CN104342553A - Method for processing printed circuit board, and apparatus thereof - Google Patents
Method for processing printed circuit board, and apparatus thereof Download PDFInfo
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- CN104342553A CN104342553A CN201310314092.6A CN201310314092A CN104342553A CN 104342553 A CN104342553 A CN 104342553A CN 201310314092 A CN201310314092 A CN 201310314092A CN 104342553 A CN104342553 A CN 104342553A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
The invention discloses a method for processing a printed circuit board, and an apparatus thereof. The method is applied to one printed circuit board containing N metal layers, and N is an integer not smaller than 3. The method comprises the following steps: crushing the printed circuit board; separating to obtain copper and resin combined first copper-containing resin particles; immersing the first copper-containing resin particles in a first separation drug liquid to obtain second copper-containing resin particles with decreased copper and resin combination force; and separating the copper of the second copper-containing resin particles.
Description
Technical field
The present invention relates to art of printed circuit boards, particularly relate to a kind of method and the device that process printed circuit board (PCB).
Background technology
Printed circuit board (PCB) (PCB, Printed Circuit Board, also known as printed circuit board, printed-wiring board (PWB)) be an important component part in electronic product, for the supporter carrying out being electrically connected as electronic component in electronic product, along with the renewal of electronic product, more and more waste and old printed circuit board (PCB) can be produced, simultaneously, manufacture in the process of printed circuit board (PCB) in each production firm, also due to the error in production process or other reasons, the printed circuit board (PCB) scrapped of some amount can be produced.
Printed circuit board (PCB) generally comprises the glass-fiber-fabric of the single or multiple lift of the resins such as composite epoxy, metallic copper for being electrically connected, electronic component and for by welding electronic elements solder on a printed circuit etc., printed circuit board (PCB) is not easily degraded, if discard processing can cause land resources to waste, the objectionable impuritiess such as the polyvinyl chloride simultaneously contained by printed circuit board (PCB) and halogenide fire retardant will cause huge pollution to environment, if carry out burning disposal, can produce the objectionable constituent such as dioxin and lead steam.Therefore, to the treating processes of printed circuit board (PCB) be at present: electronic component and the scolding tin of first removing printed circuit board (PCB), then printed circuit board (PCB) is pulverized, make the metal on printed circuit board (PCB) and to be nonmetally separated from each other, then the mixture after separation is carried out sorting, obtain metallic particles and non-metallic particle respectively, finally use the copper in wet separation metallic particles and precious metal.
Light along with to electronic product, thin requirement is more and more higher, the design of printed circuit board (PCB) also becomes increasingly complex, be the multi-ply wood of more than 3 layers or 3 layers under normal circumstances, the layers of copper of inner layer of printed-circuit board and resin combine very tight after pressing, the printed circuit board (PCB) of pulverizing more than 3 layers or 3 layers make the metal on printed circuit board (PCB) and nonmetal be separated from each other time, the effect extreme difference be separated, the metallic particles with nonmetal combination is there is in metallic particles, the non-metallic particle with melts combine is there is in non-metallic particle, thus cause the metallic particles of sorting gained and non-metallic particle cannot meet the requirement of recycling at all.Therefore, when recycling being carried out to the printed circuit board (PCB) of more than 3 layers or 3 layers in prior art, the technical problem of the metal on the printed circuit board (PCB) of existence and the nonmetal weak effect be separated.
Summary of the invention
The embodiment of the present invention is by providing a kind of method and the device that process printed circuit board (PCB), solve when recycling being carried out to the printed circuit board (PCB) of more than 3 layers or 3 layers in prior art, the technical problem of the metal on the printed circuit board (PCB) of existence and the nonmetal weak effect be separated.
Embodiments provide a kind of method processing printed circuit board (PCB), be applied to one containing N layer metal level printed circuit board (PCB) on, wherein N be more than or equal to 3 integer, described method comprises: pulverize described printed circuit board (PCB); Be separated the first cupric resin particle obtaining copper and be combined with resin-phase; Described first cupric resin particle is immersed first and is separated liquid medicine, obtain the second cupric resin particle that copper and resin-bonded power diminish; The copper of described second cupric resin particle is separated.
Alternatively, the described copper by the second cupric resin particle carries out being separated specifically comprising: milled by described second cupric resin particle as diameter is less than or equal to the first composite grain of the first default value, and described first composite grain comprises the first bronze medal particle and the first resin particle that copper and resin isolation after milling obtain; Described first bronze medal particle is separated from described first composite grain.
