CN104615220A - Cooling system and server system - Google Patents
Cooling system and server system Download PDFInfo
- Publication number
- CN104615220A CN104615220A CN201410830400.5A CN201410830400A CN104615220A CN 104615220 A CN104615220 A CN 104615220A CN 201410830400 A CN201410830400 A CN 201410830400A CN 104615220 A CN104615220 A CN 104615220A
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- CN
- China
- Prior art keywords
- server
- cooling
- cooling system
- refrigerant
- cold junction
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a cooling system which comprises a heat pipe (10). A refrigerant is contained in the heat pipe (10). The cooling system is constructed by a cooling circulation loop and one or more fins (20). A heating end (11), a liquid outlet pipe (13), a cold end (12) and a liquid inlet pipe (14) are communicated end to end in sequence to form the cooling circulation loop. The fins (20) perform heat exchange with the cold end (12). The invention further provides a server system. The cooling system and the server system aim at providing the cooling system with a better cooling effect and the server system with the cooling system.
Description
Technical field
The present invention relates to the server system of a kind of cooling system and this cooling system of employing.
Background technology
The computing machine used at present mostly relies on cold air to lower the temperature to machine, but the heart in the data, be only not enough to by air-cooled the cooling requirements meeting high heat flux server.The mode that traditional air-cooled pattern all adopts indirect contact to cool is carried out, complicated in diabatic process, there is thermal contact resistance and convection heat transfer thermal resistance, thermal resistance summation is large, heat exchange efficiency is lower, and between heat transfer process high/low temperature thermal source, the temperature difference is comparatively large, needs lower outdoor low-temperature heat source to guide heat transfer process to carry out.
Heat pipe is made up of shell, liquid-sucking core and end cap.Inside heat pipe is pumped into negative pressure state, is filled with suitable liquid, and this boiling point of liquid is low, easily volatilizees.Tube wall has liquid-sucking core, and it is made up of capillary-porous material.Heat pipe one end is evaporation ends, one end is condensation end in addition, when heat pipe one end is heated, liquid in kapillary evaporates rapidly, and steam flows to other one end under small pressure differential, and releases heat, regelation becomes liquid, liquid flows back to evaporation ends along porosint by the effect of capillary force again, and so circulation is more than, and heat reaches other one end by heat pipe one end.This circulation is carried out fast, and heat can be come by conduction continuously.
When heat pipe being applied to server cooling field, how the cold junction of heat pipe cools the subject matter just having become and needed to solve.As everyone knows, there is the water of impurity to be a kind of good conductor, circuit board short circuit can be caused.If adopt water to cool for the cold junction of heat pipe, although current water-filled radiator producer ensures the complete Full-sealed no-leakage of its product, this is a kind of hidden danger all the time, and most of server producer is hung back to this technology.
Summary of the invention
For Problems existing in correlation technique, the object of the present invention is to provide a kind of cooling system of stronger cooling effect and there is the server system of this cooling system of having.
For achieving the above object, on the one hand, the invention provides a kind of cooling system, comprising: inside accommodates the heat pipe of refrigerant, is configured to: be communicated with to form cooling circuit by hot junction, drain pipe, cold junction and feed tube successively head and the tail; And with at least one fin of cold junction heat interchange.
According to the present invention, at least one fin each other equidistantly and arrange at intervals.
According to the present invention, drain pipe and the feed tube pipe fitting all for being made up of flexible material.
According to the present invention, refrigerant is boiling point at the low boiling fluoride of 30-60 DEG C.
On the other hand, present invention also offers a kind of server system, this server system is provided with above-mentioned arbitrary cooling system.
According to the present invention, server system comprises: server and the CPU arranged in the server, wherein, server has top surface positioned opposite to each other and basal surface, and the hot junction of cooling system is arranged on top surface or basal surface accordingly with CPU position.
According to the present invention, server has front end face between top surface and basal surface and positioned opposite to each other and rear end face, and by the sidewall that front end face is connected with rear end face, wherein, cold junction is arranged on rear end face or sidewall.
According to the present invention, it is outside or one-body molded with server that fin is mounted to server in the mode corresponding with cold junction position.
