CN104504386A - Modular AOI (automated optical inspection) positioning method, system and burning IC (integrated circuit) equipment - Google Patents
Modular AOI (automated optical inspection) positioning method, system and burning IC (integrated circuit) equipment Download PDFInfo
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- CN104504386A CN104504386A CN201410740537.1A CN201410740537A CN104504386A CN 104504386 A CN104504386 A CN 104504386A CN 201410740537 A CN201410740537 A CN 201410740537A CN 104504386 A CN104504386 A CN 104504386A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10004—Still image; Photographic image
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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Abstract
The invention provides a modular AOI (automated optical inspection) positioning method, a modular AOI system and burning IC (integrated circuit) equipment. The burning IC equipment is subjected to IC positioning in a modularization mode, and the modularization refers to the operation that each module for controlling an IC positioning system is packed into a dynamic command library through a certain software development platform, and the positioning operation of IC burning is controlled through calling an interface function of the dynamic command library. The system has the advantages that the multi-direction calculation function is adopted, the detection speed is accelerated, and in addition, the detection precision is improved by adopting a standard image correcting method; meanwhile, through the modular development framework, the verification test time in the development process is also reduced, and the product development speed is accelerated.
Description
Technical field
The present invention relates to IC burning technical field, in particular a kind of modularization AOI localization method, system and burning IC equipment.
Background technology
In domestic IC burning industry, although robotization burning industry has been developed for many years, but AOI position detecting system does not also catch up with international step, particularly at IC detection field, the deficiency of related development technician, market detect AOI the problems such as not to be understood, positioning precision is low and cause this system to produce by Persisting exploitation always.Traditional Man detection mode, easily causes enterprise-quality to be difficult to check on, and also greatly reduces IC output efficiency simultaneously, the more serious enterprise that causes cannot take more orders, also because of quality problems cannot with more high-end commodity cooperation, for enterprise, such loss is permanent.
Therefore, prior art haves much room for improvement and improves.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of modularization AOI localization method, system and burning IC equipment, be intended to solve the problem that in existing IC burning industry, IC positioning precision is low.
Technical scheme of the present invention is as follows:
A kind of modularization AOI localization method, for carrying out IC location to burning IC equipment, wherein, described method comprises step:
A, loading burning IC picture, and image function adjustment is carried out to described burning IC picture;
B, obtain the image block after described adjustment, judge whether the image block after described adjustment is Free Region;
If the image block after the described adjustment of C is Free Region, then CCD comparison is carried out to described Free Region;
If the described CCD comparison result of D is in a threshold range pre-set, then image rectification is carried out to described Free Region, according to correction result, IC location is carried out to burning IC equipment.
Described modularization AOI localization method, wherein, obtains the described burning IC picture of loading and comprises step in described steps A:
Open four threads, four summits arranging described burning IC picture are starting point, to Load Image data to center picture.
Described modularization AOI localization method, wherein, described image function adjustment comprises: adjustment image brightness values, sharp keen value, swell value and corrosion number.
Described modularization AOI localization method, wherein, in described step C, CCD comparison comprises step:
C1, take out described Free Region, according to standard point to linear distance formulae discovery Free Region edge, and obtained the institute a little position of Free Region housing by described Free Region edge;
C2, according to all calculation of points of described housing the center of image block;
C3, taking-up, with two the some positions surveying maximum distance, utilize the slope formula of place, described two some positions straight line to calculate deviation angle and X/Y side-play amount.
Described modularization AOI localization method, wherein, in described step D, image rectification specifically comprises step:
D1, pre-set a correcting block, described correcting block is placed in below CCD, utilizes drawing gimmick to mark the straight line being equal to described correcting block length value;
D2, calculate corresponding pixel value according to described length value, this numerical value corresponding relation is designated as length-pixel corresponding relation, calculate length value corresponding when pixel value is 1 according to described length-pixel corresponding relation, this numerical value corresponding relation is designated as pixel-length corresponding relation;
D3, described pixel-length corresponding relation is set as calibration standard, carries out image rectification according to all pixels of described calibration standard to described Free Region.
Described modularization AOI positioning system, wherein, described positioning system comprises:
Loading adjustment picture module, for loading burning IC picture, and image function adjustment being carried out to described burning IC picture;
Free Region judge module, for obtaining the image block after described adjustment, judges whether the image block after described adjustment is Free Region;
CCD comparing module, if be Free Region for the image block after described adjustment, then carries out CCD comparison to described Free Region;
Image correction module, if be in a threshold range pre-set for described CCD comparison result, then carries out image rectification to described Free Region, carries out IC location according to correction result to burning IC equipment;
Described loading described burning IC picture comprises: open four threads, and four summits arranging described IC picture are starting point, to Load Image data to center picture;
Described image function adjustment comprises: adjustment image brightness values, sharp keen value, swell value and corrosion number.
