CN104246999B - Wafer map verification of data system and wafer map verification of data method - Google Patents
Wafer map verification of data system and wafer map verification of data method Download PDFInfo
- Publication number
- CN104246999B CN104246999B CN201280071771.9A CN201280071771A CN104246999B CN 104246999 B CN104246999 B CN 104246999B CN 201280071771 A CN201280071771 A CN 201280071771A CN 104246999 B CN104246999 B CN 104246999B
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- wafer
- nude film
- wafer map
- map data
- data image
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- 238000013524 data verification Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 12
- 238000010521 absorption reaction Methods 0.000 claims abstract description 18
- 238000012795 verification Methods 0.000 claims description 4
- 238000012797 qualification Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 abstract description 18
- 239000000758 substrate Substances 0.000 abstract description 7
- 230000007246 mechanism Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 206010045178 Tunnel vision Diseases 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Die Bonding (AREA)
Abstract
Wafer map data image is shown with the arrangement pattern of the nude film identical with the wafer images photographed by camera and with the region of each nude film separated by latticed line size identical with the region of each nude film of wafer images.Operator operates the input units such as mouse, keyboard or touch panel, make the display location of wafer images or wafer map data image mobile on the picture of display device and make wafer images overlapping and consistent with wafer map data image, so as to check wafer images and wafer map data image, the nude film for starting absorption is specified.Afterwards, start to produce, according to chip diagram data, only pick up qualified nude film successively from the nude film for starting absorption and be installed on substrate.
Description
Technical field
The present invention relates to the wafer map verification of data system checked wafer images and wafer map data image and
Wafer map verification of data method.
Background technology
In general, chip is glued to cutting sheet and is cut, multiple nude films (semiconductor chip) are divided into.In a crystalline substance
Unqualified nude film is included in piece, therefore each nude film is checked good no in nude film inspection operation and utilizes ink unqualified naked
On piece adds unqualified mark, and each nude film is shot by camera in nude film installation procedure and is had to unqualified mark
Without image recognition is carried out, qualified nude film (qualified chip) is only picked up successively from chip and is installed on substrate.
But in the method, it is necessary to each nude film is shot by camera and the presence or absence of unqualified mark is carried out
Image recognition, there are production efficiency difference it is such the shortcomings that.
Therefore, in recent years, as described in patent document 1 (Japanese Unexamined Patent Publication 2001-250834 publications), in nude film
In inspection operation, the whether qualified chip diagram data of the nude film of each position of the chip after representing cutting is made, is installed in nude film
In process, using chip diagram data, qualified nude film (qualified chip) is only picked up successively from chip and is installed on substrate, such side
Method becomes mainstream.
In the method, it is necessary to check actual chip and chip diagram data, make each position of actual chip
Nude film it is whether qualified corresponding exactly with chip diagram data.
Therefore, as described in patent document (Japanese Unexamined Patent Publication 2008-311430 publications), it is proposed that use pattern
The technology that matching technique automatically checks actual chip and chip diagram data.The technology is across being pasted with cutting for chip
Pitch cutting and camera and lighting source are configured at mutual opposite side, from camera-side from, (cut from chip using lighting source
Piece) rear side be illuminated and shot, so as to be easy to carry out image recognition to each nude film of chip.
Patent document 1：Japanese Unexamined Patent Publication 2001-250834 publications
Patent document 2：Japanese Unexamined Patent Publication 2008-311430 publications
Patent document 3：Japanese Unexamined Patent Publication 2010-129949 publications
The content of the invention
But it is that camera and lighting source are configured at mutual opposite side across cutting sheet in above patent document 2
Structure, but need bare chip pickup device cutting sheet lower section configure jacking mechanism, above-mentioned jacking mechanism pick up it is naked
During piece using jack up pin by the adhesive portion of the nude film to be adsorbed in cutting sheet jack-up and by the adhesive portion of the nude film from
The cutting sheet is partly peeled off, and is accordingly difficult in the lower section of cutting sheet configuration lighting source (or camera) (with reference to patent document 3).
Also, due to nude film it is small-sized/microminiaturization, be susceptible to the influence of manufacture deviation, it is difficult to the periphery of chip
The nude film in portion carries out image recognition exactly.Therefore, though using patent document 2 method, actual chip and wafer map number
According to automatic checking it is also more difficult, it is possible to misidentify the position of nude film.
