CN104659008A - Plastic-encapsulated type IPM (Intelligent Power Module) lead frame structure - Google Patents
Plastic-encapsulated type IPM (Intelligent Power Module) lead frame structure Download PDFInfo
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- CN104659008A CN104659008A CN201310590028.0A CN201310590028A CN104659008A CN 104659008 A CN104659008 A CN 104659008A CN 201310590028 A CN201310590028 A CN 201310590028A CN 104659008 A CN104659008 A CN 104659008A
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- lead frame
- frame structure
- protuberance
- recess
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Abstract
The invention discloses a plastic-encapsulated type IPM (Intelligent Power Module) lead frame structure. One or more hollow holes are formed in the lead frame; through the arrangement of the hollow holes, during module encapsulation through epoxy injection, the edge of the lead frame is in contact with injected epoxy, and in addition, the edges of the hollow holes are also in contact with and fixed to the injected epoxy, so that the contact area of the injected epoxy and the lead frame is increased. Moreover, the structural shape of the edge line of the lead frame is changed by arranging a concave part or a convex part on the edge of the lead frame, so that the length of the edge line of the lead frame is increased obviously, the contact area of the lead frame and the injected epoxy is increased correspondingly, effective fixation of the lead frame is realized, and high reliability and stability of the product are ensured.
Description
Technical field
The invention belongs to plastic sealed IPM and manufacture field, be specifically related to a kind of plastic sealed IPM lead frame structure.
Background technology
Plastic sealed IPM(Intelligent Power Module, Intelligent Power Module), be the Novel control module that igbt chip and drive circuit, control circuit and overcurrent, under-voltage, short circuit, the protective circuit such as overheated are integrated in one.It is a kind of complexity, advanced power model, automatically can realize overcurrent, under-voltage, short circuit and the complicated protection function such as overheated, thus have intelligent characteristic.Simultaneously it has the advantages such as low cost, miniaturization, highly reliable, easy use, and be widely used in the fields such as frequency-conversion domestic electric appliances, inverter, Industry Control, Social benefit and economic benefit is very considerable.
For common plastic sealed IPM, its internal structure is made up of lead frame, chip and injection moulding epoxy three parts, and lead frame is the carrier of whole module, and whole module is encapsulated finally by injection moulding epoxy by surface soldered power chip.
The driving protection of IPM inside is generally by being welded on one group of lead frame by power chip (igbt chip and diode chip for backlight unit); driving chip is welded on another group lead frame, then completes driving chip and the electrical connection between lead frame and power chip by the mode of wire bonding.
At present in plastic sealed IPM module institute's extensive use be the structure of lead frame, and the region of lead frame welding igbt chip and diode chip for backlight unit is rectangular configuration.After injection moulding, the edge of lead frame relies on injection moulding epoxy to be fixed, but the contact area of the lead frame of rectangular configuration and epoxy is less, and likely can cause after injection moulding cannot abundant anchor leg framework; Have a strong impact on the reliability and stability of product.
In view of above problem, be necessary to propose a kind of novel lead frame structure, to increase the contact area of lead frame and injection moulding epoxy, effective anchor leg framework, ensures the reliability and stability of product.
Summary of the invention
In view of this, the invention provides a kind of novel lead frame structure, by shaping hollow hole on the lead frames, to increase the contact area of lead frame and injection moulding epoxy, effective anchor leg framework, ensures the reliability and stability of product.
The plastic sealed IPM lead frame structure of the one that object according to the present invention proposes, described lead frame is welded with igbt chip and diode chip for backlight unit, described lead frame is provided with at least one hollow hole.
Preferably, described hollow hole is rectangle, triangle, trapezoidal or flower shape shape.
Preferably, described hollow hole adopt etching or impact style shaping.
Preferably, the edge of described lead frame is also provided with at least one recess and/or protuberance, and described recess and/or protuberance are all horizontally disposed with, and is positioned at same plane with described lead frame.
Preferably, described recess and described protuberance are castellated shape or wavy shape.
Preferably, described leadframe edges place arranges recess and protuberance simultaneously, and described recess is consistent with the geomery of protuberance, and quantity is identical.
Compared with prior art, the advantage of plastic sealed IPM lead frame structure disclosed by the invention is: lead frame disclosed by the invention is provided with at least one hollow hole, by arranging hollow hole, when carrying out package module by injection moulding epoxy, except the edge of lead frame contacts with injection moulding epoxy, the edge of hollow hole also contacts fixing with injection moulding epoxy, thus adds the contact area of injection moulding epoxy and lead frame.In addition, by arranging recess or protuberance in the edge of lead frame, change the planform of leadframe edges line, the edge line of such lead frame significantly increases, the increase that then lead frame is also corresponding to the contact area of injection moulding epoxy, realize effectively fixing lead frame, ensure the reliability and stability of product.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of plastic sealed IPM.
