CN105019008B - Electroplating device - Google Patents
Electroplating device Download PDFInfo
- Publication number
- CN105019008B CN105019008B CN201410181857.8A CN201410181857A CN105019008B CN 105019008 B CN105019008 B CN 105019008B CN 201410181857 A CN201410181857 A CN 201410181857A CN 105019008 B CN105019008 B CN 105019008B
- Authority
- CN
- China
- Prior art keywords
- electroplanting device
- bag
- bag body
- compound filter
- air source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title abstract description 14
- 239000010405 anode material Substances 0.000 claims abstract description 33
- 150000001875 compounds Chemical class 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims description 20
- 210000005056 cell body Anatomy 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 239000000654 additive Substances 0.000 abstract description 9
- 230000000996 additive effect Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 6
- 239000010409 thin film Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 16
- 229910021645 metal ion Inorganic materials 0.000 description 5
- 239000006259 organic additive Substances 0.000 description 5
- 230000001133 acceleration Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 208000019901 Anxiety disease Diseases 0.000 description 1
- 230000036506 anxiety Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Abstract
The invention discloses an electroplating device. At least one positive electrode of the electroplating device is provided with a compound filter bag through which an electroplating solution can penetrate. Each compound filter bag is provided with an inner bag body and an outer bag body, wherein the inner bag body is located in the inner layer, the outer bag body relatively wraps the inner bag body, the bottom of the inner bag body is closed, and only the top of the inner bag body is provided with a placement opening in which an anode material correspondingly extends. A preset distance is kept between the outer bag body and the inner bag body. An air inlet for being connected with an air source is formed in the bottom of the outer bag body. In the electroplating process, the air source can be guided into the compound filter bags wrapping the anode materials, then a bubble thin film wrapping the anode materials is formed, and therefore anode material losses and additive consumption are reduced more actively and reliably.
Description
Technical field
A kind of relevant electroplanting device of the present invention, especially a kind of electricity that can effectively reduce anode material consume and depletion of additive
Plating appts.
Background technology
Press, general plating processing mainly passes through electrolytic process, between anode and negative electrode after input voltage, in attracting electroplate liquid
Metal ion swim to negative electrode, and reduce after plate on the plated body continued in negative electrode, while the metal continued by anode
Re-dissolved, there is provided the more metal ions of electroplate liquid, makes electrolytic process persistently carry out, enough coating is deposited on plated body
Till.
It is known to pass through as shown in figure 1, continue an insoluble anode material 31 on the anode contact 11 of connection positive electricity
The mode for supplementing the metal ion of electroplate liquid 20 produces the generation electroplating effect of plated body 32 for allowing cathode contact 12 to be continued, and reaches
To being not necessary to change repeatedly the purpose of anode material 31；And, can pass through coordinate in electroplating process add in electroplate liquid it is organic
The mode of additive, uses and reaches expected electroplating effect.
Furthermore, in the electroplating process for adding organic additive, but might have and allow insoluble anode material 31 to be cracked
Anxiety, therefore industry generally can install one additional just as the netted filter bag 13 for coating anode material 31 in 31 periphery of anode material, with
Phase reduces anode material 31 under the shielding action of netted filter bag 13 and consumes.
However, so practice is still fairly limited for the effect for reducing anode material consume, therefore how effectively to reduce
Because causing anode material to consume using organic additive, the always problem of the desired most ardently solution of industry for a long time.
The content of the invention
In view of this, the present invention is providing a kind of plating dress that can effectively reduce anode material and depletion of additive consume
Put, be its main purpose person.
It is the electroplanting device of the present invention up to above taking off purpose, substantially with one for containing the cell body of electroplate liquid, in the cell body
Inside be provided with least one for connection plated body negative electrode, and at least one for jointed anode material anelectrode；It is characterized in that：
The electroplanting device is provided with one at this at least an anelectrode and is available for the compound filter bag that electroplate liquid penetrates, the compound filter bag to have a phase
Inner bag of the para-position in internal layer, and a relative outer bag for being enclosed in the inner bag periphery, the bottom of the inner bag is in closed,
Only one being formed in top and putting material mouth for what anode material correspondence was stretched into, the outer bag keeps preset space length with the inner bag, and should
One air inlet for supplying connection air source is formed on outer bag bottom.