Thus, present situation is laterally to arrange actual wafer images and wafer map data image on the picture of display device
Arrange and show, operator starts to adsorb by estimating to check actual wafer images and wafer map data image to specify
Nude film, but the image due to wafer map data image and actual wafer images are different, and verification operation needs skillfully,
When the low operator of proficiency carries out verification operation, it is possible to the location dislocation of nude film can be made and checked.In nude film
In the case of checking location dislocation, when being picked up according to chip diagram data to nude film, in the position of certified products/defective work
Also nude film is picked up in the state of misplacing, unqualified substrate can be produced.
Therefore, problem to be solved by this invention is to provide wafer map verification of data system and wafer map verification of data
Method, operator can by estimate simply and accurately to the actual wafer images that are shown on the picture of display device and
Wafer map data image is checked.
In order to solve the above problems, wafer map verification of data system of the invention possesses：Display device, shows by camera pair
Wafer images obtained from least a portion for the chip being cut in a manner of being divided into multiple nude films is shot and represent
The whether qualified wafer map data image of the nude film of each position of above-mentioned chip；And operating unit, carry out to above-mentioned wafer images
The operation checked with above-mentioned wafer map data image, above-mentioned wafer map verification of data system be characterized in that, above-mentioned chip
Diagram data image is shown that aforesaid operations unit is configured to the arrangement pattern of the nude film identical with above-mentioned wafer images,
Make the display location of above-mentioned wafer images or above-mentioned wafer map data image mobile on the picture of above-mentioned display device and make above-mentioned
Wafer images are overlapping and consistent with above-mentioned wafer map data image, so as to above-mentioned wafer images and above-mentioned wafer map data image
Checked.
In the structure shown here, due to making the display locations of wafer images or wafer map data image on the picture of display device
Move and make wafer images overlapping and consistent with wafer map data image, so as to wafer images and wafer map data image
Checked, therefore operator can be by estimating the simply and accurately actual crystalline substance to being shown on the picture of display device
Picture and wafer map data image are checked.
Operator is by operating operating unit and overlapping and consistent with wafer map data image in wafer images
The nude film for starting absorption is specified under state.Thus, operator can start to adsorb by estimating simply and accurately to specify
Nude film.
In addition, wafer map data image is not naked to distinguish with different background (colour display, grey are shown, style etc.)
The part of piece and the part for having nude film.Thus, operator can be by estimating simply and accurately to being shown in wafer map
The nude film of the peripheral part of chip on data image is differentiated.
In addition, wafer map data image can also be shown on the region of unqualified nude film mark (mark, word, mark,
Colour display, grey are shown).Thus, operator can be on the picture of display device by estimating simply to unqualified
The position of nude film is confirmed.In addition, in the case of being attached with unqualified mark on the unqualified nude film of chip, can pass through
Estimate the position of the simply mark of the unqualified nude film of the position of the unqualified mark to wafer images and wafer map data image
Unanimous circumstances are put to be confirmed.
Brief description of the drawings
Fig. 1 is the stereoscopic figure of the nude film feedway in one embodiment of the invention.
Fig. 2 is to jack up unit and the stereoscopic figure of its peripheral part.
Fig. 3 is the stereoscopic figure of chip tray.
Fig. 4 is that the broken section being indicated to the state for making jack-up cylinder rise to after absorption position when jack-up acts is put
Big figure.
Fig. 5 is that the broken section for making jack-up pin be indicated from the state after cylinder protrudes that jacks up when jack-up acts is amplified
Figure.
Fig. 6 is the figure being indicated to an example of chip diagram data.
Fig. 7 (a) is the figure being indicated to an example of wafer images, Fig. 7 (b) be to an example of wafer map data image into
The figure that row represents.
Fig. 8 (a) is the figure that the state in the way to image overlap operation is indicated, and Fig. 8 (b) is to image overlap operation
The figure that the state of completion is indicated.
Embodiment
Hereinafter, to will be illustrated for implementing the embodiment after the mode of the present invention embodies.
First, the architectural overview of bare chip pickup device 11 is illustrated using Fig. 1.
Bare chip pickup device 11 possesses feed bin maintaining part 22 (Pan Ta), pallet pull-out platform 23, XY moving mechanisms 25, jack-up list
Pallet pull-out platform 23, is arranged to be inserted in the state of component mounter (not shown) by member 28 (with reference to Fig. 2) etc..
So as to the feed bin that the mode moved up and down is stored (is not schemed in the feed bin maintaining part 22 of bare chip pickup device 11
Show) in, the loading multilayer of chip tray 32 that chip sets body 30 is installed, in production, is pulled out from feed bin by chip tray 32
Pulled out to pallet on platform 23.It will be pasted with chip is cut in chessboard trellis and is formed as shown in figure 3, chip sets body 30
Nude film 31 the cutting sheet 34 that can be stretched with the state of extension be installed on circular opening portion chip mounting plate 33
On, and the chip mounting plate 33 is installed on tray main body 35 by screw threads for fastening etc..
