CN104427422A - Electronic unit used for a microphone unit, the microphone unit, tool used for manufacturing the electronic unit and method for manufacturing the microphone unit - Google Patents
Electronic unit used for a microphone unit, the microphone unit, tool used for manufacturing the electronic unit and method for manufacturing the microphone unit Download PDFInfo
- Publication number
- CN104427422A CN104427422A CN201410441810.0A CN201410441810A CN104427422A CN 104427422 A CN104427422 A CN 104427422A CN 201410441810 A CN201410441810 A CN 201410441810A CN 104427422 A CN104427422 A CN 104427422A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- osculating element
- microphone
- unit
- electronic unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000005219 brazing Methods 0.000 claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims description 12
- 238000005476 soldering Methods 0.000 claims description 10
- 230000004308 accommodation Effects 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims 2
- 238000009434 installation Methods 0.000 claims 1
- 239000002775 capsule Substances 0.000 abstract 3
- 238000010586 diagram Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/222—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only for microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/13—Acoustic transducers and sound field adaptation in vehicles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Telephone Set Structure (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention relates to an electronic unit used for a microphone unit, the microphone unit, a tool used for manufacturing the electronic unit and a method for manufacturing the microphone unit. Here, the electronic unit comprises a microphone capsule, other electronic components, a circuit board and an at least two-core contact unit, wherein the contact unit comprises connecting contacts for making contact with the circuit board, wherein the microphone capsule is arranged on the upper surface or on the bottom surface of the circuit board, wherein the connection contacts of the contact unit penetrate the circuit board from the top to the bottom or penetrate reversely, wherein the connecting contacts of the contact unit and designed to be plug-in members, the connecting contacts of the microphone capsule and designed to be SMD components and connecting contacts of other electronic components are soldered on the circuit board through a surface brazing technique.
Description
Technical field
The present invention relates to a kind of electronic unit for microphone unit according to claim 1,3,7 or 8, a kind of microphone unit, a kind of apparatus for the manufacture of electronic unit (Nutzen) and a kind of method for the manufacture of microphone unit.
Background technology
The microphone unit of microphone jacket (Mikrofonkapsel), circuit board and shell is comprised by the known one of CN 202 218 364 U.
Summary of the invention
The object of the invention is to, a kind of electronic unit for microphone unit or a kind of microphone unit or a kind of apparatus for the manufacture of electronic unit or a kind of method for the manufacture of microphone unit are improved,
-wherein, although electronic unit is equipped with circuit board all sidedly in top side and bottom side, can be handled by grabber, for automatically manufacturing microphone unit;
-wherein, microphone unit however still can by plug multiple-contact, and wherein, microphone unit is suitable for being installed to may occurring in the roof of dew of automobile;
-wherein, this apparatus is suitable for reliably installing osculating element;
-wherein, can automatically assemble microphone unit economically.
Electronic unit for microphone unit of the present invention comprises microphone jacket, other electronic device, the osculating element of circuit board and at least twin-core, wherein, this osculating element comprises the connection contact for contact circuit plate, wherein, on the end face that microphone jacket is arranged on this circuit board or bottom surface, wherein, the connection contact of osculating element penetrates circuit board arrives circuit board bottom surface from the end face of circuit board, or the end face of circuit board is arrived from the bottom surface of circuit board, wherein, be designed to the connection contact of the osculating element of plug device, the connection contact of the connection contact and other electronic device that are designed to the microphone jacket of SMD device adopts surperficial soldering processes to be soldered on circuit board.Generation device complex thus, this complex and osculating element comprise a kind of device, this device as pure electricity and (elektronikfrei) device without electronics has durability, this device due to its durability, and is suitable as automated active position due to the repeatedly brazing with circuit board.
In addition specify, osculating element is equipped with the main body that carry and connect contact, and this main body is provided with operator region, and grabber can capture whole electronic unit by this operator region.Utilize this operator region can realize automatically operating electronic unit easily, and the danger of the electronic device injuring electronic unit can not be produced.
