CN104375597A - Server - Google Patents
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- Publication number
- CN104375597A CN104375597A CN201410690789.8A CN201410690789A CN104375597A CN 104375597 A CN104375597 A CN 104375597A CN 201410690789 A CN201410690789 A CN 201410690789A CN 104375597 A CN104375597 A CN 104375597A
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- CN
- China
- Prior art keywords
- motherboard assembly
- fans
- side plate
- those
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention provides a server. The server comprises a case, multiple mainboard assemblies and multiple fans. The case comprises a bottom plate, a first side plate and a second side plate. The first side plate and the second side plate are connected to the two opposite side edges of the bottom plate respectively. A containing space is defined by the bottom plate, the first side plate and the second side plate jointly. The mainboard assemblies are arranged in the containing space on at least two layers and installed in the case in a slidable mode. The fans are located in the containing space and located on the same sides of the mainboard assemblies. The intervals between at least part of the fans and the bottom plate are kept different.
Description
Technical field
The present invention relates to a kind of server, particularly a kind of server with the fan group of different level height.
Background technology
Compared to personal computer (as: desk-top computer, mobile computer ... etc.), server computer has more powerful arithmetic capability, simultaneously because server computer applies to the fields such as business, finance is even meteorological, military mostly, its fiduciary level is more confidential than individual calculus higher with the requirement of stability.Therefore server computer is in the design of software and hardware, can be more harsh than personal computer.
With 2U server, 2U server has the radiator fan of double-layer mainframe plate and respective hosts plate.The assembly and disassembly being beneficial to motherboard in casing are located at slidably by these motherboards, and these radiator fans dispel the heat to these motherboards in order to produce radiating airflow.When have in server wherein a motherboard generation problem time, can service consumer be continued to allow the motherboard of all the other no problems.Maintenance personal generally can not close whole station server, and in the process of server running, directly replaces the motherboard having problem.But in the replacement process of motherboard, destroy casing internal airflow field originally because the motherboard damaged is pulled out casing, the radiating airflow making these fans produce easily concentrates the position of depositing flowing through the motherboard be originally pulled out.Thus, these fans fall apart and then cannot play original heat-sinking capability to the motherboard of all the other no problems, and then the risk causing the working temperature of all the other motherboards to raise and have assembly to damage.
Summary of the invention
The object of the present invention is to provide a kind of server, use and allow when the motherboard damaged is pulled out casing and destroys the airflow field of casing internal script, these fans can also play the heat-sinking capability of original motherboard to all the other no problems, and then the problem of the risk avoided the working temperature of all the other motherboards to raise and have assembly to damage.
For solving the problems of the technologies described above, the invention provides a kind of server, comprising a casing, multiple motherboard assembly and multiple fan.Casing comprises a base plate, one first side plate and one second side plate.First side plate and the second side plate are connected to the relative both side edges of base plate.Base plate, the first side plate and the second side plate are jointly around an accommodation space.These motherboard assemblies are arranged in accommodation space with at least double-deck arrangement mode, and are installed in casing slidably.These fans are positioned at accommodation space, and are positioned at the same side of these motherboard assemblies.At least part of fan and base plate keep different spacing.
Server disclosed by the invention described above, because these fans are positioned at the same side of these motherboard assemblies, these fans and base plate keep different spacing (namely to arrange along " V " font, or " V " font arrangement), these first fans are made to protrude from the height of the root edge of the 3rd motherboard assembly different, and to protrude from the height of the root edge of the 3rd motherboard assembly different with these second fans, therefore when at least one motherboard assembly is pulled out casing, the air-flow that these fans produce can form flow-disturbing in accommodation space, dispersible with the air-flow forcing these fans to produce and flow through each motherboard assembly, and then significantly can promote radiating airflow that these fans the produce heat-sinking capability for all the other motherboard assemblies.
Above about the explanation of content of the present invention and the explanation system of following embodiment in order to demonstration with explain principle of the present invention, and provide patent claim of the present invention further to explain.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of server described according to a first embodiment of the present invention.
Fig. 2 is the schematic rear view of the 1st figure.
Fig. 3 is the schematic perspective view that the server of the 1st figure takes out a wherein motherboard assembly.
Fig. 4 is the schematic rear view of the 3rd figure.
Fig. 5 is the schematic perspective view of server described according to a second embodiment of the present invention.
Fig. 6 is the schematic rear view of the 5th figure.