Advantageous Effects of the present invention is:
For cooling system of the present invention, be communicated with by hot junction, drain pipe, cold junction and feed tube successively head and the tail thus be configured to cooling circuit, and cold junction and fin heat interchange.Thus, in use, inside heat pipe is filled with refrigerant, and the server system heat that operationally CPU produces makes refrigerant seethe with excitement, and becomes refrigerant steam, and refrigerant steam and hot fluid form the drain pipe that gas-liquid mixed flows through evaporation cavity and flow out, and enter the cold junction of heat pipe.Cold junction and fin heat interchange also carry out nature cooling under it is assisted, and without the need to carrying out cooling twice to cold junction.After hot fluid and the abundant heat exchange of fin are lowered the temperature, refrigerant vapour condenses, and hot fluid is lowered the temperature, thus again becomes cold fluid.Cold fluid returns evaporation cavity, completes a refrigeration cycle.Therefore compared with air-cooled cooling technology of the prior art, the present invention has stronger cooling effect, and lowers the temperature to refrigerant steam without the need to heat dissipation equipment, but alternatively adopts nature cooling, and therefore cost is lower, convenient and swift.
In addition, refrigerant is low boiling fluoride, does not have water in system, so there is no the risk that water leaks.And refrigerant is insulation, even if leakage does not also injure the components and parts on server and mainboard and affects.
In addition, feed tube and drain pipe are flexible pipe, can arbitrarily flexural deformation, bear certain acting force, simultaneously more narrow space in adaptation server.
For server system of the present invention, because it is provided with above-mentioned cooling system, therefore this server system possesses above all advantages.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of refrigerating of cooling system of the present invention;
Fig. 2 is the structural representation of cooling system of the present invention and a server system embodiment;
Fig. 3 is the structural representation of cooling system of the present invention and another embodiment of server system.
Embodiment
Referring now to accompanying drawing, present invention is described.As shown in Figure 1 to Figure 3, the invention provides a kind of cooling system, this cooling system comprises heat pipe 10 and fin 20, and particularly, heat pipe 10 inside accommodates refrigerant and is configured to: be communicated with by hot junction 11, drain pipe 13, cold junction 12 and feed tube 14 successively head and the tail to form cooling circuit.Further, at least one fin 20 and cold junction 12 heat interchange.
As shown in Figure 2, in a preferred embodiment, at least one above-mentioned fin 20 can each other equidistantly and arrange at intervals.
In addition, in a preferred embodiment, drain pipe 13 and feed tube 14 can pipe fittings all for being made up of flexible material.Certainly should be appreciated that the flexible degree of drain pipe 13 and feed tube 14 can be determined according to concrete service condition, the present invention is not limited to this.
In addition, in a preferred embodiment, being contained in the refrigerant in heat pipe 10, that is, the refrigerant flowed in the cooling circuit formed by hot junction 11, drain pipe 13, cold junction 12 and feed tube 14, can be boiling point at the low boiling fluoride of 30-70 DEG C.This fluoride is nontoxic, pollution-free, not corroding metal, and has very high insulativity.Such as, this refrigerant can be CF
3cHCl
2, C
4f
9oCH
3, C
3h
7br, C
3cl
2hF
5, C
2cl
2h
3f, C
2cl
3f
3in any one or several.But also can adopt other forms of refrigerant, this can determine according to concrete use situation, and the present invention is not limited thereto.
In addition, for server system of the present invention, it can be provided with cooling system as above.Further, this server system CPU that can comprise server 30 and be arranged in server 30.
Particularly, server 30 has top surface positioned opposite to each other and basal surface, and the hot junction 11 of cooling system can be arranged on top surface or basal surface accordingly with CPU position.
In addition, in a preferred embodiment, server 30 can have front end face between top surface and basal surface and positioned opposite to each other and rear end face, and by the sidewall that front end face is connected with rear end face, cold junction 12 can be arranged on rear end face or sidewall.
In addition, it is outside or one-body molded with server 30 that the mode that fin 20 can be corresponding with cold junction 12 position is mounted to server 30.Certainly be to be understood that, the form that arranges between fin 20 and server 30 can be determined according to concrete service condition, namely, no matter fin 20 is mounted to server 30, or it is one-body molded with server 30, only fin 20 need be made can to promote naturally cooling of the cold junction 12 of cooling system, the present invention is not limited to this.
