CN104934335A - Method for providing resin sheet and method and device for encapsulating semiconductor - Google Patents
Method for providing resin sheet and method and device for encapsulating semiconductor Download PDFInfo
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- CN104934335A CN104934335A CN201510117815.2A CN201510117815A CN104934335A CN 104934335 A CN104934335 A CN 104934335A CN 201510117815 A CN201510117815 A CN 201510117815A CN 104934335 A CN104934335 A CN 104934335A
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- resin
- die cavity
- bottom part
- sheet material
- cavity bottom
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- 229920005989 resin Polymers 0.000 title claims abstract description 377
- 239000011347 resin Substances 0.000 title claims abstract description 377
- 239000004065 semiconductor Substances 0.000 title claims abstract description 238
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000004806 packaging method and process Methods 0.000 claims abstract description 25
- 230000002093 peripheral effect Effects 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 224
- 239000000758 substrate Substances 0.000 claims description 97
- 230000007246 mechanism Effects 0.000 claims description 57
- 238000005538 encapsulation Methods 0.000 claims description 35
- 230000006835 compression Effects 0.000 claims description 23
- 238000007906 compression Methods 0.000 claims description 23
- 238000007493 shaping process Methods 0.000 claims description 20
- 238000005520 cutting process Methods 0.000 claims description 7
- 238000012856 packing Methods 0.000 claims description 6
- 230000003405 preventing effect Effects 0.000 claims description 4
- 230000032258 transport Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 20
- 238000010586 diagram Methods 0.000 description 10
- 238000004382 potting Methods 0.000 description 10
- 238000007665 sagging Methods 0.000 description 10
- 230000009471 action Effects 0.000 description 3
- 238000001574 biopsy Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000003550 marker Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- -1 and Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Manufacturing & Machinery (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention provides a method for providing resin required for semiconductor element (17) resin package to a cavity (25) of a semiconductor package mold (15) and resin flow in the cavity (25) when the resin is compressed can be inhibited. According to the resin sheet providing method and the semiconductor packaging method and device, an upper surface height position of a cavity bottom component (21) is set to be a height position above the upper surface height of a cavity side component (22) including the upper surface height position of the cavity side component (22), and the resin sheet (33) with large area than the cavity bottom face component (21) is arranged on the upper surface of the cavity bottom face component (21). Then the periphery of the resin sheet (33) arranged on the upper surface part of the cavity bottom face component (21) is stretched out and overlapped to the upper surface of the cavity side face component (22). Therefore, gaps without resin are avoided on the peripheral part of the cavity (25) in the procedure of arranging the overlapping part (33a) of the resin sheet (33) on the outer periphery of the cavity bottom face component (21).
Description
Technical field
The present invention relates to a kind of method of the assigned position donor sheet timber fat die-filling to the semiconductor package in semiconductor encapsulation device, semiconductive resin method for packing and semiconductor encapsulation device.Described semiconductive resin method for packing and semiconductor encapsulation device supply to the assigned position that semiconductor package is die-filling and place the semiconductor element on semiconductor substrate, and to be housed in by sheet material resin in the die-filling die cavity portion of semiconductor package and to carry out heat fused and carry out resin-encapsulated by compression molten resin material to the semiconductor element on semiconductor substrate.In more detail, relate to a kind of sheet material resin supply method of improvement and method for packaging semiconductor and semiconductor encapsulation device, it is configured to when the assigned position donor sheet timber fat die-filling to semiconductor package, the appropriate resin material carrying out needed for resin-encapsulated to semiconductor element can be supplied in the die-filling die cavity portion of semiconductor package, and the mobilization of this molten resin material is suppressed when compressing the molten resin material in die cavity portion, thus the semiconductor element installed on a semiconductor substrate can not produce the unfavorable conditions such as position deviation because of the mobilization of this molten resin material, and, semiconductor component packing can be taken shape in in the shaping resin package covers of the thickness reduction of equalization.
Background technology
Such as, as Patent Document 1, the method for packaging semiconductor using sheet material resin and semiconductor encapsulation device have been there will be a known in the past.
Patent documentation 1 discloses semiconductor encapsulation device counterdie and patrix are oppositely arranged and the conveyer etc. be used for this counterdie die cavity donor sheet timber fat (resin material of tabular).This sheet material resin is shaped to corresponding with the shape of counterdie die cavity by briquetting (solidification) in advance.Therefore, if supply this sheet material resin in the mode be entrenched in counterdie die cavity, then can with each position supply resin material in the downward model cavity of the state of equalization.
But, even if when supplying this sheet material resin in downward model cavity, also the size of population of sheet material resin (area) must be set smaller than the size (area) of counterdie die cavity.Therefore, when supplying this sheet material resin in downward model cavity, between the outer peripheral edges and the inner peripheral of counterdie die cavity of sheet material resin, produce required space part.And, time in this state by carrying out molten resin material that matched moulds compresses in counterdie die cavity to upper and lower two moulds, the periphery of the downward model cavity of molten resin material is extruded and flows, and, carrying out easily being involved in air in the molten resin material flowed.So, mobilization and the air involution of molten resin material cannot be prevented effectively.Its result, has the significant problem of following resin forming aspect: namely, produces the molten resin material carrying out flowing and makes the bonding wire short circuit in semiconductor element or make the unfavorable conditions such as bonding wire distortion/cut-out.
Further, there is following problem: namely, the semiconductor element installed on a semiconductor substrate produces the unfavorable conditions such as position deviation because of the mobilization of this molten resin, or produce bubble in the resin package covers that semiconductor element is encapsulated, or cannot with the thickness of equalization in each position compression forming resin package covers.In addition, there is following problem: the space part that must form counterdie die cavity inner rim because of reason described above, therefore be in fact difficult to the size of sheet material resin and counterdie die cavity and shape are coincide, therefore cannot supply is corresponding to its capacity in model cavity downwards appropriate resin material.
Patent documentation 1: JP 2004-174801 publication (see [0019] section and Fig. 1)
Summary of the invention
Problem of the present invention is, when the die cavity portion donor sheet timber fat die-filling to semiconductor package, prevents the periphery in die cavity from producing the space part of non-potting resin state further effectively.Further, problem of the present invention is, by die cavity equably and with the state of equalization supply resin material, thus by the semiconductor component packing on semiconductor substrate in the resin package covers that each position of semiconductor substrate is shaping with the thickness of equalization.
Sheet material resin supply normal direction involved in the present invention at least possesses patrix 12, counterdie 14, the upper surface part donor sheet timber fat 33 of the described counterdie 14 in the resin-encapsulated mould of die cavity bottom part 21 and cavity side face component 22, wherein, described patrix 12 is provided with the semiconductor substrate 18 of multiple semiconductor element 17 for placing, described counterdie 14 carries out compression encapsulation for utilizing resin to the semiconductor element 17 on described semiconductor substrate 18, described die cavity bottom part 21 doubles as resin pressure-producing part and has the upper surface shape of flat condition and be arranged at described counterdie 14, described cavity side face component 22 is flush-mounted in the periphery of described die cavity bottom part 21 and doubles as the guide member up and down of described die cavity bottom part 21,
The feature of described sheet material resin supply method is, comprising:
Die cavity bottom part height and position setting operation, is set as the height and position of more than the upper level of the described cavity side face component 22 of the upper level position comprising described cavity side face component 22 by the upper level position of described die cavity bottom part 21;
Sheet material resin mounting operation, carries out, the sheet material resin 33 with the area wider than the area of described die cavity bottom part 21 is placed in the upper surface part of described die cavity bottom part 21 after described die cavity bottom part height and position setting operation; With
Sheet material resin overlap setting operation, carry out in described sheet material resin mounting operation, stretched out by the peripheral part of the described sheet material resin 33 making the upper surface part being placed in described die cavity bottom part 21 and overlap onto the upper surface of described cavity side face component 22, thus setting the overlapping portion 33a of described sheet material resin 33 at the outer peripheral edges position of described die cavity bottom part 21.
Sheet material resin supply method involved in the present invention has as under type: as described in die cavity bottom part height and position setting operation in, the upper level position of described die cavity bottom part 21 is set as more than the upper level of described cavity side face component 22, and exceeds less than three times of the height of the thickness being equivalent to described sheet material resin 33 than the upper level position of described cavity side face component 22.
Sheet material resin supply method involved in the present invention has as under type: comprise sheet material resin mounting operation further, adhere on release film 31 by making described sheet material resin 33, and described sheet material resin 33 is placed in the upper surface part of described die cavity bottom part 21, thus described sheet material resin 33 is placed in the upper surface part of described die cavity bottom part 21 via described release film 31.
