CN104182739A - Fingerprint identification device and electronic device of fingerprint identification device and packaging method of fingerprint identification device - Google Patents

Fingerprint identification device and electronic device of fingerprint identification device and packaging method of fingerprint identification device Download PDF

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Publication number
CN104182739A
CN104182739A CN201410425250.XA CN201410425250A CN104182739A CN 104182739 A CN104182739 A CN 104182739A CN 201410425250 A CN201410425250 A CN 201410425250A CN 104182739 A CN104182739 A CN 104182739A
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CN
China
Prior art keywords
fingerprint identification
identification device
fingerprint
color layers
fingerprint recognition
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Pending
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CN201410425250.XA
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Chinese (zh)
Inventor
蒋芳
唐根初
刘伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
Nanchang OFilm Biometric Identification Technology Co Ltd
OFilm Group Co Ltd
Original Assignee
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
Nanchang OFilm Biometric Identification Technology Co Ltd
Shenzhen OFilm Tech Co Ltd
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Application filed by Nanchang OFilm Tech Co Ltd, Suzhou OFilm Tech Co Ltd, Nanchang OFilm Biometric Identification Technology Co Ltd, Shenzhen OFilm Tech Co Ltd filed Critical Nanchang OFilm Tech Co Ltd
Priority to CN201410425250.XA priority Critical patent/CN104182739A/en
Publication of CN104182739A publication Critical patent/CN104182739A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a fingerprint identification device and an electronic device of the fingerprint identification device and a packaging method of the fingerprint identification device. The fingerprint identification device comprises a fingerprint identification assembly and an insulating protection layer formed on the fingerprint identification assembly in a covered mode. The insulating protection layer comprises a color layer formed on the fingerprint identification assembly and a protection surface layer formed on the color layer, wherein the interface between the color layer and the protection surface layer is provided with a diffuse reflection concave-convex shape, and the roughness of the interface ranges from 5 micrometers to 10 micrometers. By means of the fingerprint identification device, the glare problem of the insulating protection layer covering the fingerprint identification assembly is solved without affecting fingerprint identification; furthermore, better hand feeling can be obtained when a user touches or rubs the surface of the fingerprint identification device.

Description

Fingerprint identification device and electronic equipment thereof, method for packing
Technical field
The present invention relates to fingerprint recognition field, particularly a kind of fingerprint identification device and electronic equipment thereof, method for packing.
Background technology
Along with the widespread use of portable terminal in people's daily life, from strength to strength, and this diversified function has facilitated user to the function of present portable terminal.But portable terminal, in providing more conveniences for user, has carried too many personal information; if once this portable terminal is lost or is stolen; these information, due to the protection of not being correlated with, are therefore easy to let out, and make troubles to user.Therefore, on portable terminal, do some settings aspect secret and seem very necessary.
The function of keeping secret of traditional portable terminal that possesses touch-screen is nothing but to arrange as software functions such as keypad lock on portable terminal, and realizes secret by input password; Or the fingerprint identification device that employing electrostatic capacitance detection mode is set on portable terminal is expanded the function of keeping secret of fingerprint recognition.
In general, fingerprint identification device comprises fingerprint recognition assembly, and covers and be formed with insulating protective film on this fingerprint recognition assembly.In the process using; in the time that finger is put in insulating protective film surperficial, between the detecting electrode in the ridge of fingerprint and fingerprint recognition assembly, distance is shorter, and the distance between paddy and the detecting electrode of fingerprint is longer; by detecting the capacitance of fingerprint diverse location, thereby extract so-called fingerprint pattern.
In view of the process of fingerprint recognition is the unevenness that depends on fingerprint, therefore, the outside surface of insulating protective film, i.e. fingerprint surface of contact, should guarantee it is smooth, avoids fingerprint detection to cause interference.But ganoid insulating protective film is the mirror-reflection of light to external world, easily cause the effect of dazzle, impact is used.
Summary of the invention
The object of the present invention is to provide a kind of fingerprint identification device and electronic equipment thereof, method for packing, do not affecting on the basis of fingerprint recognition, solve the glare problem existing in prior art.
One aspect of the present invention provides a kind of fingerprint identification device, and it comprises: fingerprint recognition assembly; And insulating protective layer, cover and be formed on fingerprint recognition assembly; Described insulating protective layer comprises: color layers, and it is formed on described fingerprint recognition assembly; With protection top layer, it is formed on described color layers; Interface between wherein said color layers and described protection top layer has diffuse reflection concaveconvex shape; The roughness at this interface is 5-10 micron.
