CN104308720A - Grinding head washing device, grinding equipment and washing method - Google Patents
Grinding head washing device, grinding equipment and washing method Download PDFInfo
- Publication number
- CN104308720A CN104308720A CN201410427479.7A CN201410427479A CN104308720A CN 104308720 A CN104308720 A CN 104308720A CN 201410427479 A CN201410427479 A CN 201410427479A CN 104308720 A CN104308720 A CN 104308720A
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- CN
- China
- Prior art keywords
- grinding head
- shower nozzle
- gap
- cleaning device
- grinding
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a grinding head washing device and a washing method. Inclined sprinklers are arranged at corresponding positions of a gap between a membrane and a retaining ring of a grinding head, so that the local washing capability is enhanced under the condition of keeping a washing condition unchanged, a gap area which is more difficult to wash is mainly washed, the washing efficiency is improved, and the production period is shortened. The grinding head washing device is simple in structure, convenient to mount and suitable for industrial production.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, particularly relate to a kind of new grinding head cleaning device, milling apparatus and cleaning method.
Background technology
Along with the develop rapidly of super large-scale integration ULSI (Ultra Large Scale Integration), integrated circuit fabrication process becomes and becomes increasingly complex with meticulous.In order to improve integrated level, reduce manufacturing cost, the characteristic size (Feature Size) of element constantly diminishes, number of elements in chip unit are constantly increases, plane routing has been difficult to the requirement meeting the distribution of element high density, can only polylaminate wiring technique be adopted, utilize the vertical space of chip, improve the integration density of device further.But the application of polylaminate wiring technique can cause silicon chip surface uneven, extremely unfavorable to graphic making.For this reason, need to carry out planarized (Planarization) process to irregular wafer surface.At present, chemical mechanical milling method (CMP, ChemicalMechanical Polishing) be the best approach reaching global planarizartion, especially, after semiconductor fabrication process enters sub-micron (sub-micron) field, cmp has become an indispensable Manufacturing Techniques.
Chemical mechanical milling method (CMP) is a complicated technical process, and it is that its device therefor is often called grinder or polishing machine by the planarized wafer surface of the relative motion between wafer and grinding pad.During grinding, to be ground the facing down of the wafer that will grind is attached on grinding head, the relative grinding pad rotated of to be ground contact of wafer, wafer is pressed onto on grinding pad by the downforce that grinding head provides, when surface post rotate under the drive of grinding pad at motor time, grinding head also relatively rotates.Simultaneously, lapping liquid is transported on grinding pad by lapping liquid supply pipe (tube), and be evenly distributed on grinding pad by centrifugal force, chemical composition in this lapping liquid and polished wafer generation chemical reaction, insoluble matter is converted into lyotrope matter (chemical reaction process), then by mechanical friction, these lyotropes are removed from polished surface, realize in conjunction with mechanism and chemical reaction, the surfacing of wafer being removed, reach global planarizartion effect.The remarkable quality problems that cmp (CMP) brings are surface scratches (Scratch), after CMP process thin layer often have scratch on surface, the scratch of these little and difficult discoveries easily causes short circuit or open circuit phenomenon at intermetallic, greatly reduces the yield rate of product.
Application number is disclose a kind of chemical and mechanical grinding method reducing the tungsten metal of scratch in the Chinese patent of 02120608.2, the method is ground by the Acidic tungsten lapping liquid and oxide lapping liquid that have employed standard at the leading portion ground and back segment respectively, achieves the minimizing of tungsten metal grinding surface scratches.But because its unresolved problem need cleaning the lapping liquid removing the last grinding stage in the new grinding stage completely, after using the method, wafer surface still may deposit surface scratches after grinding.
After the grinding of first stage terminates, grinding head and wafer can remain the lapping liquid of this grinding and grind residue, if these lapping liquids and residue cleaning are not removed, the grinding of second stage will be had influence on, cause cut in wafer surface.For this reason, in CMP equipment, be generally provided with on-line cleaning device, to realize the cleaning to grinding head and wafer during grinding head moves.Fig. 1 is that schematic diagram is cleaned in existing grinding head midway, as shown in Figure 1, grinding head utilizes vacuum suction wafer 100 through cleaning area by vacuum line 105, when grinding head aligns with the cleaning shower nozzle 102 on scavenge pipe 101, shower nozzle 102 sprays deionized water and cleans it, to remove lapping liquid accompanying on wafer and grinding head and residue.But, because the cleaning dynamics of existing cleaning device is inadequate, for in grinding head, some are difficult to the relief region of cleaning, Waffer edge as being positioned at grinding head supporting disk 106 lower surface covers ring (retaining ring, also known as clasp) 103 and buffer film (membrane, also known as diaphragm) lapping liquid that exists in gap 108 between 104 and residue, be difficult to remove under general cleaning condition, the normal scavenging period needing cost longer, still can not guarantee to clean up, cause the reduction of Integral cleaning efficiency and effect, impact grinding next time.
