CN104302100A - Welding pad structure, printed circuit board employing welding pad structure, and memory storage device - Google Patents
Welding pad structure, printed circuit board employing welding pad structure, and memory storage device Download PDFInfo
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- CN104302100A CN104302100A CN201310303603.4A CN201310303603A CN104302100A CN 104302100 A CN104302100 A CN 104302100A CN 201310303603 A CN201310303603 A CN 201310303603A CN 104302100 A CN104302100 A CN 104302100A
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- electronic component
- weld
- pad structure
- welding pad
- scolding tin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a welding pad structure, a printed circuit board employing the welding pad structure, and a memory storage device. The welding pad structure is suitable for configuring an electronic element on the printed circuit board. The welding pad structure comprises a first welding pad and multiple second welding pads, wherein the first welding pad is electrically connected with one end of the electronic element, each second welding pad is electrically connected with the other end of the electronic element, the first welding pad and the second welding pads are mutually independent, and the second welding pads are mutually independent.
Description
Technical field
The present invention relates to a kind of circuit layout, and in particular to a kind of welding pad structure and printed circuit board (PCB) and the memory storage apparatus of applying it.
Background technology
Along with the progress of printed circuit board (PCB) (Printed circuit board, PCB) and fabrication of electronic components technology, the design of printed circuit board (PCB) and electronic component also designs towards undersized direction thereupon, to meet the demand of existing electronic product microminiaturization.But the reduction of printed circuit board sizes, means that the layout designs of printed circuit board (PCB) is difficult increasingly also simultaneously.
Generally speaking, in the layout designs of printed circuit board (PCB), the welding pad structure meeting electronic component dimensions usually can be utilized electronic component to be electrically connected to other element/circuit on printed circuit board (PCB).With regard to traditional welding pad structure, it only can carry out the end points of electrical connecting electronic component usually with single weld pad.Such as, when electronic component is the electronic component of both-end, generally welding pad structure can be designed to there are two respectively in order to be electrically connected the weld pad of the end points of electronic component.
But, because traditional welding pad structure only can set up single connected node to be electrically connected other circuit on printed circuit board (PCB) for electronic component, therefore in the layout designs of some printed circuit board (PCB)s, if two-phase exclusive-OR circuit will be made mutually to be electrically connected, must set up extra electronic component (such as low-impedance resistance) toward contact, and design meets the welding pad structure of this additional electronic component and cabling using as the access path between two-phase exclusive-OR circuit.Thus, the integral layout area of printed circuit board (PCB) just can be made to increase, and the layout density of printed circuit board (PCB) is improved, and then cause the degree of difficulty of circuit layout design to promote significantly.
Summary of the invention
Exemplary embodiment of the present invention provides a kind of welding pad structure and applies its printed circuit board (PCB) and memory storage apparatus, and it can reduce the layout area of circuit design.
The welding pad structure of the present invention one exemplary embodiment is suitable for electronic component arrangements on printed circuit board (PCB).Described welding pad structure comprises the first weld pad and multiple second weld pad.First weld pad is suitable for the one end being electrically connected electronic component.Each second weld pad is suitable for the other end being electrically connected electronic component, and wherein the first weld pad and described multiple second weld pad are electrically independent each other, and these second weld pads are also electrically independent each other.
In an exemplary embodiment, the second weld pad is arranged at the same side in welding pad structure, and the first weld pad is arranged at opposite side relative with a little second weld pad in welding pad structure.In an exemplary embodiment, electronic component is the element pasted on surface (surface mounting device, SMD) comprising multiple scolding tin junction.These scolding tin junctions comprise one first scolding tin junction and one second scolding tin junction.First scolding tin junction is arranged at one end of this electronic component, and the second scolding tin junction is the other end being arranged at electronic component.First weld pad is suitable for this end being connected to electronic component via the first scolding tin electric characteristics on contact surface, and the second weld pad is suitable for this other end via the second scolding tin electric characteristics on contact surface connecting electronic component.
In an exemplary embodiment, the second above-mentioned weld pad comprises one the 3rd weld pad and one the 4th weld pad.3rd weld pad is electrically connected to one first circuit.4th weld pad is electrically connected to a second circuit, and the first circuit and second circuit are electrically independent each other.When above-mentioned electronic component arrangements is in this welding pad structure, the 3rd weld pad and the 4th weld pad are electrically connected mutually via the second above-mentioned scolding tin junction, and the first circuit and second circuit are electrically connected mutually with activation second circuit.