Alternatively, if the surface metal-layer of described printed circuit board (PCB) comprises precious metal, before the described printed circuit board (PCB) of described pulverizing, described method also comprises: the surface copper being separated described precious metal and described printed circuit board (PCB) under wet method condition.
Alternatively, when described precious metal is specially gold, the described surface copper being separated described precious metal and described printed circuit board (PCB) under wet method condition, specifically comprises: described printed circuit board (PCB) is immersed second and be separated in liquid medicine; Peel off described surface metal-layer, obtain the copper gold plaque comprising described gold and described surface copper; Described copper gold plaque is immersed decopper(ing) be separated in liquid medicine, make described surface copper be separated liquid medicine with described decopper(ing) and react and generate copper sulfate, described gold precipitates in the form of sheets; Filter containing the solution of copper sulfate with gold, obtain gold plaque and the solution containing described copper sulfate; Heat and dry the described solution containing described copper sulfate, obtaining copper sulfate crystal.
Alternatively, when described precious metal is specially gold or silver, the described surface copper being separated described precious metal and described printed circuit board (PCB) under wet method condition, specifically comprise: described printed circuit board (PCB) is immersed in thiourea solution, described gold or described silver and described thiourea solution are reacted and generates containing gold complex or contain silver complex, described surface copper and described thiourea solution react and generate copper sulfate; Use whizzer separation containing described containing gold complex or the solution containing silver complex and described copper sulfate, containing gold complex or described containing silver complex and the solution containing described copper sulfate described in obtaining; Electrolysis, containing gold complex or described containing silver complex, obtains silver; Heat and dry the described solution containing described copper sulfate, obtaining copper sulfate crystal.
The embodiment of the present invention also provides a kind of device processing printed circuit board (PCB) on the other hand, described device is for the treatment of the printed circuit board (PCB) containing N layer metal level, wherein N be more than or equal to 3 integer, described device comprises separating dry space from moist space unit, described separating dry space from moist space unit comprises: the first pulverizing unit, for pulverizing printed circuit board (PCB); First separating unit, for from the printed circuit board (PCB) after pulverizing, is separated the first cupric resin particle obtaining copper and be combined with resin-phase; First immerses unit, is separated liquid medicine, the second cupric resin particle that the bonding force obtaining copper and resin diminishes for the first cupric resin particle is immersed first; Second separating unit, for being separated the copper in the second cupric resin particle.
Alternatively, described second separating unit is specifically for milling as diameter is less than or equal to the first composite grain of the first default value by described second cupric resin particle, described first composite grain comprises the first bronze medal particle and the first resin particle that copper and resin isolation after milling obtain, and is separated from described first composite grain by described first bronze medal particle.
Alternatively, described device also comprises a precious metal separation unit, and described precious metal separation unit is used for when the surface metal-layer of described printed circuit board (PCB) comprises precious metal, is separated the surface copper of described precious metal and described printed circuit board (PCB) under wet method condition.
Alternatively, when described precious metal is specially gold, described precious metal separation unit is used for described printed circuit board (PCB) being immersed second and is separated in liquid medicine, and peel off described surface metal-layer, obtain the copper gold plaque comprising described gold and described surface copper, and described copper gold plaque is immersed in decopper(ing) separation liquid medicine, make described surface copper be separated liquid medicine with described decopper(ing) to react and generate copper sulfate, described gold precipitates in the form of sheets, and filter containing the solution of copper sulfate with gold, obtain gold plaque and the solution containing described copper sulfate, and heat and dry the described solution containing described copper sulfate, obtain copper sulfate crystal.
Alternatively, when described precious metal is specially gold or silver, described precious metal separation unit is used for described printed circuit board (PCB) to immerse in thiourea solution, described gold or described silver and described thiourea solution are reacted and generates containing gold complex or containing silver complex, described surface copper and described thiourea solution react and generate copper sulfate, and use whizzer to be separated containing described containing gold complex or the solution containing silver complex and described copper sulfate, obtain described containing gold complex or described containing silver complex, and the solution containing described copper sulfate, and electrolysis is containing gold complex or described containing silver complex, obtain silver, and heat and dry the described solution containing described copper sulfate, obtain copper sulfate crystal.