Fig. 2 is the structural representation of plastic sealed IPM lead frame structure embodiment 1 disclosed by the invention.
Fig. 3 is the structural representation of plastic sealed IPM lead frame structure embodiment 2 disclosed by the invention.
The title of the numeral in figure or the corresponding component representated by letter:
1, igbt chip 2, diode chip for backlight unit 3, lead frame 4, hollow hole 5, recess 6, protuberance
Embodiment
At present in plastic sealed IPM module institute's extensive use be the structure of lead frame, and the region of lead frame welding igbt chip and diode chip for backlight unit is rectangular configuration.After injection moulding, the edge of lead frame relies on injection moulding epoxy to be fixed, but the contact area of the lead frame of rectangular configuration and epoxy is less, and likely can cause after injection moulding cannot abundant anchor leg framework; Have a strong impact on the reliability and stability of product.
The present invention is directed to deficiency of the prior art, provide a kind of novel lead frame structure, by shaping hollow hole on the lead frames, to increase the contact area of lead frame and injection moulding epoxy, effective anchor leg framework, ensures the reliability and stability of product.
To be clearly and completely described technical scheme of the present invention by embodiment below.Obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment 1
Please also refer to Fig. 1, Fig. 2, Fig. 1 is the structural representation of plastic sealed IPM.Fig. 2 is the structural representation of plastic sealed IPM lead frame structure disclosed by the invention.As shown in the figure, a kind of plastic sealed IPM lead frame structure, lead frame 3 is welded with igbt chip 1 and diode chip for backlight unit 2, lead frame 3 is provided with at least one hollow hole 4.By shaping hollow hole, plastic sealed IPM is made to have the lead frame structure of hollow type, when adopting injection moulding epoxy to encapsulate whole module, except leadframe edges, the edge of hollow hole also contacts fixing with injection moulding epoxy, increase the contact area of injection moulding epoxy and lead frame, lead frame better can be fixed in injection moulding epoxy, and then improve the reliability and stability of product.
Wherein hollow hole is can rectangle, triangle, trapezoidal or flower shape shape, and also can be irregular polygon etc., concrete shape needs according to use and determines, and does not limit at this.
Hollow hole mainly adopts the modes such as etching or punching press shaping.Wherein hollow hole can be 1,2,3 or to be evenly arranged on lead frame multiple, concrete quantity needs according to use and determines, can use hollow hole as much as possible while guarantee lead frame structure intensity, the contact area of effective increase injection moulding epoxy and lead frame, concrete quantity does not limit.
Embodiment 2
As shown in Figure 3, all the other are identical with embodiment 1, and difference is, the edge of lead frame 3 is also provided with a recess 5 and a protuberance 6, and recess 5 and protuberance 6 are all horizontally disposed with, and recess 5 and protuberance 6 are all positioned at same plane with lead frame 3.By arranging recess and protuberance, the edge line overall length of rectangular lead frame is increased, like this when by injection moulding epoxy encapsulated modules, effectively can increase the contact area of lead frame and injection moulding epoxy, realize effectively fixing lead frame, ensure the reliability and stability of product.
Wherein, the planform of recess and protuberance is trapezoidal dentation, and recess 5 is consistent with the geomery of protuberance 6, and quantity is identical, ensures that the overall volume of lead frame is constant.
Except employing stepped tooth shape, the planform of recess and protuberance also can be cone gear form or rectangle etc., and concrete structure shape needs according to use and determines, and does not limit at this.
The quantity of recess and protuberance also can be 2,3,4 or multiple, and specifically need according to use and determine, can ensure effective anchor leg framework, concrete quantity does not limit.
In addition, recess 5 and protuberance 6 also can be wavy shape, and quantity is identical, ensure that the overall volume of lead frame is constant.
Recess 5 and the protuberance 6 of wavy shape are uniformly distributed in the periphery of lead frame 3, the curved shape of edge line of lead frame 3.By curve shape is arranged at the edge of lead frame, be a significant increase the girth of lead frame, like this, the increase that injection moulding epoxy is corresponding to the contact area of leadframe edges, realize effectively fixing lead frame, on the basis ensureing lead frame constancy of volume, ensure the reliability and stability of product.
