CN105033496B - A kind of compound lead-free high-temperature solder of high-strength highly-conductive and preparation method thereof - Google Patents
A kind of compound lead-free high-temperature solder of high-strength highly-conductive and preparation method thereof Download PDFInfo
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- CN105033496B CN105033496B CN201510388451.1A CN201510388451A CN105033496B CN 105033496 B CN105033496 B CN 105033496B CN 201510388451 A CN201510388451 A CN 201510388451A CN 105033496 B CN105033496 B CN 105033496B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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Abstract
The present invention relates to compound lead-free high-temperature solder of a kind of high-strength highly-conductive and preparation method thereof, belong to the manufacturing technology field of lead-free solder.The solder is made up of tinbase welding powder, copper alloy powder and weld-aiding cream.First weigh tinbase welding powder, copper alloy powder, weld-aiding cream；Tinbase welding powder and weld-aiding cream are placed in container and stirred；It is uniform to three kinds of components by stirring is continued in copper alloy powder addition container, that is, obtain high-temp leadless soldering paste.The paste solder printing quality problems that composite solder prepared by this method efficiently solves the uniform mixed problem of three kinds of components and wide particle size range powder belt comes；Significantly improve the heat-resisting quantity difference problem of tin solder postwelding, the problems such as postwelding conduction/thermal conductivity deficiency and heavy load creep can be improved simultaneously, and hole caused by effectively alleviating postwelding solidification shrinkage/empty problem, the high-temperature solder of alternative existing high Pb contents encapsulate for high-power third generation semi-conductor discrete device.
Description
Technical field
The present invention relates to compound lead-free high-temperature solder of a kind of high-strength highly-conductive and preparation method thereof, the solder is welded by tinbase
Three kinds of powder, copper alloy powder and weld-aiding cream components are combined by uniform stirring.Belong to the manufacturing technology field of lead-free solder, it is special
It is not lead-free high-temperature soldering paste technology category.
Background technology
Attaching importance to environmental protection, the main trend that green product is current world economy development is advocated, the unleaded of electronic product is exactly
One of which major action.In the unleaded alternative aspect of middle low temperature solder containing pb, had been obtained for by the research of more than ten years
Reliability demonstration, and be widely used, but high kupper solder [w (Pb)>85%] there is no suitable substitute also but so far,
Also therefore temporary transient exemption has been obtained in RoHS instructions.But planned according to instruction：RoHS Directive will phase out exempt item.
For example, being exempted to the lead in 2016 end of the year vehicle cored solders to be released from, the comprehensive unleaded of whole system will be realized at that time, it is high
Kupper solder will also be substituted, therefore prepare the lead-free product meaning weight of good performance that can be used for substituting vehicle-mounted high kupper solder
Greatly.
Au-Sn alloys are concentrated mainly on to research of the high temperature lead-free solder in terms of alloy material at present, Sn-Sb bases close
Four classes such as gold, Zn-Al based alloys and Bi based alloys：
1st, 80Au-Sn solders：The fusing point of Au-Sn eutectic solders is 280 DEG C, most close with the fusing point of high kupper solder, compatible
Property is good, compared with the unleaded eutectic solder of low melting point (about 217 DEG C), has bigger stability and reliability.But the solder
It is more crisp, and because Au (w) is that 80% cost is too high, thus it is mainly used in optoelectronic packaging, high reliability (such as InP laser two
Pole pipe), in high-power electronic device circuit level Hermetic Package and chip package.
2nd, Sn-Sb alloys：Because Sn-Sb [w (Sb)≤10%] alloy melting section is narrower (232~250 DEG C), and with
Existing solder compatibility is good, thus as the candidate material of high temperature lead-free solder.But its fusing point is relatively low, and particularly solder is unleaded
Because the fusing point of existing lead-free solder is compared with the height (general high 30-40 DEG C) of Sn-Pb eutectic alloys since change, package temperature can be
Lifting, subsequent reflow or wave-soldering temperature can exceed its fusing point when causing multistage assemble, and then influence the reliability of packaging,
Even cause product rejection.
