CN104889074A - Coated wafer defect detection and sorting set - Google Patents

Coated wafer defect detection and sorting set Download PDF

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Publication number
CN104889074A
CN104889074A CN201510343693.9A CN201510343693A CN104889074A CN 104889074 A CN104889074 A CN 104889074A CN 201510343693 A CN201510343693 A CN 201510343693A CN 104889074 A CN104889074 A CN 104889074A
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CN
China
Prior art keywords
mechanical arm
plated film
silicon chip
conveyer belt
rack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510343693.9A
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Chinese (zh)
Inventor
孙智权
童钢
赵不贿
张千
周奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHENJIANG SYD TECHNOLOGY Co Ltd
Original Assignee
ZHENJIANG SYD TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHENJIANG SYD TECHNOLOGY Co Ltd filed Critical ZHENJIANG SYD TECHNOLOGY Co Ltd
Priority to CN201510343693.9A priority Critical patent/CN104889074A/en
Publication of CN104889074A publication Critical patent/CN104889074A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a coated wafer defect detection and sorting set and belongs to the field of production of solar cells. A PLC (programmable logic controller) unit in a cabinet feeds back an analog signal to a first single-axis mechanical arm and a second single-axis mechanical arm; the first single-axis mechanical arm sorts out discarded unqualified products; the second single-axis mechanical arm sorts out even red chips and feeds them into specified wafer boxes, respectively; qualified products are continuously conveyed to wafer collecting boxes through a qualified wafer conveyer; thus, sorting is finished. The post-coating wafer defect detection and sorting set is suitable for real-time, online, efficient and quick defect detection and sorting of the coated wafers, a production line needs no pausing, and the wafers are subjected to non-contact detection; the coated wafer defect detection and sorting set is compact in structure, easy to maintain, suitable for recovering even red wafers and high in practicality.