Embodiment
Below in conjunction with the drawings and specific embodiments, the server that the present invention proposes is described in further detail.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that, accompanying drawing all adopts the form that simplifies very much and all uses non-ratio accurately, only in order to object that is convenient, the aid illustration embodiment of the present invention lucidly.
Refer to Fig. 1 and Fig. 2.Fig. 1 is the schematic perspective view of server described according to a first embodiment of the present invention.Fig. 2 is the schematic rear view of Fig. 1.
The server 10 of the present embodiment comprises a casing 100, multiple motherboard assembly 200 and multiple fan 300.
Casing 100 comprises base plate 110,1 first side plate 120 and one second side plate 130.First side plate 120 is connected to the relative both side edges of base plate 110 with the second side plate 130.Base plate 110, first side plate 120 and the second side plate 130 are jointly around an accommodation space 140.
These motherboard assemblies 200 are arranged in accommodation space 140 with at least double-deck arrangement mode, and are installed in casing 100 slidably.Specifically, wherein these motherboard assemblies 200 comprise one first motherboard assembly 210,1 second motherboard assembly 220, the 3rd motherboard assembly 230 and one the 4th motherboard assembly 240.First motherboard assembly 210 and the second motherboard assembly 220 are positioned at above base plate 110 in the mode of horizontal Tile.3rd motherboard assembly 230 and the 4th motherboard assembly 240 are positioned at above the first motherboard assembly 210 and the second motherboard assembly 220 in the mode of horizontal Tile, take advantage of the arrangement mode of two to be located in accommodation space 140 to make the first motherboard assembly 210, second motherboard assembly 220, the 3rd motherboard assembly 230 and the 4th motherboard assembly 240 with two.In addition, the 3rd motherboard assembly 230 and the 4th motherboard assembly 240 have the root edge 231,241 of close base plate 110 respectively.
In the present embodiment, each motherboard assembly 200 is to be installed in slippingly in casing 100 through carrier.But not as limit, in other embodiments, each motherboard assembly 200 also directly can not be screwed on casing 100 through carrier.
In addition, the quantity of the motherboard assembly 200 of the present embodiment is also not used to limit the present invention, and in other embodiments, the quantity of motherboard assembly 200 also can be six, and such as takes advantage of the arrangement mode of three to be located in accommodation space 140 with two.
These fans 300 are positioned at accommodation space 140, and are positioned at the same side of these motherboard assemblies 200.In addition, the shaft parallel of these fans 300 is in base plate 110.These fans 300 comprise multiple first fan 310 and multiple second fan 320.These first fans 310 are from the first side plate 120 towards the arrangement of the direction of the second side plate 130, and the spacing between these the first fan 310 and base plates 110 is successively decreased from contiguous first side plate 120 towards the direction away from the first side plate 120.
Specifically, as shown in Figure 2, the quantity of these the first fans 310 is three.In three the first fans 310, first fan 310 of the most contiguous first side plate 120 keeps one first space D 1 with base plate 110, first fan 310 of secondary vicinity keeps one second space D 2 with base plate 110, and the first fan 310 farthest away from the first side plate 120 keeps one the 3rd space D 3 with base plate 110.Further, the first space D 1 is greater than the second space D 2, and the second space D 2 is greater than the 3rd space D 3, makes these second fans 320 protrude from the height of the root edge 231 of the 3rd motherboard assembly 230 different.
These second fans 320 are from the second side plate 130 towards the arrangement of the direction of the first side plate 120, and the spacing between these the second fan 320 and base plates 110 is successively decreased from contiguous second side plate 130 towards the direction away from the second side plate 130.
Specifically, as shown in Figure 2, the quantity of these the second fans 320 is three.In three the second fans 320, second fan 320 of the most contiguous second side plate 130 keeps one the 4th space D 4 with base plate 110, second fan 320 of secondary vicinity keeps one the 5th space D 5 with base plate 110, and the second fan 320 farthest away from the second side plate 130 keeps one the 6th space D 6 with base plate 110.Further, the 4th space D 4 is greater than the 5th space D 5, and the 5th space D 5 is greater than the 6th space D 6, makes these second fans 320 protrude from the height of the root edge 231 of the 3rd motherboard assembly 230 different.Thus, these fans 300 are about arranged in above base plate 110 in English alphabet " V " font.