Application number be 200610030021.3 Chinese patent provide a kind of cleaning device of grinding head, in this cleaning device, the sprinkler height of corresponding grinding head center is less than the sprinkler height of corresponding grinding head fringe region, and the gap coming edge region is cleaned.Although this patent can improve the cleaning performance to gap to a certain extent, but shower nozzle spray water outlet direction remain perpendicular to grinding head, the gap between clasp and diaphragm is caused not contacted completely by water column, especially the sidewall in gap can not be cleaned well, therefore, the cleaning performance of this technical scheme is still limited.
Summary of the invention
In order to realize goal of the invention of the present invention, the invention provides a kind of grinding head cleaning device, milling apparatus and cleaning method, the technical problem in gap between clasp and diaphragm cannot be cleaned completely with solving vertical direction injection water in prior art.
Grinding head cleaning device provided by the invention, this grinding head has middle diaphragm area and the clasp region at edge, between this diaphragm area and clasp region, there is gap, this cleaning device comprises the scavenge pipe that is connected with main pipe rail and by multiple cleaning shower nozzles that scavenge pipe is drawn, wherein, this cleaning shower nozzle comprises multiple first shower nozzle corresponding to grinding head diaphragm area and multiple second shower nozzles corresponding to grinding head gap area, this second shower nozzle is established in scavenge pipe surface thereof, and the medium ejected to make it is with this gap of non-vertical direction directive.
Further, the sidewall in this gap of medium directive that ejects of this second shower nozzle.
Further, this second shower nozzle comprises the shower nozzle be tilted to the left and the shower nozzle be tilted to the right, the both sides sidewall in this gap of medium directive of ejecting to make it.
Further, the height of this second shower nozzle is greater than the height of the first shower nozzle.
Further, the spout of this second shower nozzle is less than the spout of the first shower nozzle.
Further, the quantity of this second shower nozzle is greater than the quantity of the first shower nozzle.
Further, this scavenge pipe also comprises the 3rd shower nozzle at least one this gap of vertical direction directive corresponding to grinding head gap area.
Further, this main pipe rail is water lines, air pipe or vacuum line.
The present invention also provides a kind of chemical-mechanical grinding device with above-mentioned grinding head cleaning device, it comprises multiple grinding pad, multiple grinding head and multiple cleaning device for cleaning grinding head be fixed between neighboring abrasive pad, this grinding head has middle diaphragm area and the clasp region at edge, between this diaphragm area and clasp region, there is gap, this cleaning device comprises the scavenge pipe that is connected with main pipe rail and by multiple cleaning shower nozzles that scavenge pipe is drawn, wherein, this cleaning shower nozzle comprises multiple first shower nozzle corresponding to grinding head diaphragm area and multiple second shower nozzles corresponding to grinding head gap area, this second shower nozzle is established in scavenge pipe surface thereof, the medium ejected to make it is with this gap of non-vertical direction directive.
The present invention also provides a kind of grinding head cleaning method utilizing above-mentioned grinding head cleaning device, and it comprises: utilize this first shower nozzle to clean the diaphragm area in the middle of grinding head, utilize this second shower nozzle gap to grinding head edge to clean.
Grinding head cleaning device of the present invention, milling apparatus and cleaning method, the shower nozzle of inclination is set by the position in gap between corresponding grinding head upper diaphragm and clasp, when keeping cleaning condition constant, enhance local cleansing power, the emphasis achieved for the gap area of more difficult cleaning cleans, improve cleaning efficiency, shorten the production cycle.Structure of the present invention is simple, easy for installation, be suitable for suitability for industrialized production.
Accompanying drawing explanation
For can clearer understanding objects, features and advantages of the present invention, below with reference to accompanying drawing, preferred embodiment of the present invention be described in detail, wherein:
Fig. 1 is the schematic diagram that existing grinding head cleaning device cleans grinding head;
Fig. 2 is the structural representation of grinding head cleaning device of the present invention.
Detailed description of the invention
first embodiment
Refer to Fig. 2, the grinding head cleaning device of the present embodiment, this grinding head has middle diaphragm area 21 and the clasp region 22 at edge, between this diaphragm area 21 and clasp region 22, there is gap 23, this cleaning device comprises the scavenge pipe 31 that is connected with main pipe rail and by multiple cleaning shower nozzles that scavenge pipe 31 is drawn, wherein, this cleaning shower nozzle comprises multiple first shower nozzle 32 corresponding to grinding head diaphragm area 21 and multiple second shower nozzles 33 corresponding to grinding head gap area 22, this second shower nozzle 33 is established in scavenge pipe 31 surface thereof, the medium ejected to make it is with this gap 23 of non-vertical direction directive, gap 23 is cleaned better, especially the sidewall cleaned is difficult in gap 23.