Method for packaging semiconductor involved in the present invention at least possesses patrix 12 by using, counterdie 14, the resin-encapsulated mould of die cavity bottom part 21 and cavity side face component 22 carries out resin-encapsulated to the semiconductor element on semiconductor substrate, wherein, described patrix 12 is provided with the semiconductor substrate 18 of multiple semiconductor element 17 for placing, described counterdie 14 carries out compression encapsulation for utilizing resin to the semiconductor element 17 on described semiconductor substrate 18, described die cavity bottom part 21 doubles as resin pressure-producing part and has the upper surface shape of flat condition and be arranged at described counterdie 14, described cavity side face component 22 is flush-mounted in the periphery of described die cavity bottom part 21 and doubles as the guide member up and down of described die cavity bottom part 21,
The feature of described method for packaging semiconductor is, comprising:
Die cavity bottom part height and position setting operation, is set as the height and position of more than the upper level of the described cavity side face component 22 of the upper level position comprising described cavity side face component 22 by the upper level position of described die cavity bottom part 21;
Sheet material resin mounting operation, carries out, the sheet material resin 33 with the area wider than the area of described die cavity bottom part 21 is placed in the upper surface part of described die cavity bottom part 21 after described die cavity bottom part height and position setting operation;
Sheet material resin overlap setting operation, carry out in described sheet material resin mounting operation, stretched out by the peripheral part of the described sheet material resin 33 making the upper surface part being placed in described die cavity bottom part 21 and overlap onto the upper surface of described cavity side face component 22, thus setting the overlapping portion 33a of described sheet material resin 33 at the outer peripheral edges position of described die cavity bottom part 21;
Matched moulds operation, carries out, by carrying out matched moulds to described patrix 12 and counterdie 14 and form resin forming die cavity portion 25 between described patrix 12 and this two mould of described counterdie 14 after described sheet material resin mounting operation;
Sheet material resin cuts off operation, carries out in described matched moulds operation, cuts off described sheet material resin 33 along described die cavity bottom part 21 with the chimeric position of described cavity side face component 22;
Sheet material resin collecting operation, cut off in operation at described sheet material resin and carry out, at the upper surface of described die cavity bottom part 21, described sheet material resin 33b after cutting off is housed in described die cavity portion 25, and described overlapping portion 33a is housed in resin delay portion 29 that the outer fix of described die cavity bottom part 21 is arranged as the residual resin of described sheet material resin 33; With
Resin compression forming operation, carry out after described sheet material resin collecting operation, by carrying out heat fused to the described sheet material resin 33b after the cut-out be housed in described die cavity portion 25, and under the state in the described sheet material resin 33b after the heat fused being immersed in described die cavity portion 25 making the described semiconductor element 17 on described semiconductor substrate 18, described sheet material resin 33b after heat fused is compressed, thus in the shaping resin package covers 36 of the equal thicknesses that the described semiconductor element 17 on described semiconductor substrate 18 is packaged in specify.
Method for packaging semiconductor involved in the present invention has as under type: as described in die cavity bottom part height and position setting operation in, the upper level position of described die cavity bottom part 21 is set as more than the upper level of described cavity side face component 22, and exceeds less than three times of the height of the thickness being equivalent to described sheet material resin 33 than the upper level position of described cavity side face component 22.
Method for packaging semiconductor involved in the present invention has as under type: the thickness of sheet material resin 33 as described in making and as described in shaping in resin compression forming operation as described in the thickness of resin package covers 36 equal.
Method for packaging semiconductor involved in the present invention has as under type: as described in matched moulds operation by die cavity bottom part 21 as described in making relative to as described in cavity side face component 22 carry out moving down and carry out.
Method for packaging semiconductor involved in the present invention has as under type: as described in resin-encapsulated mould as described in patrix 12 and as described in there is between counterdie 14 intermediate die 28 for semiconductor substrate as described in supporting,
In described matched moulds operation, between described intermediate die 28 and described cavity side face component 22, form described resin delay portion 29.
Method for packaging semiconductor involved in the present invention has as under type: as described in resin-encapsulated mould as described in patrix 12 and as described in there is between counterdie 14 intermediate die 38 for semiconductor substrate as described in supporting,
In described matched moulds operation, between described intermediate die 38 and described die cavity bottom part 21, form described die cavity portion 25.
Method for packaging semiconductor involved in the present invention has as under type: as described in sheet material resin mounting operation, by the roll-to-roll mechanism 34 of automatic conveying sheet material resin the described sheet material resin 33 adhered on the release film 31 of strip being placed in the upper surface part of described die cavity bottom part 21.
Method for packaging semiconductor involved in the present invention has as under type: as described in sheet material resin mounting operation, by the loading frame mechanism 41 that manually transports this sheet material resin 33, the sheet material resin 33 adhered on the release film 31 cutting into the short strip shape corresponding with the die joint shape of described counterdie 14 is in advance placed in the upper surface part of described die cavity bottom part 21.
Semiconductor encapsulation device involved in the present invention at least possesses patrix 12 by using, counterdie 14, the resin-encapsulated mould of die cavity bottom part 21 and cavity side face component 22 carries out resin-encapsulated to the semiconductor element 17 on semiconductor substrate 18, wherein, described patrix 12 is provided with the semiconductor substrate 18 of multiple semiconductor element 17 for placing, described counterdie 14 carries out compression encapsulation for utilizing resin to the semiconductor element 17 on described semiconductor substrate 18, described die cavity bottom part 21 doubles as resin pressure-producing part and has the upper surface shape of flat condition and be arranged at described counterdie 14, described cavity side face component 22 is flush-mounted in the periphery of described die cavity bottom part 21 and doubles as the guide member up and down of described die cavity bottom part 21,
The feature of described semiconductor encapsulation device is to have:
For supporting the intermediate die 28 of described semiconductor substrate, be arranged between described patrix 12 and described counterdie 14; With
Resin delay portion 29, for accommodating residual resin 33c,
Described resin delay portion 29 is formed between described intermediate die 28 and described cavity side face component 22 by the matched moulds of described patrix 12 and described counterdie 14.
Semiconductor encapsulation device involved in the present invention has as under type: as described in cavity side face component 22 be provided with further for catch be housed in as described in resin delay portion 29 as described in the residual resin of residual resin 33c catch mechanism 30.
Semiconductor encapsulation device involved in the present invention has as under type: as described in intermediate die 28 be provided with the resin adhered to for residual resin 33c as described in resin delay portion 29 as described in preventing from being housed in further and adhere to anti-locking mechanism 37.
Semiconductive resin packaging system involved in the present invention at least possesses patrix 12 by using, counterdie 14, the resin-encapsulated mould of die cavity bottom part 21 and cavity side face component 22 carries out resin-encapsulated to the semiconductor element 17 on semiconductor substrate 18, wherein, described patrix 12 is provided with the semiconductor substrate 18 of multiple semiconductor element 17 for placing, described counterdie 14 carries out compression encapsulation for utilizing resin to the semiconductor element 17 on described semiconductor substrate 18, described die cavity bottom part 21 doubles as resin pressure-producing part and has the upper surface shape of flat condition and be arranged at described counterdie 14, described cavity side face component 22 is flush-mounted in the periphery of described die cavity bottom part 21 and doubles as the guide member up and down of described die cavity bottom part 21,
The feature of described semiconductor encapsulation device is to have:
For supporting the intermediate die 28 of described semiconductor substrate, be arranged between described patrix 12 and described counterdie 14; With
The die cavity portion 38a of resin forming,
Described die cavity portion 38a is formed between described die cavity bottom part 21 and described intermediate die 38 by the matched moulds of described patrix 12 and described counterdie 14.
According to the present invention, the sheet material resin being supplied to die cavity portion can be prevented sagging because of deadweight, and can prevent to a large amount of resin materials more than thickness of the periphery in die cavity portion and the position donor sheet timber fat corresponding with the degree of depth in die cavity portion.
Therefore, it is possible to prevent effectively further at the space part producing non-potting resin state to periphery during die cavity portion donor sheet timber fat in die cavity portion.
In addition, due to can equably and supply resin material with the state of equalization in die cavity portion, therefore, it is possible to by the semiconductor component packing on semiconductor substrate in the resin package covers that each position of semiconductor substrate is shaping with the thickness of equalization.
Accompanying drawing explanation
Fig. 1 is the first embodiment involved in the present invention, is the die-filling major part of the semiconductor package schematically shown in semiconductor encapsulation device, and represents biopsy cavity marker devices front view semiconductor substrate and sheet material resin being transported to state behind the die-filling portion of semiconductor package.
Fig. 2 amplifies the longitudinal section representing the major part that the semiconductor package of corresponding diagram 1 is die-filling.
Fig. 3 amplifies the longitudinal section representing the major part that the semiconductor package of corresponding diagram 2 is die-filling.
Fig. 4 is the die-filling longitudinal section of the semiconductor package of corresponding diagram 3.
Fig. 5 is the die-filling longitudinal section of the semiconductor package of corresponding diagram 4.
Fig. 6 amplifies the longitudinal section representing the major part that the semiconductor package of corresponding diagram 5 is die-filling.
Fig. 7 is the die-filling longitudinal section of the semiconductor package of corresponding diagram 6.
Fig. 8 is the longitudinal section representing another variation that the semiconductor package of corresponding diagram 7 is die-filling.
Fig. 9 is the second embodiment involved in the present invention, is the die-filling major part of the semiconductor package schematically shown in semiconductor encapsulation device, and represents biopsy cavity marker devices front view semiconductor substrate and sheet material resin being transported to state behind the die-filling portion of semiconductor package.
