CN104582438A - Cooling structure - Google Patents

Cooling structure Download PDF

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Publication number
CN104582438A
CN104582438A CN201410817430.2A CN201410817430A CN104582438A CN 104582438 A CN104582438 A CN 104582438A CN 201410817430 A CN201410817430 A CN 201410817430A CN 104582438 A CN104582438 A CN 104582438A
Authority
CN
China
Prior art keywords
fin
heat shield
radiator structure
width
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410817430.2A
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Chinese (zh)
Inventor
林奇成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qisda Optronics Suzhou Co Ltd
Qisda Corp
Original Assignee
Qisda Optronics Suzhou Co Ltd
Qisda Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qisda Optronics Suzhou Co Ltd, Qisda Corp filed Critical Qisda Optronics Suzhou Co Ltd
Priority to CN201410817430.2A priority Critical patent/CN104582438A/en
Publication of CN104582438A publication Critical patent/CN104582438A/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides a cooling structure which comprises a machine body and cooing fins, wherein the cooling fins are arranged on the machine body and comprise a plurality of fins and a plurality of heat insulation sheets, the plurality of fins are arranged at intervals in a strip shape, and side edges of the plurality of fins bulge out of the machine body; and the plurality of heat insulation sheets cover the side edges of the plurality of fins.

Description

Radiator structure
Technical field
The invention relates to a kind of radiator structure, and relate to a kind of radiator structure avoiding thermo-contact especially.
Background technology
Electronic installation can produce along with heat usually when operating, and this heat is dissipated into outside body with thermal convection or thermal-radiating mode after absorbing via fin (heat sink).But; when fin is arranged within body; except thermal radiation effect is not good; also must install fan additional in body; in the mode of forced convection by thermal transpiration to outside body; therefore often can produce the noise of disturbing people because of fan running, and the dust on fin is also not easy to clear up and affects the radiating efficiency of fin.
Summary of the invention
The object of the present invention is to provide a kind of radiator structure, to solve the problem.
On the one hand, the invention provides a kind of radiator structure, comprising: body and fin; Fin, is arranged on this body, and this fin comprises multiple fin and multiple heat shield, and the plurality of fin is strip and is spaced, and the side of the plurality of fin protrudes from outside this body; Wherein the plurality of heat shield covers the side of the plurality of fin.
Preferably, this body has peristome, and the plurality of fin separation is arranged in this peristome.
Preferably, this fin covers around this body.
Preferably, this fin and this body form the shell structure with the plurality of fin.
Preferably, the side wall surface of the plurality of fin is rectangle plane, and the plurality of heat shield does not cover the side wall surface of the plurality of fin.
Preferably, the plurality of heat shield is attached to the side of the plurality of fin with adhesive plaster.
Preferably, the plurality of heat shield is provided with the holding section mutually engaged with the side of the plurality of fin.
Preferably, this holding section has snap fit, and the side of the plurality of fin is respectively equipped with the draw-in groove holding this snap fit; Or this holding section is plug-in unit, and the side of the plurality of fin is respectively equipped with the slot holding this plug-in unit.
Preferably, the plurality of heat shield correspondence covers at least two sides of the plurality of fin.
Preferably, the width of the plurality of heat shield is identical in fact with the width of the side of the plurality of fin.
Preferably, the material of the plurality of heat shield comprises silica gel.
Preferably, the interval width between the plurality of fin is less than into the width of finger, and is greater than the width of the side of the plurality of fin.
Preferably, this body is display casing or computer chassis.
Compared with prior art, the radiator structure disclosed by the present invention, utilizes the heat on heat shield obstruct fin, even if therefore fin is revealed in outside body, does not also have hot danger.In addition, fin is revealed in outside body except having better radiating efficiency, also can save the cost installing fan additional or install screen pack additional, and the dust on fin is also easier to cleaning, more meets heat sinking benefit.
Accompanying drawing explanation
Fig. 1 illustrates the schematic diagram of the radiator structure according to one embodiment of the invention;
Fig. 2 A and Fig. 2 B illustrates the configuration relation figure between heat shield and fin respectively;
Fig. 3 A to Fig. 3 C illustrates the configuration relation figure between heat shield and fin respectively;
Fig. 4 illustrates the schematic diagram of the radiator structure according to another embodiment of the present invention.
Embodiment
In an example of the present embodiment, a kind of radiator structure is proposed, in the housing of display or computer, to dispel the heat to the electronic installation in display or computer.Generally speaking, the temperatures as high of fin 60 to 70 degrees Celsius, has hot danger.Scald one's hand in order to avoid thermo-contact, the radiator structure of the present embodiment is arranged on the side of fin by avoiding the heat shield of thermo-contact, reduces the chance touching fin.
Be described in detail to proposition embodiment below, embodiment only in order to illustrate as example, and is not used to the scope of limit the present invention for protection.
Please refer to Fig. 1, it illustrates the schematic diagram of the radiator structure 100 according to one embodiment of the invention.Radiator structure 100 comprises body 110 and fin 120.Fin 120 is arranged on body 110, and its material is such as the metal such as copper, aluminium.For example, body 110 can comprise drain pan 111 and cover plate 112.Cover plate 112 is covered on drain pan 111, and fin 120 is arranged in the accommodation space between drain pan 111 and cover plate 112.The heat that fin 120 produces in order to absorb electronic installation in accommodation space (such as processor), and via thermal convection or thermal-radiating mode by outside thermal transpiration to body 110.