In addition, in these first fans 310 and these the second fans 320, the first adjacent fan 310 and the second fan 320 are separated and make between the first adjacent fan 310 and the second fan 320 and have a reason space of lines 400.Reason space of lines 400 is convenient to be installed with the transmission line (for illustrating in figure) being connected to each motherboard assembly 200.
Refer to Fig. 3 and Fig. 4.Fig. 3 is the schematic perspective view that the server of Fig. 1 takes out a wherein motherboard assembly.4 figure are the schematic rear view of Fig. 3.
As shown in Figure 3 and Figure 4, when needs replacing the 4th motherboard assembly 240, the 4th motherboard assembly 240 need detach from casing 100 by user.After the 4th motherboard assembly 240 is pulled out, originally the windage being installed with the 4th motherboard assembly 240 place can be less than the windage being installed with all the other motherboard assembly 210,220,230 places, therefore ought to, the radiating airflow major part that these fans 300 produce when operating all can be concentrated and lower ground flow through (as along the direction indicated by arrow a) side's position of the 4th motherboard assembly 240 (originally) from windage, causes producing the problem that radiating airflow that these fans 300 produce declines for the heat-sinking capability of all the other motherboard assemblies 210,220,230.But, because these fans 300 of the present embodiment are about arranged in above base plate 110 in English alphabet " V " font, therefore after the 4th motherboard assembly 240 is pulled out, the air-flow that these fans 300 produce can form flow-disturbing in accommodation space 140, dispersible with the air-flow forcing these fans 300 to produce and flow through each motherboard assembly 200, and then significantly can promote radiating airflow that these fans 300 the produce heat-sinking capability for all the other motherboard assemblies 210,220,230.
Refer to Fig. 5 and Fig. 6.Fig. 5 is the schematic perspective view of server described according to a second embodiment of the present invention.Fig. 6 is the schematic rear view of Fig. 5.
The server 10 of the present embodiment comprises a casing 100, multiple motherboard assembly 200 and multiple fan 300.
Casing 100 comprises base plate 110,1 first side plate 120 and one second side plate 130.First side plate 120 is connected to the relative both side edges of base plate 110 with the second side plate 130.Base plate 110, first side plate 120 and the second side plate 130 are jointly around an accommodation space 140.
These motherboard assemblies 200 are arranged in accommodation space 140 with at least double-deck arrangement mode, and are installed in casing 100 slidably.Specifically, wherein these motherboard assemblies 200 comprise one first motherboard assembly 210,1 second motherboard assembly 220, the 3rd motherboard assembly 230 and one the 4th motherboard assembly 240.First motherboard assembly 210 and the second motherboard assembly 220 are positioned at above base plate 110 in the mode of horizontal Tile.3rd motherboard assembly 230 and the 4th motherboard assembly 240 are positioned at above the first motherboard assembly 210 and the second motherboard assembly 220 in the mode of horizontal Tile, take advantage of the arrangement mode of two to be located in accommodation space 140 to make the first motherboard assembly 210, second motherboard assembly 220, the 3rd motherboard assembly 230 and the 4th motherboard assembly 240 with two.
In the present embodiment, each motherboard assembly 200 is to be installed in slippingly in the chute (not shown) of casing 100 through carrier.But not as limit, in other embodiments, each motherboard assembly 200 also directly can not be screwed on casing 100 through carrier.
In addition, the quantity of the motherboard assembly 200 of the present embodiment is also not used to limit the present invention, and in other embodiments, the quantity of motherboard assembly 200 also can be six, and such as takes advantage of the arrangement mode of three to be located in accommodation space 140 with two.
These fans 300 are positioned at accommodation space 140, and are positioned at the same side of these motherboard assemblies 200.These fans 300 comprise multiple first fan 310 and multiple second fan 320.These first fans 310 are from the first side plate 120 towards the arrangement of the direction of the second side plate 130, and the spacing between these the first fan 310 and base plates 110 increases progressively from contiguous first side plate 120 towards the direction away from the first side plate 120.
Specifically, as shown in Figure 6, the quantity of these the first fans 310 is three.In three the first fans 310, first fan 310 of the most contiguous first side plate 120 keeps one the 7th space D 7 with base plate 110, first fan 310 of secondary vicinity keeps one the 8th space D 8 with base plate 110, and the first fan 310 farthest away from the first side plate 120 keeps one the 9th space D 9 with base plate 110.Further, the 7th space D 7 is less than the 8th space D 8, and the 8th space D 8 is less than the 9th space D 9, makes these second fans 320 protrude from the height of the root edge 231 of the 3rd motherboard assembly 230 different.