Microphone unit of the present invention comprises a kind of electronic unit according to claim 1 and 2 and a kind of shell, wherein, the main body of osculating element comprises flange portion, wherein, electronic unit is connected with shell, remain in this shell to form fit when making electronic unit install microphone unit on the flange portion of its osculating element, thus the plug contact of the osculating element of electronic unit can with Plug contact, and the brazing between osculating element and circuit board can not be made to bear mechanical load.By osculating element, electronic unit is suspended in shell, can realizes like this making circuit board avoid the load of machinery, just there will be described load in the plug contact of osculating element by Plug contact or with during its disengaging.
Circuit board and the microphone jacket arranged thereon and layout other electronic device are thereon arranged in the inner chamber of the peripheral containment be made up of shell upper, outer casing underpart and osculating element main body; so; be configured with in the voice channel situation of under shed in outer casing underpart, just protect the water droplet that all electronic devices being arranged in this inner chamber avoid vertically falling.
Apparatus of the present invention comprises at least four circuit boards, wherein, this apparatus has notch, the quantity of notch at least equals the quantity of circuit board, wherein, each circuit board is equipped with at least one notch, wherein, this apparatus can assemble the osculating element of at least twin-core, the quantity of osculating element equals the quantity of circuit board, wherein, each osculating element comprises the connection contact treating to be connected with circuit board, can with the plug contact of Plug contact and the main body that carry these contacts, wherein, in order to implement surperficial soldering processes, each osculating element is supported on relevant circuit board with the first abutment face, and be supported on the region adjacent with circuit board of apparatus with the second abutment face, thus the connection contact treating to be connected with circuit board of osculating element is correctly located relative to circuit board in order to brazing process.Osculating element is supported on apparatus in this way, the framework that this apparatus is comprised circuit board and maintained by circuit board by edge strip, this makes it possible to reliably and exactly aligned contact unit, this is because the moment of torsion produced by the gravity of osculating element in correct position is born by apparatus.
Method for the manufacture of microphone unit of the present invention comprises the steps: the osculating element assembling the microphone jacket being configured to SMD device and at least twin-core being configured to plug device to each circuit board of apparatus; Adopt surperficial soldering processes that these devices are soldered on circuit board; The electronic unit be made up of circuit board, microphone jacket, osculating element and other electronic device respectively separately; Grabber is utilized to pick up each electronic unit; Electronic unit is loaded in the outer casing underpart of shell, between the osculating element flange portion constructed in osculating element main body in this case and the flange accommodation section of outer casing underpart, carry out the connection of the form fit of bidimensional; Shell upper is inserted on outer casing underpart, thus by shell seal, between the flange portion and shell of osculating element, carries out the connection of three-dimensional form fit in this case.Because each method step can be implemented with common operating mechanism, so adopt the method can manufacture microphone unit inexpensively economically.
Accompanying drawing explanation
Other details of the present invention will be introduced by the embodiment schematically shown in the accompanying drawings.
Wherein:
Fig. 1 is the three-dimensional exploded view of microphone unit of the present invention and adapter base, and microphone unit can be fixed on adapter base;
Fig. 2 is the stereogram in the assembled state of the microphone unit shown in Fig. 1;
Fig. 3 is the schematic diagram of the electronic unit of the microphone unit illustrated in fig 1 and 2;
Fig. 4 is the schematic diagram of the first Variant Design of apparatus of the present invention;
Fig. 5 illustrates the local of the second Variant Design of apparatus of the present invention;
The different views of the larger section that Fig. 6-10 is the apparatus shown in Fig. 5.
Embodiment
Figure 1 shows that the three-dimensional exploded view of microphone unit 1 of the present invention.Also show adapter base 501 in the below of microphone unit 1, microphone unit 1 can be fixed on this adapter base.