The present invention one exemplary embodiment proposes a kind of printed circuit board (PCB), and it comprises at least one first welding pad structure.Each first welding pad structure comprises the first weld pad and multiple second weld pad.First weld pad is suitable for one end of electric connection one electronic component.Each second weld pad is suitable for the other end being electrically connected electronic component, and wherein the first weld pad and described multiple second weld pad are electrically independent each other, and these second weld pads are electrically independent each other.
In an exemplary embodiment, above-mentioned printed circuit board (PCB) also comprises this electronic component.This electronic component is arranged in the first above-mentioned welding pad structure.Wherein, one end of electronic component is connected to the first weld pad, and the other end of electronic component is connected to the second weld pad.
In an exemplary embodiment, above-mentioned printed circuit board (PCB) also comprises one second welding pad structure.This second welding pad structure comprises two the 5th weld pads.One of them the 5th weld pad is suitable for one end of electric connection one first electronic component, and another the 5th weld pad is suitable for the other end of electric connection first electronic component.These the 5th weld pads are electrically independent each other, and the number of the scolding tin junction of the first electronic component is same as the number of the scolding tin junction of above-mentioned electronic component.
In an exemplary embodiment, the layout area of above-mentioned first welding pad structure is identical in fact with the layout area of the second welding pad structure.
With another one angle, the present invention one exemplary embodiment proposes a kind of memory storage apparatus, comprises connector, reproducible nonvolatile memorizer module and Memory Controller.Connector is electrically connected to a host computer system.Reproducible nonvolatile memorizer module comprises multiple physics erased cell.Memory Controller is electrically connected to connector and reproducible nonvolatile memorizer module.Connector or Memory Controller are arranged on a printed circuit board (PCB), and this printed circuit board (PCB) comprises at least one first welding pad structure.Each first welding pad structure comprises the first weld pad and multiple second weld pad.First weld pad is suitable for one end of electric connection one electronic component.Each second weld pad is suitable for the other end being electrically connected electronic component, and wherein the first weld pad and described multiple second weld pad are electrically independent each other, and these second weld pads are electrically independent each other.
Based on above-mentioned, exemplary embodiment of the present invention proposes a kind of welding pad structure and applies its printed circuit board (PCB) and memory storage apparatus.In described welding pad structure, it includes at least two in order to be electrically connected the weld pad of same one end of electronic component, uses and sets up the extra connected node of described electronic component.Therefore, designer can directly utilize described extra connected node to connect two-phase exclusive-OR circuit when design circuit layout, and then reduces the layout area of the circuit design on printed circuit board (PCB), and the versatility of circuit layout design and flexibility are promoted.
For above-mentioned feature and advantage of the present invention can be become apparent, exemplary embodiment cited below particularly, and coordinate accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of welding pad structure and the electronic component illustrated according to an exemplary embodiment.
Fig. 2 A is the schematic diagram of a kind of printed circuit board (PCB) and layout structure thereof.
Fig. 2 B is the schematic equivalent circuit illustrating the printed circuit board (PCB) shown in Fig. 2 A.
Fig. 3 A is the schematic diagram of printed circuit board (PCB) and the layout structure thereof illustrated according to an exemplary embodiment.
Fig. 3 B is the schematic equivalent circuit illustrating the printed circuit board (PCB) shown in Fig. 3 A.
Fig. 4 A is the host computer system and memory storage apparatus that illustrate according to an exemplary embodiment.
Fig. 4 B is the schematic diagram of computer, input/output device and the memory storage apparatus illustrated according to an exemplary embodiment.
Fig. 4 C is the schematic diagram of host computer system and the memory storage apparatus illustrated according to an exemplary embodiment.
Fig. 5 is the schematic block diagram illustrating the memory storage apparatus shown in Fig. 4 A.
[symbol description]
10,10_1,10_2,10_3: electronic component
100,210,220,230,310,320: welding pad structure
200,300: printed circuit board (PCB)
CKT1: the first circuit
CKT2: second circuit
P1: the first weld pad
P2_1, P2_2: the second weld pad
P211, P212, P221, P222, P231, P232, P311_1, P311_2, P312, P321, P322: weld pad
T1: first end
T2: the second end
S1, S2: scolding tin junction
N1, N2: tie point
GND: earthed voltage
1000: host computer system
1100: computer
1102: microprocessor
1104: random access memory
1106: input/output device
1108: system bus
1110: data transmission interface
1202: mouse
1204: keyboard
1206: display
1208: printer
1212: Portable disk
1214: storage card
1216: solid state hard disc
1310: digital camera
1312:SD card
1314:MMC card
1316: memory stick
1318:CF card
1320: embedded storage device
400: memory storage apparatus
402: connector
404: Memory Controller
406: reproducible nonvolatile memorizer module
408 (0) ~ 408 (R): physics erased cell
Embodiment
In order to make content of the present disclosure more easily be understood, below especially exemplified by the example that exemplary embodiment can be implemented really according to this as the disclosure.But the present invention is not limited only to illustrated multiple exemplary embodiment, wherein also allows suitable combination between exemplary embodiment.In addition, all may part, in graphic and execution mode, use the element/component/step of identical label, represent identical or like.