The one or more technical schemes provided in the embodiment of the present invention, at least have following technique effect or advantage:
When carrying out recycling process to printed circuit board (PCB), described printed circuit board (PCB) is first pulverized owing to have employed, and be separated the first cupric resin particle obtaining copper and be combined with resin-phase, and described first cupric resin particle is immersed the first separation liquid medicine, obtain the second cupric resin particle, in described second cupric resin particle, the bonding force of copper and resin diminishes, and the copper of described second cupric resin particle is carried out the technical scheme that is separated, add cupric resin particle and the contact area being separated liquid medicine, so make the effect of copper and resin isolation strengthen, thus the situation avoiding copper and resin isolation thoroughly not to cause cupric resin particle existing, therefore, solve in prior art in the metal of the printed circuit board (PCB) of separation more than 3 layers or 3 layers and the technical problem of nonmetal weak effect, achieve and be effectively separated metal on printed circuit board (PCB) and nonmetallic technique effect, make the metallic particles of acquisition and non-metallic particle can meet the needs of recycling.
Accompanying drawing explanation
The schema of the method for the process printed circuit board (PCB) that Fig. 1 provides for the embodiment of the present invention;
The functional block diagram of the device of the process printed circuit board (PCB) that Fig. 2 provides for the embodiment of the present invention;
The functional block diagram of the separating dry space from moist space unit that Fig. 3 provides for the embodiment of the present invention.
Embodiment
The embodiment of the present invention is by providing a kind of method and the device that process printed circuit board (PCB), solve when recycling being carried out to the printed circuit board (PCB) of more than 3 layers or 3 layers in prior art, the technical problem of the metal on the printed circuit board (PCB) of existence and the nonmetal weak effect be separated.
Technical scheme in the embodiment of the present invention is for solving the problems of the technologies described above, and general thought is as follows:
The embodiment of the present invention provides a kind of method processing printed circuit board (PCB), be applied to one containing N layer metal level printed circuit board (PCB) on, wherein N be more than or equal to 3 integer, method comprises:
Pulverize printed circuit board (PCB);
Be separated the first cupric resin particle obtaining copper and be combined with resin-phase;
First cupric resin particle is immersed first and is separated liquid medicine, obtain the second cupric resin particle that copper and resin-bonded power diminish;
The copper of the second cupric resin particle is separated.
Can be found out by above-mentioned part, when carrying out recycling process to printed circuit board (PCB), first printed circuit board (PCB) is pulverized owing to have employed, and be separated the first cupric resin particle obtaining copper and be combined with resin-phase, and the first cupric resin particle is immersed the first separation liquid medicine, obtain the second cupric resin particle that copper and resin-bonded power diminish, and the copper of the second cupric resin particle is carried out the technical scheme that is separated, add cupric resin particle and the contact area being separated liquid medicine, so make the effect of copper and resin isolation strengthen, thus the situation avoiding copper and resin isolation thoroughly not to cause cupric resin particle existing, therefore, solve in prior art in the metal of the printed circuit board (PCB) of separation more than 3 layers or 3 layers and the technical problem of nonmetal weak effect, achieve and be effectively separated metal on printed circuit board (PCB) and nonmetallic technique effect, make the metallic particles of acquisition and non-metallic particle can meet the needs of recycling.
In order to better understand technique scheme, below in conjunction with Figure of description and concrete embodiment, technique scheme is described in detail.
In actual applications, if printed circuit board (PCB) is the printed circuit board (PCB) comprising electronic component, such as, be the printed circuit board (PCB) split out from electronic product, then need to anticipate the electronic component on this printed circuit board (PCB) and the solder for soldering of electronic components.Specifically can process in the following way:
The first step, peel off the electronic component on printed circuit board (PCB), such as, printed circuit board (PCB) is put in a hot bellows and leaves standstill for some time, such as, solder on printed circuit board (PCB) is generally tin, therefore printed circuit board (PCB) is only needed to leave standstill one minute or two minutes in the hot bellows of 288 DEG C, the tin of soldering of electronic components is softened, certainly, as long as temperature is higher than the temperature of fusion of solder, this is not restricted, thus the electronic component of printed circuit board surface can be peeled off by manual type or mechanical system, of course, the electronic component separated can reclaim after screening,
Second step, remove the solder on the printed circuit board (PCB) after peeling off electronic component, such as, can the printed circuit board (PCB) after stripping electronic component be placed in a detin equipment, same, as long as temperature is higher than the temperature of fusion of solder, this detin equipment can be arranged side by side, temperature is multiple steel electric power rollers of 288 DEG C, wherein the diameter of each roller can be 3-6cm, when printed circuit board (PCB) after peeling off electronic component is placed on this roller, tin melted by heat on printed circuit board (PCB), and flow downward under gravity, thus the tin eliminated on printed circuit board (PCB), comparatively preferred scheme, be the quantity of roller it is 30-40, and make the total length of roller side by side be greater than 1.2m, make the printed circuit board (PCB) comparatively commonly used disposablely can remove scolding tin simultaneously like this.After the tin removing printed circuit board (PCB) lower surface, can by artificial or mechanical mode by printed circuit board (PCB) turn-over, thus the tin on another surface on removal printed circuit board (PCB), a Receiving bin can be set below roller, thus the tin can removed in this step reclaims.