These second fans 320 are from the second side plate 130 towards the arrangement of the direction of the first side plate 120, and the spacing between these the second fan 320 and base plates 110 is successively decreased from contiguous second side plate 130 towards the direction away from the second side plate 130.
Specifically, as shown in Figure 6, the quantity of these the second fans 320 is three.In three the second fans 320, second fan 320 of the most contiguous second side plate 130 keeps a ten pitch D10 with base plate 110, second fan 320 of secondary vicinity keeps 1 the 11 space D 11 with base plate 110, and the second fan 320 farthest away from the second side plate 130 keeps 1 the 12 space D 12 with base plate 110.Further, ten pitch D10 is less than the 11 space D 11, and the 11 space D 11 is less than the 12 space D 12, makes these second fans 320 protrude from the height of the root edge of the 3rd motherboard assembly 230 different.Thus, these fans 300 about fall " V " font in English alphabet and are arranged in above base plate 110.
These fans 300 due to the present embodiment about fall " V " font in English alphabet and are arranged in above base plate 110, therefore after the 4th motherboard assembly 240 is pulled out, the air-flow that these fans 300 produce can form flow-disturbing in accommodation space 140, dispersible with the air-flow forcing these fans 300 to produce and flow through each motherboard assembly 200, and then significantly can promote radiating airflow that these fans 300 the produce heat-sinking capability for all the other motherboard assemblies 210,220,230.
Server disclosed by the invention described above, because these fans are positioned at the same side of these motherboard assemblies, these fans and base plate keep different spacing (namely to arrange along " V " font, or " V " font arrangement), these first fans are made to protrude from the height of the root edge of the 3rd motherboard assembly different, and to protrude from the height of the root edge of the 3rd motherboard assembly different with these second fans, therefore when at least one motherboard assembly is pulled out casing, the air-flow that these fans produce can form flow-disturbing in accommodation space, dispersible with the air-flow forcing these fans to produce and flow through each motherboard assembly, and then significantly can promote radiating airflow that these fans the produce heat-sinking capability for all the other motherboard assemblies.
Foregoing description is only the description to present pre-ferred embodiments, any restriction not to the scope of the invention, and any change that the those of ordinary skill in field of the present invention does according to above-mentioned disclosure, modification, all belong to the protection domain of claims.
Claims (10)
1. a server, is characterized in that, comprising:
One casing, comprise a base plate, one first side plate and one second side plate, this first side plate is connected to the relative both side edges of this base plate with this second side plate, and this base plate, this first side plate and this second side plate are jointly around an accommodation space;
Multiple motherboard assembly, is arranged in this accommodation space with at least double-deck arrangement mode, and is installed in this casing slidably; And
Multiple fan, is positioned at this accommodation space, and is positioned at the same side of those motherboard assemblies, and those fans and this base plate keep different spacing.
2. server as claimed in claim 1, it is characterized in that, those fans comprise multiple first fan and multiple second fan, those first fans arrange from this first side plate towards the direction of this second side plate, and spacing between those the first fan and this base plates is successively decreased from this first side plate contiguous towards this direction away from this first side plate, those second fans arrange from this second side plate towards the direction of this first side plate, and spacing between those the second fan and this base plates is successively decreased from this second side plate contiguous towards this direction away from this second side plate.
3. server as claimed in claim 2, is characterized in that, in those first fans and those the second fans, this adjacent first fan and this second fan are separated and make between this adjacent first fan and this second fan and have a reason space of lines.
4. server as claimed in claim 2, it is characterized in that, those motherboard assemblies comprise one first motherboard assembly, one second motherboard assembly, one the 3rd motherboard assembly and one the 4th motherboard assembly, this the first motherboard assembly and this second motherboard assembly are positioned at above this base plate in the mode of horizontal Tile, 3rd motherboard assembly and the 4th motherboard assembly are positioned at above this first motherboard assembly and this second motherboard assembly in the mode of horizontal Tile, to make this first motherboard assembly, this the second motherboard assembly, 3rd motherboard assembly and the 4th motherboard assembly take advantage of the arrangement mode of two to be located in this accommodation space with two.