The present embodiment arranges the shower nozzle of inclination by the position in gap between corresponding grinding head upper diaphragm and clasp, when keeping cleaning condition constant, enhance local cleansing power, the emphasis achieved for the gap area of more difficult cleaning cleans, improve cleaning efficiency, shorten the production cycle, adopt the cleaning device of the present embodiment, scavenging period can shorten over half.
In order to improve the cleaning performance to gap 23, the second shower nozzle 33 comprises the shower nozzle be tilted to the left and the shower nozzle be tilted to the right, as shown in Figure 2, and the both sides sidewall in the medium directive gap 23 of ejecting to make it.Meanwhile, in order to take into account the cleaning performance bottom gap 23, the second shower nozzle 33 place, namely corresponds to grinding head gap area, preferably corresponding to immediately below gap 23, arranges the 3rd shower nozzle that at least one is vertical, with the bottom depths in vertical direction directive gap 23.In addition, the position of corresponding grinding head diaphragm area can also arrange the shower nozzle of inclination, to increase cleaning angle to diaphragm area, improves the cleansing power to diaphragm area.
In order to improve the local cleansing power of this cleaning device to gap area, the height that following three kinds of mode: a. can be taked to arrange the second shower nozzle 33 is greater than the height of the first shower nozzle 32, the distance being difficult to the gap area of cleaning in second shower nozzle 33 and grinding head is reduced, when not changing the cleaning conditions such as pressure, strengthen the cleansing power to gap area; B. the spout arranging the second shower nozzle 33 is less than the spout of the first shower nozzle 32, make the expulsion pressure of the second shower nozzle 33 under same rate-of flow larger, spray more concentrated, better to the cleaning performance of gap area; C. the quantity arranging the second shower nozzle 33 is greater than the first shower nozzle 32, to the gap area being difficult to clean in addition more local cleansing power.
In the present embodiment, angle of inclination between second shower nozzle 33 and scavenge pipe 31 is 40 °, can adjust as required in practical application, and preferably angular range is 30-60 °, the depths in angle too small less cleaning gap, angle is excessive, can reduce the cleaning performance to slot sidewall.
In practical application, the shower nozzle more more or less than the present embodiment can be set on demand.
In practical application, described main pipe rail can be water lines, air pipe or vacuum line, and what shower nozzle ejected can be the media such as deionized water, cleaning fluid, nitrogen, argon gas, and pull of vacuum also can be utilized to remove grinding head surface residual debris.
second embodiment
The present embodiment provides the chemical-mechanical grinding device with above-mentioned first embodiment grinding head cleaning device, it comprises multiple grinding pad, multiple grinding head and multiple cleaning device for cleaning grinding head be fixed between neighboring abrasive pad, this grinding head has middle diaphragm area and the clasp region at edge, between this diaphragm area and clasp region, there is gap, this cleaning device comprises the scavenge pipe that is connected with main pipe rail and by multiple cleaning shower nozzles that scavenge pipe is drawn, wherein, this cleaning shower nozzle comprises multiple first shower nozzle corresponding to grinding head diaphragm area and multiple second shower nozzles corresponding to grinding head gap area, this second shower nozzle is established in scavenge pipe surface thereof, the medium ejected to make it is with this gap of non-vertical direction directive.
embodiment of the method
The present embodiment provides a kind of grinding head cleaning method utilizing above-mentioned first embodiment grinding head cleaning device, it comprises: utilize this first shower nozzle to clean the diaphragm area in the middle of grinding head, utilize this second shower nozzle gap to grinding head edge to clean.
Claims (10)
1. a grinding head cleaning device, this grinding head has middle diaphragm area and the clasp region at edge, between this diaphragm area and clasp region, there is gap, this cleaning device comprises the scavenge pipe that is connected with main pipe rail and by multiple cleaning shower nozzles that scavenge pipe is drawn, it is characterized in that: this cleaning shower nozzle comprises multiple first shower nozzle corresponding to grinding head diaphragm area and multiple second shower nozzles corresponding to grinding head gap area, this second shower nozzle is established in scavenge pipe surface thereof, and the medium ejected to make it is with this gap of non-vertical direction directive.
2. grinding head cleaning device according to claim 1, is characterized in that: the sidewall in this gap of medium directive that this second shower nozzle ejects.
3. grinding head cleaning device according to claim 2, is characterized in that: this second shower nozzle comprises the shower nozzle be tilted to the left and the shower nozzle be tilted to the right, the both sides sidewall in this gap of medium directive of ejecting to make it.