How above-mentioned introduction processes the process of electronic component on printed circuit board (PCB) and solder, in actual applications, likely existence only has solder and does not have the printed circuit board (PCB) of electronic component, also likely there is the printed circuit board (PCB) not only not having electronic component but also do not have solder, when only having solder on a printed circuit and there is no electronic component, above-mentioned second step can be performed to remove solder, when not only there is no electronic component but also there is no solder on a printed circuit, the step in the method for the process printed circuit board (PCB) that the embodiment of the present invention provides can be performed.
Do not exist on a printed circuit electronic component and for weld this electronic component solder time, can classify by the metal on the surface of printed circuit board (PCB), when the surface of printed circuit board (PCB) is precious metal, need the precious metal and the surface copper that are first separated printed circuit board surface, specifically can by following mode: the surface copper of separate precious metal and printed circuit board (PCB) under wet method condition.
Under wet method condition, the surface copper of separate precious metal and printed circuit board (PCB) has various ways, such as:
The first, when precious metal is specially gold, under wet method condition, the surface copper of separate precious metal and printed circuit board (PCB), specifically comprises the steps:
The first step, printed circuit board (PCB) being immersed second is separated in liquid medicine, reduce the bonding force of surface copper and resin, can be such as printed circuit board (PCB) is immersed butyl phosphate to be separated in liquid medicine, being separated liquid medicine temperature is 25-100 DEG C, the immersion time is 60-100 minute, printed circuit board (PCB) can certainly be immersed hard acid butyl ester is separated in liquid medicine, be separated liquid medicine temperature 180 DEG C, the immersion time is 20 minutes, or printed circuit board (PCB) is immersed 1-4 butyleneglycol, phosphoric acid butyric acid, in the composite liberation liquid medicine of vinyl acetic monomer, being separated liquid medicine temperature is 50 DEG C, the immersion time is 40 minutes etc., just repeat no more at this.
Second step, after the immersion of the first step, the surface copper of printed circuit board (PCB) and the bonding force of primary insulation resin decline, thus surface metal-layer can be stripped down from printed circuit board (PCB), obtain and comprise surface copper and golden copper gold plaque.
3rd step, copper gold plaque is immersed decopper(ing) be separated in liquid medicine, make surface copper be separated liquid medicine with decopper(ing) and react and generate copper sulfate, the gold in copper gold plaque precipitates in the form of sheets, wherein the concrete composition of decopper(ing) separation liquid medicine can be: sulfuric acid 3 ~ 5mol/L, hydrogen peroxide concentration 30% ~ 40%; The volume ratio of sulfuric acid and hydrogen peroxide is 10:1.Certainly, by the introduction of the present embodiment, the technician belonging to this area according to practical situation, suitably can adjust the composition that decopper(ing) is separated in liquid medicine, to meet the needs of practical situation, has just repeated no more at this.
4th step, filter the solution containing copper sulfate and gold obtained in above-mentioned 3rd step, obtain gold plaque and the solution containing copper sulfate, then can gold recovering, such as, dust technology (concentration is 6%) can be used to heat rinsing gold plaque, remove undesired impurities in addition to gold, again the gold plaque obtained is put into porcelain crucible, and at surface coverage borax, mixture roasting more than 1200 DEG C in retort furnace of soda ash obtain purity higher than 95% gold.
5th step, heats and dries the solution containing copper sulfate obtained in above-mentioned 4th step, obtaining copper sulfate crystal, then can reclaim the surface copper of printed circuit board (PCB).
The second, the surface copper of separate precious metal and printed circuit board (PCB) under wet method condition, specifically comprises the following steps:
The first step, printed circuit board (PCB) is immersed in thiourea solution, iron trichloride can also be added wherein as catalyzer simultaneously, silver and thiourea solution are reacted and generates containing silver complex, surface copper and thiourea solution react and generate copper sulfate simultaneously, wherein, the concentration of thiocarbamide is 23g/L ~ 25g/L, the concentration of iron trichloride can be 6g/L, PH:1 ~ 2, the temperature of thiourea solution is 25 ~ 30 DEG C, soak time is 2 ~ 3 hours, certainly, by the introduction of the present embodiment, technician belonging to this area can according to practical situation, composition in thiourea solution is suitably adjusted, to meet the needs of practical situation, just repeat no more at this.