Preferably, described diffuse reflection concaveconvex shape is granular concave shape or sawtooth concaveconvex shape or wave concaveconvex shape.
Preferably, the thickness of described color layers is 0.005~0.02 millimeter.
Preferably, the thickness on described protection top layer is 0.025~0.075 millimeter.
Preferably, described protection top layer adopts light-transmitting materials to make.
The present invention provides a kind of electronic equipment with fingerprint identification function on the other hand, and it comprises above-mentioned fingerprint identification device.Preferably, there is the electronic equipment (the such as portable terminal such as mobile phone, ipad or entrance guard device etc.) of fingerprint identification function, comprise above-mentioned fingerprint identification device.Preferred, this device can be arranged on the non-display area transparent cover plate of display screen or on entity HOME key.
Further aspect of the present invention provides a kind of method for packing of fingerprint identification device, and it comprises: make fingerprint recognition assembly; Adopt the mode of ink jet to form color layers on the surface of fingerprint recognition assembly; On the surface of color layers, form diffuse reflection concaveconvex shape, the surfaceness of color layers is 5-10 micron; On the surface of the concaveconvex shape of color layers, adopt the mode of blade coating to form the protection top layer of printing opacity.
Preferably, described diffuse reflection concaveconvex shape is granular concave shape or sawtooth concaveconvex shape or wave concaveconvex shape.
Preferably, adopt the method for sandblast to form granular concave shape on the surface of color layers.
Preferably, the thickness of described color layers is 0.005~0.02 millimeter.
Preferably, the thickness on described protection top layer is 0.025~0.075 millimeter.
Adopt the fingerprint identification device of technique scheme, formed diffuse reflection concaveconvex shape in the color layers of insulating protective layer with protecting between top layer, this concavo-convex interface is to incident ray diffuse reflection, thereby realizes the effect of dumb light; Therefore, ensureing, on the impregnable basis of fingerprint recognition, to have solved the glare problem that is covered in the insulating protective layer on fingerprint recognition assembly.In addition, user, in the time of this fingerprint identification device surface touch or swiping, can obtain better feel.
Brief description of the drawings
By describe its example embodiment in detail with reference to accompanying drawing, above-mentioned and further feature of the present invention and advantage will become more obvious.
Fig. 1 is the schematic diagram of the electronic equipment for fingerprint recognition of the embodiment of the present invention 1;
Fig. 2 is the part cross-sectional schematic in S region in Fig. 1;
Fig. 3 is the sectional view of the insulating protective layer in embodiment 1;
Fig. 4 is the part cross-sectional schematic of fingerprint identification device in embodiment 2.
Accompanying drawing of the present invention is only for illustrating relative position relation and electrical connection, and the bed thickness at some position has adopted the plotting mode of lavishing praise on oneself so that understand, and the bed thickness in accompanying drawing does not represent the proportionate relationship of actual bed thickness.
The electronic equipment of terminal is configured to comprise conventionally: display screen, touch-screen, cover-plate glass, storage, SOC (system on a chip) (system on chip), CPU, GPU, internal memory, Wi-Fi connection, bluetooth connection, USB connection, battery, external power supply, computer-readable media and software etc.
In addition, the electronic equipment of terminal or the display screen of electronic equipment can be configured to comprise such as, a button or a kind of physical appearance (form factor) for user interactions (machine open/close, volume adjustment etc.).Button can be integrated in the shell of electronic equipment of terminal, also can be included in the screen of electronic equipment of terminal.The size of physical appearance can be less than or equal to 900mm 2, or can be less than or equal to 5mm 2.In certain embodiments, the thickness of physical appearance is less than or equal to 2mm, can also be less than or equal to 1mm.
Fingerprint identification device disclosed by the invention is integrated in the screen or shell of electronic equipment of terminal, and be positioned on the screen of electronic equipment or the top surface of shell of terminal, so that when the top surface of the electronic equipment of user's finger contact terminal, the distance of fingerprint detection element and finger is in 250 μ m.In configuring at least in part, fingerprint identification device can be configured in the time of the top surface of the electronic equipment of user's finger contact terminal, fingerprint detection element wherein and the distance of finger are in 200 μ m, preferably in 150 μ m, more preferably in 100 μ m, what is more can be in 50 μ m.
