CN104439710A - Water jet assisted laser chemical etching device and method - Google Patents
Water jet assisted laser chemical etching device and method Download PDFInfo
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- CN104439710A CN104439710A CN201410635562.3A CN201410635562A CN104439710A CN 104439710 A CN104439710 A CN 104439710A CN 201410635562 A CN201410635562 A CN 201410635562A CN 104439710 A CN104439710 A CN 104439710A
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- laser
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
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- General Chemical & Material Sciences (AREA)
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Abstract
The invention discloses a water jet assisted laser chemical etching device and method and belongs to the application field of non-traditional machining. The water jet assisted laser chemical etching device consists of three systems including a laser system, a water jet system and a chemical system and is characterized in that the high energy of laser and the washout effect of water jets are firstly utilized to jointly machine material surface, a hand-cranking wheel is turned to enable a material to be completely immersed into chemical liquid through a lifting worktable after primary machining is finished, and molten slag on the machined material surface can be decreased as far as possible and the thickness of a recast layer is decreased under the corrosive effect of the chemical liquid. By means of the water jet assisted laser chemical etching device and method, required grooves can be formed in the machined material surface in an etching mode, obvious molten slag, the recast layer and the like do not exist on the surfaces of the grooves, and according good machining effect is obtained.
Description
Technical field:
The present invention relates to the application of the special process, be specially a kind of device and method of water jet auxiliary laser chemical etching.
Background technology:
Along with the development of material engineering, difficult-to-machine material becomes the primary study object of field of machining gradually.Scientifically say, using the cutting ability of material as criterion, hardness > HB250, intensity σ > 1000MPa, percentage elongation > 80%, impact value α > 0.98MJ/m
2, thermal conductivity factor k < 41.8 material be referred to as difficult-to-machine material.Difficult-to-machine material enjoys favor in each engineering field, and the needs that these fields have carve circular groove at material surface, and some needs are at its surface erosion circular hole.But the hard fragility of the height due to these materials, there is the defects such as finished surface precision is low, easy fracture in the conventional processing mode such as turning, grinding, drilling, and when adopting the special process such as microwave, ultrasonic wave, still there is the shortcoming of inefficiency.
Laser ablation is compared with traditional processing method, it is a kind of contactless, little without cutting force, heat affecting, clean and can carry out the processing method of special processing, laser etching techniques is as one conventional in laser processing technology, it makes laser ablation difficult-to-machine material become reality, but still various problem can be there is in laser direct etching difficult-to-machine material, for example can there is more serious recast layer and inevitable residual thermal stress and micro-crack in material surface, directly affects the suface processing quality of material.
Summary of the invention:
Based on the various problems existed in laser direct etching difficult-to-machine material process, the present invention is by introducing water-jet technology, and by chemical attack effect, to removing the slag on difficult-to-machine material surface and reducing recast layer thickness, minimizing heat affected area etc., thus obtain best machined surface quality.
The device and method of a kind of water jet auxiliary laser chemical etching of the present invention, this device comprises:
(1) laser system;
(2) water jet system;
(3) chemical system.
In the present invention, described laser system comprises speculum, laser beam, assist gas oxygen, laser head, the current strength of laser is 120 ~ 200A, pulse width is 0.4 ~ 1.8ms, pulse recurrence frequency is 20 ~ 50HZ, defocusing amount is 1 ~ 3mm, and laser scanning speed is 0.6 ~ 1.5mm/s, and the laser beam that laser system produces finally sends from laser head.
In the present invention, the Water projectile in described water jet system and the angle of laser beam are 5 ~ 80 °, and the diameter of Water projectile is 6 ~ 9mm, and the flow velocity of Water projectile is regulated by the pressure of pump.
In the present invention, described chemical system comprises chemical liquid, self-powered platform, hand-operated wheel, and the last major part of slag of material is all by chemical liquid corrosion.
In the present invention, after the while of described laser beam and Water projectile, rapidoprint terminates, rotate self-powered platform, the material processed can immerse in chemical liquid completely.
