CN104700083B - Fingerprint identification device and its manufacturing method, touch screen, terminal device - Google Patents
Fingerprint identification device and its manufacturing method, touch screen, terminal device Download PDFInfo
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- CN104700083B CN104700083B CN201510100679.6A CN201510100679A CN104700083B CN 104700083 B CN104700083 B CN 104700083B CN 201510100679 A CN201510100679 A CN 201510100679A CN 104700083 B CN104700083 B CN 104700083B
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Abstract
The invention discloses a kind of fingerprint identification device and its manufacturing method, touch screen, terminal device, including panel assembly and fingerprint identification module, panel assembly includes first part and second part, and second part includes: that substrate includes first end face and second end face；Cover board is set to the first end face side of substrate, including cover board outer end face and cover board inner face；Fingerprint identification module includes fingerprint sensor, to identify the fingerprint of user；Circuit substrate, circuit substrate one end connect fingerprint sensor, and the other end extends around substrate edges to second end face.Above-mentioned fingerprint identification device, fingerprint sensor is set to second part, even if first part is damaged, will not influence other elements and work normally.Fingerprint sensor is set between substrate and cover board, identifies the fingerprint of cover board outer end face, and the signal that fingerprint sensor generates is passed by circuit substrate around substrate.It is therefore not necessary to which aperture or fluting on cover board and substrate, have reached intensity requirement.
Description
Technical field
The present invention relates to fingerprint recognition field, more particularly to a kind of fingerprint identification device and its manufacturing method, touch screen,
Terminal device.
Background technique
With the development of science and technology, portable terminal in people's daily life using increasingly extensive, function
It is increasingly powerful.But portable terminal also carries many personal informations while with more and more functions.If
These personal informations are leaked or usurp, and can make troubles to user, cause immeasurable loss, therefore, portable terminal
Security structure is arranged on end to be very important.
For being encrypted using modes such as passwords, user needs to remember preset password, and there is also password leakages
Or the possibility cracked.And the fingerprint of people is formed by nature-nurture collective effect, complexity not only can provide use
In the enough of identification, also there is uniqueness and invariance, therefore fingerprint recognition becomes the encryption side that some electronic equipments use
Formula.
However, fingerprint identification module needs to be installed below cover board for the terminal device for installing fingerprint identification device.Lid
Input interface of the plate as user needs certain intensity, therefore the thickness of cover board is commonly greater than 300 microns.Although cover board is thick
Degree increases the intensity of cover board, but also will affect fingerprint identification module simultaneously to the recognition efficiency of fingerprint.
Existing electronic product generallys use to realize fingerprint identification function and meet the thickness requirement of cover board and substrate
It opens up through hole or opens up the mode of groove, to expose the touch-control sensing region of fingerprint sensor or reduce finger and fingerprint biography
The distance of sensor, so that fingerprint sensor can be carried out accurate fingerprint detection.Alternatively, include cover board and substrate by terminal device,
But also need aperture or fluting on cover board or substrate.
However, since cover board with substrate generally uses the materials such as glass to be made, using the above method, then destroy cover board with
The overall structure of substrate causes cover board or substrate to be easily damaged, reduces production efficiency, increases production cost.
Summary of the invention
Based on this, it is necessary to aiming at the problem that screen panel can not guarantee the recognition efficiency and intensity of fingerprint module simultaneously,
A kind of recognition efficiency increasing fingerprint module and the fingerprint identification device and its manufacturing method, touch that do not influence intensity are provided
Screen, terminal device.
A kind of fingerprint identification device, including panel assembly and fingerprint identification module, the panel assembly include being connected with each other
First part and second part, the first part be structure as a whole, the second part includes:
Substrate, including the first end face and second end face being parallel to each other；
Cover board is set to the first end face side of the substrate, including cover board outer end face and cover board inner face；
The fingerprint identification module includes:
Fingerprint sensor, between the first end face and the cover board inner face, the fingerprint sensor induction refers to
One end of line is close to the first end face, to identify the fingerprint of user；
Circuit substrate, described circuit substrate one end connect the fingerprint sensor, the other end around the substrate edges to
The second end face extends.
Above-mentioned fingerprint identification device, panel assembly are divided into first part and second part.Fingerprint sensor is set to second
Point, therefore the settable thicker thickness of first part will not influence the normal work of other elements even if first part is damaged
Make.Fingerprint sensor is set between substrate and cover board, identifies the fingerprint of cover board outer end face, and the signal that fingerprint sensor is generated
It is passed by circuit substrate around substrate.Therefore the fingerprint identification device is not necessarily to aperture or fluting on cover board and substrate,
The integrality of the structure of cover board and substrate is maintained, and the whole thick of the fingerprint identification device ensure that by the setting of substrate
Degree, has reached intensity requirement.
The fingerprint sensor directly contacts and fits in the cover board inner face in one of the embodiments,.
The fingerprint identification device further includes fingerprint recognition chip in one of the embodiments, the fingerprint recognition core
Piece is set to the second end face, and the circuit substrate bypasses the substrate, is connected to the fingerprint recognition chip.
The circuit substrate is flexible circuit board in one of the embodiments,.
In one of the embodiments, between the substrate and the cover board be equipped with filled layer, with connect the substrate with
The cover board.
The filling layer material is adhesive in one of the embodiments, and the filled layer surrounds the fingerprint sensing
Device, described adhesive material are transparent optical cement or ultraviolet hardening resin.
Ink layer, and the ink layer are set between the cover board and the fingerprint sensor in one of the embodiments,
At least one layer.