Described modularization AOI positioning system, wherein, described CCD comparing module also comprises:
Free Region housing point position acquiring unit, for taking out described Free Region, according to standard point to linear distance formulae discovery Free Region edge, and obtains the institute a little position of Free Region housing by described Free Region edge;
Center computing unit, for the center of image block according to all calculation of points of described housing;
Off-set value computing unit, for taking out two some positions with surveying maximum distance, utilizes the slope formula of place, described two some positions straight line to calculate deviation angle and X/Y side-play amount.
Described modularization AOI positioning system, wherein, described image correction module also comprises:
Length value acquiring unit, for pre-setting a correcting block, is placed in below CCD by described correcting block, utilizes drawing gimmick to mark the straight line being equal to described correcting block length value;
Length in pixels value corresponding unit, for calculating corresponding pixel value according to described length value, this numerical value corresponding relation is designated as length-pixel corresponding relation, calculate length value corresponding when pixel value is 1 according to described length-pixel corresponding relation, this numerical value corresponding relation is designated as pixel-length corresponding relation;
Calibration standard setup unit, for described pixel-length corresponding relation is set as calibration standard, carries out image rectification according to all pixels of described calibration standard to described Free Region.
Described modularization AOI positioning system, wherein, also comprises:
Dynamic base sets up module, for described loading adjustment picture module, Free Region judge module, CCD comparing module and image correction module are packaged into a dynamic command storehouse, is controlled the positioning action of burning IC by the interface function calling described dynamic command storehouse.
A kind of burning IC equipment, wherein, comprises the modularization AOI positioning system described in above any one.
A kind of modularization AOI localization method provided by the present invention, system and burning IC equipment, modular mode is adopted to carry out IC location to burning IC equipment, modularization refers to and the modules of control IC positioning system is packaged into dynamic command storehouse by certain Software Development Platform, is controlled the positioning action of burning IC by the interface function calling described dynamic command storehouse.This system has used multi-direction formula computing function, improves detection speed, and adopts standard video correction gimmick to improve accuracy of detection; Modular development frame decreases the validation test time in performance history simultaneously, accelerates product development speed.
Accompanying drawing explanation
Fig. 1 is the preferred embodiment process flow diagram of modularization AOI localization method of the present invention.
Fig. 2 a, 2b, 2c are the Application Example schematic diagram of modularization AOI localization method of the present invention.
Fig. 3 is the functional block diagram of modularization AOI positioning system of the present invention.
Embodiment
The invention provides a kind of modularization AOI localization method, system and burning IC equipment, for making object of the present invention, technical scheme and effect clearly, clearly, developing simultaneously referring to accompanying drawing, the present invention is described in more detail for embodiment.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Refer to Fig. 1, it is the preferred embodiment process flow diagram of modularization AOI localization method of the present invention.As shown in the figure, described modularization AOI localization method comprises the following steps:
S101, loading burning IC picture, and image function adjustment is carried out to described burning IC picture.
In the embodiment of the present invention, when loading described burning IC picture, by opening four threads, four summits arranging described burning IC picture are starting point, to Load Image data to center picture, do the speed can accelerated image data and read like this.After loading, carry out image function adjustment further to described burning IC picture, described image function adjustment comprises: adjustment image brightness values, sharp keen value, swell value and corrosion number.
The present invention adopts modular framework mode, modular mode be exactly these have been completed program packing journey dynamic base (DLL.LIB) of checking and open basic image processing function as: picture luminance adjustment, binaryzation, sharpened ... etc. function.These functions can adjust, only need input parameter so decrease programmer's test duration according to the different picture of Different Light.
Being the original image schematic diagram in the embodiment of the present invention as shown in Figure 2 a, after binaryzation, adjustment brightness value, sharp keen value, swell value and corrosion number, is the image schematic diagram after function adjustment as shown in Figure 2 b.
S102, obtain the image block after described adjustment, judge whether the image block after described adjustment is Free Region.
If the image block after the described adjustment of S103 is Free Region, then CCD comparison is carried out to described Free Region.
Described CCD comparison specifically comprises step:
C1, take out described Free Region, according to standard point to linear distance formulae discovery Free Region edge, and obtained the institute a little position of Free Region housing by described Free Region edge;
C2, according to all calculation of points of described housing the center of image block;
C3, taking-up, with two the some positions surveying maximum distance, utilize the slope formula of place, described two some positions straight line to calculate deviation angle and X/Y side-play amount.
Be CCD comparison schematic diagram as shown in Figure 2 c, draw deviation angle and the X/Y side-play amount of this image according to above step.
