CN104979262B - 一种晶圆分离的方法 - Google Patents
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Abstract
本发明提供一种晶圆分离的方法,它采用气流发生装置制造出朝向功能晶圆和载体晶圆键合的结合处的气流,通过气流使载体晶圆与功能晶圆分离。采用上述方法后,本申请在分离晶圆时简单方便,只需要一台气流发生装置即可,适用于大批量地分离晶圆,成本较低,适用于工业化生产。
Description
技术领域:
本发明涉及微电子技术领域,具体讲是一种晶圆分离的方法。
背景技术:
随着人们对电子产品的要求朝着小型化的方向发展,电子芯片也朝向越来越薄的方向发展,但是硅晶圆的厚度如果要减薄至100微米或以下时,非常容易发生碎片、或者是在对晶圆做处理时由于应力导致晶圆弯曲变形等,无法对这种超薄晶圆进行直接加工处理。因此,为了能加工处理这类超薄晶圆,需要将这种超薄的功能晶圆首先与一载体晶圆临时键合,键合之后,功能晶圆与载体晶圆粘节为一体,就可以对功能晶圆进行减薄、TSV的制造、再布线层的制造、形成内部互连等工艺制作。然后再将功能晶圆与载体晶圆进行分离,并对减薄后的功能晶圆进行清洗、切割等工艺,完成对这种超薄的功能晶圆的加工工艺。
目前行业内采用的晶圆键合方法一般是在在两块晶圆之间涂覆键合胶,然后再采用键合机将两块晶圆键合在一起。
针对上述临时键合的晶圆进行分离一般有以下几种方法:第一种,利用溶剂从键合的两块晶圆的边缘溶解键合时的键合胶,第二种就是采用热力剪切分离,第一种方法,溶解剂从晶圆边缘处慢慢溶解键合胶,溶解剂到达晶圆中心的时间太长,分离效率太低,而且直接将载体晶圆与功能晶圆分离还需要有特殊的载板来固定功能晶圆,防止在分离时,功能晶圆和载体晶圆混合,工序麻烦,成本较高。采用第二种方法,需要专门的设备进行热力剪切,成本较高,而且剪切时容易损坏晶圆,成功率较低。
为此,申请人发明了一种晶圆键合方法,这种方法是在载体晶圆上做表面处理,形成一层隔离膜,隔离膜与载体晶圆之间的粘接度适中,在不故意去撕的情况下,薄膜不会从载体晶圆上脱离,但是当施力撕扯时,可将薄膜从载体晶圆上剥离,然后键合时将带有隔离膜的载体晶圆的正面与功能晶圆之间涂覆键合胶,将功能晶圆和载体晶圆键合在一起,分离时先将隔离膜和载体晶圆之间分出一定的缝隙,然后采用真空吸盘吸附在载体晶圆背面,施力将载体晶圆从隔离膜上剥离。采用这种分离方法虽然比现有技术方便,但是仍然需要通过吸盘施力将载体晶圆从隔离膜上剥离,操作还是麻烦,而且如果要适用于工业化生产还需要机械手,结构复杂,成本较高。
发明内容:
本发明解决的技术问题是,克服现有的技术缺陷,提供一种分离简单,成本较低,适用于工业化生产的晶圆分离的方法。
本发明提供的技术方案是:本发明提供一种晶圆分离的方法,它采用气流发生装置制造出朝向功能晶圆和载体晶圆键合的结合处的气流,通过气流使载体晶圆与功能晶圆分离。
采用上述方法后,本申请在分离晶圆时简单方便,只需要一台气流发生装置即可,适用于大批量地分离晶圆,成本较低,适用于工业化生产。
所述气流发生装置在功能晶圆和载体晶圆键合的结合处设置一个出气口。采用一个出气口吹向一处也可以将功能晶圆和载体晶圆分离。