It is covered in the ink layer of position of the cover board equipped with the fingerprint sensor in one of the embodiments,
Color it is different from the color of the ink layer being covered in other regions of the cover board.
At least one layer of ink layer is equipped between the cover board and substrate in one of the embodiments,.
The cover plate materials are ultra-thin glass or wear-resistant thermoplastic polyester in one of the embodiments,.
The cover sheet thickness is less than or equal to 100 microns in one of the embodiments, the thickness range of the second part
It is 300~400 microns.
It is a kind of for sensing the touch screen of identification fingerprint, including panel assembly, fingerprint identification module and touch-control sensing layer, institute
Stating panel assembly includes first part interconnected and second part, and the first part is structure as a whole, and described second
Divide and includes:
Substrate, including the first end face and second end face being parallel to each other；
Cover board is set to the first end face side of the cover board, including cover board outer end face and cover board inner face；
The fingerprint identification module includes:
Fingerprint sensor, between the first end face and the cover board inner face, the fingerprint sensor induction refers to
One end of line is close to the first end face, to identify the fingerprint of user；
Circuit substrate, described circuit substrate one end connect the fingerprint sensor, the other end around the substrate edges to
The second end face extends；
Wherein, the first part is set to the second part side, and the first part includes first surface and second
Surface, the first surface are generally aligned in the same plane with the cover board outer end face；
The touch-control sensing layer is at least partially arranged at the second surface side of the first part.
The fingerprint identification device further includes fingerprint recognition chip in one of the embodiments, the fingerprint recognition core
Piece is set to the second end face, and the circuit substrate bypasses the substrate, is connected to the fingerprint recognition chip.
The fingerprint identification device further includes semiconductive thin film in one of the embodiments, and the semiconductive thin film covers
It is placed on the cover board outer end face, to increase the susceptibility of the fingerprint sensor.
The fingerprint sensor directly contacts and fits in the cover board inner face in one of the embodiments,.
The circuit substrate is flexible circuit board in one of the embodiments,.
In one of the embodiments, between the substrate and the cover board be equipped with filled layer, with connect the substrate with
The cover board.
The filling layer material is adhesive in one of the embodiments, and the filled layer surrounds the fingerprint sensing
Device, described adhesive material are transparent optical cement or ultraviolet hardening resin.
Ink layer, the ink layer are equipped between the cover board and the fingerprint sensor in one of the embodiments,
At least one layer.
It is covered in the ink layer of position of the cover board equipped with the fingerprint sensor in one of the embodiments,
Color it is different from the color of the ink layer being covered in other regions of the cover board.
Ink layer is equipped between the cover board and substrate in one of the embodiments, and the ink layer is at least one
Layer.
The cover plate materials are ultra-thin glass or wear-resistant thermoplastic polyester in one of the embodiments,.
The cover sheet thickness is less than or equal to 100 microns in one of the embodiments, the thickness range of the second part
It is 300~400 microns.
A kind of terminal device for fingerprint recognition sensing, the terminal device are divided into visible area and non-visible area domain,
The terminal device includes panel assembly, fingerprint identification module and touch-control sensing layer, and the panel assembly covers the visible area
Domain and the non-visible area domain, including being at least partially disposed at the first part of the visible area and being at least partially disposed at described non-
The second part of visible area, the second part include:
Substrate, including the first end face and second end face being parallel to each other；
Cover board is set to the first end face side of the substrate, including cover board outer end face and cover board inner face；
The fingerprint identification module includes:
Fingerprint sensor, between the first end face and the cover board inner face, the fingerprint sensor induction refers to
One end of line is close to the first end face, to identify the fingerprint of user；
Circuit substrate, described circuit substrate one end connect the fingerprint sensor, and the other end reaches institute around the substrate
State second end face；Wherein, the second part is set to the first part side, and the second part includes first surface and the
Two surfaces, the first surface are generally aligned in the same plane with the cover board outer end face；
The touch-control sensing layer is at least partially arranged at the second surface side of the first part.
The fingerprint identification device further includes fingerprint recognition chip in one of the embodiments, the fingerprint recognition core
Piece is set to the second end face, and the circuit substrate bypasses the substrate, is connected to the fingerprint recognition chip.
The cover board of the second part extends to the first part and with described in one of the embodiments,
A part forms integral structure.
The fingerprint identification device further includes semiconductive thin film in one of the embodiments, and the semiconductive thin film covers
It is placed on the cover board outer end face, to increase the susceptibility of the fingerprint sensor.
The fingerprint sensor directly contacts and fits in the cover board inner face in one of the embodiments,.
The circuit substrate is flexible circuit board in one of the embodiments,.
In one of the embodiments, between the substrate and the cover board be equipped with filled layer, with connect the substrate with
The cover board.
The filling layer material is adhesive in one of the embodiments, and the filled layer surrounds the fingerprint sensing
Device, described adhesive material are transparent optical cement or ultraviolet hardening resin.
At least one layer of ink layer is equipped between the cover board and the fingerprint sensor in one of the embodiments,.
It is covered in the ink layer of position of the cover board equipped with the fingerprint sensor in one of the embodiments,
Color it is different from the color of the ink layer being covered in other regions of the cover board.
At least one layer of ink layer is equipped between the cover board and substrate in one of the embodiments,.
The cover plate materials are ultra-thin glass or wear-resistant thermoplastic polyester in one of the embodiments,.
The cover sheet thickness is less than or equal to 100 microns in one of the embodiments, the thickness range of the second part
It is 300~400 microns.