Using said structure feature, the electroplanting device of the present invention, air source can be imported into relative cladding in electroplating process
In the compound filter bag of anode material periphery, into the air of compound filter bag, you can follow the gap between inside and outside bag to upstream
It is dynamic, and then a relative bubble film for being coated on anode material periphery is formed, use and produce the organic solvent limited in electroplate liquid
The effect barriering effect contacted with anode material, is reduced anode material with relatively more positive, reliable means and additive disappears
Consumption consume.
According to said structure feature, the electroplanting device further includes an air source being connected with each compound filter bag.
The air source can help Pu for an air.
The air source can be an air compressor.
The air source can be a steel cylinder for being filled with compressed gas.
The inside and outside bag of each compound filter bag forms connection in the edge for putting material mouth.
Specifically, disclosed herein electroplanting device, following effect can be produced.
1. anode material consume and depletion of additive are reduced with relatively more positive, reliable means, be suitably applied especially
Using the electroplating activity of organic additive.
2. the effect of disturbance electroplate liquid can be produced simultaneously, and the metal ion in acceleration electroplate liquid is swum to plated body.
Description of the drawings
Fig. 1 is an existing electroplanting device structural representation.
Electroplanting device structural representations of the Fig. 2 for first embodiment of the invention.
Fig. 3 is the structure sectional view of compound filter bag in the present invention.
Electroplanting device structural representations of the Fig. 4 for second embodiment of the invention.
Figure number explanation：
11 anode contacts
12 cathode contacts
13 filter bags
20 electroplate liquids
31 anode materials
32 plated bodies
40 cell bodies
41 negative electrodes
42 anelectrodes
50 compound filter bags
51 inner bags
511 put material mouth
52 outer bags
521 air inlets.
Specific embodiment
Present invention generally provides one kind can effectively reduce anode material consume and depletion of additive, use is suitably applied especially
The electroplanting device structural representation of the electroplanting device of the electroplating activity of organic additive, such as Fig. 2 first embodiment of the invention, Fig. 3
In the present invention shown in the structure sectional view of compound filter bag, the electroplanting device of the present invention, substantially with for containing electroplate liquid 20
Cell body 40, be provided with the cell body 40 at least one for connection plated body 32 negative electrode 41, and at least one supply jointed anode
The anelectrode 42 of material 31.
It is a feature of the present invention that：The electroplanting device at this at least an anelectrode 42 is provided with one and is available for what electroplate liquid was penetrated
Compound filter bag 50, the compound filter bag 50 have inner bag 51 of the relative position in internal layer, and one is enclosed in the inner bag 51 relatively
The outer bag 52 of periphery, the bottom of the inner bag 51 is in closed, only forms one for putting that anode material correspondence is stretched in top
Material mouth 511, the outer bag 52 keep preset space length with the inner bag 51, and 52 bottom of outer bag forms one for connection air source
The air inlet 521 of (figure is omited).
In the embodiment shown in Figure 2, overall electroplanting device, is provided with a negative electrode 41 and an anelectrode in the cell body 40
42；Certainly, overall electroplanting device, also can be as shown in figure 4, be provided with a negative electrode 41 and a plurality of anelectrodes in the cell body 40
42；Also, the inside and outside bag 51,52 of each compound filter bag forms connection in the edge for putting material mouth 511 being preferred.
In principle, electroplanting device of the invention, when using, injects the electroplate liquid 20 of predetermined volume in cell body 40, and
The air inlet 521 of compound filter bag 50 is connected into default air source, then by plated body 32 and anode material 31 respectively with negative electricity
After pole 41 and anelectrode 42 connect, you can plated body 32 and anode material 31 are immersed in electroplate liquid 20, and by anode material 31
Stretch in the inner bag 51 of compound filter bag 50；The current lead-through of positive and negative electrode 42,41 is treated, and is coordinated default air source
After importing each compound filter bag 50, you can produce electroplating effect to plated body 32.
Especially, into the air of compound filter bag 50, that is, the gap that follow between inside and outside bag 51,52 flows up, except can
The effect of disturbance electroplate liquid is produced, the metal ion in acceleration electroplate liquid is swum to outside plated body 32, can more form a relative bag
Overlay on the bubble film of 31 periphery of anode material.The organic solvent and anode material 31 limited in electroplate liquid 20 is produced in order to using
The effect barriering effect of contact, reduces anode material 31 with relatively more positive, reliable means and consumes and depletion of additive.
