CN104914961A - Computer case radiating mechanism - Google Patents

Computer case radiating mechanism Download PDF

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Publication number
CN104914961A
CN104914961A CN201510355431.4A CN201510355431A CN104914961A CN 104914961 A CN104914961 A CN 104914961A CN 201510355431 A CN201510355431 A CN 201510355431A CN 104914961 A CN104914961 A CN 104914961A
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CN
China
Prior art keywords
water
cooling
heat
radiating
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510355431.4A
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Chinese (zh)
Inventor
陈科吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN YUNHONG MOLD Co Ltd
Original Assignee
DONGGUAN YUNHONG MOLD Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN YUNHONG MOLD Co Ltd filed Critical DONGGUAN YUNHONG MOLD Co Ltd
Priority to CN201510355431.4A priority Critical patent/CN104914961A/en
Publication of CN104914961A publication Critical patent/CN104914961A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a computer case radiating mechanism, and belongs to the field of computer accessories. The computer case radiating mechanism comprises a water-cooling radiating assembly and air inlet fans which are both arranged in the computer case; the water-cooling radiating assembly comprises a radiating cavity, water-cooling radiating pipes and a water-cooling radiating pump, wherein the water-cooling radiating pipelines are uniformly distributed in the radiating cavity, and the water-cooling radiating pump is communicated in a loop of the water-cooling radiating pipelines to carry out water-cooling radiating; the air inlet fans are arranged at the air inlet of the radiating cavity, and the radiating cavity is further provided with an air outlet to take away the heat of the water-cooling radiating pipelines by inlet air. According to the computer case radiating mechanism, the water-cooling radiating can be carried out by separately taking in and discharging air, therefore the dirt retention on accessories in the case can be prevented, and the radiating effect is good.