Fig. 1 is the schematic diagram of welding pad structure and the electronic component illustrated according to an exemplary embodiment.Please refer to Fig. 1, in this exemplary embodiment, welding pad structure 100 is suitable for electronic component 10 to be configured on printed circuit board (PCB), be able to make electronic component 10 be mutually electrically connected by welding pad structure 100 and other element/circuit on printed circuit board (PCB), use and make electronic component 10 realize corresponding function in circuit.Wherein, electronic component 10 can be active member or passive device, and the present invention is also not subject to the limits.Such as, electronic component 10 can be metal oxide semiconductcor field effect transistor (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), bipolar transistor (bipolar junction transistor, BJT), electric capacity, resistance or inductance.In this exemplary embodiment, welding pad structure 100 is the electronic components 10 being applied to both-end.Welding pad structure 100 comprises the first weld pad P1 and the second weld pad P2_1 and P2_2.First weld pad P1 is suitable for the first end T1 being electrically connected electronic component 10, and the second weld pad P2_1 and P2_2 is suitable for the second end T2 being electrically connected electronic component 10, wherein the first weld pad P1 and the second weld pad P2_1 and P2_2 is electrically independent each other, and the second weld pad P2_1 and P2_2 is also electrically independent each other.
In an exemplary embodiment, electronic component 10 is for having the element pasted on surface (surface mounting device, SMD) of scolding tin junction S1 and S2.When designer is for being configured at electronic component 10 on a printed circuit board (PCB) (not illustrating) by welding pad structure 100, scolding tin junction S1 can be welded on the first weld pad P1 by designer, and is welded on the second weld pad P2_1 and P2_2 by scolding tin junction S2.In other words, the first weld pad P1 in welding pad structure 100 is the first end T1 being electrically connected to electronic component 10 via scolding tin junction S1, and the second weld pad P2_1 and P2_2 is the second end T2 being electrically connected to electronic component 10 via scolding tin junction S2.Under the configuration that electronic component 10 is welded in welding pad structure 100, mutually can be electrically connected via the scolding tin junction S2 of electronic component 10 between the second weld pad P2_1 and P2_2.
In this exemplary embodiment, second weld pad P2_1 and P2_2 is the same side be arranged in welding pad structure 100 according to the position of the second end T2 of electronic component 10, and the first weld pad P1 is arranged at the opposite side relative with the second weld pad P2_1 and P2_2 according to the position of the first end T1 of electronic component 10, but the present invention is not limited only to this.In another exemplary embodiment, bond pad locations can have different settings according to the end points/pin/junction position of electronic component 10 and quantity from weld pad quantity, thus makes electronic component 10 be suitable for by welding pad structure 100 and be configured on printed circuit board (PCB).
For example, if electronic component 10 is the element pasted on surface of three ends, then except the first weld pad P1 and the second weld pad P2_1 and P2_2, designer also can arrange one the 3rd weld pad (not illustrating) according to the scolding tin junction position of the 3rd end of electronic component 10 in welding pad structure 100.By this, the 3rd end of electronic component 10 is electrically connected mutually by other element/circuit on the 3rd weld pad and printed circuit board (PCB).In other words, in this exemplary embodiment, welding pad structure 100 also comprises the 3rd weld pad, and it is suitable for the 3rd end being electrically connected electronic component.Specifically, the first weld pad P1, the second weld pad P2_1, the second weld pad P2_2 and the 3rd weld pad are electrically independent each other.But if electronic component 10 has more multiterminal, then welding pad structure 100 also can have more weld pads.
Moreover, although two the second weld pad P2_1 and P2_2 are the second end T2 being electrically connected to electronic component 10 in FIG.But, in another exemplary embodiment, designer also can design second weld pad of more than three in welding pad structure 100, and these second weld pads be jointly be electrically connected to electronic component 10 same one end (such as, second end T2), use the connected node simultaneously providing more than three.
Base this, in fact the welding pad structure of this exemplary embodiment can adjust the configuration of bond pad locations and weld pad quantity adaptively based on the type of applied electronic component (electronic components as more than both-end, three ends or three ends), the present invention is not limited this.In other words; as long as in same welding pad structure; having plural weld pad is the same one end being electrically connected to electronic component, and described plural weld pad is electrically independent each other in time not being electrically connected electronic component, neither departs from the scope of welding pad structure of the present invention institute for protecting.