In the present invention, rotate clockwise hand-operated wheel, self-powered platform moves down, and rotates counterclockwise hand-operated wheel, and self-powered platform moves up.
In the present invention, the concentration of described chemical solution is 40 ~ 80%.
In the present invention, carry out the method for water jet auxiliary laser chemical etching according to described device, comprise the following steps:
(1) scantling and Working position, is determined;
(2), the preliminary etachable material surface of water jet auxiliary laser;
(3) slag, in chemical attack cutting.
The beneficial effect that the present invention has:
(1) water jet device is very simple, and cost is low, and water jet pressure is little, little to material surface damage;
(2) souring of water jet can reduce slag, the reduction recast layer thickness of a part of material surface;
(3) high-energy of laser can realize quick etachable material, obtains required groove;
(4) utilize chemical attack effect, effectively reduce material surface slag;
(5) utilize laser, water jet, chemical liquid three acting in conjunction, good processing effect can be obtained.
Accompanying drawing illustrates:
The structure drawing of device of Fig. 1 needed for processing method of the present invention.
Wherein: 1, stationary work-table; 2, chemical liquid 3, self-powered platform; 4, material; 5, hand-operated wheel; 6, laser head; 7, assist gas oxygen; 8, laser beam; 9, speculum; 10, Water projectile; 11, syringe needle; 12, nozzle; 13, spray gun; 14, pump; 15, water pipe; 16, water tank; 17, V band; 18, motor
Fig. 2 is the flow chart of a kind of water jet auxiliary laser chemical etching of the invention process.
Detailed description of the invention:
In order to enable technical scheme of the present invention more clearly show, below in conjunction with accompanying drawing, the invention will be further described.
Refer to Fig. 1, a kind of device of water jet auxiliary laser chemical etching, comprising:
(1) laser system;
(2) water jet system;
(3) chemical system.
Laser system comprises speculum (9), laser beam (8), assist gas oxygen (7), laser head (6), the current strength of laser is 120 ~ 200A, pulse width is 0.4 ~ 1.8ms, pulse recurrence frequency is 20 ~ 50HZ, defocusing amount is 1 ~ 3mm, laser scanning speed is 0.6 ~ 1.5mm/s, and the laser beam (8) that described laser system produces finally sends from laser head (6).
The Water projectile (10) of water jet system and the angle of laser beam (8) are 5 ~ 80 °, the diameter of Water projectile is 6 ~ 9mm, the flow velocity of Water projectile is regulated by the pressure of pump (14), be generally 12m/s more reasonable, rational water jet flow velocity can reduce energy loss on the one hand effectively, on the other hand, slag can be reduced to greatest extent.
Chemical system comprises chemical liquid (2), the concentration of chemical solution is 40 ~ 80%, self-powered platform (3), hand-operated wheel (5), after the while of laser beam and Water projectile, rapidoprint terminates, rotate clockwise hand-operated wheel, self-powered platform moves down, and the material processed can immerse in chemical liquid completely, after chemical reaction a period of time, rotate counterclockwise hand-operated wheel, self-powered platform moves up, and finally takes out material.
In actual application, consult flow chart shown in Fig. 2: the W18Cr4v high-speed steel plate being of a size of 50x50x1mm for laser ablation, labor is carried out to etch step of the present invention.
Specific implementation step is as follows:
(1) scantling and Working position is determined
The W18Cr4v high-speed steel plate being of a size of 50x50x1mm is fixed on self-powered platform (3), and Working position is the center of high-speed steel just.
(2) the preliminary etachable material surface of water jet auxiliary laser
Normal startup air switch and laser instrument open the light, and laser instrument is the Nd of 500W
3+: YAG laser, the current strength of laser instrument is adjusted to 160A, and pulse width is adjusted to 0.6ms, and pulse recurrence frequency is adjusted to 30HZ, and defocusing amount is adjusted to 0.8mm, and assist gas oxygen (7) pressure is adjusted to 4MPa.
Open water fluidic system, motor (18) being run well, by regulating the pressure of pump (14), finally water jet flow velocity being defined as 12m/s, water jet diameter is 0.6mm, and Water projectile (10) is 60 ° with the angle of laser beam (8).