所述气流发生装置在功能晶圆和载体晶圆键合的结合处的周围设置多个出气口,所述多个出气口均朝向功能晶圆和载体晶圆键合的结合处。采用多个出气口在载体晶圆和功能晶圆的周围同时向载体晶圆和功能晶圆的结合处进行吹气也可以使载体晶圆和功能晶圆分离,而且如果气流的方向设有向上的角度,并且气流的压力、流速和流量设置比较合适,可以在分离的同时,使位于上方的晶圆漂浮在位于下方的晶圆上方,更加方便后续操作。
作为改进,所述载体晶圆的表面设有一层隔离膜,所述载体晶圆的隔离膜和功能晶圆之间涂覆有键合胶将载体晶圆和功能晶圆键合在一起,所述分离是指通过气流将载体晶圆与隔离膜分离。采用这种方法,剥离之后,功能晶圆上带有键合胶以及隔离膜,然后再从功能晶圆上剥离隔离膜,功能晶圆上就只有键合胶,然后再通过浸泡的方式清洗键合胶,由于键合胶的一面暴露,因此键合胶与清洗液可以充分接触,清洗效率比现有技术要高很多,而且由于只有功能晶圆,而没有载体晶圆,因此去除键合胶时不需要采用载板来固定功能晶圆,成本较低,效率也较高。
作为另一改进,所述载体晶圆直接通过键合胶与功能晶圆键合,分离之前先通过处理使键合胶的粘接度降低,然后再通过气流使载体晶圆与功能晶圆分离。现有技术中是直接将载体晶圆和功能晶圆通过键合胶来键合,由于键合后的晶圆需要进行加工,因此要求键合胶的粘接强度要足够强,这种键合后的晶圆一般是无法通过气流吹开的,但是如果通过物理处理或者化学处理使键合胶的粘接度降低,那么也可以通过气流直接将载体晶圆与功能晶圆分离。
作为改进,在吹气前,先对载体晶圆与功能晶圆的结合处的隔离膜制造出一个缝隙,然后再通过气流发生装置产生朝向该缝隙的气流,将载体晶圆与隔离膜分离。采用这种方式由于事先制造出一个缝隙,因此吹气时直接针对缝隙吹气即可,这样所需要的气流的压力就会小许多。
作为进一步改进,所述气流发生装置产生的气流,其气流的压力、流量、流速、出气角度及气流的横截面形状均可控制,通过在气流发生装置上设置压力表、减压阀及流量阀来控制气流的压力、流量和流速,通过调整气嘴的形状来调整气流的横截面形状,通过调整气嘴的安装位置或者调整出气口的角度来调整出气角度。采用这种方法,可以调整气流发生装置制造出的气流的各项参数,这样可以根据晶圆的不同,或者根据要求的不同来调整各项参数,从而达到所需求的分离晶圆的目的。
附图说明:
附图1为本发明的结构示意图;
附图2为本发明的另一实施例的结构示意图;
如图所示:1、载体晶圆、2功能晶圆,3、气流,4、隔离膜,5、键合胶,6、出气口。
具体实施方式
下面结合附图和具体实施例对本发明做详细说明:
如图1-图2所示:本发明提供一种晶圆分离的方法,它采用气流发生装置制造出朝向功能晶圆2和载体晶圆1键合的结合处的气流,通过气流使载体晶圆1与功能晶圆2分离。
如图1所示:所述气流发生装置在功能晶圆和载体晶圆键合的结合处设置一个出气口。采用一个出气口吹向一处也可以将功能晶圆和载体晶圆分离。
如图2所示:为另一实施例,所述气流发生装置在功能晶圆和载体晶圆键合的结合处的周围设置多个出气口6,所述多个出气口6均朝向功能晶圆和载体晶圆键合的结合处。本实施例中,功能晶圆和载体晶圆均为圆形,出气口设有4个,且布置在键合后的功能晶圆和载体晶圆的周围并且均匀分布。而在实际应用中,晶圆的形状如果有变化,则出气口的设置位置以及设置数量也会有变化,例如晶圆为椭圆形,出气口可设置5个、6个以及其它,但是只要是在晶圆周围设置多个朝向功能晶圆和载体晶圆的结合处的出气口,则均应在本申请保护范围之内。采用多个出气口在载体晶圆和功能晶圆的周围同时向载体晶圆和功能晶圆的结合处进行吹气也可以使载体晶圆和功能晶圆分离,而且如果气流的方向设有向上的角度,并且气流的压力、流速和流量设置比较合适,可以在分离的同时,使位于上方的晶圆漂浮在位于下方的晶圆上方,更加方便后续操作。