Below utilize Fig. 2 A ~ 3B so that the difference that the welding pad structure 100 of this exemplary embodiment causes when being applied to the layout designs of printed circuit board (PCB) with traditional welding pad structure to be described further.
Fig. 2 A is the schematic diagram of a kind of printed circuit board (PCB) and layout structure thereof.Fig. 2 B is the schematic equivalent circuit illustrating the printed circuit board (PCB) shown in Fig. 2 A.Referring to Fig. 2 A and Fig. 2 B, printed circuit board (PCB) 200 comprises the first circuit CKT1, second circuit CKT2, multiple welding pad structure 210,220 and 230, and electronic component 10_1 ~ 10_3.Wherein, printed circuit board (PCB) 200 can be applicable to the electronic installation of any type.
Welding pad structure 210,220 and 230 is traditional welding pad structure, and it utilizes two weld pads to carry out electrical connecting electronic component respectively.Such as, weld pad P211 and weld pad P212 is the two ends being electrically connected to electronic component 10_1; Weld pad P221 and weld pad P222 is the two ends being electrically connected to electronic component 10_2; And weld pad P231 and weld pad P232 is the two ends being electrically connected to electronic component 10_3.Wherein, before electronic component 10_3 is not arranged at welding pad structure 230, weld pad P231 and weld pad P232 is electrically independent each other.At this, electronic component 10_1 and 10_2 is for electric capacity, and electronic component 10_3 is for resistance.
Specifically, in printed circuit board (PCB) 200, first circuit CKT1 is main functional circuit (even printed circuit board (PCB) 200 can circuit needed for normal operation), and second circuit CKT2 is auxiliary functional circuit (can provide the circuit of additional functionality, can determine whether add by designer).The specification demands of the electronic installation that designer can apply according to printed circuit board (PCB) 200 and determine whether add second circuit CKT2, and design the layout structure of corresponding printed circuit board (PCB) 200 according to this.
For example, the first circuit CKT1 can be such as controller circuitry, and second circuit CKT2 can be such as the external power source circuit in order to provide external power source.If designer is for being that the internal electric source of employing first circuit CKT1 carrys out work by electronic device design, then designer can not need the layout structure considering second circuit CKT2 to the first circuit CKT1.Otherwise if designer is for carrying out work by electronic device design for adopting external power source, then designer need design the layout structure of corresponding printed circuit board (PCB), can be electrically connected to the first circuit CKT1 to make second circuit CKT2.
More particularly, under the execution mode not adding second circuit CKT2, designer only needs the configuration considering welding pad structure 210 and 220, and electronic component 10_1 and 10_2 is to the trace configurations of the first circuit CKT1, can complete the layout designs of printed circuit board (PCB) 200.On the contrary, under the execution mode adding second circuit CKT2, designer needs routing of layout layout further, makes second circuit CKT2 can be electrically connected to the first circuit CKT1.Under this execution mode, because printed circuit board (PCB) 200 uses traditional welding pad structure 230, therefore designer must configure the access path that extra resistance 10_3 and cabling are used as second circuit CKT2 and the first circuit CKT1.
From the above, in the layout structure design of printed circuit board (PCB) utilizing conventional bond pad structure, designer must design the layout structure of two kinds of different printed circuit board (PCB)s for the electronic installation of different size.In addition, under the execution mode adding second circuit CKT2, printed circuit board (PCB) 200 must increase the layout area of a welding pad structure 230, and (this is with the exemplary embodiment of Fig. 2 A and 2B, the number needs of the in fact required welding pad structure increased decides depending on the circuit design on printed circuit board (PCB)), make the arrangement space of other element/circuit on printed circuit board (PCB) 200 will certainly be subject to relative limit, thus make the integrated circuit layout designs of printed circuit board (PCB) 200 by restriction to a certain extent.
Fig. 3 A is the schematic diagram of printed circuit board (PCB) and the layout structure thereof illustrated according to an exemplary embodiment.Fig. 3 B is the schematic equivalent circuit illustrating the printed circuit board (PCB) shown in Fig. 3 A.Referring to Fig. 3 A and Fig. 3 B, printed circuit board (PCB) 300 comprises the first circuit CKT1, second circuit CKT2, welding pad structure 310 and 320 and electronic component 10_1 and 10_2.Wherein, printed circuit board (PCB) 300 can be applicable to the electronic installation of any type equally, and electronic component 10_1 and 10_2 is for electric capacity at this equally.
