CN104219176A - Processing method for applying switch to cloud switching platform in low-temperature environment - Google Patents
Processing method for applying switch to cloud switching platform in low-temperature environment Download PDFInfo
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- CN104219176A CN104219176A CN201410429925.8A CN201410429925A CN104219176A CN 104219176 A CN104219176 A CN 104219176A CN 201410429925 A CN201410429925 A CN 201410429925A CN 104219176 A CN104219176 A CN 104219176A
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Abstract
The invention discloses a processing method for applying a switch to a cloud switching platform in a low-temperature environment. The processing method is mainly implemented by a CPLD (complex programmable logic device), a heating circuit and a temperature detection and control chip. The temperature detection and control chip is placed nearby a system-on-chip and used for monitoring the real-time temperature of the system-on-chip, and then the heating circuit is arranged at the bottom of the system-on-chip and used for heating the system-on-chip in the low-temperature environment. Compared with the prior art, the processing method for applying the switch to the cloud switching platform in the low-temperature environment has the advantages of reasonable design, convenience in use, implementing flexibility, high universality and capability of being applied to foundation services of the cloud switching platform.
Description
Technical field
The present invention relates to field of cloud computer technology, specifically a kind of switch is applied to the processing method in cloud switching plane at low ambient temperatures.
Background technology
Increasing work and management now depends on reliable and stable computer network and application system has been come.China Internet data center (IDC) report " Chinese Government's industry IT solution market 2011-2015 predict and analysis " display, the coming five years is Electronic Government Affairs in China integrated development period, and the construction of information system will face transformation: from being main turn to based on overall planning construction with project; Cloud is utilized to realize merging with the degree of depth of work.
By cloud switching plane to realize the ability of sharing mass data, excavate, search for, analyze and serving, make data can carry out unifying effective management as intangible asset; Meanwhile, utilize data integration and the integration technology of cloud computing, realize interdepartmental information sharing and business cooperation, can greatly improve the level of IT application and office efficiency; In addition, cloud computing significantly can save IT construction and O&M spending, realizes green offfice.
Owing to also there being the demand to cloud switching plane under low temperature environment (-40 DEG C), and common non-wide temperature switch can not meet low temperature environment, causes work normally to carry out, and needs a kind of switch to be applied to processing method in cloud switching plane at low ambient temperatures.
CPLD (Complex Programmable Logic Device) CPLD, be from PAL and GAL device development device out, scale is large comparatively speaking, and complex structure, belongs to large scale integrated circuit scope.The digital integrated circuit of be a kind of user according to needing separately constitutive logic function voluntarily.Its basic design method is by Integrated Development software platform, by the method such as schematic diagram, hardware description language, generates corresponding file destination, is sent in objective chip, realizes the digital system of design by download cable (" in system " programmes) by code.
PHY refers to physical layer, the bottom of OSI.Refer generally to the chip with external signal interface.Physical layer defines data and transmits and the electricity required for reception and light signal, line status, clock reference, data encoding and circuit etc., and provides standard interface to data link layer device.The chip of physical layer is referred to as PHY.
Summary of the invention
Technical assignment of the present invention is to provide a kind of switch and is applied to processing method in cloud switching plane at low ambient temperatures.
Technical assignment of the present invention realizes in the following manner, this processing method realizes primarily of CPLD, heater circuit and temperature detection and control chip, near System on Chip/SoC, laying temperature detects and control chip, for the real time temperature of monitoring system chip, then bottom System on Chip/SoC, heater circuit is arranged, for heating to System on Chip/SoC at low ambient temperatures.
Described System on Chip/SoC comprises CPU, exchange chip, gigabit PHY and 10,000,000,000 PHY.
Described process method step is as follows:
First near System on Chip/SoC, laying temperature detects and control chip, bottom System on Chip/SoC, arrange heater circuit; Then power on to switch, temperature detection and control chip detect the temperature of CPU, exchange chip, gigabit PHY and 10,000,000,000 PHY, testing result is transferred to CPLD and adds up, to control heater circuit; When System on Chip/SoC temperature being detected lower than zero degree, CPLD controls heater circuit and heats each master chip; When chip temperature being detected higher than zero degree, CPU starts, and starts to be configured exchange chip; Exchange chip configures gigabit PHY and 10,000,000,000 PHY, and switch starts normally to work in cloud switching plane.
Compared to the prior art a kind of switch of the present invention is applied to processing method in cloud switching plane at low ambient temperatures, have reasonable in design, easy to use, realize flexibly, highly versatile, can be widely used in the infrastructure service of cloud switching plane.
Accompanying drawing explanation
Accompanying drawing 1 is the schematic flow sheet that a kind of switch is applied to the processing method in cloud switching plane at low ambient temperatures.
Accompanying drawing 2 is applied to cloud switching plane system block diagram at low ambient temperatures for a kind of switch.