Description

Defect grouping system equipment after plated film
Technical field
The invention belongs to solar battery sheet production field, be specifically related to Defect grouping system equipment after plated film.
Background technology
Solar cell is the core carrier that luminous energy is converted to electric energy, and after plated film, silicon chip is the main source of solar cell.The quality of coating quality directly affects the quality of solar battery sheet printing in subsequent technique, decides efficiency and the performance of whole solar energy system.Therefore, defects detection is carried out to silicon chip after plated film and sorting is necessary.But due to the impact of the factors such as graphite boat, external environment, manual operation, after plated film, silicon chip there will be jaundice sheet, evenly red, the different classes of silicon chip of the sheet that turns white, spot sheet, fragment etc.
Be detected and sorting by artificial visually examine substantially in existing technology, not only efficiency is low, and easily generation is undetected, leakage divides, wrong point phenomenon.
Summary of the invention
Goal of the invention: the object of the present invention is to provide Defect grouping system equipment after plated film, can efficient, stable, rapidly defects detection and sorting are carried out to silicon chip after plated film.
Technical scheme: for achieving the above object, the present invention adopts following technical scheme:
Defect grouping system equipment after plated film, comprise conveyer belt, described conveyer belt runs through the below being arranged on blanking mechanical device and camera bellows successively, pass until be connected with qualified silicon chip conveyer with the below of the second single shaft mechanical arm through the first single shaft mechanical arm again, described driving-belt is arranged in metal beam, and metal beam is fixed on rack; The gaily decorated basket for silicon chip after placing plated film is provided with in described blanking mechanical device; Described camera bellows by Bracket setting on rack, top in described camera bellows be provided with the use of industrial camera and camera lens, dome light source is provided with in the below of camera lens, the metal beam of placing conveyer belt immediately below described camera bellows is inlayed white background plate is set, white background plate is provided with photoelectric sensor; Wherein, the industrial computer coordinating camera bellows and rack to use is provided with at the top of described rack; The image processing module carrying out Signal transmissions with photoelectric sensor is provided with in industrial computer; PLC control unit is provided with in described rack.
Described conveyer belt passes from the support bottom camera bellows, and the upper surface of conveyer belt presses close to the bottom of camera bellows.
Described qualified silicon chip conveyer is connected with silicon chip disposable box.
Described conveyer belt is white.
The first described single shaft mechanical arm and the second single shaft mechanical arm are provided with two two-way suckers respectively.
After plated film, Defect grouping system method, comprises the steps:
1) censorship
The scheduling of PLC control unit and cylinder in rack, after plated film, silicon chip flows out successively from the gaily decorated basket blanking mechanical device, be delivered on the white background plate immediately below camera bellows through conveyer belt, after this plated film, silicon chip covers the photoelectric sensor on white background plate, completes censorship;
2) defects detection
Photoelectric sensor is covered rear transmission of signal to the image processing module in industrial computer by silicon chip after the plated film of censorship, image processing module triggers industrial camera and camera lens gathers image and processes, result is converted to dissimilar analog signal simultaneously and passes to PLC control unit in rack, complete defects detection;
3) sorting
Analog signal is fed back to the first single shaft mechanical arm and the second single shaft mechanical arm by the PLC control unit in rack, and discarded defective work is picked out by the first single shaft mechanical arm, the second single shaft mechanical arm by evenly red pick out, respectively send into specify silicon box; Certified products continue stream by qualified silicon chip conveyer and deliver in silicon chip disposable box, complete sorting.
Beneficial effect: compared with prior art, Defect grouping system equipment after plated film of the present invention, can carry out in real time silicon chip after plated film, online, stable, efficiently, defects detection and sorting fast, and production line is without the need to pausing, to silicon chip non-contact detection, lossless; It is compact conformation not only, is easy to maintenance and safeguards, and achieving the evenly recycling of red, reducing production cost, possess good practicality.
Accompanying drawing explanation
Fig. 1 is the front view of Defect grouping system equipment after plated film;
Fig. 2 is the white background plate top view being embedded with photoelectric sensor.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is described further.
After plated film, Defect grouping system method, comprises the steps:
1) censorship
The scheduling of PLC control unit and cylinder in rack, after plated film, silicon chip flows out successively from the gaily decorated basket blanking mechanical device, be delivered on the white background plate immediately below camera bellows through conveyer belt, after this plated film, silicon chip covers the photoelectric sensor on white background plate, completes censorship;