In one embodiment, body 110 has peristome 113, and this peristome 113 can be positioned at upper surface or the side surface of body 110.Size, the position of the size of fin 120, position and peristome 113 are corresponding or identical haply, outside can being contained in peristome 113 to make fin 120 or being revealed in via peristome 113.Please refer to Fig. 1, it is the fin 121 of strip and multiple heat shield 130 in strip that fin 120 comprises multiple.Fin 121 is spaced in peristome 113, and the interval width D between fin 121 can adjust according to the demand of reality.After fin 120 absorbs heat, can via the fin 121 in peristome 113 and extraneous natural convection air, thus need with fan forced convection.In addition, be arranged in body relative to traditional method by fin, fin 121 is revealed in the peristome 113 of body 110 by the radiator structure 100 of the present embodiment, via thermal-radiating mode by outside thermal radiation to body 110, and then can improve radiating efficiency.
In addition, contact in order to avoid user the fin 121 that exposes and feel hot or scald, heat shield 130 is arranged at the side 121s of fin 121 by the radiator structure 100 of the present embodiment, to cover the region that user may touch.Please refer to Fig. 2 A and Fig. 2 B, it illustrates the configuration relation figure between heat shield 130 and fin 121 respectively.In fig. 2, heat shield 130 is in strip, and the width W 1 of heat shield 130 can be less than or equal in fact the width W 2 of side 121s of fin 121.
In addition, in one embodiment, the side 121s both sides of fin 121 have two the side wall surface 121w be parallel to each other, and be such as rectangle plane, heat shield 130 is only covered in the side 121s of fin 121, and does not cover the side wall surface 121w of its left and right sides.Because the area of the side wall surface 121w of fin 121 is much larger than the area of the side 121s of fin 121, therefore most heat all can be dispersed via large-area side wall surface 121w.Moreover, the fin 121 of fin 120 is spaced, and the interval width between fin 121 is less than into the width of finger, even if heat shield 130 is only covered in the side 121s of fin 121, and do not cover the side wall surface 121w of its left and right sides, the finger of user still cannot stretch in gap and contact with side wall surface 121w, therefore the danger of thermo-contact can not occur.Moreover the interval width D between fin 121 also can not be too little and affect the effect of thermal convection, and the interval width D between fin 121 is good to be greater than the width of the side 121s of fin 121.
In fig. 2, heat shield 130 is provided with the holding section 131 mutually engaged with the side 121s of fin 121, and the side 121s of fin 121 is provided with the groove 121u holding holding section 131.In addition, in fig. 2b, heat shield 130 is except covering the first side 121s1 of fin 121, and the two ends of heat shield 130 also can vertically extend two protuberances 132 and 133, and these two protuberances cover second side 121s2 and the 3rd side 121s3 of fin 121 both sides respectively.In addition, second side 121s2 and the 3rd side 121s3 is such as respectively equipped with the second groove 121u2 and the 3rd groove 121u3, in order to hold this two protuberances 132 and 133.Therefore, heat shield 130 can be fixed by these two protuberances 132 and 133 or be held on fin 121, or is attached on fin 121 by adhesive plaster.In addition, heat shield 130 also can be fixed on the side 121s of fin 121 by other snap-in structure, and the present invention is not limited this.
Above-mentioned two protuberances 132 and 133 can be integrally formed with heat shield 130, but also can be formed separately.That is, these two protuberances 132 and 133 can be independently two heat shields, cover second side 121s2 and the 3rd side 121s3 of fin 121 respectively.In another embodiment, heat shield 130 can be L shape heat shield, and it is covered in first side 121s1 and second side 121s2 or is covered in first side 121s1 and the 3rd side 121s3.Therefore, as long as heat shield 130 can cover more than at least one side of fin 121, the present invention is not limited this.
Please refer to Fig. 3 A to Fig. 3 C, it illustrates the configuration relation figure between heat shield 130 and fin 121 respectively.In figure 3 a, heat shield 130 can be attached to the side 121s of fin 121 by viscose glue 140.In figure 3b, the holding section 131 of heat shield 130 has snap fit 131t, and is provided with the draw-in groove 121t holding snap fit 131t in the groove 121u of the side 121s of fin 121, comes off to avoid heat shield 130.In addition, in fig. 3 c, the holding section 131 of heat shield 130 is plug-in unit, and the side 121s of fin 121 is provided with the slot 121p holding plug-in unit.In one embodiment, heat shield 130 can be soft materials, rigid material or porous material.For example, heat shield 130 can be silica gel material or has the high molecular material of silica gel, except effect of heat insulation is good, also has plasticity, and holding section that can be suitable according to the profile design of snap-in structure, be sticked in groove to make holding section produce deformation.
Please refer to Fig. 4, it illustrates the schematic diagram of the radiator structure 101 according to one embodiment of the invention.In the present embodiment, the surrounding of body 110 is provided with fin 121 outwardly and is arranged at the heat shield 130 of side of each fin 121.The fin 121 that heat shield 130 can be avoided user to contact exposing.In one embodiment, the fin of radiator structure 101 can be made up of multiple fin, and its quantity is not limit.For example, fin comprises the first fin 120a, the second fin 120b and the 3rd fin 120c, first fin 120a covers the first side 110a of body 110, second fin 120b covers the second side 110b of body 110, and the 3rd fin 120c covers the 3rd side 110c of body 110.First fin 120a, the second fin 120b and the 3rd fin 120c can fashion of extrusion integrally formed or be combined into one in a snap-in manner.Above-mentioned fin and body can form the shell structure with fin 121, and its inside can holding electronic device, such as motherboard or wafer set etc.Interval width between fin 121 can be less than the width of common people's finger, and therefore the finger of user cannot stretch in gap and contact with the side wall surface of fin 121.
Radiator structure disclosed by the above embodiment of the present invention, utilizes the heat on heat shield obstruct fin, even if therefore fin is revealed in outside body, does not also have hot danger.In addition, fin is revealed in outside body except having better radiating efficiency, also can save the cost installing fan additional or install screen pack additional, and the dust on fin is also easier to cleaning, more meets heat sinking benefit.
The present invention is described by above-mentioned related embodiment, but above-described embodiment is only enforcement example of the present invention.Must it is noted that the embodiment disclosed limit the scope of the invention.On the contrary, change done without departing from the spirit and scope of the present invention and retouching, all belong to scope of patent protection of the present invention.

