CN104213102B - Cavity airflow direction varistructure - Google Patents
Cavity airflow direction varistructure Download PDFInfo
- Publication number
- CN104213102B CN104213102B CN201410440010.7A CN201410440010A CN104213102B CN 104213102 B CN104213102 B CN 104213102B CN 201410440010 A CN201410440010 A CN 201410440010A CN 104213102 B CN104213102 B CN 104213102B
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- CN
- China
- Prior art keywords
- cavity
- loading end
- bleeding
- steam vent
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Cavity airflow direction varistructure, mainly solving vacuum elements in prior art can only provide negative pressure and control flow, it is impossible to realize controlling the technical problem of gas flow.It includes cavity, and the side of cavity is provided with air chamber.Loading end A and loading end B in above-mentioned cavity arrange the most up and down along cavity, loading end A place big footpath ceramic ring, on the loading end B that path ceramic ring is positioned in cavity.Above-mentioned air chamber is provided with core of bleeding, and core of bleeding is provided displacement power by outside, can move along loading end A and loading end B arranged direction.The lower end of corrugated tube is connected with vacuum pump, forms the vacuum environment of whole system.When core of bleeding moves and combines with bleeding point A and steam vent B or combines with bleeding point B and steam vent A, owing to the pore size of its steam vent A and steam vent B has difference, and then realize the change of the size of air-flow, speed, the flow direction.Having simple in construction, reliability is high, maintainability is good, the feature of highly versatile, can be widely applied to semiconductor coated film technical field.
Description
Technical field
The present invention relates to a kind of structure that can change inside cavity gas flow rate, the flow direction, flow, mainly
It is applied to semiconductor coated film apparatus and process reaction chamber, belongs to semiconductive thin film deposition applications and technology of preparing
Field.
Background technology
Existing semiconductor coated film equipment, reaction chamber completes the core institution of production as filming equipment,
To ensureing product quality and the high reliability of performance, high duplication plays vital effect.And react
Vacuum elements in chamber wafer especially one of core texture ensureing process environments in coating process, due to
This vital function, with regard to inevitable requirement vacuum elements for gas flow rate, flow, stream in chamber
Accurately control to can accomplish.
Contemporary semiconductor industry is more and more higher to the requirement of filming equipment performance, and the structure of reaction chamber also exists
Ceaselessly it is correspondingly improved, has occurred in that multistage is bled cavity, and for double sections of pumping chambers
Vacuum elements matched for body needs realize controlling gas with in different flows, technical process
Gas is with required flow velocity, the function of the flow direction, in order to coordinate other parameters of technique to realize improving thin film
The effect of energy.
Summary of the invention
The present invention is for the purpose of solving the problems referred to above, and mainly solving vacuum elements in prior art can only provide
Negative pressure and control flow can not realize controlling the technical problem of gas flow, and provide a kind of simple in construction,
Highly versatile, can be suitable for multistage and bleed the structure of cavity.
For achieving the above object, the present invention uses following technical proposals: cavity airflow direction varistructure,
Including cavity (1), the side of cavity (1) is provided with air chamber, and above-mentioned air chamber is provided with core of bleeding (4)
And O-shaped rubber ring (5).Loading end A (11) in above-mentioned cavity (1) and loading end B (12) edge
Cavity is arranged the most up and down, and loading end A (11) is upper places big footpath ceramic ring (2), path ceramic ring (3)
It is positioned on the loading end B (12) in cavity (1).The lower end of above-mentioned corrugated tube (6) and vacuum pump
Connect, form the vacuum environment of whole system.Described core of bleeding (4) passes corrugated tube (6) and cavity
(1) cooperation is sealed.Described corrugated tube (6) is bolted with cavity (1), by O (5)
Realize sealing.Above-mentioned core of bleeding (4) is provided displacement power by outside, can be along loading end A (11) and hold
Section B (12) arranged direction moves.When core of bleeding (4) is mobile and with bleeding point A (7) and aerofluxus
Due to its steam vent A (9) when hole B (10) combines or combines with bleeding point B (8) and steam vent A (9)
There is a difference with the pore size of steam vent B (10), and then realize the size of air-flow, speed, the flow direction
Change.
