CN104485311A - Packaging structure and preparation method of OLED (organic light emitting diode) panel - Google Patents
Packaging structure and preparation method of OLED (organic light emitting diode) panel Download PDFInfo
- Publication number
- CN104485311A CN104485311A CN201410697610.1A CN201410697610A CN104485311A CN 104485311 A CN104485311 A CN 104485311A CN 201410697610 A CN201410697610 A CN 201410697610A CN 104485311 A CN104485311 A CN 104485311A
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- Prior art keywords
- plate glass
- glass
- buffer structure
- panel
- oled panel
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/125—Active-matrix OLED [AMOLED] displays including organic TFTs [OTFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a packaging structure and a preparation method of an OLED (organic light emitting diode) panel. The preparation method comprises the following steps of providing substrate glass, defining a plurality of panel areas on the substrate glass, and respectively preparing an OLED light emitting unit in each panel area; providing cover plate glass, and coating packaging glue around the parts, corresponding to each panel area, of the cover plate glass; curing the packaging glue; after the packaging glue is cured, coating a buffer structure between the adjacent packaging glue; attaching the cover plate glass on the substrate glass; sintering the packaging glue and the buffer structure, and packaging the cover plate glass on the substrate glass to form a glass large template; cutting the glass large template into a plurality of OLED panels along the corresponding buffer structure. The preparation method has the advantage that by coating the buffer structure on the cover plate glass, when the glass is cut by a knife wheel, the shock caused by the glass cracks can be reduced by the buffer structures, the penetrating stress of the knife wheel and the stress of the glass cracks are absorbed, and the influence on the packaging glue by the cutting stress is reduced.
Description
Technical field
The present invention relates to OLED encapsulation technology, refer in particular to a kind of encapsulating structure of oled panel and the preparation method of oled panel.
Background technology
There is various ways in existing OLED encapsulation, glass cement (Frit) is wherein a kind of mode, glass cement is coated on cover-plate glass, through press equipment, cover-plate glass is combined with base plate glass, two sheet glass to be combined packaging operation via laser (laser) sintering again, directly large for glass version has been cut into single panel (Panel) finally by by infiltration type break bar.
But glass cement is after sintering, stress can be produced and concentrate or accumulation, can impact glass cement during the large version of infiltration type break bar glass-cutting, cause Panel to occur the phenomenons such as sliver is bad, angle collapses.And glass cement material is not only crisp but also hard, when Cutting Road distance glass cement is nearer, sliver bad phenomenon can affect aggravation, causes yield to reduce.
Summary of the invention
Because easily there is the problem of sliver bad phenomenon in above-mentioned prior art during panel cutting, the invention provides a kind of preparation method of oled panel, comprising:
Base plate glass is provided, described base plate glass defines a plurality of panel area, in panel area described in each, prepare OLED luminescence unit respectively;
There is provided cover-plate glass, the surrounding coating packaging plastic of corresponding panel area described in each on described cover-plate glass;
Process is cured to described packaging plastic;
After described packaging plastic solidification, between adjacent described packaging plastic, be coated with buffer structure;
Described cover-plate glass is fitted on described base plate glass;
Sintering processes is carried out to described packaging plastic and described buffer structure, described cover-plate glass is encapsulated on described base plate glass, form the large version of a glass;
Large for described glass version is cut into a plurality of oled panel by the position along described buffer structure.
The preparation method of oled panel of the present invention, by being coated with one deck buffer structure on cover-plate glass, when infiltration type break bar glass-cutting, because when break bar is cut on glass, there is cushioned structural support at the back side, utilize this buffer structure, the impact caused when can slow down glass sliver, absorb infiltration stress and the glass sliver stress of break bar, and unlikely impact radium-shine sintering residual stress during glass sliver, reduce glass and cut the impact of cutting stress when splitting to the impact of packaging plastic.Produce sliver uneven phenomenon and packaging plastic place generation slight crack when avoiding glass sliver, cause packaging plastic to sinter bad phenomenon.
The further improvement of the preparation method of oled panel of the present invention is, when being coated with described buffer structure, leaves gap between described buffer structure and described packaging plastic.
