CN104485330A - 一种具有超高esd的高精度测温芯片的版图结构 - Google Patents
一种具有超高esd的高精度测温芯片的版图结构 Download PDFInfo
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US20030154056A1 (en) * | 2000-01-13 | 2003-08-14 | Toku Ito | System for acquiring data from facilities and method CIP |
CN102338669A (zh) * | 2010-05-27 | 2012-02-01 | 香港科技大学 | 低电压低功耗cmos温度传感器 |
CN102930094A (zh) * | 2012-10-25 | 2013-02-13 | 北京七芯中创科技有限公司 | 带温度补偿的高精度时钟芯片版图结构 |
CN102931187A (zh) * | 2012-10-25 | 2013-02-13 | 北京七芯中创科技有限公司 | 一种温度补偿时钟芯片的版图结构 |
CN102931188A (zh) * | 2012-10-25 | 2013-02-13 | 北京七芯中创科技有限公司 | 一种温度补偿时钟芯片的版图结构 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030154056A1 (en) * | 2000-01-13 | 2003-08-14 | Toku Ito | System for acquiring data from facilities and method CIP |
CN102338669A (zh) * | 2010-05-27 | 2012-02-01 | 香港科技大学 | 低电压低功耗cmos温度传感器 |
CN102930094A (zh) * | 2012-10-25 | 2013-02-13 | 北京七芯中创科技有限公司 | 带温度补偿的高精度时钟芯片版图结构 |
CN102931187A (zh) * | 2012-10-25 | 2013-02-13 | 北京七芯中创科技有限公司 | 一种温度补偿时钟芯片的版图结构 |
CN102931188A (zh) * | 2012-10-25 | 2013-02-13 | 北京七芯中创科技有限公司 | 一种温度补偿时钟芯片的版图结构 |
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Addressee: Beijing 7Q Technology Co., Ltd. Document name: Notification of Publication and of Entering the Substantive Examination Stage of the Application for Invention |
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Address after: Room 5, building 98, No. 102300 West Lake Road, Mentougou District, Beijing, China Applicant after: Beijing 7Q Technology Co., Ltd. Address before: 100029, A, block 69, mount, No. 202, Beichen West Road, Beijing, Chaoyang District Applicant before: Beijing 7Q Technology Co., Ltd. |
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