Figure 10 amplifies the longitudinal section representing the major part that the semiconductor package of corresponding diagram 9 is die-filling.
Figure 11 amplifies the longitudinal section representing the major part that the semiconductor package of corresponding diagram 10 is die-filling.
Figure 12 is the die-filling longitudinal section of the semiconductor package of corresponding Figure 11.
Figure 13 is the die-filling longitudinal section of the semiconductor package of corresponding Figure 12.
Figure 14 is the die-filling longitudinal section of the semiconductor package of corresponding Figure 13.
Figure 15 is the 3rd embodiment involved in the present invention, the longitudinal section of the major part that the semiconductor package in expression semiconductor encapsulation device is die-filling.
Figure 16 is the die-filling longitudinal section of the semiconductor package of corresponding Figure 15.
Figure 17 is the die-filling longitudinal section of the semiconductor package of corresponding Figure 16.
Figure 18 is the 4th embodiment involved in the present invention, represent the loading frame of sheet material resin, (1) of Figure 18 is the vertical view representing its entirety, and (2) of Figure 18 are the longitudinal sections of its central authorities, and (3) of Figure 18 amplify the longitudinal section representing its major part.
Figure 19 is the longitudinal section of the example of the loading frame representing corresponding Figure 18, is represented by the major part of decomposing semiconductor package die-filling.
Figure 20 is the longitudinal section representing the matched moulds state that the semiconductor package of corresponding Figure 19 is die-filling.
Figure 21 is the key diagram of correlation technique of the present invention, and (1) of Figure 21 is the biopsy cavity marker devices front view schematically showing the die-filling counterdie of semiconductor package, and (2) of Figure 21 are the front views amplifying the major part representing its counterdie.
Embodiment
Before describing embodiments of the present invention, the basic structure implementing semiconductor encapsulation device of the present invention is described.In this semiconductor encapsulation device, when downward model cavity portion donor sheet timber fat, the peripheral part of sheet material resin is stretched out and the profile overlapped onto as the counterdie at outer peripheral edges position, counterdie die cavity portion and set overlapping portion, and then to be cut off by the clamping pressure utilizing semiconductor package die-filling and to be separated this overlapping portion, and by removal through to cut off and the appropriate sheet material resin of the overlapping portion be separated is housed in counterdie die cavity portion, thus prevent the periphery in counterdie die cavity from producing the space part of non-potting resin state.
But, when downward model cavity portion donor sheet timber fat, when the floor height position in counterdie die cavity portion is set to lower than the profile (upper surface) of counterdie, there will be the unfavorable condition of following resin forming aspect.Namely, as shown in figure 21, in the counterdie 1 of resin-encapsulated mould, between die cavity bottom part 1a and cavity side face component 1b, form the die cavity portion 2 of resin forming by making die cavity bottom part 1a carry out moving down relative to cavity side face component 1b, the counterdie 1 of described resin-encapsulated mould possesses the die cavity bottom part 1a that upper surface shape is set to flat condition and the cavity side face component 1b be flush-mounted on the periphery of die cavity bottom part 1a.Now, the height and position of the bottom surface (that is, the upper surface of die cavity bottom part 1a) in die cavity portion 2 is set to lower than the profile (that is, the upper surface of cavity side face component 1b) of counterdie.
As shown in (1) of Figure 21, in the above-described state, if supplied the sheet material resin 4 adhered on release film 3 to die cavity portion 2 by release film 3, and the peripheral part of sheet material resin 4 is stretched out and overlaps onto the profile (upper surface of cavity side face component 1b) of the counterdie as outer peripheral edges position, die cavity portion 2 and set overlapping portion 4a, then sheet material resin 4 be subject to by deadweight cause hang down effect and sagging.Namely, the overlapping portion 4a having required flexibility and a sheet material resin due to release film 3 and sheet material resin 4 is subject to the clamping pressure etc. caused by the bottom surface of patrix (not shown), as shown in (2) of Figure 21, the part in sheet material resin 4 except the 4a of its overlapping portion is housed in die cavity portion 2 under sagging state in the effect of hanging down being subject to being caused by deadweight.And, by periphery (with the Qian He of cavity side face component 1b) the position cut off machine timber fat 4 along die cavity portion 2, thus can by the partial receipt of sheet material resin 4 except the 4a of overlapping portion in die cavity portion 2.Therefore, it is possible to prevent the periphery 2a in die cavity portion 2 from producing the space part of non-potting resin state.
But, when using the semiconductor element on the sheet material resin 4 pairs of semiconductor substrates be housed in die cavity 2 to carry out compression encapsulation, there will be following unfavorable condition.That is, about the semiconductor element on semiconductor substrate, heating is carried out to the sheet material resin 4 in die cavity portion 2 and makes it to become molten state, then make the semiconductor element on semiconductor substrate impregnated in molten resin.And, in this condition, by making die cavity bottom part 1a be moved upward to the height and position of regulation and the resin compressed in die cavity portion 2, thus semiconductor element is compressed in the shaping resin package covers of the thickness that is packaged in specify.But the peripheral part of resin package covers after shaping, that is, be formed as compared with other positions at the position that the periphery 2a in die cavity portion 2 is shaping with the state of standing shape projection.This tendency is common especially in the batch resin-encapsulated using large substrate, and at this moment, the semiconductor element on semiconductor substrate likely cannot be made to be packaged in effectively in the resin package covers that each position of semiconductor substrate is shaping with the thickness of equalization.
Can think that this unfavorable condition results from following technology item.Namely, each position due to sheet material resin 4 is formed as impartial thickness, therefore to being housed in the bottom surface in die cavity portion 2 (namely, the upper surface of die cavity bottom part 1a) part in portion equably and with the state of equalization supply resin material, but concerning a large amount of resin materials more than thickness of donor sheet timber fat 4 the periphery 2a in die cavity portion 2 and the position corresponding with the degree of depth 2b in die cavity portion 2.In addition, owing to using thermoset resin material to be convention as this sheet material resin 4, therefore in the die cavity portion 2 through heating, easily promote thermosetting effect.Its result, the sheet material resin 4 be housed in die cavity portion 2 is subject to heat effect and melts, easily produce the mobilization of the horizontal direction in die cavity portion 2 thus, but be combined with the thermosetting reacting phase of sheet material resin 4, there is the repressed tendency of mobilization widely in die cavity portion 2.Therefore, compared with other positions, be formed as thicker by the molding thickness of the periphery 2a supplied in a large number in the die cavity portion 2 of resin material.Below, the various embodiments of the present invention eliminating this unfavorable condition are described.
First the first embodiment shown in Fig. 1 to Fig. 8 is described.
The general configuration of the semiconductor encapsulation device 10 shown in Fig. 1 involved by the first embodiment.
Be provided with the compression forming semiconductor package die-filling 15 possessing patrix 12 and counterdie 14 at this semiconductor encapsulation device 10, described patrix 12 is installed in the lower surface of upper bolster 11, and described counterdie 14 is installed in the upper surface of die shoe 13 side.In addition, the lower surface of patrix 12 is provided with substrate placement section 16, and is configured to supply to the assigned position of substrate placement section 16 and places the semiconductor substrate 18 being provided with multiple semiconductor elements 17 (shown in legend so-called flip-chip variety).In addition, patrix side seal parts 19 are equipped with in the position as upper bolster 11 outside with the state that can move up and down.And then these patrix side seal parts 19 utilize the elasticity of the elastomeric element 20 be arranged between patrix side seal parts 19 and upper bolster 11 to be biased highlightedly downwards.
In addition, the counterdie 14 being installed in die shoe 13 side is made up of die cavity bottom part 21 and cavity side face component 22, its upper surface shape of described die cavity bottom part 21 is formed flat condition and doubles as resin pressure-producing part, described cavity side face component 22 is flush-mounted in the periphery of die cavity bottom part 21, and doubles as the guide member up and down of die cavity bottom part 21.In addition, die cavity bottom part 21 utilizes the elasticity of the elastomeric element 23 be arranged between die cavity bottom part 21 and die shoe 13 side to be biased highlightedly upward.In addition, as aftermentioned, the elasticity of die cavity bottom part elastomeric element 23 is set to more weak than the elasticity of cavity side face component elastomeric element 24.
In addition, die cavity bottom part 21 is embedded in the embedded hole 22a arranged on the central portion of cavity side face component 22.And periphery is provided with the inclined plane 22b narrowed upward above embedded hole 22a, therefore, the central portion upper surface of cavity side face component 22 is formed section convex shape.
In addition, as aftermentioned, die cavity bottom part 21 is set to move to the upper-lower height position of regulation under matched moulds effect.And this die cavity bottom part 21 and elastomeric element 23 are configured for the resin compressing mechanism resin material being supplied to the spatial portion (resin forming die cavity portion 25) be made up of the inner circumferential face of the embedded hole 22a in the upper surface part of die cavity bottom part 21 and cavity side face component 22 being carried out to compression forming.
In addition, counterdie side seal parts 26 are equipped with in the position of the outside as die shoe 13 side relative with patrix side seal parts 19.