The invention discloses a kind of plastic sealed IPM lead frame structure, this lead frame is provided with at least one hollow hole, by arranging hollow hole, when carrying out package module by injection moulding epoxy, except the edge of lead frame contacts with injection moulding epoxy, the edge of hollow hole also contacts fixing with injection moulding epoxy, thus adds the contact area of injection moulding epoxy and lead frame.In addition, by arranging recess or protuberance in the edge of lead frame, change the planform of leadframe edges line, the edge line of such lead frame significantly increases, the increase that then lead frame is also corresponding to the contact area of injection moulding epoxy, realize effectively fixing lead frame, ensure the reliability and stability of product.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (6)
1. a plastic sealed IPM lead frame structure, described lead frame is welded with igbt chip and diode chip for backlight unit, it is characterized in that, described lead frame is provided with at least one hollow hole.
2. plastic sealed IPM lead frame structure as claimed in claim 1, is characterized in that, described hollow hole is rectangle, triangle, trapezoidal or flower shape shape.
3. plastic sealed IPM lead frame structure as claimed in claim 1, is characterized in that, described hollow hole adopt etching or impact style shaping.
4. plastic sealed IPM lead frame structure as claimed in claim 1, it is characterized in that, the edge of described lead frame is also provided with at least one recess and/or protuberance, and described recess and/or protuberance are all horizontally disposed with, and is positioned at same plane with described lead frame.
5. plastic sealed IPM lead frame structure as claimed in claim 4, is characterized in that, described recess and described protuberance are castellated shape or wavy shape.
6. plastic sealed IPM lead frame structure as claimed in claim 4, is characterized in that, described leadframe edges place arranges recess and protuberance simultaneously, and described recess is consistent with the geomery of protuberance, and quantity is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310590028.0A CN104659008A (en) | 2013-11-19 | 2013-11-19 | Plastic-encapsulated type IPM (Intelligent Power Module) lead frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310590028.0A CN104659008A (en) | 2013-11-19 | 2013-11-19 | Plastic-encapsulated type IPM (Intelligent Power Module) lead frame structure |
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| Publication Number | Publication Date |
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| CN104659008A true CN104659008A (en) | 2015-05-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310590028.0A Pending CN104659008A (en) | 2013-11-19 | 2013-11-19 | Plastic-encapsulated type IPM (Intelligent Power Module) lead frame structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106486451A (en) * | 2015-08-28 | 2017-03-08 | 苏州普福斯信息科技有限公司 | The anti-hierarchy of TSOP package leadframe |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104359A (en) * | 1992-09-17 | 1994-04-15 | Apic Yamada Kk | Layout of resin molded type lead frame |
| KR20010076003A (en) * | 2000-01-24 | 2001-08-11 | 윤종용 | Power package |
| US20040256703A1 (en) * | 2001-11-19 | 2004-12-23 | Chino-Excel Technology Corp. | Wireless bonded semiconductor device and method for packaging the same |
| CN2904299Y (en) * | 2006-04-15 | 2007-05-23 | 宁波康强电子股份有限公司 | Improved high power triode lead wire frame |
| JP2007165445A (en) * | 2005-12-12 | 2007-06-28 | Matsushita Electric Ind Co Ltd | Power amplifier module |
| CN2929961Y (en) * | 2006-04-15 | 2007-08-01 | 宁波康强电子股份有限公司 | Improved triode lead frame |
| US20130221507A1 (en) * | 2012-02-29 | 2013-08-29 | Zhiqiang Niu | Aluminum alloy lead-frame and its use in fabrication of power semiconductor package |
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2013
- 2013-11-19 CN CN201310590028.0A patent/CN104659008A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104359A (en) * | 1992-09-17 | 1994-04-15 | Apic Yamada Kk | Layout of resin molded type lead frame |
| KR20010076003A (en) * | 2000-01-24 | 2001-08-11 | 윤종용 | Power package |
| US20040256703A1 (en) * | 2001-11-19 | 2004-12-23 | Chino-Excel Technology Corp. | Wireless bonded semiconductor device and method for packaging the same |
| JP2007165445A (en) * | 2005-12-12 | 2007-06-28 | Matsushita Electric Ind Co Ltd | Power amplifier module |
| CN2904299Y (en) * | 2006-04-15 | 2007-05-23 | 宁波康强电子股份有限公司 | Improved high power triode lead wire frame |
| CN2929961Y (en) * | 2006-04-15 | 2007-08-01 | 宁波康强电子股份有限公司 | Improved triode lead frame |
| US20130221507A1 (en) * | 2012-02-29 | 2013-08-29 | Zhiqiang Niu | Aluminum alloy lead-frame and its use in fabrication of power semiconductor package |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106486451A (en) * | 2015-08-28 | 2017-03-08 | 苏州普福斯信息科技有限公司 | The anti-hierarchy of TSOP package leadframe |
| CN106486451B (en) * | 2015-08-28 | 2019-04-16 | 苏州普福斯信息科技有限公司 | The anti-layered structure of TSOP package leadframe |
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Application publication date: 20150527 |
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