In this exemplary embodiment, the function of the first circuit CKT1 and second circuit CKT2 describes as above, therefore repeats no more.Printed circuit board (PCB) 300 is with the difference part of the printed circuit board (PCB) 200 of above-mentioned Fig. 2 A and 2B, and printed circuit board (PCB) 300 is the welding pad structures 100 (that is, welding pad structure 310) described in application drawing 1.Specifically, in printed circuit board (PCB) 300, one end of electronic component 10_1 is mutually electrically connected via welding pad structure 310 and the first circuit CKT1 and second circuit CKT2, and the other end of electronic component 10_1 is electrically connected to earthed voltage GND.One end of electronic component 10_2 is then mutually be electrically connected via traditional welding pad structure 320 and the first circuit CKT1, and the other end of electronic component 10_2 is electrically connected to earthed voltage GND.Weld pad P311_2 (also known as the 3rd weld pad) is electrically connected to the first circuit CKT1, and weld pad P311_1 (also known as the 4th weld pad) is electrically connected to second circuit CKT2.When electronic component 10_1 is configured in welding pad structure 310, weld pad P311_1 and P311_2 is electrically connected mutually via the scolding tin junction on electronic component 10_1.In other words, weld pad P311_1 and P311_2 can make one end of electronic component 10_1 have two connected node N1 and N2(equivalently as shown in Figure 3 B).Therefore, in this exemplary embodiment, designer only needs laying one by the cabling of second circuit CKT2 to the second weld pad P311_1, second circuit CKT2 can be electrically connected to the first circuit CKT1.When second circuit CKT2 is electrically connected to the first circuit CKT1, second circuit CKT2 just can be enabled, and carrys out work by this with external power source.
In other words, because weld pad P311_1 can be used to set up extra connected node N1 in one end of electronic component 10_1, make designer only need laying one by the cabling of second circuit CKT2 to weld pad P311_1, second circuit CKT2 can be electrically connected to the first circuit CKT1.Therefore, compared to the printed circuit board (PCB) 200 of application conventional bond pad structure, even the printed circuit board (PCB) of this exemplary embodiment 300 is under the execution mode adding second circuit CKT2, also do not need the access path that the cabling increasing extra electronic component 10_3, welding pad structure 230 and correspondence is used as between the first circuit CKT1 and second circuit CKT2.
Furthermore, in this exemplary embodiment, due to extra electronic component need do not set up as access path based on different execution modes, therefore be no matter under the execution mode adding or do not add at second circuit CKT2, printed circuit board (PCB) 300 all can utilize identical layout structure to realize, and then improves the design versatility of printed circuit board (PCB).
In addition, the number of the scolding tin junction of electronic component 10_1 is the number (being all two) of the scolding tin junction being same as electronic component 10_2.Due to the layout area summation of weld pad P311_1 and P311_2 close with weld pad P312 (being slightly less than weld pad P312), and the layout area of weld pad P312 is close or identical with weld pad P321 or P322 in welding pad structure 320, therefore generally speaking, the layout area of welding pad structure 310 is identical in fact with the layout area of welding pad structure 320.Therefore, under the execution mode adding second circuit CKT2, the layout density of the printed circuit board (PCB) 300 of application welding pad structure 310 can be significantly less than the layout density (having lacked the layout area of a welding pad structure 230) of printed circuit board (PCB) 200.In other words, in the printed circuit board (PCB) 300 of application welding pad structure 310, the layout area of design of integer electro-circuit can substantial reduction, and then the flexibility of circuit layout design is promoted.
It should be noted, in Fig. 3 A and 3B, the layout structure of the printed circuit board (PCB) 300 illustrated is only example, and the layout structure of actual printed circuit board (PCB) 300 need determine depending on corresponding circuit design, and the present invention is not as limit.In other words, as long as apply printed circuit board (PCB) and the layout structure of the welding pad structure (as welding pad structure 100 or 310) described in this exemplary embodiment, neither depart from the present invention institute for the printed circuit board (PCB) protected and the scope of layout structure.In an exemplary embodiment, the welding pad structure 100 or 310 of above-mentioned proposition can be used in a memory storage apparatus, and this memory storage apparatus can be arranged in pairs or groups with a host computer system and used.
Fig. 4 A is the host computer system and memory storage apparatus that illustrate according to an exemplary embodiment.
Please refer to Fig. 4 A, host computer system 1000 generally comprises computer 1100 and I/O (input/output, I/O) device 1106.Computer 1100 comprises microprocessor 1102, random access memory (random access memory, RAM) 1104, system bus 1108 and data transmission interface 1110.Input/output device 1106 comprises as the mouse 1202 of Fig. 4 B, keyboard 1204, display 1206 and printer 1208.It must be appreciated, the unrestricted input/output device 1106 of the device shown in Fig. 4 B, input/output device 1106 can also comprise other devices.