A kind of manufacturing method of fingerprint identification device, includes the following steps:
The substrate of panel assembly second part is prepared, the substrate includes first end face and second end face；
Fingerprint inductive layer is formed in the first end face of the substrate；
Cover board is formed on the substrate for forming the fingerprint inductive layer；
The filling adhesive between the cover board and the substrate；
The filling adhesive between the cover board and the substrate.
In one of the embodiments, in the first end face printing ink layer of the substrate.
In one of the embodiments, in the cover board inner face printing ink layer.
The fingerprint inductive layer installs fingerprint sensor, the fingerprint sensor connection electricity in one of the embodiments,
Base board, the circuit substrate bypass the substrate edges.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the touch screen of an embodiment；
Fig. 2 is the positive structure schematic of the fingerprint identification device in touch screen shown in FIG. 1；
Fig. 3 is the structure schematic diagram of the fingerprint identification device in touch screen shown in FIG. 1；
Fig. 4 is cross-sectional view of the fingerprint identification device shown in Fig. 2 along A-A ' hatching；
Fig. 5 is equipped with the cuing open along A-A ' hatching when ink layer for the fingerprint identification device shown in Fig. 2 of an embodiment
View；
Fig. 6 is when the fingerprint identification device shown in Fig. 2 of another embodiment is equipped with ink layer along A-A ' hatching
Cross-sectional view；
Fig. 7 is when the fingerprint identification device shown in Fig. 2 of another embodiment is equipped with ink layer along A-A ' hatching
Cross-sectional view；
Fig. 8 is the structural schematic diagram for setting the fingerprint identification device there are two fingerprint identification module；
Fig. 9 is the schematic diagram of the terminal device of an embodiment；
Figure 10 is the manufacturing method flow chart of the fingerprint identification device of an embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
As shown in figs. 1 to 6, one of this preferred embodiment fingerprint identification device 100.In Fig. 1, the fingerprint identification device
100 are used cooperatively with an additional mould group, such as touch-control sensing layer 520.As shown in Fig. 2~4, the fingerprint identification device 100 packet
Include panel assembly (figure is not marked) and fingerprint identification module 146.Panel assembly includes first part 120 interconnected and second
Divide 140.First part 120 is structure as a whole.Second part 140 includes substrate 142, cover board 144 and fingerprint identification module 146.
Fingerprint identification module 146 includes fingerprint sensor 1462 and circuit substrate 1464.
Specifically, substrate 142 includes the first end face 1422 and second end face 1444 being parallel to each other.Cover board 144 is set to
1422 side of first end face of substrate 142, including cover board outer end face 1442 and cover board inner face 1444.
Fingerprint sensor 1462 is between first end face 1422 and cover board inner face 1444.Fingerprint sensor 1462 incudes
One end of fingerprint is close to first end face 1422, to identify the fingerprint of user.1464 one end of circuit substrate connects fingerprint sensor
1462, the other end reaches second end face 1424 around substrate 142.
Above-mentioned fingerprint identification device 100, panel assembly are divided into first part 120 and second part 140.Fingerprint sensor
1462 are set to second part 140, therefore the settable thicker thickness of first part 120, to protect touch screen 500, if first
Part 120 is damaged, and will not influence the normal work of touch-control sensing layer 520.
Fingerprint sensor 1462 is set between substrate 142 and cover board 144, identifies the fingerprint of cover board outer end face 1442, and will
The signal that fingerprint sensor 1462 generates is passed by circuit substrate 1464 around substrate 142.Therefore fingerprint recognition dress
100 are set, without aperture or fluting on cover board 144 and substrate 142, maintains the complete of the structure of cover board 144 and substrate 142
Property, and the setting for passing through substrate 142 ensure that the integral thickness of the fingerprint identification device 100, reach intensity requirement.
Further, fingerprint sensor 1462 directly contacts and fits in cover board inner face 1444.Cover board 144 is ultra-thin
Material, when fingerprint identification device 100 is mounted on electronic equipment, cover board 144 is exposed to outermost layer.In this way, user can pass through lid
Plate 144 carries out touch control operation.Also, cover board outer end face 1442 is located at the side of fingerprint identification device 100 outwardly, cover board inner face
1444 towards the side inside mobile phone, apparatus such as computer, that is, closer to the side of electronic component.
Input interface due to cover board 144 as user can often receive touch and pressing of user etc. and use row
For, and be in contact or even collide with other objects in use.Therefore, cover board 144 need to reach certain thickness and
Guarantee enough intensity.And currently, fingerprint sensor 1462 identifies that the effective distance of fingerprint is less than 200 microns, therefore cover board
144 distance apart from fingerprint sensor 1462 needs to be less than 200 microns, to guarantee that fingerprint sensor 1462 can carry out fingerprint
Identification.
Make the integral thickness of the cover board 144 of electronic equipment and substrate 142 at 500 microns hereinafter, setting electronics in this way
Standby cover board 144 had not only been able to achieve the demand of the rigid of input interface, but also not will increase electronic equipment thickness, and such electronics is set
Fingerprint sensor 1462 in the case of borehole, is not located between substrate 142 and cover board 144 cleverly to solve by standby cover board 144
Technical problem of the invention.
In the present embodiment, the material of cover board 144 is ultra-thin glass or wear-resistant thermoplastic polyester (Polyethylene
Terephthalate, PET) and thickness be less than or equal to 100 microns, 200 microns of distance than usually requiring are smaller, therefore, this
Fingerprint sensor 1462 in embodiment can accurately identify the fingerprint of cover board outer end face 1442, so that fingerprint recognition is with higher
Accuracy influences 144 intensity of cover board without opening up through-hole or slot on cover board 144.Production efficiency is improved, and is reduced
Production cost.