In addition; upper bolster 11 is set to can be moved up and down by clasp mould mechanism (not shown); and be set to patrix 12 can be made to be moved upward to the height and position of regulation when the die sinking of two moulds 12,14 up and down shown in Fig. 1; and on the contrary, matched moulds described later can be carried out by making patrix 12 move down.
In addition, be set to, when carrying out matched moulds by above-mentioned clasp mould mechanism to upper and lower two moulds 12,14, to engage by patrix side seal parts 19 outside sealing upper and lower two moulds 12,14 with counterdie side seal parts 26.Further, be equipped with exhaust gear (not shown), this exhaust gear is configured to by the suitable mechanism of decompressor, the air in the sealing range formed externally is discharged energetically by these patrix side seal parts 19 and counterdie side seal parts 26.
In addition, be set to when the die sinking of two moulds 12,14 up and down shown in Fig. 1, substrate can be made to supply and take out of mechanism 27 to move to assigned position between upper and lower two moulds 12,14, and make substrate supply and the semiconductor substrate 18 taken out of in mechanism 27 combine and be supported on the substrate placement section 16 of patrix 12, thus semiconductor substrate 18 is supplied and is positioned over the assigned position of substrate placement section 16.
In addition, between upper and lower two moulds 12,14, be equipped with the intermediate die 28 for support semiconductor substrate.Be provided with for the described semiconductor substrate 18 of chimeric support and the embedded hole portion 28a that the semiconductor element 17 on semiconductor substrate 18 is exposed downwards at the upper surface of this intermediate die 28.In addition, the lower surface of intermediate die 28 is provided with section angling hole portion 28b, described section angling hole portion 28b is communicated with embedded hole portion 28a and for chimeric with the central portion upper surface of the cavity side face component 22 formed with section convex shape.In addition, when the matched moulds of patrix 12 and counterdie 14, between intermediate die 28 and cavity side face component 22, be formed with the resin delay portion 29 (with reference to Fig. 5) for accommodating residual resin described later.
In addition, the residual resin be equipped for catching the residual resin described later be housed in resin delay portion 29 at the central portion upper surface of cavity side face component 22 catches mechanism 30.In addition, the release film pressing mechanism 32 of the bottom surface of intermediate die 28 is pressed in cavity side face component 22 release film 31 elasticity be equipped for making tensioning be arranged at the upper surface side of cavity side face component 22.
Residual resin seizure mechanism 30 is arranged at the inclined plane 22b in cavity side face component 22.And residual resin is caught mechanism 30 and caught the residual resin 33c be housed in resin delay portion 29 by release film 31, residual resin 33 can be made thus to combine and rest on the 22b side, inclined plane (reference Fig. 6) of cavity side face component 22.
In addition, although the residual resin 33c be captured along with described later shaping after die sinking time products formed outstanding role and remove its trap state simultaneously, be also provided with the outstanding mechanism 30a of the trap state for removing this residual resin 33c further effectively.
In addition, the supply to die cavity portion 25 of the covering of the profile (upper surface) of release film 31 pairs of counterdies 14 and sheet material resin 33 is carried out by the roll-to-roll mechanism 34 of what is called.That is, as shown in Figure 1, release film 31 is formed strip.And, this release film 31 is set to: the profile being supplied to counterdie 14 from donor rollers 34a via supply side guide roller 34b etc., and at semiconductor package die-filling 15 after the resin compression forming operation of regulation, be taken up via batching side steering roll 34c etc. and be housed in takers-in 34d.
In addition, sheet material resin 33 possesses required flexibility.And sheet material resin 33 adheres to the interval location of the regulation on release film 31.In addition, as shown in Figure 1, for the purpose of 15 sides die-filling to semiconductor package supply continuously automatically, sheet material resin 33 batches and is arranged on the donor rollers 34a in roll-to-roll mechanism 34.In addition, on release film 31, adhesion has the diaphragm 35 (laminated film) for screening glass timber fat 33.Before 15 side donor sheet timber fat 33 die-filling to semiconductor package, divest this diaphragm 35 in advance.As shown in Figure 1; in this embodiment; before 15 side supply release films 31 die-filling to semiconductor package with the sheet material resin 33 adhered on release film 31, carry out making the diaphragm 35 of the upper surface adhering to sheet material resin 33 batch through guide roller 34e and be housed in the diaphragm stripping process on the takers-in (not shown) of diaphragm.
In addition, as shown in Figure 3, the thickness 33T of sheet material resin 33 is set to the thickness 36T of the resin package covers 36 shaping in die cavity portion 25 roughly equal.In addition, the thickness 25D for the die cavity portion 25 of moulding resin packaging part 36 is set to the degree of depth roughly equal with the thickness 33T of sheet material resin 33.
In addition, the shape that the shape of sheet material resin 33 is set to the die cavity portion 25 in die-filling with semiconductor package 15 is corresponding, and larger than the opening periphery (that is, the upper end circumference of die cavity bottom part 21) in die cavity portion 25 (wide).Therefore, during to die cavity portion 25 donor sheet timber fat 33, by both position alignment (positioning control) carrying out making the center of sheet material resin 33 to aim at the center in die cavity portion 25, thus set as shown in Figure 3 and the position of the outer peripheral edges of sheet material resin 33 stretched out and overlaps onto the overlapping portion 33a at the position (that is, the upper surface of cavity side face component 22) of the outer peripheral edges in die cavity portion 25.
In addition, arrange supply side idler roller respectively at the supply side guide roller 34b of roll-to-roll mechanism 34 and the desired location of batching between side steering roll 34c and batch side idler roller (not shown), and be configured to the height and position that can adjust two idler rollers, thus the adjustment of the covering state of the profile of release film 31 pairs of counterdies 14 can be carried out or carry out the tension adjustment of release film 31.
In addition, be equipped with the adsorbing mechanism (not shown) of release film, the adsorbing mechanism of described release film is configured to the air of externally to be discharged from the chimeric position between die cavity bottom part 21 and cavity side face component 22 by the suitable mechanism of decompressor in die cavity portion 25.Therefore, when making the adsorbing mechanism work of release film 31 under the state that release film 31 is covered in the profile (upper surface) of counterdie 14, release film 31 can be adsorbed along the profile forms of counterdie 14.
Below, the situation about the upper surface part donor sheet timber fat 33 to counterdie 14 (die cavity bottom part 21 and cavity side face component 22) is described.
First, carry out die cavity bottom part height and position setting operation, the upper level position of the die cavity bottom part 21 in die-filling for semiconductor package 15 is set as the height and position of more than the upper level of the cavity side face component 22 of the upper level position comprising cavity side face component 22 by this operation.At this, the upper level position comprising cavity side face component 22 means that upper surface that the upper level position of die cavity bottom part 21 and the upper level position of cavity side face component 22 are identical height and position, what is called is in conplane state (with reference to Fig. 3).Therefore, the upper level position of die cavity bottom part 21 is set as comprising die cavity bottom part 21 is in conplane upper level position with the upper level position of cavity side face component 22, and then is set as the height and position higher than the upper level position of cavity side face component 22.
In addition, in this embodiment, the upper level position of die cavity bottom part 21 and the upper level position of cavity side face component 22 are set to be in conplane state.In addition, the upper level position of die cavity bottom part 21 can be set as the height and position higher than the upper level position of cavity side face component 22.This setting, by via suitable driving mechanism up and down (not shown), makes die cavity bottom part 21 move up to select its upper level position easily to implement.In addition, by consider such as to make the peripheral part of sheet material resin 33 stretch out and overlap onto cavity side face component 22 upper surface and can set efficiently the height and position of overlapping portion 33a, sheet material resin 33 the thermosetting reaction time, to coordinate with die closing operation and other conditions of molding etc. suitably determine the selection of the upper level position of die cavity bottom part 21.In addition, in the result of carrying out testing based on this condition, when the upper level position of die cavity bottom part 21 being set as can carry out good enforcement from the upper level position of cavity side face component 22 to when being equivalent to less than three times of height of thickness of sheet material resin 33.Therefore, as the height and position that the upper level position than cavity side face component 22 is high, be set as less than three times of the height of the thickness being equivalent to sheet material resin 33.
Next, carry out sheet material resin mounting operation, the sheet material resin 33 being shaped to the area wider than the area of die cavity bottom part 21 is placed in the upper surface part of die cavity bottom part 21 (that is, die cavity portion 25) by this operation.In addition, as previously mentioned, in this sheet material resin mounting operation, carry out making the center of sheet material resin 33 to aim at both position alignment of the center of die cavity bottom part 21.
Further, sheet material resin overlap setting operation is carried out in sheet material resin mounting operation, this operation is stretched out by the peripheral part of the sheet material resin 33 making the upper surface part being placed in die cavity bottom part 21 and is overlapped onto the upper surface of cavity side face component 22, at the overlapping portion 33a (with reference to Fig. 3) of the outer peripheral edges position of die cavity bottom part 21 setting sheet material resin 33.
In addition, as mentioned above, sheet material resin mounting operation also can supply by the upper surface part to die cavity bottom part 21 the sheet material resin 33 adhered on the upper surface of release film 31, thus by release film 31, sheet material resin 33 is placed in the upper surface part of die cavity bottom part 21.