Fingerprint identification device of the present invention can be applicable to the such as mobile terminal such as smart mobile phone, panel computer, also can be applicable to the terminal device of bank as electronic equipments such as ATM, but the present invention is not as limit.
Provide the region for fingerprint recognition at the top surface of fingerprint identification device for user, user can or be placed in this region by finger by scratching on this region, to read its fingerprint image.
Embodiment
Referring now to accompanying drawing, example embodiment is more fully described.But example embodiment can be implemented in a variety of forms, and should not be understood to be limited to embodiment set forth herein; On the contrary, provide these embodiments to make the present invention by comprehensive and complete, and the design of example embodiment is conveyed to those skilled in the art all sidedly.Identical in the drawings Reference numeral represents same or similar structure, thereby will omit being repeated in this description them.
Described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner.In the following description, thus provide many details to provide fully understanding embodiments of the present invention.But, one of ordinary skill in the art would recognize that there is no one or more in specific detail, or adopt other method, constituent element, material etc., also can put into practice technical scheme of the present invention.In some cases, be not shown specifically or describe known features, material or operation to avoid fuzzy the present invention.
Embodiment 1
As depicted in figs. 1 and 2, the fingerprint identification device of the embodiment of the present invention comprises cover plate 1, fingerprint recognition assembly 2 and insulating protective layer 3.
Fig. 2 is the part cross-sectional schematic of fingerprint identification device, in order more clearly to illustrate the structure of fingerprint identification device, in figure, between each assembly, does not directly join, and it can not be used for limiting the annexation between the each assembly of fingerprint identification device of the present invention.This explanation is applicable to Fig. 3 and Fig. 4 too.
Cover plate 1 has first surface a, corresponding with first surface second b and connects first surface and the side c of second.Cover plate 1 can be transparent cover plate, such as tempered glass, tempered glass, polycarbonate, poly-carbon, pottery or sapphire material etc.Cover plate 1 preferred high strength material, effectively to protect the element of bottom.
Fingerprint recognition assembly 2 is formed on cover plate 1.Fingerprint recognition assembly 2 comprises fingerprint detection element 21, fingerprint recognition chip 22, the first lead-in wire 23, side lead-in wire 24 and the second lead-in wire 25.
Fingerprint detection element 21 and the first lead-in wire 23 are formed at the first surface a of cover plate 1 by the mode of sputter or silk-screen, one end of the first lead-in wire 23 connects fingerprint detection element 21, and the other end connects the first end of side lead-in wire 24.Fingerprint detection element 21 is for gathering the finger print information of finger.The upper surface that in the present embodiment, fingerprint detection element 21 is made in to cover plate 1 is in order to allow the fingerprint detection element 21 can be more close with user's fingerprint, greatly reduce the distance between the detecting electrode of fingerprint detection element 21 and user's fingerprint, improve the susceptibility and the accuracy that detect.
Side lead-in wire 24 is formed at cover plate 1 side c by the mode of sputter or silk-screen, and side 24 one end that go between connect the first lead-in wire 23 on cover plate 1 first surface a, and the other end connects the second lead-in wire 25 of 1 second b of cover plate.
The second lead-in wire 25 is formed at second b of cover plate 1 by the mode of sputter or silk-screen, one end of the second lead-in wire 25 connects side lead-in wire 24, and the other end connects fingerprint recognition chip 22.
Fingerprint recognition chip 22 is positioned at second b of cover plate 1 substantially, can be connected to by the mode of flip-chip second b of cover plate 1, also can be integrated in the mainboard (not shown) being electrically connected with the second lead-in wire 25.Fingerprint recognition chip 22 is to the coupling sensitivity between user's moveable finger and fingerprint detection element 21, for accepting and process the data that transmit from fingerprint detection element 21.
By the first lead-in wire 23, side lead-in wire 24 and the second lead-in wire 25, the signal of the fingerprint detection element 21 of the first surface a of cover plate 1 can be transferred to the fingerprint recognition chip 22 of second b of cover plate 1 via the side of cover plate 1.
Insulating protective layer 3 is covered on fingerprint recognition assembly 2, and specifically in the present embodiment, insulating protective layer 3 is positioned at the first surface a of cover plate 1, covers fingerprint detection element 21 and the first lead-in wire 23.
Referring to Fig. 3, insulating protective layer 3 comprises color layers 31, protection top layer 32 and interface 33.