Further, wear-resistant thermoplastic surface of polyester is smooth and glossy, creep resistance, resistance to fatigue resistance, abrasion-resistant and ruler
Very little stability is good, has stronger impact resistance, can extend the service life of the fingerprint identification device 100.
And the material of substrate 142 is glass etc., can be selected according to actual needs.Make the thickness range of second part 140
300~400 microns, in this way, the intensity of cover board 144 can be increased, guarantees that integrally-built thickness reaches intensity requirement, make the fingerprint
Identification device 100 has a longer life expectancy and enough intensity.
Fingerprint identification device 100 further includes fingerprint recognition chip 1466.The fingerprint recognition chip 1466 is set to substrate 142
1424 side of second end face.Circuit substrate 1464 bypasses substrate 142, is connected to the fingerprint recognition chip 1466.In this way, substrate
142 are not necessarily to fluting to accommodate circuit substrate 1464, ensure that the intensity of the fingerprint identification device 100, and reduce manufacturing procedure,
Save production cost.Also, it is convenient to overhaul outside circuit substrate 50 is exposed to.In the present embodiment, circuit substrate 1464 uses
Flexible circuit board.Flexible circuit board is that have height reliability using polyimides or polyester film as one kind made of substrate, compared with
Good flexible printed circuit.Have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good.Such circuit substrate
50 can bypass substrate, connection fingerprint sensor 1462 and fingerprint recognition chip 1466 easily.
Specifically, fingerprint sensor 1462 includes multiple fingerprint identification units being arranged in the matrix form.Fingerprint recognition list
Member includes induction electrode and driving electrodes.There is detector gap between induction electrode and driving electrodes, may make up an electricity substantially
Container.When finger presses cover clamp outer end face 1442, since the dielectric constant of fingerprint ridge is the several times of air, induction electrode
Capacitive coupling between driving electrodes can be according to being fingerprint ridge or fingerprint valley is located at detector gap there are different changes in top.
In this way, fingerprint sensor 1462 can determine whether out to press the fingerprint ridge and fingerprint valley in cover board 144, fingerprint image is obtained
Picture, to carry out fingerprint collecting and identification.It is appreciated that the working principle of fingerprint sensor 1462 is without being limited thereto, it can be according to need
Select different fingerprint sensors 1462.
Filled layer 147 is equipped between substrate 142 and cover board 144, with connecting substrate 142 and cover board 144.Filled layer 147
Material is adhesive, and filled layer 147 surrounds the fingerprint sensor 1462, in connecting substrate 142 and while cover board 144,
Fixed fingerprint sensor 1462.
In the present embodiment, adhesive material be transparent optical cement (Optically Clear Adhesive, OCA) or
Ultraviolet hardening resin (Optically Clear Resin, OCR).
Transparent optical cement is that optics acryl glue is made into no substrate, then in upper and lower bottom, then one leafing type of each fitting
A kind of two-sided fitting adhesive tape of no basis material of film.Clarity is high, and have high light transmittance (full light transmittance > 99%),
High adhesion, high durable, water resistance, high temperature resistant, uvioresistant, for a long time using will not generate yellow, removing and rotten ask
Topic.
Ultraviolet hardening resin can inhibit exterior light shine with light caused by backlight scatter situation, have with similar in glass
Refractive index and light transmittance, and the dilation rate of different substrate materials can be born, height when substrate 142 is bonded with cover board 144 can be kept out
Temperature variation is led to the problem of.
Fingerprint sensor 1462 is set to by above-mentioned fingerprint identification device 100 by setting cover board 144 and substrate 142
Between cover board 144 and substrate 142,144 thickness of cover board can be reduced without slotting on cover board 144 and substrate 142, can make to refer to
The fingerprint of the cover board outer end face 1442 more easy to identify of line identification device 100, guarantees the sensibility and accuracy of fingerprint recognition.Cover board
144 are connect with substrate 142 by filled layer 147, can guarantee the intensity of cover board 144 by substrate 142, extend fingerprint recognition dress
100 service life is set, and is hardly damaged.
As shown in figure 5, the fingerprint identification device 200 of second of embodiment provided by the invention, with the first embodiment
It is roughly the same, including substrate 242, cover board 244 and fingerprint identification module 246.Wherein, substrate 242 includes first to be parallel to each other
End face 2422 and second end face 2424.Cover board 244 is set to 2422 side of first end face of substrate 242, including cover board outer end face
2442 with cover board inner face 2444.
Fingerprint identification module 246 includes fingerprint sensor 2462, circuit substrate 2464 and fingerprint recognition chip 2466.Refer to
Line sensor 2462 is between first end face 2424 and cover board inner face 2444.2464 one end of circuit substrate connects fingerprint sensing
Device 2462, the other end reach second end face 2424 around 242 edge of substrate, connect fingerprint recognition chip 2466.
The difference is that being equipped at least one layer of ink between cover board 244 and fingerprint sensor 2462 in the present embodiment
Layer 248.Ink layer 248 covers on cover board inner face 2444.Specifically, ink layer 248 can be white, black or other colors,
It can be printed in by seal printing technology on cover board 244.
In the present embodiment, ink layer 248 is two layers or more.In this way, the fingerprint sensor of 244 lower section of cover board can be covered
2462, keep the color in the region consistent with other regions, forms integral structure, aesthetic appeal.
In other embodiments, it can according to need and be not provided with ink layer 248, cover component 244 is transparent setting.When
When cover component 244 is made of non-transparent material, ink layer 248 can also be saved.