Second step, use whizzer to be separated containing the solution containing silver complex and copper sulfate, obtain containing silver complex and the solution containing copper sulfate, wherein the speed of separating centrifuge can be 100-150 rev/min, and disengaging time can be 5-15 minute.
3rd step, electrolysis is containing silver complex, thus obtain silver, also silver has namely been reclaimed, such as, power generation assembly can be two long lm of synthetic glass material, wide lm, the reactive tank composition of high 1.3m, a cationic exchange membrane is fixed in centre, the thickness of exchange membrane can be 1mm, anodic dissolution is KCl solution 0.1mol/L, volume 1t, temperature 35 DEG C, the temperature difference controls within 0.5 DEG C, cathode solution is the complexing of silver and the mixture 1t of distilled water volume 1:1, anode electrode can be zinc, iron or aluminium etc., electrode size can be 15*30cm, cathode electrode is Graphite Electrodes, electrode size can be 15*30cm, electromotive power output can be 1600 ~ 1640W, of course, by the introduction of the present embodiment, technician belonging to this area can according to practical situation, suitable adjustment is carried out to the device of electrolytic silver, to meet the needs of practical situation, just repeat no more at this.
4th step, heats and dries the solution containing copper sulfate obtained in second step, obtaining copper sulfate crystal, then can reclaim the surface copper of printed circuit board (PCB).
Certainly, saidly separate precious metal under wet method condition is separated in by thiourea solution except above-mentioned, and outside the surface copper of printed circuit board (PCB), the precious metal of printed circuit board (PCB) and the surface copper of printed circuit board (PCB) can also be separated by cyanidation method, its principle utilizes alkali metal cyanide by the gold of printed circuit board surface, the precious metals such as silver dissolve and enter solution, thus be separated with the unclassified stores in printed circuit board (PCB), but, the dissolution rate of gold is also slower, production cycle is long, and cyanide process process low grade material or difficult raw material time reagent consume excessive, associated metal impact is serious, soak golden weak effect, what the most important thing is prussiate has severe toxicity, healthy and environmental hazard is larger to operator, seriously polluted, but still can use under some special occasions, technician belonging to this area can according to practical situation, a kind of suitable mode is selected from the mode that can use, to meet the needs of practical situation, just repeat no more at this.
Above-mentioned introduction detailed process of the surface copper of separate precious metal and printed circuit board (PCB) under wet method condition, the method of the process printed circuit board (PCB) that namely printed circuit board (PCB) being separated precious metal and surface copper can use the embodiment of the present invention to provide carries out recycling, of course, printed circuit board (PCB) be indicated as copper time, the method for the process printed circuit board (PCB) that also can directly use the embodiment of the present invention to provide carries out recycling.
Please refer to Fig. 1, Fig. 1 is the method flow diagram of the process printed circuit board (PCB) that the embodiment of the present invention provides, and as shown in Figure 1, the method that the embodiment of the present invention provides comprises:
S1: pulverize printed circuit board (PCB);
S2: be separated the first cupric resin particle obtaining copper and be combined with resin-phase;
S3: the first cupric resin particle is immersed first and is separated liquid medicine, obtain the second cupric resin particle that copper and resin-bonded power diminish;
S4: the copper of the second cupric resin particle is separated.
In step sl, pulverize this printed circuit board (PCB), obtain the first cupric resin particle that resin particle, copper particle and copper are combined with resin-phase, such as, shear crusher can be used, gyratory crusher, printed circuit board (PCB) pulverized by hammer mill, the particle now obtained is divided into resin particle, copper particle and the first cupric resin particle, and resin particle mostly is 0.1 ~ 0.3mm, and first mostly is more than 20mm containing a resin of copper material.
By step S1, printed circuit board (PCB) is being pulverized after for copper particle, resin particle and the first cupric resin particle, namely namely the method for process printed circuit board (PCB) that the embodiment of the present invention provides can enter step S2, that is: be separated the first cupric resin particle obtaining copper and be combined with resin-phase.
In step s 2, first, copper particle is separated from resin particle and the first cupric resin particle, such as, electrostatic separation technique can be used to be separated from resin particle and the first cupric resin particle by copper particle, or also can be that copper particle is separated by pneumatic separation technology from resin particle and the first cupric resin particle, just repeat no more at this;
Then, use screen cloth to be separated from resin particle by the first cupric resin particle, such as, the aperture of screen cloth can be 0.5mm, certainly, the technician belonging to this area also can adjust it according to practical situation thus be separated the first cupric resin particle obtaining copper and be combined with resin-phase.