5. server as claimed in claim 4, it is characterized in that, 3rd motherboard assembly and the 4th motherboard assembly respectively have a root edge, this root edge has identical level height, those first fans and those the second fans protrude from this root edge of the 3rd motherboard assembly, and the height that those first fans and those the second fans protrude from this root edge of the 3rd motherboard assembly is different.
6. server as claimed in claim 1, it is characterized in that, those fans comprise multiple first fan and multiple second fan, those first fans arrange from this first side plate towards the direction of this second side plate, and spacing between those the first fan and this base plates increases progressively from this first side plate contiguous towards this direction away from this first side plate, those second fans arrange from this second side plate towards the direction of this first side plate, and spacing between those the second fan and this base plates increases progressively from this second side plate contiguous towards this direction away from this second side plate.
7. server as claimed in claim 6, is characterized in that, in those first fans and those the second fans, this adjacent first fan and this second fan are separated and make between this adjacent first fan and this second fan and have a reason space of lines.
8. server as claimed in claim 6, it is characterized in that, those motherboard assemblies comprise one first motherboard assembly, one second motherboard assembly, one the 3rd motherboard assembly and one the 4th motherboard assembly, this the first motherboard assembly and this second motherboard assembly are positioned on this base plate in the mode of horizontal Tile, 3rd motherboard assembly and the 4th motherboard assembly are positioned at above this first motherboard assembly and this second motherboard assembly in the mode of horizontal Tile, to make this first motherboard assembly, this the second motherboard assembly, 3rd motherboard assembly and the 4th motherboard assembly take advantage of the arrangement mode of two to be located in this accommodation space with two.
9. server as claimed in claim 8, it is characterized in that, 3rd motherboard assembly and the 4th motherboard assembly respectively have a root edge, this root edge has identical level height, those first fans and those the second fans protrude from this root edge of the 3rd motherboard assembly, and the height that those first fans and those the second fans protrude from this root edge of the 3rd motherboard assembly is different.
10. server as claimed in claim 1, it is characterized in that, those fans are tubeaxial fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410690789.8A CN104375597B (en) | 2014-11-25 | 2014-11-25 | Server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410690789.8A CN104375597B (en) | 2014-11-25 | 2014-11-25 | Server |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104375597A true CN104375597A (en) | 2015-02-25 |
| CN104375597B CN104375597B (en) | 2017-09-19 |
Family
ID=52554581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410690789.8A Active CN104375597B (en) | 2014-11-25 | 2014-11-25 | Server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104375597B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107515654A (en) * | 2016-06-15 | 2017-12-26 | 广达电脑股份有限公司 | Servo rack component and its element carrier |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM261738U (en) * | 2004-09-09 | 2005-04-11 | Tatung Co | Computer server |
| CN101639706A (en) * | 2008-07-31 | 2010-02-03 | 英业达股份有限公司 | Motherboard module array |
| US8045328B1 (en) * | 2010-05-04 | 2011-10-25 | Chenbro Micom Co., Ltd. | Server and cooler moduel arrangement |
| CN102541154A (en) * | 2010-12-08 | 2012-07-04 | 鸿富锦精密工业（深圳）有限公司 | Rack type server |
| CN102800462A (en) * | 2011-05-23 | 2012-11-28 | 苏州沃能电力设备有限公司 | Heat radiation device applied in dry type transformer |
-
2014
- 2014-11-25 CN CN201410690789.8A patent/CN104375597B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM261738U (en) * | 2004-09-09 | 2005-04-11 | Tatung Co | Computer server |
| CN101639706A (en) * | 2008-07-31 | 2010-02-03 | 英业达股份有限公司 | Motherboard module array |
| US8045328B1 (en) * | 2010-05-04 | 2011-10-25 | Chenbro Micom Co., Ltd. | Server and cooler moduel arrangement |
| CN102541154A (en) * | 2010-12-08 | 2012-07-04 | 鸿富锦精密工业（深圳）有限公司 | Rack type server |
| CN102800462A (en) * | 2011-05-23 | 2012-11-28 | 苏州沃能电力设备有限公司 | Heat radiation device applied in dry type transformer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107515654A (en) * | 2016-06-15 | 2017-12-26 | 广达电脑股份有限公司 | Servo rack component and its element carrier |
| CN107515654B (en) * | 2016-06-15 | 2020-03-03 | 广达电脑股份有限公司 | Server rack assembly and element carrier thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104375597B (en) | 2017-09-19 |
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