Jack up unit 28 and area of space below the cutting sheet 34 of chip tray 32 is configured to (with reference to Fig. 2) along XY
Move in direction.Also, using jacking up the jack-up pin 39 (with reference to Fig. 4, Fig. 5) of cylinder 37 by being picked up (absorption) in cutting sheet 34
The adhesive portion of nude film 31 partly jacked up from below so that by the adhesive portion of the nude film 31 from cutting sheet 34 partly
Peel off and float nude film 31 and as be easy to pickup state.
The jack-up unit 28 is configured to make jack-up unit 28 move down on the whole for driving source with servomotor (not shown)
It is dynamic.In nude film picking action, when jack-up unit 28 rises and the upper surface of jack-up cylinder 37 is set to rise to and chip tray 32
During the pre- stator absorption position that cutting sheet 34 substantially contacts, stop the rising of jack-up unit 28 using stop mechanism (not shown)
Only, when further continuing vertical motion, jack up pin 39 (with reference to Fig. 4, Fig. 5) and dash forward upward from the upper surface for jacking up cylinder 37
Go out, the adhesive portion of the nude film 31 to be picked up in cutting sheet 34 is jacked up.In this case, by being used as driving source
The rotation amount of servomotor is adjusted, and the jack-up height and position (jack-up amount) that jack up pin 39 can be adjusted.
As shown in Figure 1, assembling adsorption head 41 and camera 42 in XY moving mechanisms 25, adsorption head 41 and camera 42 utilize the XY
Moving mechanism 25 and integratedly moved along XY directions.Nude film 31 in cutting sheet 34 is adsorbed suction nozzle 43 (with reference to Fig. 4,
Adsorption head 41 Fig. 5) is arranged in a manner of moving up and down.Camera 42 shoots the nude film 31 in cutting sheet 34 from top and right
Its shooting image carries out image procossing, so as to which the position for the nude film 31 to be adsorbed by suction nozzle 43 is identified.
The control device (not shown) of bare chip pickup device 11 by camera 42 to being shot in the nude film 31 in cutting sheet 34
Image obtained from the nude film 31 to be adsorbed is handled, and the position of the nude film 31 is identified, to determine the nude film
31 jack-up position and absorption position, as shown in figure 5, using jacking up the jack-up pin 39 of cylinder 37 by being picked up in cutting sheet 34
The adhesive portion of the nude film 31 of (absorption) is taken partly to be jacked up from below, so that by the adhesive portion of the nude film 31 from cutting sheet
34 partly peel off and float nude film 31 as the state of pickup is easy to, and carry out absorption to the nude film 31 by suction nozzle 43 and pick up
Take.
In general, unqualified nude film is included in a chip, therefore in chip manufacturing company, based on nude film inspection knot
Fruit, makes the whether qualified chip diagram data (with reference to Fig. 6) of the nude film 31 of each position of the chip after representing cutting, by the chip
Diagram data is supplied to nude film installation base plate manufacturing company together with chip.In nude film installation base plate manufacturing company, nude film is used
Pick device 11, according to chip diagram data, qualified nude film (qualified chip) is only picked up from chip and is installed on substrate successively.
So, it is necessary to carry out core to actual chip and chip diagram data in the case of using chip diagram data
It is right, make the nude film of each position of actual chip whether qualified corresponding exactly with chip diagram data.
Therefore, in the present embodiment, as shown in fig. 7, in the picture of display device (not shown), show and photographed by camera 42
Actual wafer images and wafer map data image, and two images are checked as follows.
In the present embodiment, unqualified mark is attached with using ink on unqualified nude film in the wafer, so that operator
It can confirm unqualified nude film by estimating, but the crystalline substance that unqualified mark is added not on unqualified nude film can also be used
Piece.
In addition, wafer map data image with the arrangement pattern of the nude film identical with wafer images and with by latticed line every
The region for each nude film the opened size identical with the region of each nude film of wafer images is shown.In addition, wafer map datagram
As in, the part of no nude film is distinguished with different backgrounds (colour is shown, grey is shown, style etc.) and there is the portion of nude film
Point, operator can simply and accurately differentiate the naked of the peripheral part for the chip being shown on wafer map data image by estimating
Piece.
In addition, in wafer map data image, mark (mark, word, mark, coloured silk are shown in the region of unqualified nude film
Color is shown, grey is shown), operator can be on the picture of display device by estimating simply to the position of unqualified nude film
Put and confirmed.