By step S2 by after being separated and obtaining the first cupric resin particle that copper is combined with resin-phase, the method of the process printed circuit board (PCB) that the embodiment of the present invention provides can enter step S3, that is: the first cupric resin particle is immersed first and be separated liquid medicine, obtain copper and resin-bonded power and to diminish the second cupric resin particle.
First is separated liquid medicine can with introduce in preceding sections second to be separated liquid medicine identical, just repeat no more at this, after first cupric resin particle immerses the first separation liquid medicine, in first cupric particle, copper diminishes under will being separated the effect of liquid medicine first with the bonding force of resin, thus obtain the second cupric resin particle, technician belonging to this area can adjust ratio and temperature etc. the parameter of each composition in the first separation liquid medicine according to practical situation, make the bonding force of the copper in the second cupric resin particle and resin minimum, just repeated no more at this.
Simultaneously, after using the devices such as screen cloth to be leached by the second cupric resin particle, the second cupric particle can be heated, other are separated out to make separation liquid medicine wherein be heated into volatility, and this volatile gases is passed into again in the solution in the 4th step, realize recycling, namely can save material, the pollution to environment can be avoided again.
After obtained the second cupric resin particle by step S3, the method for the process printed circuit board (PCB) that the embodiment of the present invention provides enters step S4, that is: be separated by the copper in the second cupric resin particle.
Specifically, by following mode, the copper in the second cupric resin particle can be separated:
First, second cupric resin particle is milled for diameter is less than or equal to the first composite grain of the first default value, such as the second cupric resin particle can be milled for diameter is less than or equal to first composite grain of 0.1mm by rectilinear runner milling, first composite grain comprises the first bronze medal particle and the first resin particle that copper and resin isolation after milling obtain, simultaneously because the bonding force of the second cupric particle copper and resin is less, so the separating effect of copper and resin is better, can be separated comparatively completely;
Then, the first bronze medal particle is separated from the first composite grain, such as, the modes such as aforementioned said electrostatic separation or pneumatic separation can be used to be separated, just repeated no more at this.
Can be found out by above-mentioned part, when carrying out recycling process to printed circuit board (PCB), first printed circuit board (PCB) is pulverized owing to have employed, and be separated the first cupric resin particle obtaining copper and be combined with resin-phase, and the first cupric resin particle is immersed the first separation liquid medicine, obtain the second cupric resin particle, in second cupric resin particle, the bonding force of copper and resin diminishes, and the copper of the second cupric resin particle is carried out the technical scheme that is separated, add cupric resin particle and the contact area being separated liquid medicine, so make the effect of copper and resin isolation strengthen, thus the situation avoiding copper and resin isolation thoroughly not to cause cupric resin particle existing, therefore, solve in prior art in the metal of the printed circuit board (PCB) of separation more than 3 layers or 3 layers and the technical problem of nonmetal weak effect, achieve and be effectively separated metal on printed circuit board (PCB) and nonmetallic technique effect, make the metallic particles of acquisition and non-metallic particle can meet the needs of recycling.
Based on same inventive concept, the embodiment of the present invention provides a kind of device processing printed circuit board (PCB), this device is for the treatment of the printed circuit board (PCB) containing N layer metal level, wherein N be more than or equal to 3 integer, please refer to Fig. 2, Fig. 2 is the functional block diagram of the device of the process printed circuit board (PCB) that the embodiment of the present invention provides, as shown in Figure 2, this device comprises separating dry space from moist space unit 201, please also refer to Fig. 2 and Fig. 3, and Fig. 3 is the functional block diagram of the separating dry space from moist space unit 201 that the embodiment of the present invention provides.As shown in Figure 3, separating dry space from moist space unit 201 specifically comprises:
First pulverizing unit 2011, for pulverizing printed circuit board (PCB), the first pulverizing unit 2011 can be such as shear crusher, gyratory crusher, hammer mill etc.;
First separating unit 2012, for from the printed circuit board (PCB) after pulverizing, be separated and obtain the first cupric resin particle that copper is combined with resin-phase, the first separating unit 2012 can be such as electrostatic separation equipment or pneumatic separation equipment etc.;
First immerses unit 2013, is separated liquid medicine, the second cupric resin particle that the bonding force obtaining copper and resin diminishes for the first cupric resin particle is immersed first, and first to immerse unit 2013 can be such as mechanical arm, streamline etc.;
Second separating unit 2014, for being separated by the copper in the second cupric resin particle, the second separating unit 2014 can be such as rectilinear runner milling etc.