The further improvement of the preparation method of oled panel of the present invention is, when being coated with described buffer structure, described buffer structure to be coated on described cover-plate glass the position of the Cutting Road between corresponding panel area described in each.
The further improvement of the preparation method of oled panel of the present invention is:
Described Cutting Road is positioned at the middle of described buffer structure;
Large for described glass version is cut into a plurality of oled panel by the position along described buffer structure, comprising: large for described glass version is cut into a plurality of oled panel by the middle along described buffer structure.
The further improvement of the preparation method of oled panel of the present invention is, described buffer structure adopts heat curing-type glue material.
Present invention also offers a kind of encapsulating structure of oled panel, comprising:
Base plate glass and the cover-plate glass being packaged in described base plate glass;
On described base plate glass, definition has panel area, and in described panel area, preparation has OLED luminescence unit;
Be provided with packaging plastic between described base plate glass and described cover-plate glass, described packaging plastic is arranged at the surrounding of described panel area, and described packaging plastic arranged outside has buffer structure, and the side of described buffer structure and the side of described base plate glass trim.
The encapsulating structure of oled panel of the present invention; because buffer structure is positioned at the centre of two glass sheets that cover-plate glass and base plate glass form; therefore when cutting the first surface of two glass sheet; namely buffer structure is had to protect; also buffer structure is had to protect when cutting second of two glass sheet; make both sides sliver all have buffer structure to protect, and then make section neat.When the thickness of glass of cover-plate glass and base plate glass is thinner, the Cutting Road of the large version of glass from packaging plastic more close to time, the buffering effect of buffer structure is more obvious.
The further improvement of the encapsulating structure of oled panel of the present invention is, leaves gap between described buffer structure and described packaging plastic.
The further improvement of the encapsulating structure of oled panel of the present invention is, this side of described buffer structure and the side of described cover-plate glass trim.
The further improvement of the encapsulating structure of oled panel of the present invention is, the side of this side of described buffer structure and the side of described base plate glass and described cover-plate glass trims, described in the place of trimming be the Cutting Road of oled panel encapsulating structure.
The further improvement of the encapsulating structure of oled panel of the present invention is, described buffer structure is heat curing-type glue material.
Accompanying drawing explanation
Fig. 1 is the structural representation before the encapsulating structure cutting of oled panel of the present invention.
Fig. 2 is the flow chart of the preparation method of oled panel of the present invention.
Fig. 3 is the profile after adopting the preparation method of oled panel of the present invention to prepare OLED luminescence unit on base plate glass.
Fig. 4 is the profile after adopting the preparation method of oled panel of the present invention to be coated with packaging plastic on cover-plate glass.
Fig. 5 is the vertical view after adopting the preparation method of oled panel of the present invention to be coated with packaging plastic on cover-plate glass.
Fig. 6 is the profile after adopting the preparation method of oled panel of the present invention to be coated with buffer structure on cover-plate glass.
Fig. 7 is the vertical view after adopting the preparation method of oled panel of the present invention to be coated with buffer structure on cover-plate glass.
Fig. 8 is the profile adopting the preparation method of oled panel of the present invention cover-plate glass and base plate glass to be fitted.
Fig. 9 is the profile after adopting the preparation method of oled panel of the present invention cover-plate glass and base plate glass to be encapsulated.
Figure 10 is the profile of the single oled panel after adopting the preparation method of oled panel of the present invention to cut.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The encapsulating structure of oled panel of the present invention, comprising:
Base plate glass and the cover-plate glass being packaged in described base plate glass;
On described base plate glass, definition has panel area, and in described panel area, preparation has OLED luminescence unit;
Be provided with packaging plastic between described base plate glass and described cover-plate glass, described packaging plastic is arranged at the surrounding of described panel area, and described packaging plastic arranged outside has buffer structure, and the side of described buffer structure and the side of described base plate glass trim.Preferably, described packaging plastic adopts glass cement, and described buffer structure adopts buffering adhesive, and described buffering adhesive more preferably adopts heat curing-type glue material.
Further, gap is left between described buffer structure and described packaging plastic.This side of described buffer structure and the side of described cover-plate glass trim.The side of this side of described buffer structure and the side of described base plate glass and described cover-plate glass trims, described in the place of trimming be the Cutting Road of oled panel encapsulating structure.