If the described CCD comparison result of S104 is in a threshold range pre-set, then image rectification is carried out to described Free Region, according to correction result, IC location is carried out to burning IC equipment.
Described image rectification specifically comprises step:
D1, pre-set a correcting block, described correcting block is placed in below CCD, utilizes drawing gimmick to mark the straight line being equal to described correcting block length value;
D2, calculate corresponding pixel value according to described length value, this numerical value corresponding relation is designated as length-pixel corresponding relation, calculate length value corresponding when pixel value is 1 according to described length-pixel corresponding relation, this numerical value corresponding relation is designated as pixel-length corresponding relation;
D3, described pixel-length corresponding relation is set as calibration standard, carries out image rectification according to all pixels of described calibration standard to described Free Region.
Such as, buy one piece of professional correcting block (this correcting block must regularly return factory's inspection), this correcting block is placed in below CCD, utilizes drawing gimmick, marks the straight line being equal to correcting block length, as the length of straight line is 5mm as described in measuring; Calculate 5mm=pixel further, the image pixel value namely corresponding to 5mm is how many, and then calculates 1pixel=mm, and it is how many for namely calculating length value corresponding when pixel value is 1.Such as, if 5mm=200pixel, known 1pixel=0.025mm.Using the standard that 1pixel=0.025mm corrects as, all pixels of Free Region are carried out image rectification.
Based on above-described embodiment, the present invention also provides a kind of modularization AOI positioning system, as shown in Figure 3, comprising:
Loading adjustment picture module 100, for loading burning IC picture, and image function adjustment being carried out to described burning IC picture; As detailed above.
Free Region judge module 200, for obtaining the image block after described adjustment, judges whether the image block after described adjustment is Free Region; As detailed above.
CCD comparing module 300, if be Free Region for the image block after described adjustment, then carries out CCD comparison to described Free Region; As detailed above.
Image correction module 400, if be in a threshold range pre-set for described CCD comparison result, then carries out image rectification to described Free Region, carries out IC location according to correction result to burning IC equipment; As detailed above.
Further, described loading described burning IC picture comprises: open four threads, and four summits arranging described IC picture are starting point, to Load Image data to center picture.
Further, described image function adjustment comprises: adjustment image brightness values, sharp keen value, swell value and corrosion number.
Further, described CCD comparing module also comprises:
Free Region housing point position acquiring unit, for taking out described Free Region, according to standard point to linear distance formulae discovery Free Region edge, and obtains the institute a little position of Free Region housing by described Free Region edge; As detailed above.
Center computing unit, for the center of image block according to all calculation of points of described housing; As detailed above.
Off-set value computing unit, for taking out two some positions with surveying maximum distance, utilizes the slope formula of place, described two some positions straight line to calculate deviation angle and X/Y side-play amount.
Further, described image correction module also comprises:
Length value acquiring unit, for pre-setting a correcting block, is placed in below CCD by described correcting block, utilizes drawing gimmick to mark the straight line being equal to described correcting block length value; As detailed above.
Length in pixels value corresponding unit, for calculating corresponding pixel value according to described length value, this numerical value corresponding relation is designated as length-pixel corresponding relation, calculate length value corresponding when pixel value is 1 according to described length-pixel corresponding relation, this numerical value corresponding relation is designated as pixel-length corresponding relation; As detailed above.
Calibration standard setup unit, for described pixel-length corresponding relation is set as calibration standard, carries out image rectification according to all pixels of described calibration standard to described Free Region; As detailed above.
Further, described modularization AOI positioning system also comprises:
Dynamic base sets up module, for described loading adjustment picture module, Free Region judge module, CCD comparing module and image correction module are packaged into a dynamic command storehouse, is controlled the positioning action of burning IC by the interface function calling described dynamic command storehouse.
Based on above-described embodiment, the present invention also provides a kind of burning IC equipment, and the burning IC equipment described in the present embodiment comprises modularization AOI positioning system described above.
In sum, a kind of modularization AOI localization method provided by the present invention, system and burning IC equipment, modular mode is adopted to carry out IC location to burning IC equipment, modularization refers to and the modules of control IC positioning system is packaged into dynamic command storehouse by certain Software Development Platform, is controlled the positioning action of burning IC by the interface function calling described dynamic command storehouse.This system has used multi-direction formula computing function, improves detection speed, and adopts standard video correction gimmick to improve accuracy of detection; Modular development frame decreases the validation test time in performance history simultaneously, accelerates product development speed.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection domain that all should belong to claims of the present invention.