Determine that the sweep speed of laser is 1.0mm/s, laser and water jet scan according to predefined paths simultaneously.
Preparatory processing terminates
(3) slag in chemical attack cutting
Rotate clockwise hand-operated wheel (5), self-powered platform (3) moves down, until W18Cr4v high-speed steel plate immerses in chemical liquid (2) HCL solution completely, after chemical reaction a period of time, rotate counterclockwise hand-operated wheel (5), self-powered platform (3) moves up.
Process all terminates.
Required groove can be etched easily by above-mentioned steps, by water jet system and chemical system, both improve the speed of etching, and in turn ensure that the suface processing quality of product.
The above only have expressed one embodiment of the present invention, and its statement is relatively more detailed, but cannot be interpreted as the restriction to the utility model the scope of the claims.It should be noted that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, any type of amendment can also be done.Therefore, the protection domain of patent of the present invention should based on claims.
Claims (8)
1. a device for water jet auxiliary laser chemical etching, is characterized in that, comprises laser system, water jet system, chemical system.
2. the device of water jet auxiliary laser chemical etching according to claim 1, it is characterized in that, described laser system comprises speculum (9), laser beam (8), assist gas oxygen (7), laser head (6), the current strength of laser is 120 ~ 200A, pulse width is 0.4 ~ 1.8ms, pulse recurrence frequency is 20 ~ 50HZ, defocusing amount is 1 ~ 3mm, laser scanning speed is 0.6 ~ 1.5mm/s, and the laser beam that described laser system produces finally sends from laser head.
3. the device of water jet auxiliary laser chemical etching according to claim 1, it is characterized in that, the Water projectile (10) of described water jet system and the angle of laser beam (8) are 5 ~ 80 °, the diameter of Water projectile is 6 ~ 9mm, and the flow velocity of Water projectile is regulated by the pressure of pump (14).
4. the device of water jet auxiliary laser chemical etching according to claim 1, it is characterized in that, described chemical system comprises chemical liquid (2), self-powered platform (3), hand-operated wheel (5), and the last major part of slag of material (4) is all by chemical liquid corrosion.
5. the device of water jet auxiliary laser chemical etching according to claim 1, is characterized in that, after the while of described laser beam and Water projectile, rapidoprint terminates, rotate self-powered platform, the material processed can immerse in chemical liquid completely.
6. the device of water jet auxiliary laser chemical etching according to claim 1, it is characterized in that, rotate clockwise hand-operated wheel, self-powered platform moves down, and rotates counterclockwise hand-operated wheel, and self-powered platform moves up.
7. the device of water jet auxiliary laser chemical etching according to claim 1, is characterized in that, the concentration of described chemical solution is 40 ~ 80%.
8. device according to claim 1 carries out the method for water jet auxiliary laser chemical etching, it is characterized in that, comprises the following steps: (1), determine scantling and Working position; (2), the preliminary etachable material surface of water jet auxiliary laser; (3) slag, in chemical attack cutting.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410635562.3A CN104439710B (en) | 2014-11-07 | 2014-11-07 | Water jet assisted laser chemical etching device and method |
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| CN201410635562.3A CN104439710B (en) | 2014-11-07 | 2014-11-07 | Water jet assisted laser chemical etching device and method |
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| CN104439710A true CN104439710A (en) | 2015-03-25 |
| CN104439710B CN104439710B (en) | 2017-02-15 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105689900A (en) * | 2016-04-05 | 2016-06-22 | 江南大学 | Machining method and device for water-assisted cooling and laser cutting of CFRP (carbon fiber reinforced plastics) |