Beneficial effects of the present invention and feature are:
Use this structure, if the movement of the core that completes to bleed coordinate the differentiated compression ring of pore size
Complete process gas to flow with the path of different needs.By this structure can convenient, fast, have
Realize to effect the control of flow velocity, flow, the flow direction.There is simple in construction, reliability is high, maintainability is good,
The feature of highly versatile, can be widely applied to semiconductor coated film technical field.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention.
Fig. 2 is use view during upper strata bleeding point B of the present invention work.
Fig. 3 is upper strata bleeding point B of the present invention uses view when working with lower floor bleeding point A simultaneously.
Use view during Tu4Shi lower floor of the present invention bleeding point A work.
Detailed description of the invention
Embodiment
With reference to Fig. 1-3, cavity airflow direction varistructure, including cavity 1, the side of cavity 1 is provided with
Air chamber, above-mentioned air chamber is provided with bleed core 4 and O-shaped rubber ring 5.Described O-shaped rubber ring 5 is arranged on takes out
In the rubber ring mounting groove of gaseous core 4.Described core 4 of bleeding coordinates through corrugated tube 6 with cavity 1 sealing.
Described corrugated tube 6 is bolted with cavity 1, O 5 realize sealing.In above-mentioned cavity 1
Loading end A11 and loading end B12 arrange the most up and down along cavity, on loading end A11 place big footpath pottery
Porcelain ring 2, path ceramic ring 3 is positioned on the loading end B12 in cavity 1.Above-mentioned corrugated tube 6 times
End is connected with vacuum pump, forms the vacuum environment of whole system.Above-mentioned core 4 of bleeding is provided displacement by outside
Power, can move along loading end A11 and loading end B12 arranged direction.
Operation principle: being driven core 4 of bleeding to move by external impetus, core 4 moves to Fig. 3 position when bleeding
Time, bleeding point A7 and bleeding point B8 on cavity 1 work simultaneously, and gas passes through bleeding point A7 and row
The combination of pore B10 and the combination of bleeding point B8 and steam vent A9 are flowed simultaneously.When bleeding, core 4 moves
During to Fig. 2 position, the bleeding point B8 work on cavity 1, gas passes through bleeding point B8 and steam vent A9
Combination flow.Bleeding point A7 work when core 4 of bleeding moves to Fig. 4 position, on cavity 1
Making, gas is flowed by the combination of bleeding point A7 and steam vent B10.Bleeding point A7 and steam vent
B10 combines bleeding point B8 and the steam vent A9 combination that compares, due to its steam vent A9 and steam vent B10
Hole diameter size have difference can realize the control of flow velocity, flow.And different bleeding point A7 or
The control flowed to can be realized during bleeding point B8 work.
Claims (3)
1. cavity airflow direction varistructure, including cavity (1), the side of cavity (1) is provided with air chamber,
It is characterized in that: loading end A (11) in above-mentioned cavity (1) and loading end B (12) is along cavity axle
To arranging up and down, loading end A (11) is upper places big footpath ceramic ring (2), and path ceramic ring (3) is placed
On loading end B (12) in cavity (1), above-mentioned air chamber is provided with core of bleeding (4), makes pottery in described big footpath
It is provided with steam vent B (10) on porcelain ring (2), and is correspondingly arranged on big footpath ceramic ring (2) and bleeds
Mouth A (7)；Be provided with steam vent A (9) on described path ceramic ring (3), and with path ceramic ring
(3) be correspondingly arranged on bleeding point B (8), described in bleed core (4) by outside provide displacement power, edge
Loading end A (11) and loading end B (12) arranged direction move, when core of bleeding (4) is mobile and with take out
QI KOU A (7) and steam vent B (10) combine or combine with bleeding point B (8) and steam vent A (9)
The control of Shi Shixian cavity airflow direction.