Embodiment
Embodiment 1:
This processing method realizes primarily of CPLD, heater circuit and temperature detection and control chip, and step is as follows: first near System on Chip/SoC, laying temperature detects and control chip, bottom System on Chip/SoC, arrange heater circuit; Then power on to switch, the temperature of temperature detection and control chip detection system chip, is transferred to CPLD testing result and adds up, to control heater circuit; When System on Chip/SoC temperature being detected lower than zero degree, CPLD controls heater circuit and heats each master chip; When chip temperature being detected higher than zero degree, CPU starts, and starts to be configured exchange chip; Exchange chip configures gigabit PHY and 10,000,000,000 PHY, and switch starts normally to work in cloud switching plane.
Embodiment 2:
This processing method realizes primarily of CPLD, heater circuit and temperature detection and control chip, and step is as follows: first near System on Chip/SoC, laying temperature detects and control chip, for the real time temperature of monitoring system chip; Heater circuit is arranged, for heating to System on Chip/SoC at low ambient temperatures bottom System on Chip/SoC; Then power on to switch, the temperature that temperature detection and control chip detect CPU, exchange chip, gigabit PHY, 10,000,000,000 PHY, kilomega network interface and 10,000,000,000 network interfaces is-40 DEG C, and testing result is transferred to CPLD; CPLD controls heater circuit and heats each master chip; When chip temperature being detected higher than zero degree, CPU starts, and starts to be configured exchange chip; Exchange chip configures gigabit PHY and 10,000,000,000 PHY, and switch starts normally to work in cloud switching plane.
By embodiment above, described those skilled in the art can be easy to realize the present invention.But should be appreciated that the present invention is not limited to above-mentioned several embodiments.On the basis of disclosed execution mode, described those skilled in the art can the different technical characteristic of combination in any, thus realizes different technical schemes.
Claims (3)
1. a switch is applied to the processing method in cloud switching plane at low ambient temperatures, it is characterized in that, this processing method realizes primarily of CPLD, heater circuit and temperature detection and control chip, near System on Chip/SoC, laying temperature detects and control chip, for the real time temperature of monitoring system chip, then bottom System on Chip/SoC, heater circuit is arranged, for heating to System on Chip/SoC at low ambient temperatures.
2. a kind of switch according to claim 1 is applied to the processing method in cloud switching plane at low ambient temperatures, it is characterized in that, described System on Chip/SoC comprises CPU, exchange chip, gigabit PHY and 10,000,000,000 PHY.
3. a kind of switch according to claim 1 and 2 is applied to the processing method in cloud switching plane at low ambient temperatures, it is characterized in that, described process method step is as follows:
First near System on Chip/SoC, laying temperature detects and control chip, bottom System on Chip/SoC, arrange heater circuit; Then power on to switch, temperature detection and control chip detect the temperature of CPU, exchange chip, gigabit PHY and 10,000,000,000 PHY, testing result is transferred to CPLD and adds up, to control heater circuit; When System on Chip/SoC temperature being detected lower than zero degree, CPLD controls heater circuit and heats each master chip; When chip temperature being detected higher than zero degree, CPU starts, and starts to be configured exchange chip; Exchange chip configures gigabit PHY and 10,000,000,000 PHY, and switch starts normally to work in cloud switching plane.
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN2519565Y (en) * | 2001-10-17 | 2002-10-30 | 湖南计算机股份有限公司 | Low-temp. heating device for exchange |
CN201869495U (en) * | 2010-11-25 | 2011-06-15 | 汉柏科技有限公司 | Network equipment capable of working normally in extreme temperature range |
CN102110039A (en) * | 2011-01-27 | 2011-06-29 | 浪潮电子信息产业股份有限公司 | Method for enabling management module main chip of blade server to work under low-temperature environment |
CN102279764A (en) * | 2011-09-14 | 2011-12-14 | 浪潮电子信息产业股份有限公司 | Method for normally starting reinforced cloud server at ultra-low temperature |
US20130156037A1 (en) * | 2011-12-19 | 2013-06-20 | Alaxala Networks Corporation | Network relay apparatus |
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2014
- 2014-08-28 CN CN201410429925.8A patent/CN104219176A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2519565Y (en) * | 2001-10-17 | 2002-10-30 | 湖南计算机股份有限公司 | Low-temp. heating device for exchange |
CN201869495U (en) * | 2010-11-25 | 2011-06-15 | 汉柏科技有限公司 | Network equipment capable of working normally in extreme temperature range |
CN102110039A (en) * | 2011-01-27 | 2011-06-29 | 浪潮电子信息产业股份有限公司 | Method for enabling management module main chip of blade server to work under low-temperature environment |
CN102279764A (en) * | 2011-09-14 | 2011-12-14 | 浪潮电子信息产业股份有限公司 | Method for normally starting reinforced cloud server at ultra-low temperature |
US20130156037A1 (en) * | 2011-12-19 | 2013-06-20 | Alaxala Networks Corporation | Network relay apparatus |
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Application publication date: 20141217 |