In specific implementation process, second separating unit 2014 is specifically for milling as diameter is less than or equal to the first composite grain of the first default value by the second cupric resin particle, first composite grain comprises the first bronze medal particle and the first resin particle that copper and resin isolation after milling obtain, and is separated from the first composite grain by the first bronze medal particle.
In specific implementation process, this device also comprises a precious metal separation unit 202, precious metal separation unit 302 for when the surface metal-layer of printed circuit board (PCB) comprises precious metal, the surface copper of separate precious metal and printed circuit board (PCB) under wet method condition.
In specific implementation process, when precious metal is specially gold, precious metal separation unit 302 is separated in liquid medicine for printed circuit board (PCB) being immersed second, and stripper surface metal level, obtain the copper gold plaque comprising gold and surface copper, and copper gold plaque is immersed in decopper(ing) separation liquid medicine, make surface copper be separated liquid medicine with decopper(ing) to react and generate copper sulfate, gold precipitates in the form of sheets, and filter containing the solution of copper sulfate with gold, obtain gold plaque and the solution containing copper sulfate, and heat and dry the solution containing copper sulfate, obtain copper sulfate crystal.
In specific implementation process, when precious metal is specially gold or silver, precious metal separation unit 302 is for immersing in thiourea solution by printed circuit board (PCB), gold or silver and thiourea solution are reacted and generates containing gold complex or containing silver complex, surface copper and thiourea solution react and generate copper sulfate, and use whizzer separation to contain containing gold complex or the solution containing silver complex and copper sulfate, obtain containing gold complex or containing silver complex, and the solution containing copper sulfate, and electrolysis is containing gold complex or containing silver complex, obtain silver, and heat and dry the solution containing copper sulfate, obtain copper sulfate crystal.
The method of the process printed circuit board (PCB) in the device of the process printed circuit board (PCB) in the embodiment of the present invention and previous embodiment is based on the aspect of two under same inventive concept, detailed description is done to the implementation process of method above, so those skilled in the art can according to the structure of the electronics in aforementioned understanding the present embodiment be described clearly and implementation process, succinct in order to specification sheets, has just repeated no more at this.
Technical scheme in the invention described above embodiment, at least has following technique effect or advantage:
When carrying out recycling process to printed circuit board (PCB), first printed circuit board (PCB) is pulverized owing to have employed, and be separated the first cupric resin particle obtaining copper and be combined with resin-phase, and the first cupric resin particle is immersed the first separation liquid medicine, obtain the second cupric resin particle, in second cupric resin particle, the bonding force of copper and resin diminishes, and the copper of the second cupric resin particle is carried out the technical scheme that is separated, add cupric resin particle and the contact area being separated liquid medicine, so make the effect of copper and resin isolation strengthen, thus the situation avoiding copper and resin isolation thoroughly not to cause cupric resin particle existing, therefore, solve in prior art in the metal of the printed circuit board (PCB) of separation more than 3 layers or 3 layers and the technical problem of nonmetal weak effect, achieve and be effectively separated metal on printed circuit board (PCB) and nonmetallic technique effect, make the metallic particles of acquisition and non-metallic particle can meet the needs of recycling.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. process a method for printed circuit board (PCB), be applied to one containing N layer metal level printed circuit board (PCB) on, wherein N be more than or equal to 3 integer, it is characterized in that, described method comprises:
Pulverize described printed circuit board (PCB);
Be separated the first cupric resin particle obtaining copper and be combined with resin-phase;
Described first cupric resin particle is immersed first and is separated liquid medicine, obtain the second cupric resin particle that copper and resin-bonded power diminish;
The copper of described second cupric resin particle is separated.
2. the method for claim 1, is characterized in that, the described copper by the second cupric resin particle carries out being separated specifically comprising:
Milled by described second cupric resin particle as diameter is less than or equal to the first composite grain of the first default value, described first composite grain comprises the first bronze medal particle and the first resin particle that copper and resin isolation after milling obtain;
Described first bronze medal particle is separated from described first composite grain.
3. method as claimed in claim 1 or 2, it is characterized in that, if the surface metal-layer of described printed circuit board (PCB) comprises precious metal, before the described printed circuit board (PCB) of described pulverizing, described method also comprises:
The surface copper of described precious metal and described printed circuit board (PCB) is separated under wet method condition.