Checked on the actual wafer images to being shown on the picture of display device and wafer map data image
Operation, operator the input units such as mouse, keyboard (operating unit) are operated or display device picture by
Operator utilizes the picture of the touch display units such as finger in the case that touch panel (operating unit) is formed, and such as Fig. 8 (a) institutes
Make the display location of wafer images or wafer map data image mobile on the picture of display device with showing and make its overlapping, such as scheme
Make the region of each nude film of wafer images and each nude film of wafer map data image consistent shown in 8 (b).In the present embodiment,
, can be by estimating simply to wafer images due to addition of unqualified mark on unqualified nude film in the wafer
The situation of the position consistency of the mark of the position of unqualified mark and the unqualified nude film of wafer map data image is confirmed.
As described above, in the state of wafer images are overlapping and consistent with wafer map data image, operator is to mouse, key
The input units such as disk or touch panel are operated and are specified the nude film for starting absorption.Afterwards, start to produce, according to wafer map number
According to only picking up qualified nude film successively from the nude film for starting absorption and be installed on substrate.
The present embodiment from the description above, operator operate the input units such as mouse, touch panel etc., aobvious
Make the display location of wafer images or wafer map data image mobile on the picture of showing device and make wafer images and wafer map number
Overlapping and consistent according to image, so as to check wafer images and wafer map data image, therefore operator can lead to
Cross range estimation simply and accurately to the actual wafer images that are shown on the picture of display device and wafer map data image into
Row verification, operator can simply and accurately specify the nude film for starting absorption by estimating.Thus, the workability of operation is checked
Preferably, time can be shortened.Also, since operator can start the naked of absorption by estimating simply and accurately to specify
Piece, therefore can prevent from adsorbing unqualified nude film by mistake, it can prevent from producing unqualified substrate.
In addition, in the present embodiment, show that the image of chip entirety and chip diagram data are whole on the picture of display device
The image of body, but in the case where having tunnel vision for camera 42 can only shoot a part for chip, can also
The image of a part for the chip photographed by camera 42 is shown on the picture of display device, and is shown and the display portion
The image of a part for corresponding chip diagram data, makes the image of either one mobile and makes two images overlapping and consistent, so that right
Wafer images and wafer map data image are checked.
Alternatively, it is also possible to the wafer images to being shown on the picture of display device, wafer map data image it is aobvious
Show the function that multiplying power is adjusted, so as to utilize the operation of operator on the picture of display device to wafer images, crystalline substance
The display multiplying power of piece diagram data image is adjusted.
In addition, the bare chip pickup device 11 of the present embodiment be configured to adsorption head 41 and camera 42 using XY moving mechanisms 25 and
Integratedly move, but can also be configured to along XY directions, adsorption head 41 and camera 42 move only along an X, and chip tray
32 pull out in pallet and are moved on platform 23 along Y-direction so that as reference object/absorption object nude film 31 position along XY side
To movement.
In addition, the present invention can also to the structure of bare chip pickup device 11, the structure of chip tray 32 suitably into
Row change etc., can make various changes and implement in the range of main idea is not departed from, this is self-evident.
Description of reference numerals
11 ... bare chip pickup devices, 22 ... feed bin maintaining parts, 23 ... pallets pull out platform, 25 ... XY moving mechanisms, 28 ... tops
Unit is played, 30 ... chips set body, 31 ... nude films, 32 ... chip trays, 33 ... chip mounting plates, 34 ... cutting sheets, 37 ... tops
Cylinder is played, 39 ... jack up pin, 41 ... adsorption heads, 42 ... cameras, 43 ... suction nozzles.
Claims (4)
1. a kind of wafer map verification of data system, possesses：Display device, shows by camera in a manner of being divided into multiple nude films
The nude film of wafer images obtained from least a portion of cut chip is shot and each position of the expression chip
Whether qualified wafer map data image；And operating unit, carry out to the wafer images and the wafer map data image into
The operation of row verification,
The wafer map verification of data system is characterized in that,
The wafer map data image with the arrangement pattern of the nude film identical with the wafer images and with by latticed line every
The region for each nude film the opened size identical with the region of each nude film of the wafer images shown,
The operating unit is configured to, and the wafer images or the wafer map datagram are made on the picture of the display device
The display location of picture is mobile and makes the wafer images overlapping and consistent with the wafer map data image, so as to pass through range estimation pair
The wafer images and the wafer map data image are checked,
The operating unit have make to refer in the state of the wafer images are overlapping and consistent with the wafer map data image
The unit of the fixed nude film for starting absorption, enabling only pick up the nude film of qualification successively from the nude film for starting absorption.