3rd, Zn-Al alloy：Rettenmayr etc. and Shimizu deciles you can well imagine substitutes 95Pb-5Sn to weld with Zn based alloys
Material realizes that chip connects.But Zn based alloy poor in processability, and easily aoxidize and cause moistening badness, and Zn based alloys is higher
Activity also causes soldering reliability to be under suspicion, therefore largely limits the application of such alloy.
4th, Bi based alloys：Bi based alloys are good due to fusing point suitable (270 DEG C or so), filling capacity, it is considered to be substitution
The unleaded candidate solders of the high Pb solders of tradition, the JP2001-205477 proprietary alloys that such as Japanese Murata Manufacturing Co. Ltd. announces.Bi-Ag
It is that solder is most studied Bi based alloys, Bi and Ag mutual solubility very little under normal temperature, its eutectic alloy fusing point is 262.5
DEG C, research shows its elongation percentage than SnAg25Sb10 (J alloys, 365 DEG C of fusing point) fortunately, and increase Ag contents can improve Bi-Ag conjunctions
The intensity of gold, and the fragility of its alloy can be improved, but it is generally smaller than SnAg25Sb10 alloy, and add cost of alloy.
Another kind is manufacture composite solder, specific to be divided into two classes again：Additional particle mechanical mixing and reaction in-situ life
Cheng Fa.
Mechanical mixing is that additional particle is dissolved in solder matrix as dispersoid so as to form composite soldering.It is even if warm
The solubility of degree rise these dispersoids still old very little in parent.Lin et al. adds TiO in common Sn-Pb solders2
With Cu nanometer powders so as to obtaining nano combined lead base solder soldering paste.For the enhancing relatively evenly disperseed in solder matrix
Body, Mavoori and Jin et al. have developed a coated particle and then have been plastically deformed repeatedly to reach nano particle in solder matrix
The method of even dispersion.In this approach, eutectic Sn-37Pb brazing filler metal alloys powder (35 μm) and nano-scale TiO2(5nm)/
Al2O3(10nm) powder is by acutely rocking to reach completely discrete and mix in proper proportions, Ran Houtong in ethanol
Cross lasting stirring and form the Sn-Pb lotions for applying and being covered with oxide particle.Tsao et al. have studied in Sn-3.5Ag-0.25Cu
Series addition TiO2Nano particle.As a result show to add 0.25-1wt.%TiO in Sn-Ag-Cu lead-free brazings2Nano particle is led
Cause its liquidus temperature and add 3.5-5.9 DEG C.The metallographic observation of SAC lead-free brazings shows β-Sn crystallite dimensions and Ag3Sn
Phase and Ag3Interval between Sn phases reduces.In terms of mechanical behavior, more large content of TiO is added in SAC lead-free brazings2
Nano particle can improve microhardness, and its extensibility decrease to some degree.Masazumi is by the metal of nanoscale
Particle and Au are added in Sn-Ag base leadless solders, study these nano particles whether can four reflow process and it is long when
Between high-temperature aging after slow down the growth of intermetallic compound；These nanometers in the dilatory test of HI high impact are investigated simultaneously
Whether grain can reduce the probability in intermetallic compound fracture.Except the analysis of intermetallic compound, nanometer is investigated
Impact effect of the grain to solder drop test performance.As a result show：Compared with other several elements, Co, Ni and Pt are to repeatedly weight
The growth inhibition of intermetallic compound and the lifting of drop test performance are highly effective during molten.
In-situ method is another main method for preparing composite soldering, working process brazing filler metal alloy in itself during shape
Into enhancing nano particle.Wherein, embedded solder matrix enhancing particle is not from additional reinforcement.This original positions of Lee et al.
One kind Cu has been made in method6Sn5The composite soldering of enhancing.The Cu powder (~1 μm) that they with the addition of coating RMA type brazing fluxes arrives Sn-
In 3.5Ag eutectic solders, and Al is placed it into argon gas atmosphere2O3Melted in crucible.It is anti-between Sn and Cu in order to promote
Should, when temperature is increased to 573K, machinery is stirred the fusing solder of Cu powder.Solder this temperature keep one minute, so
It is quick in alcohol afterwards to cool down so as to solidify.The ingot casting of solidification is hot rolled into thin slice, is then punched into disk.It is in maximum temperature
Under 523K thermograde, by disk remelting in the cylindrical chamber of silicone oil.The disk of fusing shape in the presence of surface tension
As 760 μm of solder ball of diameter.The composite soldering being distributed by the way that even dispersion can be obtained during this.Hwang et al.