The encapsulating structure of oled panel of the present invention; because buffer structure is positioned at the centre of two glass sheets that cover-plate glass and base plate glass form; therefore when cutting the first surface of two glass sheet; namely buffer structure is had to protect; also buffer structure is had to protect when cutting second of two glass sheet; make both sides sliver all have buffer structure to protect, and then make section neat.When the thickness of glass of cover-plate glass and base plate glass is thinner, the Cutting Road of the large version of glass from packaging plastic more close to time, the buffering effect of buffer structure is more obvious.
Below in conjunction with accompanying drawing and specific embodiment, be described in detail the preparation method of oled panel of the present invention, in this embodiment, packaging plastic is for glass cement, and buffer structure is for buffering adhesive.
Fig. 1 is the structural representation before the encapsulating structure cutting of oled panel of the present invention, refers to Fig. 1, before the encapsulating structure cutting of oled panel of the present invention, comprising:
Base plate glass 1 and the cover-plate glass 2 be packaged on base plate glass 1;
On base plate glass 1, definition has a plurality of panel area 11, and in each panel area 11, preparation has OLED luminescence unit 12 respectively;
Be coated with glass cement 21 between base plate glass 1 and cover-plate glass 2, glass cement 21 coats the surrounding of each panel area 11, and is coated with buffering adhesive 22 between adjacent glass cement 21.
Preferably, buffering adhesive 22 adopts heat curing-type glue material, leaves gap between buffering adhesive 22 and glass cement 21, and coats the position of the Cutting Road 3 on cover-plate glass 2 on counterpart substrate glass 1 between each panel area 11, more preferably, Cutting Road 3 is positioned at the middle of buffering adhesive 22.
Below coordinate accompanying drawing, the preparation method of oled panel of the present invention is elaborated.
Fig. 2 is the flow chart of the preparation method of oled panel of the present invention, consults shown in Fig. 2, and the preparation method of oled panel of the present invention, comprising:
Shown in S101 composition graphs 3, provide base plate glass 1, base plate glass 1 defines a plurality of panel area 11, in each panel area 11, prepare OLED luminescence unit 12 respectively.
S102 composition graphs 4, with shown in Fig. 5, provides cover-plate glass 2, utilizes glue spreader surrounding coated glass glue 21 of each panel area 11 on counterpart substrate glass 1 on cover-plate glass 2.
S103 is cured process to the glass cement 21 on cover-plate glass 2.
S104 composition graphs 6, with shown in Fig. 7, after glass cement 21 hot setting, utilizes between glass cement 21 that glue spreader is adjacent on cover-plate glass 2 and is coated with buffering adhesive 22.Preferably, buffering adhesive 22 and glass cement 21 are not coated on not contacting with each other the position of the Cutting Road 3 on cover-plate glass 2 on counterpart substrate glass 1 between each panel area 11, more preferably, Cutting Road 3 is positioned at the middle of buffering adhesive 22.
Shown in S105 composition graphs 8, cover-plate glass 2 is fitted on base plate glass 1;
Shown in S106 composition graphs 9, radium-shine sintering processes is carried out to glass cement 21 and buffering adhesive 22, cover-plate glass 2 is encapsulated on base plate glass 1, form the large version of a glass;
S107 is after glass cement 21 and the radium-shine sintering of buffering adhesive 22 complete, and along the position of buffering adhesive 22, large for described glass version is cut into a plurality of independent oled panel by the position of the Cutting Road 3 namely on base plate glass 1 between each panel area 11.Oled panel structure after having cut as shown in Figure 10.
The preparation method of oled panel of the present invention, by being coated with one deck buffer structure on cover-plate glass, when infiltration type break bar glass-cutting, during owing to cutting on glass, there is buffer structure at the back side, utilize this buffer structure, the impact caused when can slow down glass sliver, absorbs infiltration stress and the glass sliver stress of break bar, and the impact on packaging plastic when splitting cut by reduction glass.