作为改进,所述载体晶圆1的表面设有一层隔离膜4,所述载体晶圆1的隔离膜4和功能晶圆2之间涂覆有键合胶5将载体晶圆1和功能晶圆2键合在一起,所述分离是指通过气流3将载体晶圆1与隔离膜4分离。采用这种方法,剥离之后,功能晶圆上带有键合胶以及隔离膜,然后再从功能晶圆上剥离隔离膜,功能晶圆上就只有键合胶,然后再通过浸泡的方式清洗键合胶,由于键合胶的一面暴露,因此键合胶与清洗液可以充分接触,清洗效率比现有技术要高很多,而且由于只有功能晶圆,而没有载体晶圆,因此去除键合胶时不需要采用载板来固定功能晶圆,成本较低,效率也较高。
作为另一改进,所述载体晶圆1直接通过键合胶5与功能晶圆2键合,分离之前先通过处理使键合胶5的粘接度降低,然后再通过气流使载体晶圆1与功能晶圆2分离。有技术中的功能晶圆和载体晶圆之间通过键合胶进行键合,为了保证键合后的晶圆能够完成后续的加工而不分离,因此要求键合胶的粘接强度要足够强,这种键合后的晶圆一般是无法通过气流分离的,但是如果通过物理处理或者化学处理使键合胶的粘接度降低,那么也可以通过气流直接将载体晶圆与功能晶圆分离,这种方式也应在本申请保护范围之内。其中通过化学处理可以是将键合后的晶圆浸泡在具有降低键合胶粘接度的溶剂中,使键合胶的粘接度降低。也可以通过设置一种可以随着温度的变化、粘接度会发生变化的键合胶,然后通过改变温度来改变键合胶的粘接度。只要是通过改变键合胶的粘接度,然后再利用气流使载体晶圆1和功能晶圆分离的方法则均应在本申请保护范围之内。
作为改进,在吹气前,先对载体晶圆1与功能晶圆2的结合处的隔离膜4制造出一个缝隙,然后再通过气流发生装置产生朝向该缝隙的气流,将载体晶圆与隔离膜分离。采用这种方式由于事先制造出一个缝隙,因此吹气时直接针对缝隙吹气即可,这样所需要的气流的压力就会小许多。
作为进一步改进,所述气流发生装置产生的气流,其气流的压力、流量、流速、出气角度及气流的横截面形状均可控制,通过在气流发生装置上设置压力表、减压阀及流量阀来控制气流的压力、流量和流速,通过调整气嘴的形状来调整气流的横截面形状,通过调整气嘴的安装位置或者调整出气口的角度来调整出气角度。采用这种方法,可以调整气流发生装置制造出的气流的各项参数,这样可以根据晶圆的不同,或者根据要求的不同来调整各项参数,从而达到所需求的分离晶圆的目的。
作为改进,所述载体晶圆1的表面设有一层隔离膜4,所述载体晶圆的隔离膜4和功能晶圆2之间涂覆有键合胶5将载体晶圆1和功能晶圆2键合在一起,所述分离是指吹气将载体晶圆1与隔离膜4分离。采用这种方法,剥离之后,功能晶圆上带有键合胶以及隔离膜,然后再从功能晶圆上剥离隔离膜,功能晶圆上就只有键合胶,然后再通过浸泡的方式清洗键合胶,由于键合胶的一面暴露,因此键合胶与清洗液可以充分接触,清洗效率比现有技术要高很多,而且由于只有功能晶圆,而没有载体晶圆,因此去除键合胶时不需要采用载板来固定功能晶圆,成本较低,效率也较高。
作为改进,在吹气前,先对载体晶圆1与功能晶圆2的结合处的隔离膜4造出一个缝隙,然后再通过吹气设备对该缝隙进行吹气,将载体晶圆与隔离膜分离。制造缝隙可以采用刀切,也可以采用溶剂溶解的方式,采用这种方式由于事先制造出一个缝隙,因此吹气时直接针对缝隙吹气即可,这样所需要的气流的压力就会小许多。当然如果是载体晶圆和功能晶圆直接通过键合胶键合,则如果在键合胶处制造缝隙,则可能会伤到功能晶圆,但是如果控制的足够好,那么也可以直接在键合胶处开出缝隙,则这也应在本申请保护范围之内。