A kind of in-situ method for preparing composite soldering is have developed, step is as follows：Pure Sn, Ag, Cu ingot casting can oozed under argon gas atmosphere
Melt in saturating porcelain crucible, then solder mixture is cast in swage.IMC particles are prepared by rolling cast sheet
The solder bar of enhancing, a diameter of 1.5mm thin slice is then punched into, the solder ball of 630 μm of diameter is formed finally by hot oil bath.
The initial IMC dendroids dendrite formed in casting cycle in solder matrix can be crushed to be good in plasticity work
Particle, therefore IMC particles being capable of even dispersion distribution in solder matrix after rolling.
The B1 of United States Patent (USP) 6,360,939 discloses a kind of method for manufacturing the lead-free solder paste in electronics industry, soldering paste tool
Have a basic solder powder and one in welding process infusible addition metal powder constituent, the fusing point for adding powder compare base
The fusing point of this solder powder is much higher, and basic solder powder includes 80-90% Sn and 1-20% Ag, addition powdered-metal choosing
From the metal constituent element for including Sn, Ni, Cu, Ag and Bi and other mixtures；The researcher of Akron universities of the U.S. passes through in Sn-
Copper is added in Pb solders or the nano particle of titanium oxide significantly improves Joint Strength；IBM Corporation is then received by adding molybdenum and tantalum
Rice grain is prepared for composite solder, and Chinese patent CN 1672858A disclose the tin-silver solder containing memory alloy particle；China
Patent CN 1672859A are disclosed containing nano zircite particle enhancement type tin silver solder and its preparation method；And United States Patent (USP) US
The composite solder that 2002/0040624 A1 and CN 1732063A are announced two kinds of components in welding process are molten state, it is desirable to
The fusing point difference of two components is less than 15 DEG C in solder.
Whether different component fusing (dissolving) depends not only on the different component that composite solder includes in itself in composite solder
Between fusing point it is poor, and mutual infiltration spread coefficient and process window etc. during welding are closely bound up between different component.It is above-mentioned
Research and patent report, do not refer to the matching of the pattern of different component powder, grain size specification and Size Distribution in composite solder
Influence of the property to solder, different component interphase interaction and the existing forms butt welding of postwelding composite solder interface in welding process
The influence of the electric heating property of point (or weld seam)；Specification and Size Distribution phase to adding large scale in high-temperature solder system matrix
When high heat-conductivity conducting particle be even more be rarely reported；Particularly, for solder as a kind of special functional material, it is using process
In need re-melting and solidification and crystallization process, this is particularly important to composite solder system, due to solder postwelding solidification receive
Contracting and cavity and its expanding with heat and contract with cold during high-temperature service are to cause non-running down system composite solder to be difficult to reality in industry
The key of border application.
The content of the invention
Present invention aims at a kind of compound lead-free high-temperature solder of high-strength highly-conductive and preparation method thereof is provided, welding
Cheng Zhong, enable refractory metal particle in solder to react to form high-melting-point IMC with periphery low melting point ingredient in situ, consume simultaneously
Internal low-melting component, so as to greatly improve the temperature resistant capability of Sn-Sb or Sn-Bi bianry alloy postweldings, the weldering for being formed it
Point has higher remelting temperature, improves the fatigability of resistance to temperature and resistance to temperature impact.The high temperature application of solder is realized, is replaced
Generation traditional high Pb alloys and high cost Au-Sn alloys.Meanwhile for the ease of in the printing use of tin cream and mechanical recombination process
Uniformity controlling, the different powder in composite solder employ particle size and the suitable two kinds of components of Size Distribution matching.