Memory storage apparatus 400 is electrically connected by data transmission interface 1110 other elements with host computer system 1000.Data can be write to memory storage apparatus 400 by microprocessor 1102, random access memory 1104 with the running of input/output device 1106 or read data from memory storage apparatus 400.Such as, memory storage apparatus 400 can be the type nonvolatile storage device of Portable disk 1212, storage card 1214 or solid state hard disc (Solid State Drive, SSD) 1216 etc. as shown in Figure 4 B.
Generally speaking, host computer system 1000 is any system that can coordinate to store data substantially with memory storage apparatus 100.Although in this exemplary embodiment, host computer system 1000 explains with computer system, but host computer system 1000 can be the systems such as digital camera, video camera, communicator, audio player or video player in another exemplary embodiment of the present invention.Such as, when host computer system is digital camera (video camera) 1310, type nonvolatile storage device is then its SD card 1312 used, mmc card 1314, memory stick (memory stick) 1316, CF card 1318 or embedded storage device 1320 (as shown in Figure 4 C).Embedded storage device 1320 comprises embedded multi-media card (Embedded MMC, eMMC).It is worth mentioning that, embedded multi-media card is directly electrically connected on the substrate of host computer system.
Fig. 5 is the schematic block diagram illustrating the memory storage apparatus shown in Fig. 4 A.
Please refer to Fig. 5, memory storage apparatus 400 comprises connector 502, Memory Controller 504 and reproducible nonvolatile memorizer module 506.
In this exemplary embodiment, connector 502 is compatible to advanced annex (Serial Advanced Technology Attachment, the SATA) standard of serial.But, it must be appreciated, the present invention is not limited thereto, connector 502 also can be meet parallel advanced annex (Parallel Advanced Technology Attachment, PATA) standard, Institute of Electrical and Electric Engineers (Institute of Electrical and Electronic Engineers, IEEE) 1394 standards, peripheral component connecting interface (Peripheral Component Interconnect Express, PCI Express) standard, USB (Universal Serial Bus, USB) standard, secure digital (Secure Digital, SD) interface standard, a ultrahigh speed generation (Ultra High Speed-I, UHS-I) interface standard, ultrahigh speed two generation (Ultra High Speed-II, UHS-II) interface standard, memory stick (Memory Stick, MS) interface standard, multimedia storage card (Multi Media Card, MMC) interface standard, down enters formula multimedia storage card (Embedded Multimedia Card, eMMC) interface standard, general flash memory (Universal Flash Storage, UFS) interface standard, compact flash (Compact Flash, CF) interface standard, integrated driving electrical interface (Integrated Device Electronics, IDE) standard or other standards be applicable to.
Memory Controller 504 in order to perform with multiple gate of hardware pattern or firmware pattern implementation or control command, and according to the instruction of host computer system 1000 carry out in reproducible nonvolatile memorizer module 506 data write, read and the running such as to erase.
Reproducible nonvolatile memorizer module 506 is electrically connected to Memory Controller 504, and in order to data that host system 1000 writes.Reproducible nonvolatile memorizer module 506 has physics erased cell 508 (0) ~ 508 (R).Such as, physics erased cell 508 (0) ~ 508 (R) can belong to same memory crystal grain (die) or belong to different memory crystal grain.Each physics erased cell has multiple physics programming unit respectively, and the physics programming unit belonging to same physics erased cell can be written independently and side by side be erased.Such as, each physics erased cell is made up of 128 physics programming units.But it must be appreciated, the present invention is not limited thereto, each physics erased cell can be made up of 64 physics programming units, 256 physics programming units or other any physics programming units.
In more detail, physics erased cell is the least unit of erasing.That is, each physics erased cell contain minimal amount in the lump by the memory cell of erasing.Physics programming unit is the minimum unit of programming.That is, physics programming unit is the minimum unit of write data.Each physics programming unit generally includes data bit district and redundant digit district.Data bit district comprises multiple physics access address in order to store the data of user, and redundant digit district is in order to the data (such as, control information and error correcting code) of storage system.In this exemplary embodiment, 4 physics access addresses in the data bit district of each physics programming unit, can be comprised, and the size of a physics access address is 512 bytes (byte, B).But in other exemplary embodiment, can comprise 8,16 or the more or less physics access address of number in data bit district, the present invention does not limit size and the number of physics access address yet.Such as, physics erased cell is physical blocks, and physics programming unit is physical page or physical sector.
In this exemplary embodiment, reproducible nonvolatile memorizer module 506 is multistage memory cell (Multi Level Cell, MLC) NAND type flash memory module, namely can store at least 2 bit data in a memory cell.But, the present invention is not limited thereto, reproducible nonvolatile memorizer module 506 may also be single-order memory cell (Single Level Cell, SLC) NAND type flash memory module, multistage memory cell (Trinary Level Cell, TLC) NAND type flash memory module, other flash memory module or other there is the memory module of identical characteristics.