The above is only preferred embodiment of the present invention, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, any those skilled in the art, not departing from the scope of technical solution of the present invention, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be the content not departing from technical solution of the present invention, according to any simple modification that technical spirit of the present invention is done above embodiment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (10)
1. a preparation method for oled panel, is characterized in that, comprising:
Base plate glass is provided, described base plate glass defines a plurality of panel area, in panel area described in each, prepare OLED luminescence unit respectively;
There is provided cover-plate glass, the surrounding coating packaging plastic of corresponding panel area described in each on described cover-plate glass;
Process is cured to described packaging plastic;
After described packaging plastic solidification, between adjacent described packaging plastic, be coated with buffer structure;
Described cover-plate glass is fitted on described base plate glass;
Sintering processes is carried out to described packaging plastic and described buffer structure, described cover-plate glass is encapsulated on described base plate glass, form the large version of a glass;
Large for described glass version is cut into a plurality of oled panel by the position along described buffer structure.
2. the preparation method of oled panel as claimed in claim 1, is characterized in that, when being coated with described buffer structure, leave gap between described buffer structure and described packaging plastic.
3. the preparation method of oled panel as claimed in claim 1, is characterized in that, when being coated with described buffer structure, described buffer structure is coated on the position of the Cutting Road on described cover-plate glass between corresponding panel area described in each.
4. the preparation method of oled panel as claimed in claim 3, is characterized in that:
Described Cutting Road is positioned at the middle of described buffer structure;
Large for described glass version is cut into a plurality of oled panel by the position along described buffer structure, comprising: large for described glass version is cut into a plurality of oled panel by the middle along described buffer structure.
5. the preparation method of the oled panel according to any one of Claims 1-4, is characterized in that, described buffer structure adopts heat curing-type glue material.
6. an encapsulating structure for oled panel, is characterized in that, comprising:
Base plate glass and the cover-plate glass being packaged in described base plate glass;
On described base plate glass, definition has panel area, and in described panel area, preparation has OLED luminescence unit;
Be provided with packaging plastic between described base plate glass and described cover-plate glass, described packaging plastic is arranged at the surrounding of described panel area, and described packaging plastic arranged outside has buffer structure, and the side of described buffer structure and the side of described base plate glass trim.
7. the encapsulating structure of oled panel as claimed in claim 6, is characterized in that, leave gap between described buffer structure and described packaging plastic.
8. the encapsulating structure of oled panel as claimed in claim 6, it is characterized in that, this side of described buffer structure and the side of described cover-plate glass trim.
9. the encapsulating structure of oled panel as claimed in claim 8, it is characterized in that, the side of this side of described buffer structure and the side of described base plate glass and described cover-plate glass trims, described in the place of trimming be the Cutting Road of oled panel encapsulating structure.
10. the encapsulating structure of the oled panel according to any one of claim 6 to 9, is characterized in that, described buffer structure is heat curing-type glue material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410697610.1A CN104485311A (en) | 2014-11-27 | 2014-11-27 | Packaging structure and preparation method of OLED (organic light emitting diode) panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410697610.1A CN104485311A (en) | 2014-11-27 | 2014-11-27 | Packaging structure and preparation method of OLED (organic light emitting diode) panel |