Microphone unit 1, except comprising electronic unit 2, also comprises shell 3.Electronic unit 2 comprises microphone jacket 4(and sees Fig. 3), the osculating element 8 of other electronic device, circuit board 7 and twin-core that symbolically represents with the device 5 and 6 schematically shown.Connection contact 8a, 8b(that osculating element 8 comprises for contact circuit plate 7 are shown in Fig. 3), also comprise plug contact 8c and 8d, electronic unit 2 and unshowned Plug contact can be made by these plug contact, such as, be connected with the hands-free telephone device of automobile.Microphone jacket 4 is arranged on the end face 7a of circuit board 7.Connection contact 8a, 8b of osculating element 8 pass from the bottom surface 7b of circuit board 7 the end face 7a that circuit board 7 arrives circuit board 7.Be designed to connection contact 8a, the 8b of the osculating element 8 of plug device 9, the unshowned connection contact of connection contact 4a, the 4b being designed to the microphone jacket 4 of SMD device 10 and other electronic device 5,6 adopts surperficial soldering processes for end face 7a and adopt surperficial soldering processes to be soldered on circuit board 7 for bottom surface 7b.
Shell 3 comprises outer casing underpart 3a and shell upper 3b.Outer casing underpart 3a is configured with adapter 11(also see Fig. 2), wherein, the surperficial 11a of adapter 11 has structure 12, and this structure matching, in adapter base 501, makes microphone unit 1 be carried by this adapter base by frictional fit after aligning is inserted in adapter base 501.Outer casing underpart 3a is a kind of bicomponent injection molding part, and has the sealing mechanism 14 of similar annular towards microphone jacket 4 on medial surface 13, and sealing mechanism is made up of the plastics of the outer casing underpart 3a softness than remainder.Socket (Eingang) 15(that sealing mechanism 14 surrounds microphone jacket 4 under the assembled state of microphone unit 1 is shown in Fig. 3), thus the sound wave that the voice channel 16 via outer casing underpart 3a inputs is imported in microphone jacket 4.At this, voice channel 16 is made up of adapter 11.
Can see in schematic diagram 3, osculating element 8 comprises main body 17, this main body carries and connects contact 8a, 8b and plug contact 8c, 8d, main body 17 has the operator region 18 being configured to suction face 19, in this suction face, electronic unit 2 can be captured by unshowned grabber, and this grabber is such as configured to suction-type gripper.In this embodiment, what operator region 18 was configured to plane is parallel to the end face 7a of circuit board 7 or the suction face 19 of bottom surface 7b.
As seen from Figure 1, the main body 17 of osculating element 8 comprises the flange portion 20 of side direction projection.The medial surface 13 of outer casing underpart 3a is configured with the flange accommodation section 21 of pit shaft form, flange portion 20 can be inserted in this flange accommodation section by z in the direction of the arrow, this flange portion is connected with shell 3 or outer casing underpart 3a, thus on direction in space x and y, electronic unit 2 form fit is maintained.Shell upper 3b to be inserted on outer casing underpart 3a, thus closure 3, so just can to allow the z ' movement in the direction of the arrow of main body 17 or flange portion 20, its flange accommodation section 21 is closed by shell upper 3b.In order to avoid shell upper 3b and outer casing underpart 3a and undesirable get loose, two housing parts 3a, 3b have the first locking mechanism 22,23 and second locking mechanism 24,25 at opposite side, utilize these locking mechanisms that housing parts 3a, 3b can be made to connect to form fit in kayser process.After shell 3 is closed, just forbid that main body 17 is relative to shell 3 relative movement on all three direction in spaces x, y and z, thus when unshowned plug is inserted on plug contact 8c, 8d, the power worked in this case is exported to shell 3 from main body 17, and circuit board 7 and the electronic device arranged thereon are not loaded.
Under the assembled state of microphone unit 1, defined the inner chamber 26 of peripheral containment by the main body 17 of shell upper 3b, outer casing underpart 3a and osculating element 8.Circuit board 7, microphone jacket 4 is thereon set and other electronic device 5,6 be arranged on this circuit board 7 is contained in described inner chamber by comprehensive surrounding; and be subject to the protection being designed to the shell upper 3b including device in the region of inner chamber 26, in case vertically in the direction of the arrow z drippage water droplet.