4. the grinding head cleaning device according to any one of claims 1 to 3, is characterized in that: the height of this second shower nozzle is greater than the height of the first shower nozzle.
5. the grinding head cleaning device according to any one of claims 1 to 3, is characterized in that: the spout of this second shower nozzle is less than the spout of the first shower nozzle.
6. the grinding head cleaning device according to any one of claims 1 to 3, is characterized in that: the quantity of this second shower nozzle is greater than the quantity of the first shower nozzle.
7. the grinding head cleaning device according to any one of claims 1 to 3, is characterized in that: the 3rd shower nozzle this scavenge pipe also comprising at least one this gap of vertical direction directive corresponding to grinding head gap area.
8. the grinding head cleaning device according to any one of claims 1 to 3, is characterized in that: this main pipe rail is water lines, air pipe or vacuum line.
9. one kind has the chemical-mechanical grinding device of grinding head cleaning device described in claim 1, it comprises multiple grinding pad, multiple grinding head and multiple cleaning device for cleaning grinding head be fixed between neighboring abrasive pad, this grinding head has middle diaphragm area and the clasp region at edge, between this diaphragm area and clasp region, there is gap, this cleaning device comprises the scavenge pipe that is connected with main pipe rail and by multiple cleaning shower nozzles that scavenge pipe is drawn, it is characterized in that: this cleaning shower nozzle comprises multiple first shower nozzle corresponding to grinding head diaphragm area and multiple second shower nozzles corresponding to grinding head gap area, this second shower nozzle is established in scavenge pipe surface thereof, the medium ejected to make it is with this gap of non-vertical direction directive.
10. one kind utilizes the grinding head cleaning method of grinding head cleaning device described in claim 1, it is characterized in that: it comprises and utilizes this first shower nozzle to clean the diaphragm area in the middle of grinding head, utilizes this second shower nozzle gap to grinding head edge to clean.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410427479.7A CN104308720A (en) | 2014-08-27 | 2014-08-27 | Grinding head washing device, grinding equipment and washing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410427479.7A CN104308720A (en) | 2014-08-27 | 2014-08-27 | Grinding head washing device, grinding equipment and washing method |
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| CN104308720A true CN104308720A (en) | 2015-01-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410427479.7A Pending CN104308720A (en) | 2014-08-27 | 2014-08-27 | Grinding head washing device, grinding equipment and washing method |
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Cited By (7)
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| CN106272085A (en) * | 2016-08-24 | 2017-01-04 | 赣州帝晶光电科技有限公司 | Grinding processing method after a kind of liquid crystal glass base thinning |
| CN106625207A (en) * | 2016-09-27 | 2017-05-10 | 天津华海清科机电科技有限公司 | Wafer discharging method, wafer discharging auxiliary device, wafer discharging device and CMP equipment comprising wafer discharging device |
| CN106985060A (en) * | 2016-01-18 | 2017-07-28 | 三星电子株式会社 | Substrate attenuation device, the method that substrate is thinned and the method for manufacturing semiconductor packages |
| CN109844656A (en) * | 2017-05-12 | 2019-06-04 | 韩奉锡 | The abrasive action analysis method and its device of semiconductor wafer chemical mechanical grinding processes |
| CN112476231A (en) * | 2020-11-26 | 2021-03-12 | 华虹半导体(无锡)有限公司 | Method for cleaning grinding head of chemical mechanical grinding process |
| CN112677033A (en) * | 2020-12-03 | 2021-04-20 | 上海新昇半导体科技有限公司 | Polishing head, chemical mechanical polishing device and chemical mechanical polishing method |
| CN114131500A (en) * | 2021-11-02 | 2022-03-04 | 北京子牛亦东科技有限公司 | Grinding head body for chemical mechanical grinding equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106985060A (en) * | 2016-01-18 | 2017-07-28 | 三星电子株式会社 | Substrate attenuation device, the method that substrate is thinned and the method for manufacturing semiconductor packages |
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| CN112476231A (en) * | 2020-11-26 | 2021-03-12 | 华虹半导体(无锡)有限公司 | Method for cleaning grinding head of chemical mechanical grinding process |
| CN112677033A (en) * | 2020-12-03 | 2021-04-20 | 上海新昇半导体科技有限公司 | Polishing head, chemical mechanical polishing device and chemical mechanical polishing method |
| CN112677033B (en) * | 2020-12-03 | 2021-12-17 | 上海新昇半导体科技有限公司 | Polishing head, chemical mechanical polishing device and chemical mechanical polishing method |
| CN114131500A (en) * | 2021-11-02 | 2022-03-04 | 北京子牛亦东科技有限公司 | Grinding head body for chemical mechanical grinding equipment |
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