For cooling system of the present invention, be communicated with by hot junction 11, drain pipe 13, cold junction 12 and feed tube 14 successively head and the tail thus be configured to cooling circuit, and cold junction 12 and fin 20 heat interchange.Thus, in use, heat pipe 10 inside is filled with refrigerant, the server system heat that operationally CPU produces makes refrigerant seethe with excitement, become refrigerant steam, refrigerant steam and hot fluid form the drain pipe 13 that gas-liquid mixed flows through evaporation cavity and flow out, and enter the cold junction 12 of heat pipe 10.Cold junction 12 is with fin 20 heat interchange and carry out nature cooling under it is assisted, and without the need to carrying out cooling twice to cold junction.After hot fluid and the abundant heat exchange of fin 20 are lowered the temperature, refrigerant vapour condenses, and hot fluid is lowered the temperature, thus again becomes cold fluid.Cold fluid returns evaporation cavity, completes a refrigeration cycle.Therefore compared with air-cooled cooling technology of the prior art, the present invention has stronger cooling effect, and lowers the temperature to refrigerant steam without the need to heat dissipation equipment, but alternatively adopts nature cooling, and therefore cost is lower, convenient and swift.It is emphasized that after eliminating fan, super-silent effect can be reached, be adapted at requiring that higher occasion uses to noise level.
In addition, refrigerant is low boiling fluoride, does not have water in system, so there is no the risk that water leaks.And refrigerant is insulation, even if leakage does not also injure the components and parts on server and mainboard and affects.
For server system of the present invention, because it is provided with above-mentioned cooling system, therefore this server system possesses above all advantages.
Now by reference to the accompanying drawings specific works process of the present invention is described.In cooling system of the present invention, the refrigerant adopted is a kind of low boiling refrigerant medium (as mentioned above), it can undergo phase transition at a lower temperature, the heat that the heat utilizing its gasification latent heat to take away relies on sensible heat and temperature change to take away far above liquid coolant.
Directly over CPU on server 30 mainboard (namely, the top surface of server 30) be the hot junction 11 of heat pipe 10, inside is filled with refrigerant, server 30 heat that operationally CPU produces makes refrigerant seethe with excitement, become refrigerant steam, refrigerant steam and hot fluid form the drain pipe 13 that gas-liquid mixed flows through heat pipe 10 and flow out, and enter the cold junction 12 of heat pipe 10.Cold junction 12 is close together with the back side (that is, the rear end face of server 30) of server 30, and there is fin 20 in this face of server 30, to increase heat interchanging area, and cooling refrigerant steam.Refrigerant steam and hot fluid are after cold junction 12 heat exchange cooling, and refrigerant steam condensation, hot fluid is lowered the temperature, thus again becomes cold fluid.Cold fluid returns evaporation cavity, completes a refrigeration cycle.
In the present invention, heat pipe 10 is a kind of heat transfer elements efficiently, utilizes the phase transformation of refrigerant to carry out heat exchange, can carry out the refrigeration of efficiently and accurately to CPU, reduce the temperature of CPU in the evaporation cavity in hot junction 11.The cold junction 12 of heat pipe 10 directly contacts in use with the side that fin 20 is housed, and the refrigerant steam in the cold junction 12 of heat pipe 10 and hot fluid can be cooled fully naturally.
In addition, the feed tube 14 of heat pipe 10 and drain pipe 13 adopt has flexibility can the bending tubing of appropriateness, can bear installation, acting force when using and transport, to protect hot junction 11 and the CPU of heat pipe 10.Simultaneously flexible pipe more narrow space in adaptation server, thus components and parts numerous on server master board can be avoided.
In addition, shown in Fig. 2, in one embodiment, server 30 contact with the cold junction 12 of heat pipe 10, the side with fin 20 is rear sides (that is, rear end face) of server 30; Again as shown in Figure 3, in another embodiment, the cold junction 12 of heat pipe 10 and fin 20 also can be positioned over the side (that is, the sidewall of server 30) of server 30, and to increase condensing heat-exchange area, its cooling principle is identical with Fig. 2.
In sum, in the present invention, heat pipe 10 couples of CPU are used to carry out efficiently and accurately refrigeration.Install fin (that is, fin 20) additional in the outside wall surface of server 30, thus realize cold junction 12 naturally cooling and without the need to carrying out cooling twice.There are flexible feed tube 14 and drain pipe 13 can bear transport to install and power in use procedure and deformation, thus effectively protect the CPU on mainboard.In addition, flexible pipe, mainly in order to be adapted to the small space of server internal, because the iron pipe of hard cannot bend, mainboard is difficult to lay.And the present invention is more energy-conservation, noiselessness, structure is simple, and volume is little.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. a cooling system, is characterized in that, comprising:
Inside accommodates the heat pipe (10) of refrigerant, is configured to: be communicated with by hot junction (11), drain pipe (13), cold junction (12) and feed tube (14) successively head and the tail to form cooling circuit; And
With at least one fin (20) of described cold junction (12) heat interchange.