Claims (13)

1. a radiator structure, is characterized in that, comprising:
Body; And
Fin, is arranged on this body, and this fin comprises multiple fin and multiple heat shield, and the plurality of fin is strip and is spaced, and the side of the plurality of fin protrudes from outside this body;
Wherein the plurality of heat shield covers the side of the plurality of fin.
2. radiator structure as claimed in claim 1, it is characterized in that, this body has peristome, and the plurality of fin separation is arranged in this peristome.
3. radiator structure as claimed in claim 1, it is characterized in that, this fin covers around this body.
4. radiator structure as claimed in claim 3, it is characterized in that, this fin and this body form the shell structure with the plurality of fin.
5. radiator structure as claimed in claim 1, it is characterized in that, the side wall surface of the plurality of fin is rectangle plane, and the plurality of heat shield does not cover the side wall surface of the plurality of fin.
6. radiator structure as claimed in claim 1, it is characterized in that, the plurality of heat shield is attached to the side of the plurality of fin with adhesive plaster.
7. radiator structure as claimed in claim 1, it is characterized in that, the plurality of heat shield is provided with the holding section mutually engaged with the side of the plurality of fin.
8. radiator structure as claimed in claim 7, it is characterized in that, this holding section has snap fit, and the side of the plurality of fin is respectively equipped with the draw-in groove holding this snap fit; Or this holding section is plug-in unit, and the side of the plurality of fin is respectively equipped with the slot holding this plug-in unit.
9. the radiator structure according to any one of claim 5 to 8, is characterized in that, the plurality of heat shield correspondence covers at least two sides of the plurality of fin.
10. the radiator structure according to any one of claim 5 to 8, is characterized in that, the width of the plurality of heat shield is identical in fact with the width of the side of the plurality of fin.
11. radiator structures according to any one of claim 5 to 8, it is characterized in that, the material of the plurality of heat shield comprises silica gel.
12. radiator structures as claimed in claim 1, it is characterized in that, the interval width between the plurality of fin is less than into the width of finger, and is greater than the width of the side of the plurality of fin.
13. radiator structures as claimed in claim 1, it is characterized in that, this body is display casing or computer chassis.
CN201410817430.2A 2014-12-25 2014-12-25 Cooling structure Pending CN104582438A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410817430.2A CN104582438A (en) 2014-12-25 2014-12-25 Cooling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410817430.2A CN104582438A (en) 2014-12-25 2014-12-25 Cooling structure

Publications (1)

Publication Number Publication Date
CN104582438A true CN104582438A (en) 2015-04-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410817430.2A Pending CN104582438A (en) 2014-12-25 2014-12-25 Cooling structure

Country Status (1)

Country Link
CN (1) CN104582438A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105159018A (en) * 2015-05-12 2015-12-16 苏州佳世达光电有限公司 Projecting apparatus
US9952487B2 (en) 2015-05-05 2018-04-24 Qisda Corporation Projector
CN108977668A (en) * 2018-06-20 2018-12-11 核工业理化工程研究院 The heat shield structure of atom vapor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9952487B2 (en) 2015-05-05 2018-04-24 Qisda Corporation Projector
CN105159018A (en) * 2015-05-12 2015-12-16 苏州佳世达光电有限公司 Projecting apparatus
CN108977668A (en) * 2018-06-20 2018-12-11 核工业理化工程研究院 The heat shield structure of atom vapor
CN108977668B (en) * 2018-06-20 2024-04-26 核工业理化工程研究院 Heat shield structure for atomic vapor

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Application publication date: 20150429