In the exemplary embodiment of Fig. 5, connector 502 and Memory Controller 504 are configured on same printed circuit board (PCB), and this printed circuit board (PCB) comprises above-mentioned welding pad structure 100 or 310.But in another exemplary embodiment, connector 502 also can be configured on different printed circuit board (PCB)s from Memory Controller 504, and one of them printed circuit board (PCB) includes above-mentioned welding pad structure 100 or 310.
In sum, exemplary embodiment of the present invention proposes a kind of welding pad structure and applies its printed circuit board (PCB) and memory storage apparatus.In described welding pad structure, it includes at least two in order to be electrically connected the weld pad of same one end of electronic component, uses and sets up the extra connected node of described electronic component.Therefore, designer can directly utilize described extra connected node to connect two-phase exclusive-OR circuit when design circuit layout, and then reduces the layout area of the circuit design on printed circuit board (PCB), and the versatility of circuit layout design and flexibility are promoted.
Although the present invention with exemplary embodiment openly as above; so itself and be not used to limit the present invention; without departing from the spirit and scope of the present invention, when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion depending on appended claims confining spectrum for those skilled in the art.
Claims (18)
1. a welding pad structure, it is suitable for an electronic component arrangements on a printed circuit board (PCB), it is characterized in that, this welding pad structure comprises:
One first weld pad, is suitable for the one end being electrically connected this electronic component; And
Multiple second weld pad, respectively this second weld pad is suitable for the other end being electrically connected this electronic component, and wherein this first weld pad and these the second weld pads are electrically independent each other, and electrically independent each other between these second weld pads.
2. welding pad structure as claimed in claim 1, it is characterized in that, wherein these second weld pads are arranged at the same side in this welding pad structure, and this first weld pad is arranged at opposite side relative with these the second weld pads in this welding pad structure.
3. welding pad structure as claimed in claim 1, it is characterized in that, wherein this electronic component is the element pasted on surface comprising multiple scolding tin junction, and these scolding tin junctions comprise:
One first scolding tin junction, is arranged at this end of this electronic component; And
One second scolding tin junction, is arranged at this other end of this electronic component,
Wherein, this first weld pad is suitable for this end being connected to this electronic component via this first scolding tin electric characteristics on contact surface, and these second weld pads are suitable for this other end connecting this electronic component via this second scolding tin electric characteristics on contact surface.
4. welding pad structure as claimed in claim 3, it is characterized in that, wherein these second weld pads comprise:
One the 3rd weld pad, is electrically connected to one first circuit; And
One the 4th weld pad, is electrically connected to a second circuit, and this first circuit and this second circuit are electrically independent each other;
Wherein, when this electronic component arrangements is in this welding pad structure, the 3rd weld pad and the 4th weld pad are electrically connected mutually via this second scolding tin junction, and this first circuit and this second circuit are electrically connected mutually with this second circuit of activation.
5. a printed circuit board (PCB), is characterized in that, comprising:
One first welding pad structure, wherein this first welding pad structure comprises:
One first weld pad, is suitable for one end of electric connection one electronic component; And
Multiple second weld pad, respectively this second weld pad is suitable for the other end being electrically connected this electronic component, and wherein this first weld pad and these the second weld pads are electrically independent each other, and these second weld pads are electrically independent each other.
6. printed circuit board (PCB) as claimed in claim 5, it is characterized in that, wherein these second weld pads are arranged at the same side in this first welding pad structure, and this first weld pad is arranged at opposite side relative with these the second weld pads in this first welding pad structure.
7. printed circuit board (PCB) as claimed in claim 5, it is characterized in that, wherein this electronic component is the element pasted on surface comprising multiple scolding tin junction, and these scolding tin junctions at least comprise:
One first scolding tin junction, is located at this end of this electronic component; And
One second scolding tin junction, is located at this other end of this electronic component,
Wherein, this first weld pad is suitable for this end being connected to this electronic component via this first scolding tin electric characteristics on contact surface, and these second weld pads are suitable for this other end connecting this electronic component via this second scolding tin electric characteristics on contact surface.
8. printed circuit board (PCB) as claimed in claim 7, it is characterized in that, wherein these second weld pads comprise:
One the 3rd weld pad, is electrically connected to one first circuit; And
One the 4th weld pad, is electrically connected to a second circuit, and this first circuit and this second circuit are electrically independent each other,
Wherein, when this electronic component arrangements is in this welding pad structure, the 3rd weld pad and the 4th weld pad are electrically connected mutually via this second scolding tin junction, and this first circuit and this second circuit are electrically connected mutually with this second circuit of activation.