Color layers 31 is formed on fingerprint recognition assembly 2, specifically in the present embodiment, covers fingerprint detection element 21 and the first lead-in wire 23.Protection top layer 32, is formed on color layers 31.
Interface 33 between color layers 31 and protection top layer 32 has diffuse reflection concaveconvex shape; The roughness scope at this interface is 5-10 micron.The mean roughness at interface 33 is approximately 8 microns.
The diffuse reflection concaveconvex shape at interface 33 can be granular concave shape or sawtooth concaveconvex shape or wave concaveconvex shape.
The thickness of color layers 31 is 0.012mm.The material of color layers 31 is mobile phone glass cover plate ink, and it has high-k conventionally.
The material of color layers 31 also can adopt the ink that has added particle or other anti-dazzle materials.
The thickness on protection top layer 32 is 0.06mm.The material on protection top layer 32 is light-transmitting materials, can bore carbon plated film (Diamond Like Carbon Coating) or high saturating anti-fingerprint AF film etc. for class, but not as limit.
In addition, the very thin thickness on protection top layer 32, user can experience the trickle concaveconvex shape at the interface 33 between color layers 31 and protection top layer 32 in the time of the 32 surface touches of protection top layer or swiping, therefore obtains better feel.For example, in the time that interface 33 is granular concave shape, when user's touch or swiping, can obtain the texture touching on paper.
The method for packing of introducing the fingerprint identification device of the embodiment of the present invention 1 below, the method comprises the following steps:
The first step, makes fingerprint recognition assembly 2 at first surface a and second b of cover plate 1.Concrete, by the mode of sputter or silk-screen, fingerprint detection element 21 and the first lead-in wire 23 are formed to the first surface a of cover plate 1; Side lead-in wire 24 is formed at cover plate 1 side c by mode by sputter or silk-screen; By the mode of sputter or silk-screen, the second lead-in wire 25 is formed to second b of cover plate 1; By the mode of flip-chip, fingerprint recognition chip 22 is connected to second b of cover plate 1; Fingerprint detection element 21, the first lead-in wire 23, side lead-in wire 24, the second lead-in wire 25 are connected in turn with fingerprint recognition chip 22;
Second step, at the first surface a of cover plate 1, adopts the mode of ink jet to form color layers 31, and color layers 31 covers fingerprint detection element 21 and the first lead-in wire 23;
The 3rd step, adopts the method for sandblast at the grain sprayed on surface thing of color layers 31, and the particle size range of particle is about 5-10 micron, forms the surface of granular concave shape in color layers 31, and surfaceness is 5-10 micron;
The 4th step, adopts the method for blade coating on color layers 31 surfaces of concaveconvex shape, to form protection top layer 32.
This method for packing, adopts on the one hand the method for sandblast in color layers 31, to form the surface of trickle concaveconvex shape, color layers 31 with protect concavo-convex interface between top layer 32 to incident ray diffuse reflection, thereby realize the effect of dumb light; On the other hand; adopt the method for blade coating to form protection top layer 32; can make to protect the surperficial flatness on top layer 32 can not be subject to the impact of interface concaveconvex shape, can form the protection top layer with smooth planar surface, thereby ensure that fingerprint recognition is unaffected.
In the 3rd step, the formation on the concaveconvex shape surface of color layers 31, also can adopt the mode of pressing mold to form the surface of sawtooth concaveconvex shape or wave concaveconvex shape.
In addition, color layers 31 can adopt the ink that has added particle, so, has obtained the surface of diffuse reflection concaveconvex shape when ink jet forms color layers 31, can omit the step of the 3rd step.Same, color layers 31 can adopt the ink that has added other anti-dazzle materials, can omit the step of the 3rd step.
The electronic equipment with fingerprint identification function (the such as portable terminal such as mobile phone, ipad or entrance guard device etc.) of the present embodiment, comprises above-mentioned fingerprint identification device.
This device can be arranged on the non-display area transparent cover plate of display screen or on entity HOME key.
The dumb light effect of fingerprint identification device can be mated with the dumb light effect of the casing of electronic equipment, reaches the unified appearance effect of entirety.
In embodiments of the present invention, the transparent cover plate that cover plate 1 is touch display screen, fingerprint detection element 21 is arranged at the first surface of cover plate 1, and is positioned at the non-display area of touch display screen; Touch panel unit (not shown) is arranged at second of cover plate 1, and is positioned at the viewing area of touch display screen.Fingerprint identification device of the present invention can be realized on the electronic equipments such as such as portable terminal and realize fingerprint recognition, and need to be by physical button, but carry out fingerprint recognition on as the transparent cover plate of display screen, expand the practical application of fingerprint recognition, be particularly useful for Android mobile phone not having on entity HOME key etc.