2) defects detection
Photoelectric sensor is covered rear transmission of signal to the image processing module in industrial computer by silicon chip after the plated film of censorship, image processing module triggers industrial camera and camera lens gathers image and processes, result is converted to dissimilar analog signal simultaneously and passes to PLC control unit in rack, complete defects detection;
3) sorting
Analog signal is fed back to the first single shaft mechanical arm and the second single shaft mechanical arm by the PLC control unit in rack, and discarded defective work is picked out by the first single shaft mechanical arm, the second single shaft mechanical arm by evenly red pick out, respectively send into specify silicon box; Certified products continue stream by qualified silicon chip conveyer and deliver in silicon chip disposable box, complete sorting.Wherein, the second single shaft mechanical arm by evenly red pick out, evenly red recycle after make certified products.
As shown in Figure 1 and 2, Defect grouping system equipment after plated film, comprise conveyer belt 15, conveyer belt 15 runs through the below being arranged on blanking mechanical device 1 and camera bellows 3 successively, again through the below of the first single shaft mechanical arm 6 and the second single shaft mechanical arm 7 until be connected with qualified silicon chip conveyer 8, driving-belt 15 is arranged in metal beam, and metal beam is fixed on rack 10; In blanking mechanical device 1, be provided with the gaily decorated basket 2 for silicon chip 14 after placing plated film, after plated film to be checked, silicon chip 14 directly drops on conveyer belt 15 after the gaily decorated basket 2 flows out.
Camera bellows 3 is by Bracket setting on rack 10, and camera bellows 3 and support can be the structures of integral type also can be split type structure, and Split type structure is more conducive to maintenance and the maintenance of camera bellows 3 internal part.Top in camera bellows 3 be provided with the use of industrial camera 11 and camera lens 12, dome light source 13 is provided with in the below of camera lens 12, the metal beam of placing conveyer belt 15 immediately below camera bellows 3 is inlayed white background plate 4 is set, white background plate 4 is provided with photoelectric sensor 16.Conveyer belt 15 passes from the support bottom camera bellows 3, and the upper surface of conveyer belt 15 presses close to the bottom of camera bellows 3.
First single shaft mechanical arm 6 and the second single shaft mechanical arm 7 are provided with two two-way suckers respectively, and sucker is for silicon chip after sorting plated film.Wherein, discarded defective work is picked out by the first single shaft mechanical arm 6, the second single shaft mechanical arm 7 by evenly red pick out, after sorting send into specify silicon box.Qualified silicon chip conveyer 8 is connected with silicon chip disposable box 9, and silicon chip qualified after sorting flows in silicon chip disposable box 9 through conveyer belt 15.
The industrial computer 5 coordinating camera bellows 3 and rack 10 to use is provided with at the top of rack 10.The image processing module carrying out Signal transmissions with photoelectric sensor 16 is provided with in industrial computer 5.PLC control unit is provided with in rack 10.Blanking mechanical device 1 is by air cylinder driven, and cylinder is dispatched by PLC control unit.
Conveyer belt 15 is without any mark, and conveyer belt 15 is white, and good being identified of silicon chip 14 energy after making plated film, for the sorting of silicon chip is prepared.
The course of work: after plated film, silicon chip 14 flows out from the gaily decorated basket 2 in the blanking mechanical device 1 that PLC control unit rack 10 and cylinder are dispatched successively, when it flow to camera bellows 3 inside on white conveyer belt 15, below industrial camera 11, time above white background plate 4, shelter from photoelectric sensor 16, photoelectric sensor 16 by transmission of signal to the image processing module in industrial computer 5, image processing module triggers industrial camera 11 and camera lens 12 gathers image and processes, result is converted to dissimilar analog signal simultaneously and passes to PLC control unit in rack 10, in rack 10 PLC control unit then by signal feedback to screening installation, screening installation controls the first single shaft mechanical arm 6 and the second single shaft mechanical arm 7 carries out corresponding mechanical action, discarded defective work is picked out by mechanical arm 6, by evenly red by mechanical arm 7 pick out subsequent recovery utilize, certified products are then all delivered in silicon chip disposable box 9 through qualified silicon chip conveyer 8 stream.
After plated film of the present invention Defect grouping system equipment can fast, stable, the defect that reliably detects silicon chip after plated film, and automatically by silicon chip category filter, be divided into qualified category, discarded defective category, evenly red class, qualified category is directly transferred in silicon chip disposable box by qualified silicon chip conveyer, and discarded defective category and evenly red class suck appointment silicon box in real time by two two-way suckers of the first single shaft mechanical arm 6 and the second single shaft mechanical arm 7 respectively.