As shown in fig. 6, the fingerprint identification device 300 of the third embodiment provided by the invention, big with above-described embodiment
Cause identical, including substrate 342, cover board 344 and fingerprint identification module 346.Wherein, substrate 342 includes the first end being parallel to each other
Face 3422 and second end face 3424.Cover board 344 is set to 3422 side of first end face of substrate 342, including cover board outer end face
3442 with cover board inner face 3444.
Fingerprint identification module 346 includes fingerprint sensor 3462, circuit substrate 3464 and fingerprint recognition chip 3466.Refer to
Line sensor 3462 is between first end face 3424 and cover board inner face 3444.3464 one end of circuit substrate connects fingerprint sensing
Device 3462, the other end reach second end face 3424 around 342 edge of substrate, connect fingerprint recognition chip 3466.
The difference is that in the present embodiment, the ink layer 348 in the region in 3462 induction range of fingerprint sensor
It is different from the color of ink layer 348 in other regions.In this way, ink layer 348 can cover the electronic component under cover board 344, beautification
Appearance, meanwhile, make user that can quickly distinguish the positions where fingerprint sensor 3462 according to the difference of color, improve finger
The speed and accuracy of line identification, it is user-friendly.
As shown in fig. 7, the fingerprint identification device 400 of the 4th kind of embodiment provided by the invention, big with above-described embodiment
Cause identical, including substrate 442, cover board 444 and fingerprint identification module 446.Wherein, substrate 442 includes the first end being parallel to each other
Face 4422 and second end face 4424.Cover board 444 is set to 4422 side of first end face of substrate 442, including cover board outer end face
4442 with cover board inner face 4444.
Fingerprint identification module 446 includes fingerprint sensor 4462, circuit substrate 4464 and fingerprint recognition chip 4466.Refer to
Line sensor 4462 is between first end face 4424 and cover board inner face 4444.4464 one end of circuit substrate connects fingerprint sensing
Device 4462, the other end reach second end face 4424 around 442 edge of substrate, connect fingerprint recognition chip 4466.
The difference is that ink layer 448 is set between cover board 444 and substrate 442, in the present embodiment to cover substrate
Electronic component under 442 can show fingerprint sensor in cover board outer end face 4442 when cover board 444 is using transparent material
4462.So that user positions, the position of fingerprint sensor 4462 is accurately identified.
As shown in figure 8, the fifth embodiment of the present invention provides a kind of fingerprint identification device 600.The fingerprint identification device 600
Structure it is roughly the same with fingerprint identification device 100, including panel assembly and fingerprint identification module 146.Panel assembly includes the
A part 120 and second part 140.
The difference is that in the present embodiment, second part 140 is located at the two sides (not shown) of first part 120.
The second part 140 of 140 two sides of first part is respectively provided with fingerprint identification module 146, forms two fingerprint identification regions.In this way,
The regional scope for expanding fingerprint recognition facilitates the operation of user, can be in varied situations using being referred in different zones
Line identification.
As shown in Fig. 1 and Fig. 4, the present invention provides a kind of touch screens 500, including panel assembly, fingerprint identification module 146
And touch-control sensing layer 520.Panel assembly includes first part 120 interconnected and second part 140.
First part 120 is structure as a whole.Second part 140 includes substrate 142 and cover board 144, wherein substrate 142 wraps
Include the first end face 1422 and second end face 1424 being parallel to each other.Cover board 144 is set to the first end face 1,422 1 of substrate 142
Side, including cover board outer end face 1442 and cover board inner face 1444.
Fingerprint identification module 146 includes fingerprint sensor 1462, circuit substrate 1464 and fingerprint recognition chip 1466.Refer to
Line sensor 1462 is between first end face 1422 and cover board inner face 1444.1464 one end of circuit substrate connects fingerprint sensing
Device 1462, the other end reach second end face 1424 around 142 edge of substrate, connect fingerprint recognition chip 1466.
Further, first part 120 is located at 140 side of second part, and first part 120 includes first surface and second
Surface (figure is not marked), first surface is generally aligned in the same plane with cover board outer end face 1442.In this embodiment, first surface is cover board
The extension of outer end face 1442 has beautified appearance so that 500 surface of touch screen is in integrated setting.
Control mould group 520 is at least partially arranged at the second surface side of first part 120.User touches first part
120 first surface, touch-control sensing layer 520 can sense the position that user touches, and realize touch control operation.
Fingerprint identification device 100 further includes semiconductive thin film (not shown), to enhance the penetration capacity of fingerprint, increases fingerprint
Recognition efficiency.The semiconductive thin film is covered in cover board outer end face 1442.Semiconductive thin film is equipped with spaced semiconductor bar
Line.
Specifically, the material of semiconductive thin film includes semi-conducting polymer, indium tin oxide and zinc tin oxide etc., is passed through
Evaporating deposition technique, such as electron beam evaporation, magnetron sputtering mode are prepared.Using semiconductor property, not to semiconductor
When film carries out coupling charging, the electric conductivity of semiconductive thin film tends to insulate.
Position sensor and radio-frequency signal generator (not shown) are additionally provided between substrate 142 and cover board 144.Position sensing
The detectable finger touch signal of device, to start radio-frequency signal generator.
When semiconductor film layer applies radio frequency high tension charging by the radio-frequency signal generator between substrate 142 and cover board 144
When, the electric conductivity of semiconductive thin film tends to conductor, so that small current radio frequency signal can be inputted to finger by coupling charging,
Enhance finger electric field line to the penetration of cover board, increases the recognition efficiency of fingerprint sensor 1462.