下列表1本发明中带有隔离膜4的载体晶圆1和功能晶圆2键合后,成功将载体晶圆1与隔离膜4分离的部分试验数据:
表1
表1中晶圆大小是指的晶圆的直径,尺寸单位为英寸,喷着形状大小为气流的横截面的形状,尺寸为厘米,进口气压压力为通过压力表检测进入喷气嘴的气压,单位为帕,喷射角度为气流出喷气嘴时的角度范围。可以看出随着晶圆尺寸的增加,需要更大的气压以及更多的流量使载体晶圆和功能晶圆分离,而且如果在晶圆的键合处开过分析,则需要的压力和流量会小许多。
所述气流发生装置也可以采用气刀型的气流发生装置,也可以采用空气增幅型的气流发生装置,也可以采用自制的喷嘴通过工厂内的自带的气泵来制造气流。总之,只要是能够产生气流的设备则均被认为是本申请所述的气流发生装置。
Claims (4)
1.一种晶圆分离的方法,其特征在于:它采用气流发生装置制造出朝向功能晶圆和载体晶圆键合的结合处的气流,仅通过气流使载体晶圆和功能晶圆中位于上方的晶圆漂浮在位于下方的晶圆上方,所述载体晶圆直接通过键合胶与功能晶圆键合,分离之前先通过化学处理使键合胶的粘接度降低,所述化学处理为将键合后的晶圆浸泡在具有降低键合胶粘接度的溶剂中;
所述气流发生装置在功能晶圆和载体晶圆键合的结合处的周围均匀设置多个出气口,所述多个出气口均朝向功能晶圆和载体晶圆键合的结合处,所述载体晶圆的表面设有一层隔离膜。
2.根据权利要求1所述的晶圆分离的方法,其特征在于:所述载体晶圆的隔离膜和功能晶圆之间涂覆有键合胶将载体晶圆和功能晶圆键合在一起,所述分离是指通过气流将载体晶圆与隔离膜分离。
3.根据权利要求2所述的晶圆分离的方法,其特征在于:在吹气前,先对载体晶圆与功能晶圆的结合处的隔离膜制造出一个缝隙,然后再通过气流发生装置产生朝向该缝隙的气流,将载体晶圆与隔离膜分离。
4.根据权利要求1所述的晶圆分离的方法,其特征在于:所述气流发生装置产生的气流,其气流的压力、流量、流速、出气角度及气流的横截面形状均可控制,通过在气流发生装置上设置压力表、减压阀及流量阀来控制气流的压力、流量和流速,通过调整气嘴的形状来调整气流的横截面形状,通过调整气嘴的安装位置或者调整出气口的角度来调整出气角度。
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JP2016219776A (ja) | 2016-12-22 |
WO2016179892A1 (zh) | 2016-11-17 |
US20160332436A1 (en) | 2016-11-17 |
KR20160134471A (ko) | 2016-11-23 |
US9962919B2 (en) | 2018-05-08 |
CN104979262A (zh) | 2015-10-14 |
TW201639766A (zh) | 2016-11-16 |
KR101808938B1 (ko) | 2018-01-18 |
TWI627123B (zh) | 2018-06-21 |
JP6359576B2 (ja) | 2018-07-18 |
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