Embodiment 2
As shown in Figure 4, fingerprint identification device comprises: fingerprint recognition assembly 2 ' and support member 1 '.Fingerprint recognition assembly 2 ' comprising: flexible circuit film 23 ' and be formed at fingerprint detection element on flexible circuit film 23 ' 21 ' and fingerprint recognition chip 22 '.
Flexible circuit film 23 ' can be for example Kapton (Polyimide film, PI film), can be made up of two layers of polyimide resin (Polyimide resin, PI resin).
Fingerprint detection element 21 ' can be formed on flexible circuit film 23 '.Comprise at least one sensing element, with ridge and the paddy of sensing user finger, thereby user's fingerprint is identified.Fingerprint detection element 21 ' can be that one-dimentional structure can be also two-dimensional structure, and the present invention is not as limit.
The scratching formula sensor that fingerprint detection element 21 ' in the present invention can distribute for being strip type, the push type sensor that also can distribute for being array, the present invention is not as limit.In addition, fingerprint detection element 21 ' can also or be worked in combination with the combination of elements of optics sensing, infrared sensing or other sensings of the fingerprint of execution to user, and these elements itself can be coupled to certain other features of epidermis, the subcutaneous part of user's finger or expression user's the fingerprint of user's finger.
Fingerprint recognition chip 22 ' is for example electrically connected with flexible circuit film 23 ' by flip-chip (flip chip) technology.By the face down of fingerprint recognition chip 22 ' towards flexible circuit film 23 ', without Bonding, adopt the Metal Ball (for example tin ball) of some, make fingerprint recognition chip 22 ' on electric and be mechanically connected in flexible circuit film 23 '.Adopt flip chip technology (fct), because it is without Bonding, can form the shortest circuit, reduced resistance; In addition, by adopting Metal Ball to connect, dwindle package dimension, improved electrical performance.
Fingerprint recognition chip 22 ' is electrically connected with fingerprint detection element 21 ' by flexible circuit film 23 ', processes thereby the signal of fingerprint detection element 21 ' is transferred in fingerprint recognition chip 22 '.
As shown in Figure 4, support member 1 ' is wrapped up by fingerprint recognition assembly 2 ', and fingerprint recognition assembly 2 ' has wrapped up four faces of support member 1 '.Fingerprint recognition assembly 2 ' can wrap up support member 1 ' closedly, be fingerprint recognition assembly 2 ' interface two limits can between do not stay gap, also can wrap up support member 1 ' not closedly, as shown in Figure 4, between two limits of fingerprint recognition assembly 2 ' interface, leave a gap, the present invention is not as limit.
Between flexible circuit film 23 ' and support member 1 ', engage by bonding agent at least in part, to fix fingerprint recognition assembly 2 ' and support member 1 '.For example, can be as shown in Figure 4, only, in using bonding agent (as shown in black part in figure) to engage on surface level, on any surface that also can contact with fingerprint recognition assembly 2 ' at support member 1 ', use adhesive bond, the present invention is not as limit.Bonding agent is for example pressure sensitive adhesive (PSA) and hot-setting adhesive.
For accommodating fingerprint recognition chip 22 ', on a surface of support member 1 ', dig up a part, form a groove, with accommodating fingerprint recognition chip 22 '.In certain embodiments, for fear of make fingerprint recognition chip 22 ' produce the phenomenon of damage because of user's finger presses fingerprint identification device 12 ', the height of diging up part on support member 1 ' can a little higher than fingerprint recognition chip 22 ', while making to press, support member 1 ' can not touch control chip, thereby avoids the destruction to fingerprint recognition chip 22 '.
Referring to Fig. 4, insulating protective layer 3 ' is formed at least part of fingerprint recognition assembly 2 ', and is positioned at fingerprint detection element 21 ' top.In the present embodiment, color layers 31 ' is formed at the top of the flexible circuit film 23 ' of fingerprint detection element 21 ' position, and protection top layer 32 ' is formed at the top of color layers 31 '.
Interface between color layers 31 ' and protection top layer 32 ' has diffuse reflection concaveconvex shape (not shown in Fig. 4); The roughness scope at this interface is 5-10 micron.The mean roughness at interface is approximately 6 microns.