Claims (10)
1. a modularization AOI localization method, for carrying out IC location to burning IC equipment, it is characterized in that, described method comprises step:
A, loading burning IC picture, and image function adjustment is carried out to described burning IC picture;
B, obtain the image block after described adjustment, judge whether the image block after described adjustment is Free Region;
If the image block after the described adjustment of C is Free Region, then CCD comparison is carried out to described Free Region;
If the described CCD comparison result of D is in a threshold range pre-set, then image rectification is carried out to described Free Region, according to correction result, IC location is carried out to burning IC equipment.
2. modularization AOI localization method according to claim 1, is characterized in that, obtains the described burning IC picture of loading and comprise step in described steps A:
Open four threads, four summits arranging described burning IC picture are starting point, to Load Image data to center picture.
3. modularization AOI localization method according to claim 1, is characterized in that, described image function adjustment comprises: adjustment image brightness values, sharp keen value, swell value and corrosion number.
4. modularization AOI localization method according to claim 1, is characterized in that, in described step C, CCD comparison comprises step:
C1, take out described Free Region, according to standard point to linear distance formulae discovery Free Region edge, and obtained the institute a little position of Free Region housing by described Free Region edge;
C2, according to all calculation of points of described housing the center of image block;
C3, taking-up, with two the some positions surveying maximum distance, utilize the slope formula of place, described two some positions straight line to calculate deviation angle and X/Y side-play amount.
5. modularization AOI localization method according to claim 1, is characterized in that, in described step D, image rectification specifically comprises step:
D1, pre-set a correcting block, described correcting block is placed in below CCD, utilizes drawing gimmick to mark the straight line being equal to described correcting block length value;
D2, calculate corresponding pixel value according to described length value, this numerical value corresponding relation is designated as length-pixel corresponding relation, calculate length value corresponding when pixel value is 1 according to described length-pixel corresponding relation, this numerical value corresponding relation is designated as pixel-length corresponding relation;
D3, described pixel-length corresponding relation is set as calibration standard, carries out image rectification according to all pixels of described calibration standard to described Free Region.
6. a modularization AOI positioning system as claimed in claim 1, is characterized in that, described positioning system comprises:
Loading adjustment picture module, for loading burning IC picture, and image function adjustment being carried out to described burning IC picture;
Free Region judge module, for obtaining the image block after described adjustment, judges whether the image block after described adjustment is Free Region;
CCD comparing module, if be Free Region for the image block after described adjustment, then carries out CCD comparison to described Free Region;
Image correction module, if be in a threshold range pre-set for described CCD comparison result, then carries out image rectification to described Free Region, carries out IC location according to correction result to burning IC equipment;
Described loading described burning IC picture comprises: open four threads, and four summits arranging described IC picture are starting point, to Load Image data to center picture;
Described image function adjustment comprises: adjustment image brightness values, sharp keen value, swell value and corrosion number.
7. modularization AOI positioning system according to claim 6, is characterized in that, described CCD comparing module also comprises:
Free Region housing point position acquiring unit, for taking out described Free Region, according to standard point to linear distance formulae discovery Free Region edge, and obtains the institute a little position of Free Region housing by described Free Region edge;
Center computing unit, for the center of image block according to all calculation of points of described housing;
Off-set value computing unit, for taking out two some positions with surveying maximum distance, utilizes the slope formula of place, described two some positions straight line to calculate deviation angle and X/Y side-play amount.
8. modularization AOI positioning system according to claim 6, is characterized in that, described image correction module also comprises:
Length value acquiring unit, for pre-setting a correcting block, is placed in below CCD by described correcting block, utilizes drawing gimmick to mark the straight line being equal to described correcting block length value;
Length in pixels value corresponding unit, for calculating corresponding pixel value according to described length value, this numerical value corresponding relation is designated as length-pixel corresponding relation, calculate length value corresponding when pixel value is 1 according to described length-pixel corresponding relation, this numerical value corresponding relation is designated as pixel-length corresponding relation;
Calibration standard setup unit, for described pixel-length corresponding relation is set as calibration standard, carries out image rectification according to all pixels of described calibration standard to described Free Region.
9. modularization AOI positioning system according to claim 6, is characterized in that, also comprise:
Dynamic base sets up module, for described loading adjustment picture module, Free Region judge module, CCD comparing module and image correction module are packaged into a dynamic command storehouse, is controlled the positioning action of burning IC by the interface function calling described dynamic command storehouse.
10. burning IC equipment, is characterized in that, comprises the modularization AOI positioning system described in any one of claim 6 to 9.
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| CN107298304A (en) * | 2016-04-14 | 2017-10-27 | 科思通自动化设备（苏州）有限公司 | One discharge plate fills the full-automatic CD writers of IC |
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| TWI753554B (en) * | 2020-08-28 | 2022-01-21 | 致茂電子股份有限公司 | Method for automatically adjusting electronic equipment |
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| CN104504386B (en) | 2017-12-01 |
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