The height that one-size and specification are added using matching in low cold-shrink type or cold expanding mold base welding powder of the invention
Heat conduction, conducting particles, to reduce usually used kamash alloy (such as Sn-Cu or Sn-Ag-Cu) in postwelding process of setting compared with
Defect increases under phenomenon and the military service of postwelding temperature caused by expanding with heat and contract with cold in composite solder caused by big solidification shrinkage amount
Failure.The high-temperature metal particle of unique highly conductive/heat conduction containing larger proportion in high-temperature solder of the present invention, in weld job
When can suppress to cave in and bridging, postwelding serve as skeleton and conduction/passage of heat (copper core)；Low-melting component leans on hair in solder simultaneously
Spy forms fine and close flawless solder joint with penetrating into copper core gap, and relies on reaction in-situ, disappears in composite solder interface
Low-melting alloy composition is consumed, Joint Strength and postwelding resistance to elevated temperatures are improved, to meet the use of its high temperature application scenario.
The present invention takes following technical scheme：
A kind of compound lead-free high-temperature solder of high-strength highly-conductive, the solder is by tinbase welding powder, copper alloy powder, and three kinds of weld-aiding cream
Component forms.
Described tinbase welding powder is the general welding powder of Sn-Bi systems or Sn-Sb systems, and such tinbase welding powder has a common feature
Exactly belong to low cold-shrink type or cold expanding section bar material.
Described Sn-Bi systems welding powder is Sn-Bi systems eutectic alloy or hypereutectic alloy welding powder.
Described tinbase welding powder includes SnBi58, SnBi57Ag1, SnSb5, SnSb10 and SnSb10Ni0.5 welding powder etc..
In described copper alloy powder, the weight content of copper is 80%-100%.Preferably, described copper alloy powder is pure Cu
Powder or Cu-Sn powder (Cu >=80%)；Described Cu-Sn powder is CuSn10 powder or CuSn20 powder.The characteristics of such metal powder is tool
There is highly conductive, thermal conductivity.
In the compound lead-free high-temperature solder of described high-strength highly-conductive, the powder of tinbase welding powder and two kinds of metal components of copper alloy powder
Last pattern, grain size specification and Size Distribution are close.Preferably, tinbase welding powder and copper alloy powder are spherical powder or subsphaeroidal powder
End, grain size distribution are identical.
In the compound lead-free high-temperature solder of described high-strength highly-conductive, the ratio of component meets tinbase welding powder and copper alloy powder
Part by weight is 20:1~2:1, weld-aiding cream accounts for the 10-12wt% of total solder weight.
The preparation method of the above-mentioned compound lead-free high-temperature solder of high-strength highly-conductive, its preparation process comprise the following steps：
1) dispensing：Weigh tinbase welding powder, copper alloy powder, weld-aiding cream；
2) tinbase welding powder and weld-aiding cream are placed in container and stirred；
3) will copper alloy powder add container in continue stirring it is uniform to three kinds of components, that is, obtain high-temp leadless soldering paste, store
It is standby.
Beneficial effect：Using solder based on Sn-Sb the or Sn-Bi solders of low cold-shrink type or cold expanding type, reduce logical
It is compound caused by the kamash alloy (such as Sn-Cu or Sn-Ag-Cu) that often uses solidification shrinkage amount larger in postwelding process of setting
Defect increases phenomenon, lifting weld point temperature cycle life in solder.Simultaneously addition have high heat conduction, conductive features Cu or
Cu-Sn high-temperature metal particles, have played the advantage of different component in composite solder, can suppress to cave in weld job and bridge
Even, postwelding serves as skeleton and conduction/passage of heat；And low melting point composition penetrates into gap around copper core by capillarity in solder
It is middle to form fine and close flawless solder joint, and reaction in-situ is relied on, low-melting alloy composition is consumed in composite solder interface, simultaneously
Continuous high temperature skeleton is formed, Joint Strength and postwelding resistance to elevated temperatures is improved, disclosure satisfy that the use of its high temperature application scenario.
Below by drawings and examples, the present invention is described in detail.It should be understood that described embodiment is only
The preferred embodiments of the invention are only related to, in the case of the spirit and scope of the present invention are not departed from, various components and content
Changes and improvements are all possible.
Brief description of the drawings
Fig. 1 is the preparation technology flow chart of the compound lead-free high-temperature solder of high-strength highly-conductive of the present invention.