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| CN104485311A true CN104485311A (en) | 2015-04-01 |
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| CN201410697610.1A Pending CN104485311A (en) | 2014-11-27 | 2014-11-27 | Packaging structure and preparation method of OLED (organic light emitting diode) panel |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104741796A (en) * | 2015-04-20 | 2015-07-01 | 京东方科技集团股份有限公司 | Liquid crystal display panel and manufacturing method thereof and display device |
| CN106527779A (en) * | 2015-09-09 | 2017-03-22 | 深圳莱宝高科技股份有限公司 | Panel structure and panel processing method and device |
| CN106876329A (en) * | 2017-02-23 | 2017-06-20 | 深圳市华星光电技术有限公司 | The preparation method of OLED display |
| CN107658391A (en) * | 2017-09-01 | 2018-02-02 | 信利半导体有限公司 | A kind of method for packing of narrow frame PMOLED devices |
| CN107919364A (en) * | 2017-11-17 | 2018-04-17 | 京东方科技集团股份有限公司 | Display base plate motherboard, display base plate and production method, display device |
| WO2018090444A1 (en) * | 2016-11-15 | 2018-05-24 | 武汉华星光电技术有限公司 | Oled substrate and manufacturing method thereof |
| CN108448011A (en) * | 2018-05-14 | 2018-08-24 | 昆山国显光电有限公司 | A kind of display master blank and its display screen, display terminal |
| CN108649058A (en) * | 2018-05-14 | 2018-10-12 | 昆山国显光电有限公司 | A kind of display master blank and its display screen, display terminal |
| WO2018192316A1 (en) * | 2017-04-20 | 2018-10-25 | 京东方科技集团股份有限公司 | Display panel manufacturing method, display panel and display device |
| CN109003951A (en) * | 2018-08-10 | 2018-12-14 | 云谷（固安）科技有限公司 | Encapsulating structure, display device and encapsulating structure preparation method |
| CN109360847A (en) * | 2018-10-30 | 2019-02-19 | 昆山国显光电有限公司 | The manufacturing method of display panel, display device and display panel |
| WO2019200567A1 (en) * | 2018-04-18 | 2019-10-24 | 深圳市柔宇科技有限公司 | Oled touch panel preparation apparatus and oled touch panel preparation method |
| CN110797474A (en) * | 2019-11-20 | 2020-02-14 | 昆山国显光电有限公司 | Display panel, preparation method thereof and display device |
| CN111261647A (en) * | 2020-01-20 | 2020-06-09 | 甬矽电子(宁波)股份有限公司 | Light-transmitting cover plate, optical sensor and manufacturing method thereof |
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Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104741796A (en) * | 2015-04-20 | 2015-07-01 | 京东方科技集团股份有限公司 | Liquid crystal display panel and manufacturing method thereof and display device |
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| CN107658391B (en) * | 2017-09-01 | 2019-12-31 | 信利半导体有限公司 | Packaging method of narrow-frame PMOLED device |
| CN107919364A (en) * | 2017-11-17 | 2018-04-17 | 京东方科技集团股份有限公司 | Display base plate motherboard, display base plate and production method, display device |
| WO2019200567A1 (en) * | 2018-04-18 | 2019-10-24 | 深圳市柔宇科技有限公司 | Oled touch panel preparation apparatus and oled touch panel preparation method |
| CN111868957B (en) * | 2018-04-18 | 2022-05-17 | 深圳市柔宇科技股份有限公司 | OLED touch panel preparation device and OLED touch panel preparation method |
| CN111868957A (en) * | 2018-04-18 | 2020-10-30 | 深圳市柔宇科技股份有限公司 | OLED touch panel preparation device and OLED touch panel preparation method |
| CN108649058A (en) * | 2018-05-14 | 2018-10-12 | 昆山国显光电有限公司 | A kind of display master blank and its display screen, display terminal |
| CN108448011A (en) * | 2018-05-14 | 2018-08-24 | 昆山国显光电有限公司 | A kind of display master blank and its display screen, display terminal |
| CN108649058B (en) * | 2018-05-14 | 2021-03-26 | 广州国显科技有限公司 | Display mother board and display screen and display terminal thereof |
| CN109003951A (en) * | 2018-08-10 | 2018-12-14 | 云谷（固安）科技有限公司 | Encapsulating structure, display device and encapsulating structure preparation method |
| WO2020087816A1 (en) * | 2018-10-30 | 2020-05-07 | 昆山国显光电有限公司 | Display panel, display device, and method for manufacturing display panel |
| CN109360847A (en) * | 2018-10-30 | 2019-02-19 | 昆山国显光电有限公司 | The manufacturing method of display panel, display device and display panel |
| CN110797474A (en) * | 2019-11-20 | 2020-02-14 | 昆山国显光电有限公司 | Display panel, preparation method thereof and display device |
| CN110797474B (en) * | 2019-11-20 | 2022-03-25 | 昆山国显光电有限公司 | Display panel, preparation method thereof and display device |
| CN111261647A (en) * | 2020-01-20 | 2020-06-09 | 甬矽电子(宁波)股份有限公司 | Light-transmitting cover plate, optical sensor and manufacturing method thereof |
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Application publication date: 20150401 |