Description

A kind of case radiation mechanism
Technical field
The present invention relates to computer fittings field, particularly relate to a kind of case radiation mechanism.
Background technology
Cabinet is as the part in computer fittings; the Main Function that it rises places and fixing each computer fittings; play a support and protective effect; in addition; because the accessories such as CPU, video card, mainboard can generate heat when operating, cabinet also will have corresponding cooling mechanism, but traditional cooling mechanism goes out inlet air in radiation processes; easily bring dust into accessories such as CPU, video card, mainboards, affect main frame accessory performance.
Summary of the invention
For solving the above problems, the invention provides a kind of computer case radiation mechanism, going out inlet air separately, carrying out water-cooling, accessory laying dust in cabinet can not be made, and good heat dissipation effect.
The technical solution used in the present invention is: a kind of case radiation mechanism, comprises water-cooling assembly and air intake blower fan, and water-cooling assembly and air intake blower fan are all located in cabinet; Water-cooling assembly comprises heat dissipation cavity, water-cooling pipeline and water-cooling water pump; Water-cooling pipeline is distributed in heat dissipation cavity, and water-cooling water pump is communicated with in the loop of water-cooling pipeline, to carry out water-cooling; Air intake blower fan is located at the air inlet of heat dissipation cavity, and heat dissipation cavity is also provided with air outlet, takes away the heat of water-cooling pipeline with air intake.
In technique scheme, water-cooling assembly comprises two groups, to strengthen heat radiation.
In technique scheme, cabinet side board is provided with the heat radiation mesh corresponding with the air inlet of heat dissipation cavity and air outlet.
In technique scheme, water-cooling water pump bottom surface is heat sink, carries out heat interchange can be arranged on the accessories such as CPU, video card, mainboard.
In technique scheme, heat dissipation cavity medial surface is heat interchange heat sink, and heat interchange heat sink can take away the heat in cabinet, to strengthen heat radiation.
The invention has the beneficial effects as follows: this kind of case radiation mechanism, comprise water-cooling assembly, the accessories such as CPU, video card, mainboard are dispelled the heat, air intake and air-out are all carried out in heat dissipation cavity, can not to accessory laying dusts such as CPU, video card, mainboards in radiation processes, the accessory performance impacts such as CPU, video card, mainboard are minimized, and water-cooling is effective.
Accompanying drawing explanation
Fig. 1 is embodiments of the invention one and casing structure schematic diagram;
Fig. 2 is embodiments of the invention one overall perspective view;
Fig. 3 is embodiments of the invention two and casing structure schematic diagram;
Fig. 4 is embodiments of the invention two overall perspective view.
Embodiment
Below in conjunction with accompanying drawing, the present invention is further detailed explanation.
Embodiment one:
Fig. 1 and Fig. 2 show schematically show a kind of case radiation mechanism according to one embodiment of the present invention.
A kind of case radiation mechanism, comprise water-cooling assembly 1 and air intake blower fan 2, water-cooling assembly 1 and air intake blower fan 2 are all located in cabinet 3.
Water-cooling assembly 1 comprises two groups, and water-cooling assembly 1 is located at air intake blower fan about 2 two ends, to strengthen heat radiation.Water-cooling assembly 1 comprises heat dissipation cavity 11, water-cooling pipeline 12 and water-cooling water pump 13.Water-cooling pipeline 12 is distributed in heat dissipation cavity 11, and water-cooling water pump 13 is communicated with in the loop of water-cooling pipeline 12, to carry out water-cooling.Heat dissipation cavity 11 medial surface is heat interchange heat sink 15, and heat interchange heat sink 15 can take away the heat in cabinet 3, to strengthen heat radiation.Water-cooling water pump 13 bottom surface is heat sink, carries out heat interchange can be arranged on the accessories such as CPU, video card, mainboard.Air intake blower fan 2 is located at the air inlet of heat dissipation cavity 11, and heat dissipation cavity 11 is also provided with air outlet 14, takes away the heat of water-cooling pipeline 12 with air intake.
Above-mentioned, cabinet side board 4 is provided with the heat radiation mesh 41 corresponding with the air inlet of heat dissipation cavity 11 and air outlet 14.
Embodiment two:
Fig. 3 and Fig. 4 show schematically show a kind of cabinet 3 cooling mechanism according to one embodiment of the present invention.
A kind of case radiation mechanism, comprise water-cooling assembly 1 and air intake blower fan 2, water-cooling assembly 1 and air intake blower fan 2 are all located in cabinet 3.
Water-cooling assembly 1 comprises one group, and water-cooling assembly 1 is located at air intake blower fan 2 upper end.Water-cooling assembly 1 comprises heat dissipation cavity 11, water-cooling pipeline 12 and water-cooling water pump 13.Water-cooling pipeline 12 is distributed in heat dissipation cavity 11, and water-cooling water pump 13 is communicated with in the loop of water-cooling pipeline 12, to carry out water-cooling.Heat dissipation cavity 11 medial surface is heat interchange heat sink 15, and heat interchange heat sink 15 can take away the heat in cabinet 3, to strengthen heat radiation.Water-cooling water pump 13 bottom surface is heat sink, carries out heat interchange can be arranged on the accessories such as CPU, video card, mainboard.Air intake blower fan 2 is located at the air inlet of heat dissipation cavity 11, and heat dissipation cavity 11 is also provided with air outlet 14, takes away the heat of water-cooling pipeline 12 with air intake.
Above-mentioned, cabinet side board 4 is provided with the heat radiation mesh 41 corresponding with the air inlet of heat dissipation cavity 11 and air outlet 14.
Above embodiment is merely illustrative and not limiting to the invention, therefore all equivalences done according to the method described in patent claim of the present invention change or modify, and are included in patent claim of the present invention.

Claims (5)

1. a case radiation mechanism, is characterized in that, comprises wind cooling radiating component and water-cooling assembly, and wind cooling radiating component and water-cooling assembly are fixed in cabinet; Wind cooling radiating component comprises fan and air-cooled fixed head, and fan is fixed on air-cooled fixed head, to carry out wind-cooling heat dissipating; Water-cooling assembly comprises water-cooling pump, water-cooling pipe and water-cooling plate; Water-cooling pipe is distributed on water-cooling plate, and water-cooling pipe two-port all connects water-cooling pump, to carry out water-cooling.
2. a kind of case radiation mechanism according to claim 1, is characterized in that: water-cooling assembly comprises two groups, to strengthen heat radiation.
3. a kind of case radiation mechanism according to claim 1, is characterized in that: water-cooling water pump bottom surface is heat sink, carries out heat interchange can be arranged on the accessories such as CPU, video card, mainboard.
4. a kind of case radiation mechanism according to claim 1, is characterized in that: cabinet side board is provided with the heat radiation mesh corresponding with the air inlet of heat dissipation cavity and air outlet.
5. a kind of case radiation mechanism according to claim 1, is characterized in that: heat dissipation cavity medial surface is heat interchange heat sink, and heat interchange heat sink can take away the heat in cabinet, to strengthen heat radiation.
CN201510355431.4A 2015-06-24 2015-06-24 Computer case radiating mechanism Pending CN104914961A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510355431.4A CN104914961A (en) 2015-06-24 2015-06-24 Computer case radiating mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510355431.4A CN104914961A (en) 2015-06-24 2015-06-24 Computer case radiating mechanism