9. printed circuit board (PCB) as claimed in claim 5, is characterized in that, also comprise:
This electronic component, be arranged in this first welding pad structure, wherein this end of this electronic component is connected to this first weld pad, and this other end of this electronic component is connected to these the second weld pads.
10. printed circuit board (PCB) as claimed in claim 5, is characterized in that, also comprise:
One second welding pad structure, wherein this second welding pad structure comprises:
2 the 5th weld pads, these the 5th weld pads one end being suitable for electric connection one first electronic component wherein, these the 5th weld pads wherein another is suitable for the other end being electrically connected this first electronic component, wherein these the 5th weld pads are electrically independent each other, and the number of the scolding tin junction of this first electronic component is same as the number of the scolding tin junction of this electronic component.
11. as claim 10 the printed circuit board (PCB) that counts, it is characterized in that, wherein the layout area of this first welding pad structure is identical in fact with the layout area of this second welding pad structure.
12. 1 kinds of memory storage apparatus, is characterized in that, comprising:
A connector, in order to be electrically connected to a host computer system;
One reproducible nonvolatile memorizer module, comprises multiple physics erased cell; And
One Memory Controller, is electrically connected to this connector and this reproducible nonvolatile memorizer module,
Wherein, this connector or this Memory Controller are arranged on a printed circuit board (PCB), and this printed circuit board (PCB) comprises:
One first welding pad structure, wherein this first welding pad structure comprises:
One first weld pad, is suitable for one end of electric connection one electronic component; And
Multiple second weld pad, wherein respectively this second weld pad is suitable for the other end being electrically connected this electronic component,
Wherein this first weld pad and these the second weld pads are electrically independent each other, and these second weld pads are electrically independent each other.
13. memory storage apparatus as claimed in claim 12, it is characterized in that, wherein these second weld pads are arranged at the same side in this first welding pad structure, and this first weld pad is arranged at opposite side relative with these the second weld pads in this first welding pad structure.
14. memory storage apparatus as claimed in claim 12, is characterized in that, wherein this electronic component is the element pasted on surface comprising multiple scolding tin junction, and these scolding tin junctions comprise:
One first scolding tin junction, is located at this end of this electronic component; And
One second scolding tin junction, is located at this other end of this electronic component,
Wherein, this first weld pad is suitable for this end being connected to this electronic component via this first scolding tin electric characteristics on contact surface, and these second weld pads are suitable for this other end connecting this electronic component via this second scolding tin electric characteristics on contact surface.
15. memory storage apparatus as claimed in claim 14, it is characterized in that, wherein these second weld pads comprise:
One the 3rd weld pad, is electrically connected to one first circuit; And
One the 4th weld pad, is electrically connected to a second circuit, and this first circuit and this second circuit are electrically independent each other,
Wherein, when this electronic component arrangements is in this welding pad structure, the 3rd weld pad and the 4th weld pad are electrically connected mutually via this second scolding tin junction, and this first circuit and this second circuit are electrically connected mutually with this second circuit of activation.
16. memory storage apparatus as claimed in claim 12, it is characterized in that, wherein this printed circuit board (PCB) also comprises:
This electronic component, be arranged in this first welding pad structure, wherein this end of this electronic component is connected to this first weld pad, and this other end of this electronic component is connected to these the second weld pads.
17. memory storage apparatus as claimed in claim 12, it is characterized in that, wherein this printed circuit board (PCB) also comprises:
One second welding pad structure, wherein this second welding pad structure comprises:
2 the 5th weld pads, these the 5th weld pads one end being suitable for electric connection one first electronic component wherein, these the 5th weld pads wherein another is suitable for the other end being electrically connected this first electronic component, wherein these the 5th weld pads are electrically independent each other, and the number of the scolding tin junction of this first electronic component is same as the number of the scolding tin junction of this electronic component.
18. memory storage apparatus as claimed in claim 17, is characterized in that, wherein the layout area of this first welding pad structure is identical in fact with the layout area of this second welding pad structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310303603.4A CN104302100A (en) | 2013-07-18 | 2013-07-18 | Welding pad structure, printed circuit board employing welding pad structure, and memory storage device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310303603.4A CN104302100A (en) | 2013-07-18 | 2013-07-18 | Welding pad structure, printed circuit board employing welding pad structure, and memory storage device |
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| CN104302100A true CN104302100A (en) | 2015-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310303603.4A Pending CN104302100A (en) | 2013-07-18 | 2013-07-18 | Welding pad structure, printed circuit board employing welding pad structure, and memory storage device |
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| CN (1) | CN104302100A (en) |
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Application publication date: 20150121 |