It is the schematic vertical view of the first Variant Design of apparatus 101 of the present invention shown in Fig. 4.This apparatus comprises eight circuit boards 102 ~ 109 and a framework 110, and these circuit boards keep on said frame respectively by three edge strips 111,112 and 113.At framework 110, circuit board 102 ~ 109 and edge strip 111, between 112 and 113, around each circuit board 102 ~ 109, be respectively equipped with three notches 114,115 and 116.These notches 114 ~ 116 are convenient to each circuit board 102 ~ 109 and are taken out from apparatus 101, because only have edge strip 111 ~ 113 to need thorough milling (durchfr sen).Notch 114 is also soldered to unshowned in the diagram osculating element on circuit board for taking out surperficial soldering processes to be employed.In order to the deployment scenarios of osculating element 8 on apparatus is described, in figure 3 except circuit board 7 is shown, also show the framework 110 of apparatus 101 partly, described circuit board is the device corresponding to circuit board shown in Figure 4 102.Can see osculating element 8 how to utilize the first abutment face 27 to be supported in associated circuit board 7 or 102 and utilizes the second abutment face 28 to be supported on the region adjacent with circuit board 7 or 102 of apparatus 101 or framework 110 in figure 3.Connection contact 8a, 8b for the treatment of to be connected with circuit board 7 or 102 of osculating element 8 is made correctly to locate relative to circuit board 7 or 102 in order to brazing process thus.For ease of understanding, schematically show osculating element 8 with dotted line in the diagram.
It is the local of the second Variant Design of apparatus 201 of the present invention shown in Fig. 5.In order to be described, the osculating element 8 known by Fig. 1 ~ 2 is inserted in the notch 214 of apparatus 201.Can see in this stereogram the main body 17 of osculating element 8 how to be supported on the framework 210 of apparatus 201 and circuit board 202.
It is the vertical view of the larger section of the apparatus 201 illustrated partly in Figure 5 when plugging osculating element 8 shown in Fig. 6.
It is the stereogram of Fig. 6 shown in Fig. 7.
It is the upward view of Fig. 6 shown in Fig. 8.Also can see the microphone jacket 4 be arranged on the end face 7a of circuit board 202 in the figure.Connection contact 8a and 8b penetrating circuit board 202 of osculating element 8 can be seen in addition.
It is the partial view intercepted along the direction of arrow Ⅸ shown in Figure 7 of apparatus 201 shown in Fig. 9.
It is the partial view intercepted along the direction of arrow Ⅹ shown in Figure 7 of apparatus 201 shown in Figure 10.
According to a kind of Variant Design, surperficial soldering processes are implemented in reflow ovens.
The present invention is not limited to shown or described embodiment.Exactly, the present invention is contained and is improved according to the invention of claim.
List of numerals
1 microphone unit
2 electronic units
3 shells
3a outer casing underpart
3b shell upper
4 microphone jackets
The connection contact of 4a, 4b 4
5,6 electronic devices
7 circuit boards
The end face of 7a 7
The bottom surface of 7b 7
8 osculating elements
The connection contact of 8a, 8b 8
The plug contact of 8c, 8d 8
9 plug device
10 SMD devices
Adapter on 11 3a
The structure of 12 11
The medial surface of 13 3a
Sealing mechanism on 14 3a
The socket of 15 4
Voice channel in 16 3a
The main body of 17 8
Operator region on 18 8
Suction face on 19 8
Flange portion on 20 8
Flange accommodation section on 21 3a
22, the locking mechanism on 23 3a, 3b
24, the locking mechanism on 25 3a, 3b
The inner chamber closed of 26 3
27, the abutment face of 28 17 or 8
101 apparatus
102-109 circuit board
110 frameworks
111-113 edge strip
114-116 notch
201 apparatus
202 circuit boards
210 frameworks
214 notches
501 adapter bases
X direction in space
Y direction in space
Z, z ' direction in space
Claims (13)
1. the electronic unit for microphone unit (1) (2), comprising:
-microphone jacket (4);
-other electronic device (5,6);
-circuit board (7; 102-109; 202); With
The osculating element (8) of-at least twin-core,
-wherein, this osculating element (8) comprises for contact circuit plate (7; 102-109; 202) connection contact (8a, 8b),
-wherein, microphone jacket (4) is arranged on this circuit board (7; 102-109; 202) on end face (7a) or bottom surface (7b),
-wherein, the connection contact (8a, 8b) of osculating element (8) penetrates circuit board (7; 102-109; 202) arrive bottom surface (7b) from end face (7a), or arrive end face (7a) from bottom surface (7b),
-wherein, the connection contact (8a, 8b) being designed to the osculating element (8) of plug device (9), the connection contact (4a, 4b) of microphone jacket (4) being designed to SMD device (10) and the connection contact of other electronic device (5,6) adopt surperficial soldering processes to be soldered to circuit board (7; 102-109; 202) on.