2. cavity airflow direction varistructure as claimed in claim 1, it is characterised in that take out described in:
Gaseous core (4) coordinates through corrugated tube (6) with cavity (1) sealing.
3. cavity airflow direction varistructure as claimed in claim 2, it is characterised in that: described ripple
Stricture of vagina pipe (6) is bolted with cavity (1), O (5) realize sealing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410440010.7A CN104213102B (en) | 2014-09-01 | 2014-09-01 | Cavity airflow direction varistructure |
| PCT/CN2015/076752 WO2016033972A1 (en) | 2014-09-01 | 2015-04-16 | Cavity air flow direction variable structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410440010.7A CN104213102B (en) | 2014-09-01 | 2014-09-01 | Cavity airflow direction varistructure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104213102A CN104213102A (en) | 2014-12-17 |
| CN104213102B true CN104213102B (en) | 2016-08-24 |
Family
ID=52094999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410440010.7A Active CN104213102B (en) | 2014-09-01 | 2014-09-01 | Cavity airflow direction varistructure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104213102B (en) |
| WO (1) | WO2016033972A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104213102B (en) * | 2014-09-01 | 2016-08-24 | 沈阳拓荆科技有限公司 | Cavity airflow direction varistructure |
| CN104851772A (en) * | 2015-04-03 | 2015-08-19 | 沈阳拓荆科技有限公司 | Liftable ceramic baffle plate structure |
| CN113737155B (en) * | 2020-05-29 | 2023-04-18 | 江苏鲁汶仪器股份有限公司 | Cavity lining device for improving PECVD (plasma enhanced chemical vapor deposition) cleaning efficiency |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201339061Y (en) * | 2008-08-08 | 2009-11-04 | 李刚 | Chemical vapor deposition reactor |
| CN102230167A (en) * | 2007-12-26 | 2011-11-02 | 三星Led株式会社 | Chemical vapor deposition apparatus |
| CN103928378A (en) * | 2014-04-15 | 2014-07-16 | 沈阳拓荆科技有限公司 | Double-layer wafer transfer cavity |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1291063C (en) * | 2003-05-09 | 2006-12-20 | 华南师范大学 | Device and method for reinforcing organic metal chemical vapor deposition film |
| US20050103265A1 (en) * | 2003-11-19 | 2005-05-19 | Applied Materials, Inc., A Delaware Corporation | Gas distribution showerhead featuring exhaust apertures |
| JP5181100B2 (en) * | 2009-04-09 | 2013-04-10 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and storage medium |
| US8562750B2 (en) * | 2009-12-17 | 2013-10-22 | Lam Research Corporation | Method and apparatus for processing bevel edge |
| CN203346476U (en) * | 2013-07-12 | 2013-12-18 | 沈阳拓荆科技有限公司 | Single cavity coating equipment |
| CN104213102B (en) * | 2014-09-01 | 2016-08-24 | 沈阳拓荆科技有限公司 | Cavity airflow direction varistructure |
-
2014
- 2014-09-01 CN CN201410440010.7A patent/CN104213102B/en active Active
-
2015
- 2015-04-16 WO PCT/CN2015/076752 patent/WO2016033972A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102230167A (en) * | 2007-12-26 | 2011-11-02 | 三星Led株式会社 | Chemical vapor deposition apparatus |
| CN201339061Y (en) * | 2008-08-08 | 2009-11-04 | 李刚 | Chemical vapor deposition reactor |
| CN103928378A (en) * | 2014-04-15 | 2014-07-16 | 沈阳拓荆科技有限公司 | Double-layer wafer transfer cavity |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016033972A1 (en) | 2016-03-10 |
| CN104213102A (en) | 2014-12-17 |
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Address after: No.900 Shuijia, Hunnan District, Shenyang City, Liaoning Province Patentee after: Tuojing Technology Co.,Ltd. Address before: 110179 3rd floor, No.1-1 Xinyuan street, Hunnan New District, Shenyang City, Liaoning Province Patentee before: PIOTECH Co.,Ltd. |
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