Below, be supplied to the situation that the semiconductor element 17 on sheet material resin 33 pairs of semiconductor substrates 18 of the upper surface part of counterdie 14 carries out resin-encapsulated be described using.
After carrying out sheet material resin overlap setting operation, carry out matched moulds operation, this operation forms resin forming die cavity portion 25 (with reference to Fig. 3) between patrix 12 and counterdie 14 by carrying out matched moulds to patrix 12 and counterdie 14.
In addition, in the matched moulds operation of this patrix 12 and counterdie 14, carry out sheet material resin cut off operation, this operation is along chimeric position (that is, the peripheral part of embedded hole 22a) the cut off machine timber fat 33 (with reference to Fig. 4, Fig. 5) between die cavity bottom part 21 and cavity side face component 22.Now, overlapping portion 33a is cut off and the given volume (with reference to Fig. 3) of cut-out rear panel timber fat 33b after being separated.In addition, owing to applying the heat effect caused by heater (not shown) to sheet material resin 33, therefore as shown in Figure 5, be cut off and be separated and be housed in resin delay portion 29 after being become residual resin 33c by the overlapping portion 33a after heat fused.
In addition, cut off in operation at above-mentioned sheet material resin and carry out sheet material resin collecting operation, cut-out rear panel timber fat 33b on the upper surface of die cavity bottom part 21 is housed in die cavity portion 25 by this operation, and the residual resin 33c of the overlapping portion 33a on the upper surface of cavity side face component 22 is contained in (with reference to Fig. 5) in the residual resin resin delay portion 29 that arranges in the outer fix of die cavity bottom part 21.In addition, by driving mechanism up and down (not shown) suitable foregoing, die cavity bottom part 21 is moved down relative to cavity side face component 22, thus form die cavity portion 25 between die cavity bottom part 21 and cavity side face component 22.Therefore, effectively and be effectively housed in die cavity portion 25 through a certain amount of cut-out rear panel timber fat 33b of above-mentioned sheet material resin cut-out operation.
Next, as shown in Figure 5, carry out resin compression forming operation, this operation carries out heat fused to the cut-out rear panel timber fat 33b be housed in die cavity portion 25, and be immersed in the state in the molten resin material in die cavity portion 25 at the semiconductor element 17 made on semiconductor substrate 18 under, molten resin material is compressed, in the resin package covers 36 that the equal thicknesses being packaged in specify by the semiconductor element 17 on semiconductor substrate 18 is thus shaping.
In addition, in above-mentioned resin compression forming operation, the sheet material resin 33b of the thickness 33T roughly the same with the thickness 36T of resin package covers 36 can be supplied in die cavity portion 25, and this sheet material resin 33b can be supplied to the uniform configuration of equalization and equably in die cavity portion 25 and effectively prevent the periphery in die cavity portion 25 from producing the space part of non-potting resin state.Therefore, it is possible to resin material (sheet material resin 33b) is supplied equably and is filled into each position in die cavity portion 25.Therefore, it is possible to the resin material equably in heat fused die cavity portion 25.Thus, this situation of space part that can not form non-potting resin state with the circumference in die cavity portion 25 combines, and can effectively prevent or suppress molten resin material in die cavity portion 25 to flowings such as circumferences.And then, can carry out making die cavity bottom part 21 to be moved upward to the height and position of regulation and the effect compressed the molten resin material in die cavity portion 25 under low pressure (low speed).And, by preventing or inhibitory action and the low compression effect to molten resin material resin flows effect in die cavity portion 25, the semiconductor element 17 on semiconductor substrate 18 can be prevented effectively to be extruded and to produce position deviation.In addition, so resin-encapsulated can be carried out to the semiconductor element 17 on semiconductor substrate 18 under appropriate conditions, therefore, it is possible to be packaged in the resin-encapsulated 36 that each position is shaping with the thickness reduction of equalization by semiconductor element 17.
In addition, after resin compression forming operation, die sinking again (with reference to Fig. 1) is carried out to upper and lower two moulds 12,14 and intermediate die 28 etc., and supplied by substrate and take out of mechanism 27, taking out of outside mould and combine and be supported on the resin-encapsulated metacoxal plate of the state on the substrate placement section 16 of patrix 12.In addition in die sinking, when being made resin-encapsulated metacoxal plate give prominence to from die cavity portion 25 by release film 31, such as shown in Figure 7, die cavity bottom part 21 can be made to move up, and then the air that also can carry out being undertaken by spraying compressed air A from embedded hole 22a gives prominence to operation.
In addition, the release film after using then is discharged by the takers-in 34d of roll-to-roll mechanism 34 and is batched and is housed on takers-in 34d outside mould.And then, because the predetermined distance position adhesion on the release film 31 of strip has sheet material resin 33, therefore, it is possible to be set as continuously and automatically carry out using the discharge effect of rear release film and next use before the supply effect of release film.
According to the first embodiment, when by release film 31 in die cavity portion 25 during donor sheet timber fat 33b, due to the upper level position of die cavity bottom part 21 and the upper level position of cavity side face component 22 be set to become identical height and position, the upper surface of what is called is in conplane state, therefore, it is possible to prevent sheet material resin 33b sagging this disadvantage in the past in die cavity portion 25 effectively.Thus, the periphery in the die cavity portion 25 formed when matched moulds can not produce the space part of non-potting resin state, and, the appropriate resin material carrying out needed for resin-encapsulated to semiconductor element 17 can be supplied in this die cavity portion 25.In addition, when compressing the molten resin material in die cavity portion 25, the mobilization of this molten resin material can be prevented or effectively suppress this mobilization.Therefore, it is possible to effectively prevent from causing the semiconductor element 17 on semiconductor substrate 18 be extruded and produce the unfavorable condition of position deviation etc. because of the mobilization of the molten resin material in die cavity portion 25.Realize in addition the semiconductor element 17 on semiconductor substrate 18 to be packaged in this practicality effect in the resin-encapsulated 36 that each position of semiconductor substrate 18 is shaping with the thickness of equalization.
In addition, due to when carrying out matched moulds to patrix 12 and counterdie 14, between intermediate die 28 and cavity side face component 22, be configured for the resin delay portion 29 of accommodating residual resin 33c, therefore, it is possible to omit the resin delay portion be in the past arranged on the upper surface of counterdie.In addition, due to resin delay portion 29 can be arranged in the adjacent peripheral edges position in die cavity portion 25, therefore widely do not arrange in the edge, periphery of such as semiconductor substrate 18 and can implement well for region (being the clamping range of intermediate die 28 pairs of substrates in legend) clamped by mould yet.
In addition, in the above description, be illustrated about the structure being provided with die cavity bottom part 21 elastomeric element 23 and cavity side face component 22 elastomeric element 24, but replace die cavity bottom part 21 elastomeric element 23, such as, can also arrange the driving mechanism up and down (not shown) that die cavity bottom part 21 is moved up and down independently.Now, by making die cavity bottom part 21 carry out independently moving up and down via this upper and lower driving mechanism, can select arbitrarily and setting the height and position of the upper surface (that is, die cavity bottom surface) of die cavity bottom part 21.In addition, die cavity bottom part 21 can be made in linkage to be moved downward to the height and position of regulation with matched moulds effect, therefore can avoid the contact of semiconductor element on semiconductor substrate 18 17 and the upper surface (die cavity bottom surface) of die cavity bottom part 21 when matched moulds.Therefore, also the situation that semiconductor element 17 is the element of so-called wire bonds type can be tackled well.
In addition, to supply about making substrate and the semiconductor substrate 18 taken out of in mechanism 27 combines and situation about being supported on the substrate placement section 16 of patrix 12 is illustrated, but also can making after semiconductor substrate 18 is flush-mounted in the embedded hole portion 28a of intermediate die 28, intermediate die 28 to be installed on the substrate placement section 16 of patrix 12.
In addition, as shown in Figure 8, can also implement in intermediate die 28 side forming resin delay portion 29 and be configured for preventing the resin of the residual resin 33c attachment be housed in resin delay portion 29 from adhering to anti-locking mechanism 37.Such as, can also by carrying out the surface treatment adopting nickel plating to the surface of intermediate die 28 side, or this surface is adopted to the surface treatment of the simple and easy release material be made up of fluorine system and silicon system resin, or this surface structure integrated with simple and easy release layer is adopted to adhere to anti-locking mechanism 37 to form resin.In addition, as shown in Figure 8, the residual resin capture unit that can also catch in mechanism 30 at residual resin is configured for the so-called undercutting portion 30b of the seizure action effect improving residual resin.
Below, based on Fig. 9 to Figure 14, the second embodiment of the present invention is described.
Illustrate in a first embodiment, intermediate die 28 between upper and lower two moulds 12,14 is provided with for by chimeric for the semiconductor substrate 18 embedded hole portion 28a that supports and the section angling hole portion 28b chimeric with the central portion upper surface of cavity side face component 22 being arranged at, and between intermediate die 28 and cavity side face component 22, forms the structure for the resin delay portion 29 of being accommodated by residual resin 33c when die sinking.In the present embodiment, be configured to be provided with intermediate die 38 between patrix 12 and counterdie 14, and the upper surface side of intermediate die 38 is provided with the resin forming die cavity portion 38a for being fitted together to by the semiconductor element 17 on semiconductor substrate 18, be provided with the fitting portion 38b of sheet material resin 33 in the lower face side of intermediate die 38, the present embodiment is different from the first embodiment in this.In addition, content illustrated in structure identical in fact with the first embodiment in the present embodiment and the first embodiment is identical, uses identical Reference numeral to both general structures.