Claims (5)

1. Defect grouping system equipment after plated film, it is characterized in that: comprise conveyer belt (15), described conveyer belt (15) runs through the below being arranged on blanking mechanical device (1) and camera bellows (3) successively, pass until be connected with qualified silicon chip conveyer (8) with the below of the second single shaft mechanical arm (7) through the first single shaft mechanical arm (6) again, described driving-belt (15) is arranged in metal beam, and metal beam is fixed on rack (10); The gaily decorated basket (2) for silicon chip (14) after placing plated film is provided with in described blanking mechanical device (1); Described camera bellows (3) by Bracket setting on rack (10), top in described camera bellows (3) be provided with the use of industrial camera (11) and camera lens (12), dome light source (13) is provided with in the below of camera lens (12), the metal beam of placing conveyer belt (15) immediately below described camera bellows (3) is inlayed white background plate (4) is set, white background plate (4) is provided with photoelectric sensor (16); Wherein, the industrial computer (5) coordinating camera bellows (3) and rack (10) to use is provided with at the top of described rack (10); The image processing module carrying out Signal transmissions with photoelectric sensor (16) is provided with in industrial computer (5); PLC control unit is provided with in described rack (10).
2. Defect grouping system equipment after plated film according to claim 1, is characterized in that: described conveyer belt (15) passes from the support of camera bellows (3) bottom, and the upper surface of conveyer belt (15) presses close to the bottom of camera bellows (3).
3. Defect grouping system equipment after plated film according to claim 1, is characterized in that: described qualified silicon chip conveyer (8) is connected with silicon chip disposable box (9).
4. according to Defect grouping system equipment after the plated film in claim 1 ~ 3 described in any one, it is characterized in that: described conveyer belt (15) is white.
5. according to Defect grouping system equipment after the plated film in claim 1 ~ 3 described in any one, it is characterized in that: on the first described single shaft mechanical arm (6) and the second single shaft mechanical arm (7), be provided with two two-way suckers respectively.
CN201510343693.9A 2015-06-19 2015-06-19 Coated wafer defect detection and sorting set Pending CN104889074A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510343693.9A CN104889074A (en) 2015-06-19 2015-06-19 Coated wafer defect detection and sorting set

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510343693.9A CN104889074A (en) 2015-06-19 2015-06-19 Coated wafer defect detection and sorting set

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CN104889074A true CN104889074A (en) 2015-09-09

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105381961A (en) * 2015-12-23 2016-03-09 胡琳丽 Comprehensive detection device for brake blocks
CN106409711A (en) * 2016-09-12 2017-02-15 佛山市南海区广工大数控装备协同创新研究院 Solar silicon wafer defect detecting system and method
CN107175218A (en) * 2017-05-18 2017-09-19 镇江苏仪德科技有限公司 A kind of solar cell list conveyer belt sorting equipment based on machine vision
CN107345914A (en) * 2016-05-04 2017-11-14 住华科技股份有限公司 Automatic checkout system and apply its automatic testing method
CN108010864A (en) * 2017-12-21 2018-05-08 河北工业大学 A kind of photovoltaic cell defect sorting unit and its method for separating
CN108627517A (en) * 2018-04-16 2018-10-09 九豪精密陶瓷(昆山)有限公司 Ceramic substrate slight crack detection device
CN113484325A (en) * 2021-07-05 2021-10-08 广东奥普特科技股份有限公司 Wafer dispensing defect detection device and wafer dispensing defect detection method
CN113676669A (en) * 2021-08-23 2021-11-19 珠海格力电器股份有限公司 Image acquisition device, method, storage medium, and apparatus

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CN103611690A (en) * 2013-10-29 2014-03-05 上海欧普泰科技创业有限公司 Solar battery slice sorting device

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JPH07206142A (en) * 1994-01-13 1995-08-08 Shinko Electric Co Ltd Sorting device
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105381961A (en) * 2015-12-23 2016-03-09 胡琳丽 Comprehensive detection device for brake blocks
CN107345914A (en) * 2016-05-04 2017-11-14 住华科技股份有限公司 Automatic checkout system and apply its automatic testing method
CN106409711A (en) * 2016-09-12 2017-02-15 佛山市南海区广工大数控装备协同创新研究院 Solar silicon wafer defect detecting system and method
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CN108010864A (en) * 2017-12-21 2018-05-08 河北工业大学 A kind of photovoltaic cell defect sorting unit and its method for separating
CN108627517A (en) * 2018-04-16 2018-10-09 九豪精密陶瓷(昆山)有限公司 Ceramic substrate slight crack detection device
CN113484325A (en) * 2021-07-05 2021-10-08 广东奥普特科技股份有限公司 Wafer dispensing defect detection device and wafer dispensing defect detection method
CN113676669A (en) * 2021-08-23 2021-11-19 珠海格力电器股份有限公司 Image acquisition device, method, storage medium, and apparatus

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Application publication date: 20150909

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