2. electronic unit (2) as claimed in claim 1, it is characterized in that, osculating element (8) comprises the main body (17) that carry and connect contact (8a, 8b), this main body (17) has operator region (18) particularly suction face (19), grabber particularly suction-type gripper can capture electronic unit (2) by this suction face, wherein, what operator region (18) was particularly configured to plane is parallel to circuit board (7; 102-109; 202) end face (7a) or the suction face (19) of bottom surface (7b).
3. a microphone unit (1), comprises the electronic unit (2) any one of aforementioned claim and shell (3),
-wherein, the main body (17) of osculating element (8) comprises flange portion (20),
-wherein, electronic unit (2) is connected with shell (3), remain in this shell (3) to form fit when making electronic unit (2) install microphone unit (1) on the flange portion (20) of its osculating element (8), thus the plug contact (8c, 8d) of the osculating element (8) of electronic unit (2) can with Plug contact, and osculating element (8) and circuit board (7 can not be made; 102-109; 202) brazing between bears mechanical load.
4. microphone unit (1) as claimed in claim 3, it is characterized in that, outer casing underpart (3a) comprises adapter (11), this adapter can be connected with the adapter base (501) arranged in the car, wherein, the surface of adapter (11) particularly has structure (12) especially helicitic texture, utilizes this structure (to produce frictional fit between 49 and adapter base (501) at microphone unit, microphone unit (4) can be positioned on adapter base (501) in different positions thus.
5. the microphone unit (1) as described in claim 3 or claim 3 and 4, it is characterized in that, outer casing underpart (3a) comprises the sealing mechanism (14) of similar annular on medial surface (13) towards microphone jacket (4), sealing mechanism surrounds the socket (15) of microphone jacket (4), thus the sound wave that the voice channel (16) via outer casing underpart (3a) inputs is imported in microphone jacket (4).
6. the microphone unit (1) as described in claim 3 or claim 3 and 4 or claim 3,4 and 5, it is characterized in that, the inner chamber (26) of peripheral containment is formed by the main body (17) of shell upper (3b), outer casing underpart (3a) and osculating element (8), in outer casing underpart (3a), the voice channel (16) of structure is under shed, circuit board (7; 102-109; 202), arrange microphone jacket (4) thereon and other be arranged in circuit board (7; 102-109; 202) electronic device on is contained in described inner chamber, is protected thus and avoids the water droplet that vertically falls.
7. an apparatus (101; 201) at least four circuit boards (7, are comprised; 102-109; 202),
-wherein, this apparatus (101; 201) there is notch (114-116; 214), the quantity of notch at least equals circuit board (7; 102-109; 202) quantity,
-wherein, each circuit board (7; 102-109; 202) at least one notch (114-116 is all equipped; 214),
-wherein, this apparatus (101; 201) can assemble the osculating element (8) of at least twin-core, the quantity of osculating element equals circuit board (7; 102-109; 202) quantity,
-each osculating element (8) comprises to be treated and circuit board (7; 102-109; 202) the connection contact (8a, 8b) connected, can with the plug contact of Plug contact (8c, 8d) and the main body (17) that carry described contact (8a-8d),
-in order to implement surperficial soldering processes, at circuit board (7; 102-109; 202), on, each osculating element (8) is supported on relevant circuit board (7 with the first abutment face (27); 102-109; 202) on, and apparatus (101 is supported on the second abutment face (28); 201) with circuit board (7; 102-109; 202) adjacent region (110; 210) on, thus the treating and circuit board (7 of osculating element (8); 102-109; 202) the connection contact (8a, 8b) connected in order to brazing process relative to circuit board (7; 102-109; 202) correctly locate.