As shown in Fig. 9 to Figure 14, the counterdie 14 being installed in die shoe 13 side is made up of die cavity bottom part 21 and cavity side face component 22, wherein die cavity bottom part 21 doubles as resin pressure-producing part, and cavity side face component 22 is flush-mounted in the periphery of die cavity bottom part 21 and doubles as the guide up and down of die cavity bottom part 21.And then the upper surface shape of die cavity bottom part 21 and cavity side face component 22 is formed flat condition.In addition, the resin delay portion 29 of residual resin 33c is arranged at the upper surface of the cavity side face component 2 of the outer periphery position as die cavity bottom part 21.
In addition, die cavity bottom part 21 is set to the upper-lower height position moving to regulation by suitable driving mechanism up and down (not shown) independently.Therefore, in the same manner as the first embodiment, the upper level position of die cavity bottom part 21 can be set as the height and position of more than the upper level of the cavity side face component 22 of the upper level position comprising cavity side face component 22.In addition, cavity side face component 22 utilizes the elasticity of the elastomeric element 24 be arranged between cavity side face component 22 and die shoe 13 to be biased highlightedly upward.
In addition, when matched moulds, move up by making die cavity bottom part 21, and make its upper surface part (namely, die cavity bottom surface) be entrenched in intermediate die 38 die cavity portion 38a in and the height and position moved it to the regulation in die cavity portion 38a, thus set the degree of depth 25D (with reference to Figure 13) of the die cavity portion 38a of regulation by the upper surface part of intermediate die 38 and die cavity bottom part 21.And this die cavity bottom part 21 is configured for the resin compressing mechanism resin material in the die cavity portion 38a of the upper surface part and intermediate die 38 that are supplied to die cavity bottom part 21 being carried out to compression forming.
In a first embodiment, by making die cavity bottom part 21 be moved downward to upper surface position lower than cavity side face component 22, thus resin forming die cavity portion 25 is formed.On the other hand, the difference of the present embodiment have following some:
Make die cavity bottom part 21 be moved upward to the height and position of regulation when matched moulds;
Utilize the sheet material resin 33 of the upper surface part of die cavity bottom part 21 (die cavity bottom surface) upwardly in fitting portion 38b and cut off;
Cut-out rear panel timber fat 33b is housed in die cavity portion 38a, and the overlapping portion 33a of the periphery as sheet material resin 33 is cut off and is separated and becomes residual resin 33c, and accommodated and catch (with reference to Figure 13) in the resin delay portion 29 arranged on the upper surface in cavity side face component 22, etc.
Although the present embodiment has above-mentioned difference, the effect identical with the first execution mode can be realized.Namely, according to the present embodiment, when by release film 31 in die cavity portion 25 during donor sheet timber fat 33b, the upper level position of die cavity bottom part 21 and the upper level position of cavity side face component 22 be set to become identical height and position, the upper surface of what is called is in conplane state, therefore can ignore the nutating action to sheet material resin 33 as the structure of the first embodiment.Thus, the periphery in the die cavity portion 38a being formed in intermediate die 38 can not produce the space part of non-potting resin state, and, the appropriate resin material carrying out needed for resin-encapsulated to semiconductor element 17 can be supplied in die cavity portion 38a.Further, when compressing the molten resin material of die cavity portion 38a, the mobilization of this molten resin material can be prevented or effectively suppress this mobilization.Therefore, it is possible to effectively prevent from causing the semiconductor element 17 on semiconductor substrate 18 be extruded and produce the unfavorable conditions such as position deviation because of the mobilization of the molten resin material in die cavity portion 38a.In addition, realize the semiconductor element 17 on semiconductor substrate 18 to be packaged in this practicality effect in the resin-encapsulated 36 that each position of semiconductor substrate 18 is shaping with the thickness of equalization.
Next, based on Figure 15 to Figure 17, the third embodiment of the present invention is described.
In the present embodiment, in the same manner as first, second embodiment, when to the upper surface part donor sheet timber fat 33 of counterdie 14, the upper level position of the upper level position of die cavity bottom part 21 and cavity side face component 22 can be set as identical height and position, namely the upper surface of two parts 21,22 is in conplane state.And then on this basis, the upper level position of die cavity bottom part 21 can be set as the height and position of more than the upper level position of cavity side face component 22 in the present embodiment.Below to during in the present embodiment to the upper surface part donor sheet timber fat 33 of counterdie 14, the upper level position of die cavity bottom part 21 is set as the structure of the height and position of more than the upper level position of cavity side face component 22 is described in detail.In addition, structure identical in fact with the second embodiment with the first embodiment is in the present embodiment identical with content illustrated in the second embodiment with the first embodiment, uses identical Reference numeral to both general structures.In addition, due to can be identical with the second embodiment with the first embodiment implement the present embodiment, the repetition therefore in order to avoid illustrating, carries out brief description in the mode compared with the first embodiment.
Supply to patrix 12 and intermediate die 28 shown in Figure 15 and place semiconductor substrate 18, and to the upper surface part donor sheet timber fat 33 of counterdie 14, and in this condition, the first matched moulds state after patrix 12 and intermediate die 28 are moved down.Now, the upper level position 21h of die cavity bottom part 21 is set to the height and position of upper level position more than the 22h of cavity side face component 22.At this, the upper level position 22h of upper level position 21h and cavity side face component 22 that the height and position of upper level position more than the 22h of so-called cavity side face component 22 then comprises die cavity bottom part 21 is in the situation of same plane state.That is, thus by the upper level position 21h of die cavity bottom part 21 being set as the upper level position 22h higher than cavity side face component 22, prevent the sheet material resin 33 that is placed on the upper surface of die cavity bottom part 21 sagging because of deadweight.
In addition, under the first matched moulds state, sheet material resin 33 is placed in the upper surface part of die cavity bottom part 21, and stretches out as the overlapping portion 33a of the peripheral part of sheet material resin 33 and overlap onto on the inclined plane 22b of cavity side face component 22.That is, the sheet material resin 33 in die cavity bottom part 21 can not produce because of the nutating action caused of conducting oneself with dignity, but overlapping portion 33a becomes along the sagging state of the inclined plane 22b of cavity side face component 22.
The second matched moulds state after making patrix 12 and intermediate die 28 move down further from the first matched moulds state shown in Figure 16.Now, bottom surface and the semiconductor element 17 be installed on this bottom surface of semiconductor substrate 18 engage with the upper surface of the sheet material resin 33 in die cavity bottom part 21, and in this condition, together move down with patrix 12 and intermediate die 28.
The 3rd matched moulds state after making patrix 12 and intermediate die 28 move down further from the second matched moulds state shown in Figure 17.Now, the bottom surface of semiconductor substrate 18 and semiconductor element 17, via the sheet material resin 33 in die cavity bottom part 21, make die cavity bottom part 21 resist the elasticity of elastomeric element 23 and be moved downward to the height and position of regulation forming die cavity portion 25.
In addition, now, to cut off the sheet material resin 33 in die cavity bottom part 21 with the chimeric position (that is, the peripheral part of embedded hole 22a) of cavity side face component 22 along die cavity bottom part 21.Therefore, the sheet material resin 33b after this cut-out is subject to the elastic pressure that caused by die cavity bottom part 21 and is compressed, and is packaged in by the shaping resin package covers 36 in die cavity portion 25.In addition, by heat fused, the clamping pressure needed for die cavity bottom part 21 causes while the cut-out rear panel timber fat 33b be therefore housed in die cavity portion 25 melts, is subject to because sheet material resin 33 is subject to the heat effect from the heating arrangements (not shown) be installed on semiconductor package die-filling 15.
In addition, after overlapping portion 33a becomes residual resin 33c being separated with cut-out rear panel timber fat 33b, be housed in the resin delay portion 29 that forms between the section angling hole portion 28b of the intermediate die 28 and inclined plane 22b of cavity side face component 22.
Although the present embodiment has above-mentioned difference, the effect same with the first embodiment can be realized.Namely, in the present embodiment, when to the upper surface part donor sheet timber fat 33 of counterdie 14, the upper level position 21h of die cavity bottom part 21 is set as the upper level position 22h higher than cavity side face component 22, therefore, it is possible to prevent the sheet material resin 33 that is placed on the upper surface of die cavity bottom part 21 sagging because of deadweight.In addition, overlapping portion 33a is along the sagging state of the inclined plane 22b of cavity side face component 22, but in the resin delay portion 29 that forms, the outside that this part becomes residual resin 33c and is housed in die cavity bottom part 21.Thus, the periphery in the die cavity portion 25 formed when matched moulds can not produce the space part of non-potting resin state, and, the appropriate resin material carrying out needed for resin-encapsulated to semiconductor element 17 can be supplied in die cavity portion 25.And then, when compressing the molten resin material in die cavity portion 25, the mobilization of this molten resin material can be prevented or effectively suppress this mobilization.Therefore, it is possible to effectively prevent from causing the semiconductor element 17 on semiconductor substrate 18 be extruded and produce the unfavorable conditions such as position deviation because of the mobilization of the molten resin material in die cavity portion 258.In addition, realize the semiconductor element 17 on semiconductor substrate 18 to be packaged in this practicality effect in the resin-encapsulated 36 that each position of semiconductor substrate 18 is shaping with the thickness of equalization.