| CN106216837A (en) * | 2016-08-25 | 2016-12-14 | 南京先进激光技术研究院 | A kind of method of the multilayer material of separation by laser OCA optical cement laminating |
| CN106271119A (en) * | 2016-09-30 | 2017-01-04 | 广东工业大学 | The ceramic boring method of a kind of liquid auxiliary laser and hole-drilling system |
| CN110202277A (en) * | 2019-04-25 | 2019-09-06 | 青岛理工大学 | A kind of blade of aviation engine air film hole processing device and working method |
| CN111167803A (en) * | 2019-12-14 | 2020-05-19 | 上海航翼高新技术发展研究院有限公司 | Laser wet cleaning method and device |
| CN113290386A (en) * | 2021-05-10 | 2021-08-24 | 长春理工大学 | Laser/ultrasonic composite low-damage complex microstructure machining device and method for stable flow area |
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| US20030150839A1 (en) * | 2002-02-05 | 2003-08-14 | Fumitoshi Kobayashi | Glass substrate with fine hole and method for producing the same |
| CN101913065A (en) * | 2010-08-26 | 2010-12-15 | 叶淦波 | Etching method of metal micro-holes |
| CN102530852A (en) * | 2012-03-06 | 2012-07-04 | 中国科学院上海光学精密机械研究所 | Method for fabricating three-dimensional optical echo wall mode micro-cavity by using femtosecond laser |
| CN102785025A (en) * | 2012-06-21 | 2012-11-21 | 西安交通大学 | Method for enhancing chemical etching through femtosecond laser to manufacture large-scale micro-lens array |
| CN103317234A (en) * | 2012-03-22 | 2013-09-25 | 江南大学 | Laser induced low pressure jet flow combined etching processing method and device |
| CN103831540A (en) * | 2014-02-20 | 2014-06-04 | 江南大学 | Laser composite punching method for ceramics |
| CN204366265U (en) * | 2014-11-07 | 2015-06-03 | 江南大学 | A kind of device of water jet auxiliary laser chemical etching |
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2014
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| US20030150839A1 (en) * | 2002-02-05 | 2003-08-14 | Fumitoshi Kobayashi | Glass substrate with fine hole and method for producing the same |
| CN101913065A (en) * | 2010-08-26 | 2010-12-15 | 叶淦波 | Etching method of metal micro-holes |
| CN102530852A (en) * | 2012-03-06 | 2012-07-04 | 中国科学院上海光学精密机械研究所 | Method for fabricating three-dimensional optical echo wall mode micro-cavity by using femtosecond laser |
| CN103317234A (en) * | 2012-03-22 | 2013-09-25 | 江南大学 | Laser induced low pressure jet flow combined etching processing method and device |
| CN102785025A (en) * | 2012-06-21 | 2012-11-21 | 西安交通大学 | Method for enhancing chemical etching through femtosecond laser to manufacture large-scale micro-lens array |
| CN103831540A (en) * | 2014-02-20 | 2014-06-04 | 江南大学 | Laser composite punching method for ceramics |
| CN204366265U (en) * | 2014-11-07 | 2015-06-03 | 江南大学 | A kind of device of water jet auxiliary laser chemical etching |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105689900A (en) * | 2016-04-05 | 2016-06-22 | 江南大学 | Machining method and device for water-assisted cooling and laser cutting of CFRP (carbon fiber reinforced plastics) |
| CN106216837A (en) * | 2016-08-25 | 2016-12-14 | 南京先进激光技术研究院 | A kind of method of the multilayer material of separation by laser OCA optical cement laminating |
| CN106271119A (en) * | 2016-09-30 | 2017-01-04 | 广东工业大学 | The ceramic boring method of a kind of liquid auxiliary laser and hole-drilling system |
| CN110202277A (en) * | 2019-04-25 | 2019-09-06 | 青岛理工大学 | A kind of blade of aviation engine air film hole processing device and working method |
| WO2020215716A1 (en) * | 2019-04-25 | 2020-10-29 | 青岛理工大学 | Aero-engine blade film hole processing apparatus and working method |
| CN111167803A (en) * | 2019-12-14 | 2020-05-19 | 上海航翼高新技术发展研究院有限公司 | Laser wet cleaning method and device |
| CN113290386A (en) * | 2021-05-10 | 2021-08-24 | 长春理工大学 | Laser/ultrasonic composite low-damage complex microstructure machining device and method for stable flow area |
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|---|---|
| CN104439710B (en) | 2017-02-15 |
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Granted publication date: 20170215 Termination date: 20171107 |