Subsidiary one is mentioned that, the electroplanting device of the present invention, and a negative electrode and an anelectrode are whether provided with the cell body,
Or a negative electrode and a plurality of anelectrodes are provided with the cell body, overall electroplanting device, when implementing, can further include one
The air source being connected with each compound filter bag, and the air source can for an air help Pu, or for an air compression, or for one load
There is the steel cylinder of compressed gas.
Compare with traditional existing structure, disclosed herein electroplanting device, following effect can be produced.
1. anode material consume and depletion of additive are reduced with relatively more positive, reliable means, be suitably applied especially
Using the electroplating activity of organic additive.
2. the effect of disturbance electroplate liquid can be produced simultaneously, and the metal ion in acceleration electroplate liquid is swum to plated body.
Claims (6)
1. a kind of electroplanting device, supplies to contain the cell body of electroplate liquid with one, is provided with least one for connection plated body in the cell body
Negative electrode, and at least one for jointed anode material anelectrode；It is characterized in that：
The electroplanting device is provided with one at this at least an anelectrode and is available for the compound filter bag that electroplate liquid penetrates, the compound filter bag to have
Inner bag of the one relative position in internal layer, and a relative outer bag for being enclosed in the inner bag periphery, the bottom of the inner bag is in envelope
Shape being closed, only one being formed in top and is put material mouth for what anode material correspondence was stretched into, the outer bag keeps preset space length with the inner bag,
And an air inlet for supplying connection air source is formed on the outer bag bottom.
2. electroplanting device as claimed in claim 1, it is characterised in that the electroplanting device includes that is connected with each compound filter bag
Air source.
3. electroplanting device as claimed in claim 2, it is characterised in that the air source is that an air helps Pu.
4. electroplanting device as claimed in claim 2, it is characterised in that the air source is an air compressor.
5. electroplanting device as claimed in claim 2, it is characterised in that the air source is a steel cylinder for being filled with compressed gas.
6. electroplanting device as claimed in claim 1 or 2, it is characterised in that the inside and outside bag of each compound filter bag puts material mouth in this
Edge formed connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410181857.8A CN105019008B (en) | 2014-04-30 | 2014-04-30 | Electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410181857.8A CN105019008B (en) | 2014-04-30 | 2014-04-30 | Electroplating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105019008A CN105019008A (en) | 2015-11-04 |
| CN105019008B true CN105019008B (en) | 2017-04-19 |
Family
ID=54409294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410181857.8A Expired - Fee Related CN105019008B (en) | 2014-04-30 | 2014-04-30 | Electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105019008B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108950667A (en) * | 2018-08-28 | 2018-12-07 | 杨胜 | A kind of electroplanting device |
| CN108998822A (en) * | 2018-08-28 | 2018-12-14 | 杨胜 | A kind of electroplating technology |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200643227A (en) * | 2005-06-02 | 2006-12-16 | Boardtek Electronics Corp | The insoluble anode electroplating system and the processing method of the same |
| CN201121217Y (en) * | 2007-09-25 | 2008-09-24 | 紫金矿业集团股份有限公司 | Plumbum anode composite board winning cell |
| CN201626987U (en) * | 2009-12-04 | 2010-11-10 | 联鼎电子科技有限公司 | Electroplating equipment |
| CN203820914U (en) * | 2014-04-30 | 2014-09-10 | 先丰通讯股份有限公司 | Electroplating device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05125577A (en) * | 1991-10-31 | 1993-05-21 | Tanaka Kikinzoku Kogyo Kk | Gas diffusion electrode |
| US7022210B2 (en) * | 2002-08-01 | 2006-04-04 | Rockwell Scientific Licensing, Llc | Locally-distributed electrode and method of fabrication |
| US9150974B2 (en) * | 2011-02-16 | 2015-10-06 | Freeport Minerals Corporation | Anode assembly, system including the assembly, and method of using same |
-
2014
- 2014-04-30 CN CN201410181857.8A patent/CN105019008B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200643227A (en) * | 2005-06-02 | 2006-12-16 | Boardtek Electronics Corp | The insoluble anode electroplating system and the processing method of the same |
| CN201121217Y (en) * | 2007-09-25 | 2008-09-24 | 紫金矿业集团股份有限公司 | Plumbum anode composite board winning cell |
| CN201626987U (en) * | 2009-12-04 | 2010-11-10 | 联鼎电子科技有限公司 | Electroplating equipment |
| CN203820914U (en) * | 2014-04-30 | 2014-09-10 | 先丰通讯股份有限公司 | Electroplating device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105019008A (en) | 2015-11-04 |
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Granted publication date: 20170419 |