Fig. 2A and Fig. 2 B are respectively before the backflow of high-strength highly-conductive of the present invention compound lead-free high-temperature solder after schematic diagram and backflow
The metallograph of solder joint.
Fig. 3 A and Fig. 3 B are respectively the DSC tests of solder before the compound lead-free high-temperature solder Reflow Soldering of high-strength highly-conductive of the present invention
Solder DSC curve is tested after curve and backflow.
Fig. 4 is that the stretching resistance of the compound lead-free high-temperature solder of high-strength highly-conductive of different component of the present invention draws curve.
Embodiment
As shown in figure 1, be the preparation technology flow of the compound lead-free high-temperature solder of high-strength highly-conductive of the present invention, tinbase welding powder and
It is stirred after weld-aiding cream mixing, adds copper alloy powder, continue to stir, obtain high-temp leadless soldering paste.Specific preparation process includes
Following steps：1) dispensing, i.e. weigh tinbase welding powder, a certain proportion of copper alloy powder (100% >=Cu >=80%), certain proportion
Weld-aiding cream；2) tinbase welding powder and a certain proportion of weld-aiding cream are placed in container and stirred；3) copper alloy powder is uniformly introduced and stirred
Mix continue in container stirring it is uniform to three kinds of components；4) high-temp leadless soldering paste is prepared, storage is standby.
The preparation of the compound lead-free high-temperature solder of T3 type SnSb10Ni0.5+CuSn20 high-strength highly-conductives of embodiment 1：
1) SnSb10Ni0.5 routine T3 type (25-45 μm) high temperature welding powder, CuSn20 of the granularity at 25-45 μm are weighed respectively
Powder and general high temperature weld-aiding cream；SnSb10Ni0.5 routine T3 type (25-45 μm) high temperature welding powder, the weight ratio of CuSn20 powder
For 20:1, the embodiment 1 in table 1 is refer to, general high temperature weld-aiding cream accounts for the 10w% of solder gross weight；
2) SnSb10Ni0.5 routine T3 types (25-45 μm) high temperature welding powders and general high temperature weld-aiding cream are placed in tin cream stirring
In kettle, SnSb10Ni0.5 powder and weld-aiding cream are stirred into homogeneous lotion；
3) CuSn20 powder is slowly added into above-mentioned lotion, and continues to stir 5min twice, intermediate hold is once cleared up
Stirred tank wall adheres to；
4) soldering paste is poured into solder paste cartridge, that is, obtained：T3 types SnSb10Ni0.5：CuSn20=20:1st, weld-aiding cream ratio is
The 10wt% compound lead-free high-temperature solder of high-strength highly-conductive, is put into refrigerator and is in store for.
The preparation of the compound lead-free high-temperature solder of T4 type SnSb10Ni0.5+CuSn20 high-strength highly-conductives of embodiment 2：
1) SnSb10Ni0.5 routine T4 type (20-38 μm) high temperature welding powder, CuSn20 of the granularity at 20-38 μm are weighed respectively
Powder and general high temperature weld-aiding cream；SnSb10Ni0.5 routine T4 type (20-38 μm) high temperature welding powder, the weight ratio of CuSn20 powder
It is 2 with reference to the embodiment 2 in table 1:1, general high temperature weld-aiding cream accounts for the 10w% of solder gross weight；
2) SnSb10Ni0.5 routine T4 types (20-38 μm) high temperature welding powders and general high temperature weld-aiding cream are placed in tin cream stirring
In kettle, SnSb10Ni0.5 powder and weld-aiding cream are stirred into homogeneous lotion；
3) CuSn20 powder is slowly added into above-mentioned lotion, and continues to stir 5min twice, intermediate hold is once cleared up
Stirred tank wall adheres to；
4) soldering paste is poured into solder paste cartridge, that is, obtained：T4 types SnSb10Ni0.5：CuSn20=2:1st, weld-aiding cream ratio is
The 10wt% compound lead-free high-temperature solder of high-strength highly-conductive, is put into refrigerator and is in store for.