The diffuse reflection concaveconvex shape at interface can be granular concave shape or sawtooth concaveconvex shape or wave concaveconvex shape, preferred particulates concaveconvex shape.
Fig. 4 is simplified diagram, only schematically illustrates color layers 31 ' and the position relationship of protecting top layer 32 ', the interface between not shown color layers 31 ' and protection top layer 32 '; Specifically can be referring to Fig. 3 schematic diagram.
Color layers 31 ' is formed between fingerprint recognition assembly 2 ' and protection top layer 32 ', invisible to user to ensure the fingerprint recognition assembly 2 ' under it, beautifies fingerprint identification device; There is in addition the effect of synchronizeing with the housing outward appearance of electronic equipment, if for example electronic equipment under it is white, can make fingerprint identification device present white by color layers 31 ', if and its affiliated electronic equipment is black, make fingerprint identification device present black by color layers 31 '.Color layers 31 ' is for example an ink layer, is the coating that forms by deposition technique or formed by other special techniques.Conventionally, color layers 31 ' can be shown as white, black etc., but the present invention is not as limit.In addition, under color layers 31 ', on fingerprint recognition assembly 2 ', can also comprise other layers, the present invention is not as limit.
Make color layers 31 ' afterwards, can process the surface of color layers 31 ', forming the surface of diffuse reflection concaveconvex shape.For example can be by sandblast the grain sprayed on surface thing in color layers 31 ', the particle size range of particle is about 5-10 micron, mean grain size is 6 microns, thereby on the upper surface that forms granular concave shape of color layers 31 '.Also can adopt the mode of pressing mold to form the surface of sawtooth concaveconvex shape or wave concaveconvex shape.
Protection top layer 32 ' forms by spraying technology, printing technology or vacuum evaporation technology; its material for example comprises UV curing type PMMA glue (ultraviolet curing transparent glue), thermohardening type PMMA glue, hard resin layer or diamond like carbon (Diamond-like Carbon, DLC).In certain embodiments; protection top layer 32 ' can also be formed by the material of glass or other durables, the organic films such as such as polymethylmethacrylate (PMMA), polyethylene terephthalate (PET), polyimide (PI).Protection top layer 32 ' is for example a hard conating (hard coating).In addition, protection top layer 32 ' can be directly also the cover plate (such as glass, tempered glass, pottery, sapphire, quartz etc.) of electronic equipment.The thickness on the protection top layer 32 ' in the fingerprint identification device of the embodiment of the present invention 2 is 0.05mm; the thickness of color layers 31 ' is 0.01mm; the thickness of the bonding agent between color layers 31 ' and fingerprint recognition assembly 2 ' is 0.01mm, and the thickness that is formed with the flexible circuit film 23 ' of fingerprint detection element 21 ' and fingerprint recognition chip 22 ' is 0.06mm.Therefore, the fingerprint identification device of the embodiment of the present invention can provide very thin thickness, to meet electronic equipment to the lightening demand of its integrated package.Above-mentioned size is only for example, and unrestricted the present invention.
The fingerprint identification device of the above embodiment of the present invention can be integrated in the touch-screen or housing of terminal electronic equipment such as smart mobile phone, panel computer etc.For example, can use with the control knob of terminal electronic equipment or on-off element combination, also can be directly embedded into cover-plate glass or the interior use separately of housing of terminal electronic equipment.
Below illustrate particularly and described illustrative embodiments of the present invention.Should be appreciated that, the invention is not restricted to disclosed embodiment, on the contrary, the invention is intended to contain the various amendments and the equivalent replacement that comprise within the scope of the appended claims.

Claims (10)

1. a fingerprint identification device, is characterized in that, comprising:
Fingerprint recognition assembly; With
Insulating protective layer, covers and is formed on fingerprint recognition assembly;
Described insulating protective layer comprises:
Color layers, it is formed on described fingerprint recognition assembly; With
Protection top layer, it is the photic zone being formed on described color layers;
Interface between wherein said color layers and described protection top layer has diffuse reflection concaveconvex shape; The roughness at this interface is 5-10 micron.
2. fingerprint identification device as claimed in claim 1, is characterized in that, described diffuse reflection concaveconvex shape is granular concave shape or sawtooth concaveconvex shape or wave concaveconvex shape.