Publications (1)

Publication Number Publication Date
CN104914961A true CN104914961A (en) 2015-09-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510355431.4A Pending CN104914961A (en) 2015-06-24 2015-06-24 Computer case radiating mechanism

Country Status (1)

Country Link
CN (1) CN104914961A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106325429A (en) * 2016-08-16 2017-01-11 陈玮彤 Heat radiation computer case
CN106843408A (en) * 2016-12-14 2017-06-13 成都格瑞思文化传播有限公司 A kind of cooling cabinet of computer
CN108112225A (en) * 2018-01-30 2018-06-01 重庆市长寿区臻波通讯设备有限公司 Low power consuming communication terminal
CN108289402A (en) * 2018-01-30 2018-07-17 重庆市长寿区臻波通讯设备有限公司 The radiator structure of communication terminal

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2849815Y (en) * 2005-07-25 2006-12-20 陈玟翰 Integrated shaped water cooled computer casing
KR100661997B1 (en) * 2006-04-24 2006-12-28 주식회사 쿠덴 Computer case
US20090044929A1 (en) * 2007-08-15 2009-02-19 Xigmatek Co., Ltd Liquid cooling module
CN102819303A (en) * 2011-06-09 2012-12-12 鸿富锦精密工业(深圳)有限公司 Computer case
CN203376682U (en) * 2013-08-07 2014-01-01 加弘科技咨询(上海)有限公司 Case, with liquid cooling mechanism, of mass storage system
CN203812170U (en) * 2014-04-15 2014-09-03 吴江市赛纳电子科技有限公司 Self-cooling type computer case
CN204117058U (en) * 2014-08-07 2015-01-21 吉林工商学院 A kind of computer cabinet
CN204790806U (en) * 2015-06-24 2015-11-18 东莞运宏模具有限公司 Machine case heat dissipation mechanism

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2849815Y (en) * 2005-07-25 2006-12-20 陈玟翰 Integrated shaped water cooled computer casing
KR100661997B1 (en) * 2006-04-24 2006-12-28 주식회사 쿠덴 Computer case
US20090044929A1 (en) * 2007-08-15 2009-02-19 Xigmatek Co., Ltd Liquid cooling module
CN102819303A (en) * 2011-06-09 2012-12-12 鸿富锦精密工业(深圳)有限公司 Computer case
CN203376682U (en) * 2013-08-07 2014-01-01 加弘科技咨询(上海)有限公司 Case, with liquid cooling mechanism, of mass storage system
CN203812170U (en) * 2014-04-15 2014-09-03 吴江市赛纳电子科技有限公司 Self-cooling type computer case
CN204117058U (en) * 2014-08-07 2015-01-21 吉林工商学院 A kind of computer cabinet
CN204790806U (en) * 2015-06-24 2015-11-18 东莞运宏模具有限公司 Machine case heat dissipation mechanism

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106325429A (en) * 2016-08-16 2017-01-11 陈玮彤 Heat radiation computer case
CN106843408A (en) * 2016-12-14 2017-06-13 成都格瑞思文化传播有限公司 A kind of cooling cabinet of computer
CN108112225A (en) * 2018-01-30 2018-06-01 重庆市长寿区臻波通讯设备有限公司 Low power consuming communication terminal
CN108289402A (en) * 2018-01-30 2018-07-17 重庆市长寿区臻波通讯设备有限公司 The radiator structure of communication terminal

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Application publication date: 20150916