The preparation of the compound lead-free high-temperature solder of embodiment 3-4 T5 or T6 type SnSb10Ni0.5+CuSn10 high-strength highly-conductives：
Respectively according to SnSb10Ni0.5 routine T5 types (15-25 μm) or T6 types (5-15 μm) high temperature welding powder, same particle size chi
The weight ratio of the CuSn10 powder (granularity is respectively 15-25 μm or 5-15 μm) of very little distribution is 10:1 and 5:1 (the implementation in table 1
Example 3 and 4), general high temperature weld-aiding cream accounts for the 10w% of solder gross weight, weighs raw material；Other preparation processes obtain with reference to embodiment 1
Arrive：T5 types SnSb10Ni0.5：CuSn20=10:1 or T6 types SnSb10Ni0.5：CuSn20=5:1st, weld-aiding cream ratio is
The 10wt% compound lead-free high-temperature solder of high-strength highly-conductive.
Table 1 is the compound lead-free high-temperature solder of typical high-strength highly-conductive of embodiment 1-4 preparations compared with contrasting solder performance.
By table 1, it can be seen that, for the thermal conductivity of solder of the present invention apparently higher than contrast solder, the thermal conductivity of embodiment 1-4 solders is 50-
81W/mK, and the thermal conductivity for contrasting solder is only 9-38W/mK.
The exemplary complex lead-free high-temperature solder of table 1 and contrast solder performance
Embodiment 5-28
With reference to embodiment 5-28 in table 2 composite solder in two kinds of metal dust granularities and part by weight, weigh tin respectively
Base welding powder, copper powder or Cu-Sn alloyed powders, account for total solder weight 10w% general high temperature weld-aiding cream；By tinbase welding powder and weld-aiding cream
It is placed in container and stirs；Copper powder or Cu-Sn alloyed powders are uniformly added into container continue stirring it is uniform to three kinds of components；It is prepared into
It is standby to high-temp leadless soldering paste, storage.
Table 2 is for the component of the compound lead-free high-temperature solder of high-strength highly-conductive of representative instance of the present invention and its using temperature.By
Table 2 can see, and the welding temperature of the compound lead-free high-temperature solder of high-strength highly-conductive of the present invention is 180-300 DEG C, solder joint high temperature resistant
260 DEG C of ability ＞.The requirement of the anti-secondary back of solder joint (general Electronic Assemblies secondary back temperature is less than 260 DEG C) can be met.
Metal component matching and welding temperature in the compound lead-free high-temperature solder of typical high-strength highly-conductive of table 2
As shown in Figure 2 A and 2 B, respectively before the compound lead-free high-temperature solder backflow of the high-strength highly-conductive of the embodiment of the present invention 1
The metallograph of solder joint after schematic diagram and backflow.
From metallograph it can be seen that：
(1) there are IMC layers between Cu-Sn, about 1-2 μm of thickness in copper particle and tin solder border, and boundary is similar to acanthosphere shape
(cluster-shaped), Fusion Strain just with expected perfect condition；
(2) particle size of acanthosphere is 30-40 μm suitable with the copper powders granularity added in composite solder, illustrates do not had
Degree fusion (that is, remaining copper core), has also further confirmed expection, i.e., can form good solder joint.In " cluster-shaped " distribution
Copper alloy particles, penetrating via, lifting alloy heat conduction/conductive capability can be formed in one direction；It is continuous rich in tissue
Sn phases have disappeared, the discrete gap being filled between Cu skeletons, boundary layer and SnSb phases, and this is also such solder high temperature resistant energy
The basic reason that 260 DEG C of power ＞.
(3) the IMC thickness degree between composite solder and Cu substrates is same about 1-2 μm, and the welding procedure for illustrating to use compares reason
Think.
As shown in Figure 3 A and Figure 3 B, the respectively compound lead-free high-temperature solder Reflow Soldering of the high-strength highly-conductive of the embodiment of the present invention 2
Solder DSC curve is tested after the DSC test curves of preceding solder and backflow.It can be seen that：Composite solder is at 300 DEG C before backflow
There is obvious endothermic peak below, illustrate melting phenomenon occurs below 300 DEG C, and the low temperature of the solder (after welding) after flowing back
Endothermic peak unobvious, illustrate that its heat-resisting ability is obviously improved.