2. cooling system according to claim 1, is characterized in that,
Described at least one fin (20) each other equidistantly and arrange at intervals.
3. cooling system according to claim 1, is characterized in that,
Described drain pipe (13) and described feed tube (14) pipe fitting all for being made up of flexible material.
4. cooling system according to claim 1, is characterized in that,
Described refrigerant is boiling point at the low boiling fluoride of 30-60 DEG C.
5. a server system, is characterized in that, described server system is provided with the cooling system according to any one of claim 1-4.
6. server system according to claim 5, is characterized in that, comprising:
Server (30) and the CPU be arranged in described server (30),
Wherein, described server (30) has top surface positioned opposite to each other and basal surface, and the described hot junction (11) of described cooling system is arranged on described top surface or described basal surface accordingly with described CPU position.
7. server system according to claim 6, is characterized in that,
Described server (30) to have between described top surface and described basal surface and front end face positioned opposite to each other and rear end face, and by the sidewall that described front end face is connected with described rear end face,
Wherein, described cold junction (12) is arranged on described rear end face or described sidewall.
8. server system according to claim 7, is characterized in that,
It is outside or one-body molded with described server (30) that described fin (20) is mounted to described server (30) in the mode corresponding with described cold junction (12) position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410830400.5A CN104615220A (en) | 2014-12-25 | 2014-12-25 | Cooling system and server system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410830400.5A CN104615220A (en) | 2014-12-25 | 2014-12-25 | Cooling system and server system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104615220A true CN104615220A (en) | 2015-05-13 |
Family
ID=53149714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410830400.5A Pending CN104615220A (en) | 2014-12-25 | 2014-12-25 | Cooling system and server system |
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| CN (1) | CN104615220A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111414025A (en) * | 2020-04-13 | 2020-07-14 | 江苏集萃智能光电系统研究所有限公司 | Visual sensor autonomous temperature control device and method for outdoor complex environment |
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|---|---|---|---|---|
| US20100128431A1 (en) * | 2007-03-07 | 2010-05-27 | Andre Sloth Eriksen | Hybrid liquid-air cooled graphics display adapter |
| CN103168509A (en) * | 2010-08-26 | 2013-06-19 | 阿塞泰克公司 | Liquid cooling system for a server |
| CN203163333U (en) * | 2013-02-20 | 2013-08-28 | 谢正茂 | Liquid gas cooling coolant circulating device |
| CN103369934A (en) * | 2013-07-17 | 2013-10-23 | 曙光信息产业(北京)有限公司 | Cooling device and server with cooling device |
| CN203561935U (en) * | 2013-09-26 | 2014-04-23 | 西安天任软件科技有限责任公司 | Water-cooled radiator utilizing case housing for heat radiation |
-
2014
- 2014-12-25 CN CN201410830400.5A patent/CN104615220A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100128431A1 (en) * | 2007-03-07 | 2010-05-27 | Andre Sloth Eriksen | Hybrid liquid-air cooled graphics display adapter |
| CN103168509A (en) * | 2010-08-26 | 2013-06-19 | 阿塞泰克公司 | Liquid cooling system for a server |
| CN203163333U (en) * | 2013-02-20 | 2013-08-28 | 谢正茂 | Liquid gas cooling coolant circulating device |
| CN103369934A (en) * | 2013-07-17 | 2013-10-23 | 曙光信息产业(北京)有限公司 | Cooling device and server with cooling device |
| CN203561935U (en) * | 2013-09-26 | 2014-04-23 | 西安天任软件科技有限责任公司 | Water-cooled radiator utilizing case housing for heat radiation |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111414025A (en) * | 2020-04-13 | 2020-07-14 | 江苏集萃智能光电系统研究所有限公司 | Visual sensor autonomous temperature control device and method for outdoor complex environment |
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Effective date of registration: 20160323 Address after: 300384 Tianjin city Xiqing District Huayuan Industrial Zone (outer ring) Haitai Huake Street No. 15 1-3 Applicant after: Sugon Information Industry Co., Ltd. Address before: 100193 Beijing, Haidian District, northeast Wang West Road, building 8, No. 36 Applicant before: Dawning Information Industry (Beijing) Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150513 |
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| RJ01 | Rejection of invention patent application after publication |