4. method as claimed in claim 3, it is characterized in that, when described precious metal is specially gold, the described surface copper being separated described precious metal and described printed circuit board (PCB) under wet method condition, specifically comprises:
Described printed circuit board (PCB) being immersed second is separated in liquid medicine;
Peel off described surface metal-layer, obtain the copper gold plaque comprising described gold and described surface copper;
Described copper gold plaque is immersed decopper(ing) be separated in liquid medicine, make described surface copper be separated liquid medicine with described decopper(ing) and react and generate copper sulfate, described gold precipitates in the form of sheets;
Filter containing the solution of copper sulfate with gold, obtain gold plaque and the solution containing described copper sulfate;
Heat and dry the described solution containing described copper sulfate, obtaining copper sulfate crystal.
5. method as claimed in claim 3, is characterized in that, when described precious metal is specially gold or silver, the described surface copper being separated described precious metal and described printed circuit board (PCB) under wet method condition, specifically comprises:
Immersed in thiourea solution by described printed circuit board (PCB), described gold or described silver and described thiourea solution are reacted and generates containing gold complex or contain silver complex, described surface copper and described thiourea solution react and generate copper sulfate;
Use whizzer separation containing described containing gold complex or the solution containing silver complex and described copper sulfate, containing gold complex or described containing silver complex and the solution containing described copper sulfate described in obtaining;
Electrolysis, containing gold complex or described containing silver complex, obtains silver;
Heat and dry the described solution containing described copper sulfate, obtaining copper sulfate crystal.
6. process a device for printed circuit board (PCB), it is characterized in that, described device for the treatment of the printed circuit board (PCB) containing N layer metal level, wherein N be more than or equal to 3 integer, described device comprises separating dry space from moist space unit, and described separating dry space from moist space unit comprises:
First pulverizing unit, for pulverizing printed circuit board (PCB);
First separating unit, for from the printed circuit board (PCB) after pulverizing, is separated the first cupric resin particle obtaining copper and be combined with resin-phase;
First immerses unit, is separated liquid medicine, the second cupric resin particle that the bonding force obtaining copper and resin diminishes for the first cupric resin particle is immersed first;
Second separating unit, for being separated the copper in the second cupric resin particle.
7. device as claimed in claim 6, it is characterized in that, described second separating unit is specifically for milling as diameter is less than or equal to the first composite grain of the first default value by described second cupric resin particle, described first composite grain comprises the first bronze medal particle and the first resin particle that copper and resin isolation after milling obtain, and is separated from described first composite grain by described first bronze medal particle.
8. device as claimed in claims 6 or 7, it is characterized in that, described device also comprises a precious metal separation unit, described precious metal separation unit is used for when the surface metal-layer of described printed circuit board (PCB) comprises precious metal, is separated the surface copper of described precious metal and described printed circuit board (PCB) under wet method condition.
9. device as claimed in claim 8, it is characterized in that, when described precious metal is specially gold, described precious metal separation unit is used for described printed circuit board (PCB) being immersed second and is separated in liquid medicine, and peel off described surface metal-layer, obtain the copper gold plaque comprising described gold and described surface copper, and described copper gold plaque is immersed in decopper(ing) separation liquid medicine, make described surface copper be separated liquid medicine with described decopper(ing) to react and generate copper sulfate, described gold precipitates in the form of sheets, and filter containing the solution of copper sulfate with gold, obtain gold plaque and the solution containing described copper sulfate, and heat and dry the described solution containing described copper sulfate, obtain copper sulfate crystal.
10. device as claimed in claim 8, it is characterized in that, when described precious metal is specially gold or silver, described precious metal separation unit is used for described printed circuit board (PCB) to immerse in thiourea solution, described gold or described silver and described thiourea solution are reacted and generates containing gold complex or containing silver complex, described surface copper and described thiourea solution react and generate copper sulfate, and use whizzer to be separated containing described containing gold complex or the solution containing silver complex and described copper sulfate, obtain described containing gold complex or described containing silver complex, and the solution containing described copper sulfate, and electrolysis is containing gold complex or described containing silver complex, obtain silver, and heat and dry the described solution containing described copper sulfate, obtain copper sulfate crystal.
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| CN201310314092.6A CN104342553A (en) | 2013-07-24 | 2013-07-24 | Method for processing printed circuit board, and apparatus thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310314092.6A CN104342553A (en) | 2013-07-24 | 2013-07-24 | Method for processing printed circuit board, and apparatus thereof |
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| CN112708781A (en) * | 2020-12-23 | 2021-04-27 | 长春黄金研究院有限公司 | Method for recovering metal Sn from waste circuit board by adopting efficient Sn-removing agent |
| CN112708781B (en) * | 2020-12-23 | 2022-11-25 | 长春黄金研究院有限公司 | Method for recovering metal Sn from waste circuit board by adopting efficient Sn-removing medicament |
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