As shown in figure 4, the compound lead-free high-temperature solder of high-strength highly-conductive and typical comparison's solder for different component of the present invention
Stretching resistance draw curve, from left to right respectively SnSb10Ni0.5, SnSb10Ni0.5+5%CuSn20, SnSb10Ni0.5+
15%CuSn20, SnSb10Ni0.5+20%CuSn20, SnSb10Ni0.5+25%CuSn20, SnSb10Ni0.5+30%
CuSn20, SnPb92.5Ag2.5 solder.It can be seen that the serial high-strength highly-conductive of the present invention is compound unleaded from stretching resistance test result
The solder bond intensity of high-temperature solder is above Sn5Pb92.5Ag2.5 high-temperature solders general at present.
Tinbase welding powder of the compound lead-free high-temperature solder of high-strength highly-conductive by low-shrinkage of the present invention, a certain proportion of granularity
Suitable height leads copper powder or Cu-Sn alloyed powders and a certain proportion of high temperature weld-aiding cream is combined.Its preparation process is first to weigh
Tinbase welding powder and the weld-aiding cream for the ratio that requires are placed in having in the container of agitating device, then will be quantitative in its whipping process
The copper powder or Cu-Sn alloyed powders of proportioning uniformly introduce wherein, form tinbase powder-copper powder or Cu-Sn alloyed powders-three kinds of weld-aiding cream
The uniform complex of component, composite solder prepared by this method efficiently solve the uniform mixed problem of three kinds of components and wide granularity
The paste solder printing quality problems that scope powder belt comes.The solder utilizes interface reaction in-situ between two kinds of different powder in composite solder
Low-melting component is consumed, significantly improves the heat-resisting quantity difference problem of tin solder postwelding, while height leads particle can improve postwelding
The problems such as conduction/thermal conductivity deficiency and heavy load creep, and composite is effectively alleviated by material selection and ratio optimization
Postwelding solidification shrinkage caused by hole/empty problem, the high-temperature solders of alternative existing high Pb contents is used for the high-power 3rd
Encapsulated for semi-conductor discrete device.
Claims (2)
- A kind of 1. compound lead-free high-temperature solder of high-strength highly-conductive, it is characterised in that：The solder is by tinbase welding powder, copper alloy powder and helps Soldering paste forms, and described tinbase welding powder is SnSb5, SnSb10 or SnSb10Ni0.5 welding powder, and described copper alloy powder is Cu-Sn The weight content of powder, wherein copper is 80%-90%；Described tinbase welding powder and copper alloy powder are spherical powder or subsphaeroidal powder End, grain size distribution is identical, and described tinbase welding powder and the weight ratio of copper alloy powder are 20:1~2:1, described weld-aiding cream For the 10-12wt% of total solder weight.
- 2. the preparation method of the compound lead-free high-temperature solder of high-strength highly-conductive described in claim 1, comprises the following steps：1) dispensing：Weigh tinbase welding powder, copper alloy powder, weld-aiding cream；2) tinbase welding powder and weld-aiding cream are placed in container and stirred；3) will copper alloy powder add container in continue stirring it is uniform to three kinds of components, that is, obtain high-temp leadless soldering paste.
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| CN201510388451.1A CN105033496B (en) | 2015-07-03 | 2015-07-03 | A kind of compound lead-free high-temperature solder of high-strength highly-conductive and preparation method thereof |
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| JP6540869B1 (en) * | 2018-03-30 | 2019-07-10 | 千住金属工業株式会社 | Solder paste |
| CN108927609B (en) * | 2018-08-13 | 2020-08-07 | 深圳市亿铖达工业有限公司 | Preparation method of composite lead-free solder paste |
| CN113231757A (en) * | 2021-06-22 | 2021-08-10 | 内蒙古玉桥合金材料制造有限公司 | Tin-based soldering paste and preparation method thereof |
| CN117548897A (en) * | 2023-11-27 | 2024-02-13 | 北京理工大学 | Solid solution strengthening solder and preparation method of high-reliability interconnection joint thereof |
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