8., for the manufacture of a method for microphone unit (1), there are following steps:
-to apparatus (101; 201) each circuit board (7; 102-109; 202) assembling is configured to the microphone jacket (4) of SMD device (10) and is configured to the osculating element (8) of at least twin-core of plug device (9);
-adopt surperficial soldering processes described device (4; 8) circuit board (7 is soldered to; 102-109; 202) on;
-comprising circuit board (7 respectively; 102-109; 202), microphone jacket (4), osculating element (8) and particularly other electronic device (5,6) electronic unit (1) separately;
-utilize grabber to pick up each electronic unit (1);
-electronic unit (1) is loaded in the outer casing underpart (3a) of shell (3), between osculating element (8) flange portion (20) and the flange accommodation section (21) of outer casing underpart (3a) of the upper structure of osculating element (8) main body (17), carry out the connection of the form fit of bidimensional in this case;
-shell upper (3b) is inserted on outer casing underpart (3a), thus shell (3) is closed, between the flange portion (20) and shell (3) of osculating element (8), carry out the connection of three-dimensional form fit in this case.
9. method as claimed in claim 8, is characterized in that, by separation process particularly milling process to circuit board (7; 102-109; 202) carry out separately, wherein, making each circuit board (7; 102-109; 202) with apparatus (101; 201) framework (110; 210) edge strip (111-113) connected separately.
10. the method as described in claim 8 or claim 8 and 9, is characterized in that, before separation process or period or afterwards, the electronic unit separated (2) is contained in transport box.
11. methods as described in item at least one in pre---ceding method claims, it is characterized in that, grabber is designed to suction-type gripper, the operator region (18) by the main body (17) of osculating element (8) captures electronic unit (1).
12. methods as described in item at least one in pre---ceding method claims, is characterized in that, from the circuit board (7 of assembling; 102-109; 202) with apparatus (101; 201) framework (110; 210) be separated, to plugging shell upper (3b), whole installation steps are all thoroughly fully automatically carried out.
13. methods as described in item at least one in pre---ceding method claims, is characterized in that, after closure (3), the plug contact of osculating element (8) (8c, 8d) is contacted automatically with plug.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013014526.0 | 2013-09-03 | ||
| DE102013014526.0A DE102013014526B4 (en) | 2013-09-03 | 2013-09-03 | Electronics unit for a microphone unit, microphone unit and method for producing a microphone unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104427422A true CN104427422A (en) | 2015-03-18 |
| CN104427422B CN104427422B (en) | 2018-04-17 |
Family
ID=52470022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410441810.0A Active CN104427422B (en) | 2013-09-03 | 2014-09-02 | For the electronic unit of microphone unit, microphone unit, the apparatus for manufacturing electronic unit and the method for manufacturing microphone unit |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104427422B (en) |
| DE (1) | DE102013014526B4 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110536211A (en) * | 2018-05-25 | 2019-12-03 | 哈曼贝克自动系统股份有限公司 | Sightless inside roof lining microphone |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015108945A1 (en) | 2015-06-08 | 2016-12-08 | Peiker Acustic Gmbh & Co. Kg | Method for producing a microphone unit and microphone unit |
| US11336974B2 (en) | 2019-12-30 | 2022-05-17 | Harman Becker Automotive Systems Gmbh | Invisible microphone assembly for a vehicle |
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Also Published As
| Publication number | Publication date |
|---|---|
| DE102013014526B4 (en) | 2021-08-05 |
| CN104427422B (en) | 2018-04-17 |
| DE102013014526A1 (en) | 2015-03-05 |
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