Next, based on Figure 18 to Figure 20, the fourth embodiment of the present invention is described.
Have in the first embodiment to the 3rd embodiment and automatically carry out the covering of the profile of release film 31 pairs of counterdies 14 (die cavity bottom part 21 and cavity side face component 22) and sheet material resin 33 structure to the supply of die cavity portion 25,38a by roll-to-roll mechanism 34.On the other hand, in the present embodiment, by carrying out above-mentioned covering and supply for the loading frame mechanism 41 of the upper surface part artificial donor sheet timber fat 40 to die cavity bottom part 21, described sheet material resin 40 by adhere to cut into the short strip shape corresponding with the profile forms of counterdie 14 in advance release film 39 on.The present embodiment is different from each embodiment of first to the 3rd in this.In addition, can be corresponding with the semiconductor encapsulation device shown in the first embodiment to the 3rd embodiment and similarly to use in the present embodiment illustrated loading frame mechanism 41.So in order to avoid the repetition illustrated, in the present embodiment, the structure with reference to the second embodiment is described.In addition, the content in the present embodiment with illustrated in the first embodiment to the identical in fact structure of the 3rd embodiment and the first embodiment to the 3rd embodiment is identical, uses identical Reference numeral to both general structures.
Whole loading frame mechanism 41 is schematically shown in Figure 18.In addition, loading frame mechanism 41 possesses two framework 41a, 41b up and down that can load and unload and the grip part 41c transported in the lump by being closed by upper and lower two framework 41a, 41b.In addition, sheet material resin 40 adheres to the upper surface of the release film 39 cutting into the short strip shape corresponding with the profile forms of described counterdie 14 (being quadrangle in legend) in advance.In addition, release film 39 is set to load and unload freely relative to the faying face of upper and lower two framework 41a, 41b.
In addition, the Reference numeral 42 in figure represent arrange in cavity side face component 22 for installing and supporting the brace table of loading frame mechanism 41.And be set to, as shown in figure 20, when being fitted together to when making loading frame mechanism 41 and being installed on brace table 42, the faying face of upper and lower two framework 41a, 41b becomes identical height and position with the height and position of the profile of counterdie 14.
Next, be described about the situation passing through the sheet material resin 40 that the profile (upper surface part of die cavity bottom part 21) of loading frame mechanism 41 to counterdie 14 supplies on release film 39.First, upper and lower two framework 41a, 41b are opened, and as shown in (2) of Figure 18, release film 39 is clamped in the faying face of upper and lower two framework 41a, 41b.In addition at this moment, in the upper face center portion of release film 39, adhesion has sheet material resin 40.In addition, between upper and lower two framework 41a, 41b before holding piece timber fat 40 or after clamping, the diaphragm (not shown) adhering to the upper surface of sheet material resin 40 is peeled off.
Next, the upper level position of die cavity bottom part 21 and the upper level position of cavity side face component 22 are set as identical height and position.Next, as shown in FIG. 19 and 20, the loading frame mechanism 41 via release film 39 holding piece timber fat 40 be fitted together to and be installed on the brace table 42 of setting in cavity side face component 22.Now, the upper level position of die cavity bottom part 21 and the upper level position of cavity side face component 22 are set to identical height and position, are namely in same plane state.Therefore, about the sheet material resin 40 on the release film 39 be held in loading frame mechanism 41, can prevent in sheet material resin sagging by the part (cutting off rear panel timber fat 33b) be placed in die cavity bottom part 21 in the same manner as the second embodiment.In addition, the periphery of this sheet material resin stretches out and overlaps onto the upper surface of cavity side face component 22 and set overlapping portion 33a (with reference to Figure 10).
In addition, the present embodiment is following identical with the second embodiment on some:
Make die cavity bottom part 21 be moved upward to the height and position of regulation when matched moulds;
Utilize the sheet material resin 33 of the upper surface part of die cavity bottom part 21 (die cavity bottom surface) upwardly in fitting portion 38b and cut off;
Being cut off rear panel timber fat 33b is housed in die cavity portion 38a, and the overlapping portion 33a of the sheet material resin as residue numerical value 33c is cut off and is separated, and accommodated and catch in the resin delay portion 29 that arranges on the upper surface in cavity side face component 22, etc.
According to the present embodiment, because the upper level position of die cavity bottom part 21 and the upper level position of cavity side face component 22 are set to identical height and position, namely same plane state is in, therefore, it is possible to prevent the sheet material resin 40 sagging this disadvantage in the past in die cavity portion 38a supplied by loading frame mechanism 41 effectively.Thus, the periphery of the die cavity portion 38a formed when matched moulds can not produce the space part of non-potting resin state, and, the appropriate resin material carrying out needed for resin-encapsulated to semiconductor element 17 can be supplied in die cavity portion 38a.And then, when compressing the molten resin material in die cavity portion 38a, the mobilization of this molten resin material can be prevented or effectively suppress this mobilization.Therefore, it is possible to effectively prevent from causing the semiconductor element 17 on semiconductor substrate 18 be extruded and produce the unfavorable conditions such as position deviation because of the mobilization of the molten resin material in die cavity portion 38a.In addition, realize the semiconductor element 17 on semiconductor substrate 18 to be packaged in this practicality effect in the resin-encapsulated 36 that each position of semiconductor substrate 18 is shaping with the thickness of equalization.
The present invention is not limited to the various embodiments described above, without departing from the spirit of the scope of the invention, and can as required, arbitrarily and suitably carry out changing and selecting and adopt.
As previously mentioned, in the present invention, release film is automatically carried out to the supply to die cavity portion (upper surface part of die cavity bottom part) of the covering of the profile of counterdie (die cavity bottom part and cavity side face component) and sheet material resin by roll-to-roll mechanism.In addition, as previously mentioned, in the present invention the release film that (shearing in advance) becomes the short strip shape of Len req, such as, after can using the release film of drawing strip from the running roller batching strip release film, is cut off in advance.Now, by adhesion tablet timber fat on the release film cutting into and the short strip shape that formed corresponding with the profile forms of counterdie in advance, and in this condition, the profile of counterdie covers the release film of short strip shape, thus via the release film of short strip shape to die cavity portion donor sheet timber fat.
Description of reference numerals
10 semiconductor encapsulation devices
11 upper bolsters
12 patrixes
13 die shoes
14 counterdies
15 semiconductor packages are die-filling
16 substrate placement sections
17 semiconductor elements
18 semiconductor substrates
19 patrix side seal parts
20 elastomeric elements
21 die cavity bottom part
21h upper level position
22 cavity side face component
22a embedded hole
22b inclined plane
22h upper level position
23 elastomeric elements
24 elastomeric elements
25 die cavity portions
The 25D die cavity portion degree of depth
26 counterdie side seal parts
27 substrates supply and take out of mechanism
28 intermediate die
28a embedded hole portion
28b section angling hole portion
29 resin delay portions
30 residual resins catch mechanism
30a gives prominence to mechanism
30b undercutting portion
31 release films
32 release film pressing mechanisms
33 sheet material resins
33a overlapping portion
33b cuts off rear panel timber fat
33c residual resin
33T sheet material resin thickness
34 roll-to-roll mechanisms
34a donor rollers
34b supply side guide roller
34c batches side steering roll
34d takers-in
34e guide roller
35 diaphragms
36 resin package covers
36T resin package covers thickness
37 resins adhere to anti-locking mechanism
38 intermediate die
38a die cavity portion
38b fitting portion
39 release films
40 sheet material resins
41 loading frame mechanisms
41a upper frame
41b underframe
41c holds with a firm grip portion
42 brace tables
A compressed air
Claims (15)
1. a sheet material resin supply method, to at least possessing patrix, counterdie, the upper surface part donor sheet timber fat of the described counterdie in the resin-encapsulated mould of die cavity bottom part and cavity side face component, wherein, described patrix is provided with the semiconductor substrate of multiple semiconductor element for placing, described counterdie carries out compression encapsulation for utilizing resin to the semiconductor element on described semiconductor substrate, described die cavity bottom part doubles as resin pressure-producing part and has the upper surface shape of flat condition and be arranged at described counterdie, described cavity side face component is flush-mounted in the periphery of described die cavity bottom part and doubles as the guide member up and down of described die cavity bottom part,
The feature of described sheet material resin supply method is, comprising:
Die cavity bottom part height and position setting operation, is set as the height and position of more than the upper level of the described cavity side face component of the upper level position comprising described cavity side face component by the upper level position of described die cavity bottom part;
Sheet material resin mounting operation, carries out, the sheet material resin with the area wider than the area of described die cavity bottom part is placed in the upper surface part of described die cavity bottom part after described die cavity bottom part height and position setting operation; With
Sheet material resin overlap setting operation, carry out in described sheet material resin mounting operation, stretched out by the peripheral part of the described sheet material resin making the upper surface part being placed in described die cavity bottom part and overlap onto the upper surface of described cavity side face component, thus setting the overlapping portion of described sheet material resin at the outer peripheral edges position of described die cavity bottom part.