2. wafer map verification of data system according to claim 1, it is characterised in that
The wafer map data image is with different backgrounds come the part distinguishing the part of no nude film He have nude film.
3. wafer map verification of data system according to claim 1 or 2, it is characterised in that
The wafer map data image shows mark on the region of unqualified nude film.
4. a kind of wafer map verification of data method, by by camera to the chip that is cut in a manner of being divided into multiple nude films extremely
Wafer images obtained from a few part is shot and represent the chip each position nude film whether qualified wafer map
Data image is shown in display device, so that the wafer images and the wafer map data image are checked,
The wafer map verification of data method is characterized in that,
The wafer map data image with the arrangement pattern of the nude film identical with the wafer images and with by latticed line every
The region for each nude film the opened size identical with the region of each nude film of the wafer images shown,
Make the display location of the wafer images or the wafer map data image mobile on the picture of the display device and
Make the wafer images overlapping and consistent with the wafer map data image, so that by range estimation to wafer images and described
Wafer map data image is checked,
The nude film for starting absorption is specified in the state of making the wafer images overlapping and consistent with the wafer map data image,
Make it possible to only pick up the nude film of qualification successively from the nude film for starting absorption.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/058316 WO2013145202A1 (en) | 2012-03-29 | 2012-03-29 | Wafer map data collation system and wafer map data collation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104246999A CN104246999A (en) | 2014-12-24 |
| CN104246999B true CN104246999B (en) | 2018-05-08 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280071771.9A Active CN104246999B (en) | 2012-03-29 | 2012-03-29 | Wafer map verification of data system and wafer map verification of data method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5761771B2 (en) |
| CN (1) | CN104246999B (en) |
| WO (1) | WO2013145202A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5953471B1 (en) * | 2014-09-24 | 2016-07-20 | 株式会社湯山製作所 | Drug dispensing device and powder dispensing operation support system |
| CN107432118B (en) * | 2015-03-30 | 2019-10-25 | 株式会社富士 | Apparatus for management of information and approaches to IM |
| JP6333871B2 (en) | 2016-02-25 | 2018-05-30 | ファナック株式会社 | Image processing apparatus for displaying an object detected from an input image |
| JP6739323B2 (en) * | 2016-11-28 | 2020-08-12 | 株式会社Ｆｕｊｉ | Adsorption start die teaching system |
| JP6623310B2 (en) * | 2016-12-06 | 2019-12-18 | 株式会社Ｆｕｊｉ | Die component supply device |
| CN109449096B (en) * | 2018-11-08 | 2021-12-03 | 科为升视觉技术（苏州）有限公司 | Method for identifying and detecting wafer chip |
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|---|---|---|---|---|
| JP3999170B2 (en) * | 2003-07-08 | 2007-10-31 | シャープ株式会社 | Semiconductor chip pickup method and pickup device |
| JP4438585B2 (en) * | 2004-09-28 | 2010-03-24 | 株式会社ルネサステクノロジ | Semiconductor chip failure analysis method |
| CN101783306A (en) * | 2009-01-13 | 2010-07-21 | 联达科技设备私人有限公司 | System and method for inspecting a wafer |
| JP2011061069A (en) * | 2009-09-11 | 2011-03-24 | Renesas Electronics Corp | Method for manufacturing semiconductor device |
| CN102227804A (en) * | 2008-12-12 | 2011-10-26 | 朗姆研究公司 | Method and system for centering wafer on chuck |
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2012
- 2012-03-29 WO PCT/JP2012/058316 patent/WO2013145202A1/en active Application Filing
- 2012-03-29 JP JP2014507168A patent/JP5761771B2/en active Active
- 2012-03-29 CN CN201280071771.9A patent/CN104246999B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3999170B2 (en) * | 2003-07-08 | 2007-10-31 | シャープ株式会社 | Semiconductor chip pickup method and pickup device |
| JP4438585B2 (en) * | 2004-09-28 | 2010-03-24 | 株式会社ルネサステクノロジ | Semiconductor chip failure analysis method |
| CN102227804A (en) * | 2008-12-12 | 2011-10-26 | 朗姆研究公司 | Method and system for centering wafer on chuck |
| CN101783306A (en) * | 2009-01-13 | 2010-07-21 | 联达科技设备私人有限公司 | System and method for inspecting a wafer |
| JP2011061069A (en) * | 2009-09-11 | 2011-03-24 | Renesas Electronics Corp | Method for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104246999A (en) | 2014-12-24 |
| JP5761771B2 (en) | 2015-08-12 |
| JPWO2013145202A1 (en) | 2015-08-03 |
| WO2013145202A1 (en) | 2013-10-03 |
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