The width of the spaced semiconductor striped of photoetching is substantially adapted to the width of finger on semiconductive thin film, thus
The region for fingerprint recognition is provided for finger.
It is appreciated that in other embodiments, semiconductive thin film can also be not provided with, fingerprint sensor 1462 directly passes through
Cover board 144 identifies fingerprint.
Touch screen 500 further includes protective layer (not shown).The protective layer is located at semiconductive thin film far from cover board outer end face
1442 sides.In the preferred embodiment, protective layer is anti-fingerprint film, is formed by spraying technology or thermal evaporation techniques, is one
Kind silicon fluoride long-chain compound, is a kind of substance with compared with low surface tension, therefore have the function of Water-proof and oil-proof, and
With preferable crocking resistance, to protect semiconductive thin film.It is appreciated that the material of protective layer is without being limited thereto, it can be according to reality
Border needs to be arranged, and can also be not provided with protective layer.
Above-mentioned touch screen 500, the touch location of user's finger are the thickness of cover board 144 apart from fingerprint sensor 1462, by
In being closer, therefore it ensure that the accuracy of fingerprint recognition.The substrate 142 of 1462 other side of fingerprint sensor setting ensure that
The thickness of the touch screen 500, and fingerprint sensor logical 1462 bypasses 142 edge of substrate by circuit substrate 1464, connects fingerprint
Identification chip 1466, cover board 144 and substrate 142 all without opening up through-hole or groove, ensure that the integrality of structure, therefore should
Touch screen 500 has certain intensity.
As shown in Fig. 1, Fig. 4 and Fig. 9, a kind of terminal device 700 provided by the invention.Terminal device 700 divides for visible area
Domain 720 and non-visible area domain 740.Terminal device 700 includes panel assembly, fingerprint identification module 146 and touch-control sensing layer 520.
Panel assembly covers visible area 720 and non-visible area domain 740, the first part including being at least partially disposed at visible area 720
120 and it is at least partially disposed at the second part 140 in non-visible area domain 740.
First part 120 is an integral structure.Second part 140 includes substrate 142 and cover board 144.Substrate 142 includes phase
Mutually parallel first end face 1422 and second end face 1424.Cover board 144 is set to 1422 side of first end face of substrate 142, packet
Include cover board outer end face 1442 and cover board inner face 1444.
Fingerprint identification module 146 includes fingerprint sensor 1462, circuit substrate 1464 and fingerprint recognition chip 1466.
Between first end face 1422 and cover board inner face 1444, fingerprint sensor 1462 incudes fingerprint sensor 1462
One end of fingerprint is close to first end face 1422, to identify the fingerprint of user.
Fingerprint sensor 1462 is between first end face 1422 and cover board inner face 1444.1464 one end of circuit substrate
Fingerprint sensor 1462 is connected, the other end reaches second end face 1424 around 142 edge of substrate, connects fingerprint recognition chip
1466。
Further, first part 120 is located at 140 side of second part, and first part 120 includes first surface and second
Surface (figure is not marked), first surface is generally aligned in the same plane with cover board outer end face 1442.In the present embodiment, second part 120
Cover board 144 extends to first part 120 and forms integral structure with first part 120.It is appreciated that the lid of second part 140
Plate 144 can not also be connect with first part.
Touch-control sensing layer 520 is at least partially arranged at the second surface side of first part 120.User touches first part
120 first surface, touch-control sensing layer 520 can sense the position that user touches, and realize touch control operation.
Above-mentioned terminal device 700 can pass through fingerprint sensor 1462 by pressing the fingerprint identification region of cover clamp 144
User fingerprints are identified, with the equipment 700 that opens a terminal, user information are avoided to reveal from terminal device 700.
A kind of manufacturing method of fingerprint identification device as shown in Figure 10, includes the following steps:
S110: preparing the substrate 142 of panel assembly second part 140, and substrate 142 includes first end face 1422 and second
End face 1424；
S120: fingerprint inductive layer is formed in the first end face 11422 of substrate 142；
S130: cover board 144 is formed on the substrate 142 for forming fingerprint inductive layer；
S140: the filling adhesive between cover board 144 and substrate 142
S150: the first part 120 of panel assembly is formed in 144 side of cover board.
Referring to Fig. 5, wherein, it can also be as needed, in 1422 printing ink layer 148 of first end face of substrate 142, or
1444 printing ink layer 148 of cover board inner face.Cover board outer end face 32 forms semiconductive thin film and protective layer.The installation of fingerprint inductive layer
Fingerprint sensor 1462, fingerprint sensor 1462 connect circuit substrate 1464, and circuit substrate 1464 bypasses 142 edge of substrate, even
Connect fingerprint recognition chip 1462.
The manufacturing method of above-mentioned fingerprint identification device 100 is simple, fingerprint inductive layer between substrate 142 and cover board 144,
The thickness of cover board 144 makes fingerprint inductive layer that can expeditiously identify the fingerprint of cover board 144.And without in substrate 142 and cover board 144
Upper fluting ensure that the intensity of fingerprint identification device 100.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (40)
1. a kind of fingerprint identification device, which is characterized in that including panel assembly and fingerprint identification module, the panel assembly includes
First part and second part, the first part are structure as a whole and have opposite a upper surface and lower surface, and described second
Part includes:
Substrate, including the first end face and second end face being parallel to each other, the side of the substrate is connected to the first part, and
The second end face is flushed with the lower surface；
Cover board is set to the first end face side of the substrate, including cover board outer end face and cover board inner face, the cover board
It extends to the first part and forms integral structure with the first part, and the cover board outer end face and the upper surface are neat
It is flat；
The fingerprint identification module includes:
Fingerprint sensor, between the first end face and the cover board inner face；
Circuit substrate, described circuit substrate one end connect the fingerprint sensor, and the other end is around the substrate edges to described
Second end face extends.
