically can adopt inorganic silochrom or inorganic Kiselgel A.
When with PET and silica gel for raw material time, in described adhesive tape, by mass percentage, comprise PET30% and silica gel 70%.When with PVC and silica gel for raw material time, in described adhesive tape, by mass percentage, comprise PVC40% and silica gel 60%.
In sum, the present invention sticks adhesive tape by the one side at soft board, then uses the pressing of roller pressing mode, makes adhesive tape and soft board face fit closely, then carry out milling plate gong profile by conventional milling plate mode; Finally tear adhesive tape, the present invention effectively can solve the coarse and soft board burr residue problem of edges of boards.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (5)
1. a method for rigid-flex combined board milling plate, is characterized in that, comprises step:
A, stick one layer tape in the one side of the soft board of rigid-flex combined board, tape thickness is between 0.025mm ~ 0.5mm;
The mode of B, use roller pressing makes adhesive tape and soft board face fit closely, and pinch roller pressure is 0.5 ~ 4kg/cm
2;
C, again milling plate gong profile is carried out to rigid-flex combined board, after the complete profile of milling, tear adhesive tape.
2. the method for rigid-flex combined board milling plate according to claim 1, is characterized in that, the raw material of described adhesive tape is PET and silica gel.
3. the method for rigid-flex combined board milling plate according to claim 1, is characterized in that, the raw material of described adhesive tape is PVC and silica gel.
4. the method for rigid-flex combined board milling plate according to claim 1, is characterized in that, tape thickness is between 0.25mm ~ 0.35mm.
5. the method for rigid-flex combined board milling plate according to claim 1, is characterized in that, pinch roller pressure is 1 ~ 2kg/cm
2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510383836.9A CN105050325A (en) | 2015-07-03 | 2015-07-03 | Rigid-flex printed circuit board milling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510383836.9A CN105050325A (en) | 2015-07-03 | 2015-07-03 | Rigid-flex printed circuit board milling method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105050325A true CN105050325A (en) | 2015-11-11 |
Family
ID=54456384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510383836.9A Pending CN105050325A (en) | 2015-07-03 | 2015-07-03 | Rigid-flex printed circuit board milling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105050325A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105357886A (en) * | 2015-12-18 | 2016-02-24 | 景旺电子科技(龙川)有限公司 | Production method capable of removing turning burrs of PI (polyimide) dielectric layer of aluminum substrate |
| CN105357884A (en) * | 2015-11-30 | 2016-02-24 | 珠海方正科技多层电路板有限公司 | Method for forming slot in PCB (Printed Circuit Board) and manufacturing method of PCB |
| CN105407644A (en) * | 2015-12-25 | 2016-03-16 | 深圳市景旺电子股份有限公司 | Method for reducing burrs in milling process for rigid-flexible combined plate and rigid-flexible combined plate |
| CN107995800A (en) * | 2017-12-28 | 2018-05-04 | 信利光电股份有限公司 | The soft board and hardboard associated methods of a kind of Rigid Flex |
| CN108966495A (en) * | 2017-05-18 | 2018-12-07 | 北大方正集团有限公司 | A kind of production method and circuit board of circuit board molding |
| CN109693080A (en) * | 2018-12-24 | 2019-04-30 | 江苏弘信华印电路科技有限公司 | A kind of impulse- free robustness milling technology of rigid-flex combined board |
Citations (7)
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|---|---|---|---|---|
| TW200623983A (en) * | 2004-12-20 | 2006-07-01 | Nan Ya Printed Circuit Board Corp | Method for cutting printed circuit board |
| WO2009045932A1 (en) * | 2007-09-28 | 2009-04-09 | Tri-Star Laminates, Inc. | Improved systems and methods for drilling holes in printed circuit boards |
| CN101516164A (en) * | 2008-02-19 | 2009-08-26 | 环宇真空科技股份有限公司 | Method for milling slot on printed circuit board |
| CN201479473U (en) * | 2009-09-02 | 2010-05-19 | 比亚迪股份有限公司 | Circuit board and adhesive tape composite device |
| CN103547072A (en) * | 2012-07-12 | 2014-01-29 | Si弗莱克斯有限公司 | The printed circuit board manufacturing method |
| CN103763859A (en) * | 2014-01-18 | 2014-04-30 | 上海美维电子有限公司 | Machining method for printed circuit board |
| CN104363718A (en) * | 2014-12-04 | 2015-02-18 | 奥士康科技（益阳）有限公司 | Production method of soft and hard combined circuit board |
-
2015
- 2015-07-03 CN CN201510383836.9A patent/CN105050325A/en active Pending
Patent Citations (7)
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| TW200623983A (en) * | 2004-12-20 | 2006-07-01 | Nan Ya Printed Circuit Board Corp | Method for cutting printed circuit board |
| WO2009045932A1 (en) * | 2007-09-28 | 2009-04-09 | Tri-Star Laminates, Inc. | Improved systems and methods for drilling holes in printed circuit boards |
| CN101516164A (en) * | 2008-02-19 | 2009-08-26 | 环宇真空科技股份有限公司 | Method for milling slot on printed circuit board |
| CN201479473U (en) * | 2009-09-02 | 2010-05-19 | 比亚迪股份有限公司 | Circuit board and adhesive tape composite device |
| CN103547072A (en) * | 2012-07-12 | 2014-01-29 | Si弗莱克斯有限公司 | The printed circuit board manufacturing method |
| CN103763859A (en) * | 2014-01-18 | 2014-04-30 | 上海美维电子有限公司 | Machining method for printed circuit board |
| CN104363718A (en) * | 2014-12-04 | 2015-02-18 | 奥士康科技（益阳）有限公司 | Production method of soft and hard combined circuit board |
Non-Patent Citations (1)
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| 刘祖明: "《维修电工技能直通车》", 30 April 2014 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105357884A (en) * | 2015-11-30 | 2016-02-24 | 珠海方正科技多层电路板有限公司 | Method for forming slot in PCB (Printed Circuit Board) and manufacturing method of PCB |
| CN105357886A (en) * | 2015-12-18 | 2016-02-24 | 景旺电子科技(龙川)有限公司 | Production method capable of removing turning burrs of PI (polyimide) dielectric layer of aluminum substrate |
| CN105407644A (en) * | 2015-12-25 | 2016-03-16 | 深圳市景旺电子股份有限公司 | Method for reducing burrs in milling process for rigid-flexible combined plate and rigid-flexible combined plate |
| CN108966495A (en) * | 2017-05-18 | 2018-12-07 | 北大方正集团有限公司 | A kind of production method and circuit board of circuit board molding |
| CN107995800A (en) * | 2017-12-28 | 2018-05-04 | 信利光电股份有限公司 | The soft board and hardboard associated methods of a kind of Rigid Flex |
| CN107995800B (en) * | 2017-12-28 | 2020-01-03 | 信利光电股份有限公司 | Soft board and hard board combination method of soft and hard combination board |
| CN109693080A (en) * | 2018-12-24 | 2019-04-30 | 江苏弘信华印电路科技有限公司 | A kind of impulse- free robustness milling technology of rigid-flex combined board |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151111 |