3. fingerprint identification device as claimed in claim 1 or 2, is characterized in that, the thickness of described color layers is 0.005~0.02 millimeter.
4. fingerprint identification device as claimed in claim 1 or 2, is characterized in that, the thickness on described protection top layer is 0.025~0.075 millimeter.
5. there is an electronic equipment for fingerprint identification function, comprise fingerprint identification device as claimed in claim 1.
6. a method for packing for fingerprint identification device, is characterized in that, comprising:
Make fingerprint recognition assembly;
Adopt the mode of ink jet to form color layers on the surface of described fingerprint recognition assembly;
On the surface of described color layers, form diffuse reflection concaveconvex shape, the surfaceness of described color layers is 5-10 micron;
On the surface of the concaveconvex shape of described color layers, adopt the mode of blade coating to form the protection top layer of printing opacity.
7. method for packing as claimed in claim 6, is characterized in that, described diffuse reflection concaveconvex shape is granular concave shape or sawtooth concaveconvex shape or wave concaveconvex shape.
8. method for packing as claimed in claim 6, is characterized in that, adopts the method for sandblast to form granular concave shape on the surface of color layers.
9. the method for packing as described in any one in claim 6-8, is characterized in that, the thickness of described color layers is 0.005~0.02 millimeter.
10. the method for packing as described in any one in claim 6-8, is characterized in that, the thickness on described protection top layer is 0.025~0.075 millimeter.
CN201410425250.XA 2014-08-26 2014-08-26 Fingerprint identification device and electronic device of fingerprint identification device and packaging method of fingerprint identification device Pending CN104182739A (en)

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CN106610695A (en) * 2015-10-27 2017-05-03 蓝思科技(长沙)有限公司 Preparation method for sapphire lens and window lens
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CN107573860A (en) * 2017-08-02 2018-01-12 深圳市鸿兴源达光电有限公司 A kind of anti-dazzle paste layer and manufacturing process
CN108121933A (en) * 2016-11-28 2018-06-05 中芯国际集成电路制造(上海)有限公司 A kind of semiconductor devices and preparation method thereof, electronic device
CN112203824A (en) * 2018-06-07 2021-01-08 指纹卡有限公司 Smart card comprising a fingerprint sensor and method for manufacturing a smart card
CN112889067A (en) * 2020-09-06 2021-06-01 深圳市汇顶科技股份有限公司 Capacitance fingerprint identification device, preparation method and electronic equipment

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CN102682280A (en) * 2009-02-25 2012-09-19 金佶科技股份有限公司 Optical fingerprint identification system
CN103793691A (en) * 2014-01-28 2014-05-14 深圳市汇顶科技股份有限公司 Fingerprint identification device and mobile terminal with same
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CN104899585A (en) * 2015-07-06 2015-09-09 上海箩箕技术有限公司 Protective cover board, optical fingerprint sensor module and electronic product
CN106336725A (en) * 2015-07-16 2017-01-18 上海箩箕技术有限公司 Printing ink, and imaging module and coloring method thereof
CN105023003A (en) * 2015-07-24 2015-11-04 广东欧珀移动通信有限公司 Fingerprint identification apparatus, fingerprint identification terminal and setting method of fingerprint identification apparatus
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CN106971171A (en) * 2017-04-10 2017-07-21 广东小天才科技有限公司 A kind of covering plate structure recognized for optical finger print
CN107573860A (en) * 2017-08-02 2018-01-12 深圳市鸿兴源达光电有限公司 A kind of anti-dazzle paste layer and manufacturing process
US11295189B2 (en) 2018-06-07 2022-04-05 Fingerprint Cards Anacatum Ip Ab Smartcard comprising a fingerprint sensor and method for manufacturing the smartcard
CN112203824B (en) * 2018-06-07 2022-04-19 指纹卡安娜卡敦知识产权有限公司 Smart card comprising a fingerprint sensor and method for manufacturing a smart card
CN112203824A (en) * 2018-06-07 2021-01-08 指纹卡有限公司 Smart card comprising a fingerprint sensor and method for manufacturing a smart card
CN112889067A (en) * 2020-09-06 2021-06-01 深圳市汇顶科技股份有限公司 Capacitance fingerprint identification device, preparation method and electronic equipment
CN112889067B (en) * 2020-09-06 2022-11-18 深圳市汇顶科技股份有限公司 Capacitance fingerprint identification device, preparation method and electronic equipment

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Application publication date: 20141203