2. fingerprint identification device according to claim 1, which is characterized in that the fingerprint sensor is directly contacted and is bonded
In the cover board inner face.
3. fingerprint identification device according to claim 1, which is characterized in that the fingerprint identification device further includes that fingerprint is known
Other chip, the fingerprint recognition chip are set to the second end face, and the circuit substrate bypasses the substrate, is connected to the finger
Line identification chip.
4. fingerprint identification device according to claim 1, which is characterized in that the circuit substrate is flexible circuit board.
5. fingerprint identification device according to claim 1, which is characterized in that be equipped with and fill out between the substrate and the cover board
Layer is filled, to connect the substrate and the cover board.
6. fingerprint identification device according to claim 5, which is characterized in that the filling layer material is adhesive, described
Filled layer surrounds the fingerprint sensor, and described adhesive material is transparent optical cement or ultraviolet hardening resin.
7. fingerprint identification device according to claim 1, which is characterized in that between the cover board and the fingerprint sensor
If ink layer, and the ink layer is at least one layer.
8. fingerprint identification device according to claim 7, which is characterized in that be covered in the cover board and passed equipped with the fingerprint
The color of the ink layer of the position of sensor is different from the color of the ink layer being covered in other regions of the cover board.
9. fingerprint identification device according to claim 1, which is characterized in that be equipped at least one between the cover board and substrate
Layer ink layer.
10. fingerprint identification device according to claim 1, which is characterized in that the cover plate materials be ultra-thin glass or
Wear-resistant thermoplastic polyester.
11. fingerprint identification device according to claim 1, which is characterized in that it is micro- that the cover sheet thickness is less than or equal to 100
Rice, the thickness range of the second part are 300~400 microns.
12. a kind of for sensing the touch screen of identification fingerprint, which is characterized in that including panel assembly, fingerprint identification module and touching
Inductive layer is controlled, the panel assembly includes first part and second part, and the first part is structure as a whole and has opposite
Upper surface and lower surface, the second part includes:
Substrate, including the first end face and second end face being parallel to each other, the side of the substrate is connected to the first part, and
The second end face is flushed with the lower surface；
Cover board is set to the first end face side of the substrate, including cover board outer end face and cover board inner face, the cover board
It extends to the first part and forms integral structure with the first part, and the cover board outer end face and the upper surface are neat
It is flat；
The fingerprint identification module includes:
Fingerprint sensor, between the first end face and the cover board inner face；
Circuit substrate, described circuit substrate one end connect the fingerprint sensor, and the other end is around the substrate edges to described
Second end face extends；
Wherein, the touch-control sensing layer is at least partially arranged at the lower surface side of the first part.
13. touch screen according to claim 12, which is characterized in that the fingerprint identification device further includes fingerprint recognition core
Piece, the fingerprint recognition chip are set to the second end face, and the circuit substrate bypasses the substrate, are connected to the fingerprint and know
Other chip.
14. touch screen according to claim 12, which is characterized in that the fingerprint identification device further includes semiconductor film
Film, the semiconductive thin film are covered in the cover board outer end face, to increase the susceptibility of the fingerprint sensor.
15. touch screen according to claim 12, which is characterized in that the fingerprint sensor directly contacts and fits in institute
State cover board inner face.
16. touch screen according to claim 12, which is characterized in that the circuit substrate is flexible circuit board.
17. touch screen according to claim 12, which is characterized in that be equipped with filling between the substrate and the cover board
Layer, to connect the substrate and the cover board.
18. touch screen according to claim 17, which is characterized in that the filling layer material is adhesive, the filling
Layer surrounds the fingerprint sensor, and described adhesive material is transparent optical cement or ultraviolet hardening resin.
19. touch screen according to claim 12, which is characterized in that be equipped between the cover board and the fingerprint sensor
Ink layer, the ink layer are at least one layer.
20. touch screen according to claim 19, which is characterized in that be covered in the cover board equipped with the fingerprint sensor
Position the ink layer color it is different from the color of the ink layer being covered in other regions of the cover board.
21. touch screen according to claim 12, which is characterized in that ink layer is equipped between the cover board and substrate, and
The ink layer is at least one layer.
22. touch screen according to claim 12, which is characterized in that the cover plate materials are ultra-thin glass or wear-resisting heat
Plasticity polyester.
23. touch screen according to claim 12, which is characterized in that the cover sheet thickness is described less than or equal to 100 microns
The thickness range of second part is 300~400 microns.
24. it is a kind of for fingerprint recognition sensing terminal device, which is characterized in that the terminal device be divided into visible area with it is non-
Visible area, the terminal device include panel assembly, fingerprint identification module and touch-control sensing layer, and the panel assembly includes the
A part and second part, the first part are structure as a whole and have opposite a upper surface and lower surface, and described second
Divide and includes:
Substrate, including the first end face and second end face being parallel to each other, the side of the substrate is connected to the first part, and
The second end face is flushed with the lower surface；
Cover board is set to the first end face side of the substrate, including cover board outer end face and cover board inner face, the cover board
It extends to the first part and forms integral structure with the first part, and the cover board outer end face and the upper surface are neat
It is flat；
The fingerprint identification module includes:
Fingerprint sensor, between the first end face and the cover board inner face；
Circuit substrate, described circuit substrate one end connect the fingerprint sensor, and the other end is around the substrate edges to described
Second end face extends；
Wherein, the touch-control sensing layer is at least partially arranged at the lower surface side of the first part.