2. sheet material resin supply method according to claim 1, is characterized in that,
In described die cavity bottom part height and position setting operation, the upper level position of described die cavity bottom part is set as more than the upper level of described cavity side face component, and exceeds less than three times of the height of the thickness being equivalent to described sheet material resin than the upper level position of described cavity side face component.
3. sheet material resin supply method according to claim 1, is characterized in that,
Comprise sheet material resin mounting operation further, adhere on release film by making described sheet material resin, and described sheet material resin is placed in the upper surface part of described die cavity bottom part, thus described sheet material resin is placed in the upper surface part of described die cavity bottom part via described release film.
4. a method for packaging semiconductor, at least patrix is possessed by using, counterdie, the resin-encapsulated mould of die cavity bottom part and cavity side face component carries out resin-encapsulated to the semiconductor element on semiconductor substrate, wherein, described patrix is provided with the semiconductor substrate of multiple semiconductor element for placing, described counterdie carries out compression encapsulation for utilizing resin to the semiconductor element on described semiconductor substrate, described die cavity bottom part doubles as resin pressure-producing part and has the upper surface shape of flat condition and be arranged at described counterdie, described cavity side face component is flush-mounted in the periphery of described die cavity bottom part and doubles as the guide member up and down of described die cavity bottom part,
The feature of described method for packaging semiconductor is, comprising:
Die cavity bottom part height and position setting operation, is set as the height and position of more than the upper level of the described cavity side face component of the upper level position comprising described cavity side face component by the upper level position of described die cavity bottom part;
Sheet material resin mounting operation, carries out, the sheet material resin with the area wider than the area of described die cavity bottom part is placed in the upper surface part of described die cavity bottom part after described die cavity bottom part height and position setting operation;
Sheet material resin overlap setting operation, carry out in described sheet material resin mounting operation, stretched out by the peripheral part of the described sheet material resin making the upper surface part being placed in described die cavity bottom part and overlap onto the upper surface of described cavity side face component, thus setting the overlapping portion of described sheet material resin at the outer peripheral edges position of described die cavity bottom part;
Matched moulds operation, carries out, by carrying out matched moulds to described patrix and described counterdie and form resin forming die cavity portion between described patrix and this two mould of described counterdie after described sheet material resin mounting operation;
Sheet material resin cuts off operation, carries out in described matched moulds operation, cuts off described sheet material resin along described die cavity bottom part and the chimeric position of described cavity side face component;
Sheet material resin collecting operation, cut off in operation at described sheet material resin and carry out, at the upper surface of described die cavity bottom part, described sheet material resin after cutting off is housed in described die cavity portion, and described overlapping portion is housed in resin delay portion that the outer fix of described die cavity bottom part is arranged as the residual resin of described sheet material resin; With
Resin compression forming operation, carry out after described sheet material resin collecting operation, by carrying out heat fused to the described sheet material resin after the cut-out be housed in described die cavity portion, and under the state in the described sheet material resin after the heat fused being immersed in described die cavity portion making the described semiconductor element on described semiconductor substrate, described sheet material resin after heat fused is compressed, thus by the described semiconductor component packing on described semiconductor substrate in the resin package covers shaping with the equal thicknesses of regulation.
5. method for packaging semiconductor according to claim 4, is characterized in that,
In described die cavity bottom part height and position setting operation, the upper level position of described die cavity bottom part is set as more than the upper level of described cavity side face component, and exceeds less than three times of the height of the thickness being equivalent to described sheet material resin than the upper level position of described cavity side face component.
6. method for packaging semiconductor according to claim 4, is characterized in that,
Make the thickness of described resin package covers shaping in the thickness of described sheet material resin and described resin compression forming operation equal.
7. method for packaging semiconductor according to claim 4, is characterized in that,
Described matched moulds operation is undertaken by making described die cavity bottom part carry out moving down relative to described cavity side face component.
8. method for packaging semiconductor according to claim 4, is characterized in that,
Described resin-encapsulated mould has the intermediate die for supporting described semiconductor substrate between described patrix and described counterdie,
In described matched moulds operation, between described intermediate die and described cavity side face component, form described resin delay portion.
9. method for packaging semiconductor according to claim 4, is characterized in that,
Described resin-encapsulated mould has the intermediate die for supporting described semiconductor substrate between described patrix and described counterdie,
In described matched moulds operation, between described intermediate die and described die cavity bottom part, form described die cavity portion.
10. method for packaging semiconductor according to claim 4, is characterized in that,
In described sheet material resin mounting operation, by the roll-to-roll mechanism of automatic conveying sheet material resin the described sheet material resin adhered on the release film of strip being placed in the upper surface part of described die cavity bottom part.
11. method for packaging semiconductor according to claim 4, is characterized in that,
In described sheet material resin mounting operation, by the loading frame mechanism that manually transports this sheet material resin, the sheet material resin adhered on the release film cutting into the short strip shape corresponding with the profile forms of described counterdie is in advance placed in the upper surface part of described die cavity bottom part.
12. 1 kinds of semiconductor encapsulation devices, at least patrix is possessed by using, counterdie, the resin-encapsulated mould of die cavity bottom part and cavity side face component carries out resin-encapsulated to the semiconductor element on semiconductor substrate, wherein, described patrix is provided with the semiconductor substrate of multiple semiconductor element for placing, described counterdie carries out compression encapsulation for utilizing resin to the semiconductor element on described semiconductor substrate, described die cavity bottom part doubles as resin pressure-producing part and has the upper surface shape of flat condition and be arranged at described counterdie, described cavity side face component is flush-mounted in the periphery of described die cavity bottom part and doubles as the guide member up and down of described die cavity bottom part,
The feature of described semiconductor encapsulation device is to have:
For supporting the intermediate die of described semiconductor substrate, be arranged between described patrix and described counterdie; With
Resin delay portion, for accommodating residual resin,
Described resin delay portion is formed between described intermediate die and described cavity side face component by the matched moulds of described patrix and described counterdie.
13. semiconductor encapsulation devices according to claim 12, is characterized in that,
The residual resin be provided with further for catching the described residual resin be housed in described resin delay portion in described cavity side face component catches mechanism.
14. semiconductor encapsulation devices according to claim 12, is characterized in that,
Be provided with further for preventing the resin of the described residual resin attachment be housed in described resin delay portion from adhering to anti-locking mechanism in described intermediate die.
15. 1 kinds of semiconductive resin packaging systems, at least patrix is possessed by using, counterdie, the resin-encapsulated mould of die cavity bottom part and cavity side face component carries out resin-encapsulated to the semiconductor element on semiconductor substrate, wherein, described patrix is provided with the semiconductor substrate of multiple semiconductor element for placing, described counterdie carries out compression encapsulation for utilizing resin to the semiconductor element on described semiconductor substrate, described die cavity bottom part doubles as resin pressure-producing part and has the upper surface shape of flat condition and be arranged at described counterdie, described cavity side face component is flush-mounted in the periphery of described die cavity bottom part and doubles as the guide member up and down of described die cavity bottom part,
The feature of described semiconductor encapsulation device is to have:
For supporting the intermediate die of described semiconductor substrate, be arranged between described patrix and described counterdie; With
The die cavity portion of resin forming,
Described die cavity portion is formed between described die cavity bottom part and described intermediate die by the matched moulds of described patrix and described counterdie.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014056857A JP6270571B2 (en) | 2014-03-19 | 2014-03-19 | Sheet resin supply method, semiconductor sealing method, and semiconductor sealing device |
| JP2014-056857 | 2014-03-19 |
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| CN104934335A true CN104934335A (en) | 2015-09-23 |
| CN104934335B CN104934335B (en) | 2017-10-13 |
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| Country | Link |
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| JP (1) | JP6270571B2 (en) |
| KR (1) | KR101718605B1 (en) |
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| TW (1) | TWI642529B (en) |
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| US20180117813A1 (en) * | 2016-11-02 | 2018-05-03 | Asm Technology Singapore Pte Ltd | Molding apparatus including a compressible structure |
| CN107038965A (en) * | 2017-05-05 | 2017-08-11 | 深圳浩翔光电技术有限公司 | LED display, shaping module and its production technology |
| JP7406247B2 (en) * | 2020-05-22 | 2023-12-27 | アピックヤマダ株式会社 | resin mold equipment |
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| KR20150109283A (en) | 2015-10-01 |
| TW201536510A (en) | 2015-10-01 |
| JP2015179755A (en) | 2015-10-08 |
| JP6270571B2 (en) | 2018-01-31 |
| TWI642529B (en) | 2018-12-01 |
| KR101718605B1 (en) | 2017-03-21 |
| CN104934335B (en) | 2017-10-13 |
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