25. terminal device according to claim 24, which is characterized in that the fingerprint identification device further includes fingerprint recognition
Chip, the fingerprint recognition chip are set to the second end face, and the circuit substrate bypasses the substrate, is connected to the fingerprint
Identification chip.
26. terminal device according to claim 24, which is characterized in that the cover board of the second part extends to institute
It states first part and forms integral structure with the first part.
27. terminal device according to claim 24, which is characterized in that the fingerprint identification device further includes semiconductor film
Film, the semiconductive thin film are covered in the cover board outer end face, to increase the susceptibility of the fingerprint sensor.
28. terminal device according to claim 24, which is characterized in that the fingerprint sensor is directly contacted and fitted in
The cover board inner face.
29. terminal device according to claim 24, which is characterized in that the circuit substrate is flexible circuit board.
30. terminal device according to claim 24, which is characterized in that be equipped with filling between the substrate and the cover board
Layer, to connect the substrate and the cover board.
31. terminal device according to claim 30, which is characterized in that the filling layer material is adhesive, described to fill out
It fills layer and surrounds the fingerprint sensor, described adhesive material is transparent optical cement or ultraviolet hardening resin.
32. terminal device according to claim 24, which is characterized in that set between the cover board and the fingerprint sensor
There is at least one layer of ink layer.
33. terminal device according to claim 32, which is characterized in that be covered in the cover board equipped with the fingerprint sensing
The color of the ink layer of the position of device is different from the color of the ink layer being covered in other regions of the cover board.
34. terminal device according to claim 24, which is characterized in that be equipped at least one layer between the cover board and substrate
Ink layer.
35. terminal device according to claim 24, which is characterized in that the cover plate materials are ultra-thin glass or wear-resisting
Thermoplastic polyester.
36. terminal device according to claim 24, which is characterized in that the cover sheet thickness is less than or equal to 100 microns, institute
The second part range for stating substrate is 300~400 microns.
37. a kind of manufacturing method of fingerprint identification device, which comprises the steps of:
The substrate of panel assembly second part is prepared, the substrate includes first end face and second end face；
Fingerprint inductive layer is formed in the first end face of the substrate；
Cover board is formed on the substrate for forming the fingerprint inductive layer, the cover board includes cover board outer end face and cover board inner end
Face；
The filling adhesive between the cover board and the substrate；
The first part of the panel assembly is formed in the cover board side to form integral structure, and the first part has phase
Pair upper surface and lower surface；
Wherein the side of the substrate is connected to the first part, and the second end face is flushed with the lower surface, described
Cover board extends to the first part and forms integral structure, and the cover board outer end face and the upper table with the first part
Face flushes.
38. the manufacturing method of the fingerprint identification device according to claim 37, which is characterized in that described in the substrate
First end face printing ink layer.
39. the manufacturing method of the fingerprint identification device according to claim 37, which is characterized in that in the cover board inner face
Printing ink layer.
40. the manufacturing method of the fingerprint identification device according to claim 37, which is characterized in that the fingerprint inductive layer peace
Fingerprint sensor is filled, the fingerprint sensor connects circuit substrate, and the circuit substrate bypasses the substrate edges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510100679.6A CN104700083B (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device and its manufacturing method, touch screen, terminal device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510100679.6A CN104700083B (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device and its manufacturing method, touch screen, terminal device |
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| CN104951766B (en) * | 2015-06-18 | 2017-03-29 | 广东欧珀移动通信有限公司 | Fingerprint identification device, touch screen and mobile terminal |
| CN105005762B (en) * | 2015-06-24 | 2018-10-12 | 广东金龙机电有限公司 | A kind of fingerprint module making method and fingerprint module |
| CN105138958B (en) * | 2015-07-27 | 2020-06-23 | 联想(北京)有限公司 | Electronic equipment, display screen and panel |
| WO2017031634A1 (en) * | 2015-08-21 | 2017-03-02 | 华为技术有限公司 | Terminal device |
| CN106681618B (en) * | 2015-11-05 | 2020-03-17 | 小米科技有限责任公司 | Method and device for awakening fingerprint identification module and mobile terminal |
| WO2018112701A1 (en) * | 2016-12-19 | 2018-06-28 | 深圳市汇顶科技股份有限公司 | Cover plate, biometric apparatus and terminal |
| CN108701212B (en) * | 2017-02-07 | 2021-08-31 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device |
| EP3422249B1 (en) * | 2017-04-20 | 2021-09-08 | Shenzhen Goodix Technology Co., Ltd. | Biometric identification device and manufacturing method for a protective cover plate |
| KR102362598B1 (en) * | 2017-08-08 | 2022-02-14 | 삼성디스플레이 주식회사 | Printed circuit board and display device comprising the same |
| CN109460695A (en) * | 2017-09-06 | 2019-03-12 | 蓝思科技（长沙）有限公司 | Fingerprint sensing device and intelligent terminal |
| CN109508614A (en) * | 2017-09-15 | 2019-03-22 | 南昌欧菲生物识别技术有限公司 | The manufacturing method of optical finger print recognizer component |
| CN109508598A (en) * | 2017-09-15 | 2019-03-22 | 南昌欧菲生物识别技术有限公司 | The manufacturing method and electronic device of optical finger print recognizer component |
| CN109670381A (en) * | 2017-10-13 | 2019-04-23 | 蓝思科技（长沙）有限公司 | Cover board, ultrasonic fingerprint sensor structure and electronic equipment |
| CN109753844B (en) * | 2017-11-02 | 2024-03-08 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
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