CN104157069A - High-sensitivity sensor - Google Patents
High-sensitivity sensor Download PDFInfo
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- CN104157069A CN104157069A CN201310177342.6A CN201310177342A CN104157069A CN 104157069 A CN104157069 A CN 104157069A CN 201310177342 A CN201310177342 A CN 201310177342A CN 104157069 A CN104157069 A CN 104157069A
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- magnetic sensor
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Abstract
The invention provides a high-sensitivity sensor, including a chip, a permanent magnet and a magnetic conduction component. The chip is used for sensing a magnetic field of an anti-counterfeiting label in a tested object; the permanent magnet is used for premagnetizing the anti-counterfeiting label; the magnetic conduction component is manufactured by adopting magnetic conduction material, the magnetic conduction component and the permanent magnet are arranged in a superposed manner, and the magnetic conduction component is arranged at the side close to the anti-counterfeiting label; and the magnetic conduction component includes a bottom part, bending parts and convex parts, the bending parts are bent from the bottom part towards the same side, the convex part is arranged at inner sides of the bending parts away from the end of the bottom part, the bottom part, the bending parts and the convex part form an accommodating cavity provided with an opening, the opening is towards the anti-counterfeiting label, the chip is arranged in the accommodating cavity, and an induction face of the chip is towards the anti-counterfeiting label. The magnetic sensor has high sensitivity and strong anti-interference capability.
Description
Technical field
The invention belongs to precision measurement field, be specifically related to a kind of high-sensitiivty magnetic sensor for detection of being arranged at the anti-counterfeiting mark in banknote, bill etc.
Background technology
At present, the anti-counterfeiting mark that is arranged at the valuable bills inside such as banknote is mainly magnetic mark, can judge the true and false of valuable bills by detecting magnetic mark.Along with the progress of anti-counterfeiting technology, anti-counterfeiting mark is developed to soft magnetism anti-counterfeiting mark by Hard Magnetic mark gradually, to improve anti-counterfeit capability.
Itself does not have magnetic soft magnetism anti-counterfeiting mark, but can be magnetized under the effect in magnetic field, and the soft magnetism anti-counterfeiting mark after being magnetized can be responded to by Magnetic Sensor.Because soft magnetism sensor has this characteristic, the Magnetic Sensor of selling in the market also cannot detect soft magnetism anti-counterfeiting mark.
For this reason, person skilled is improved existing Magnetic Sensor, and has developed the Magnetic Sensor for detection of soft magnetism anti-counterfeiting mark.That is, in Magnetic Sensor, set up permanent magnet, utilized permanent magnet to magnetize soft magnetism anti-counterfeiting mark.But permanent magnet, in magnetization soft magnetism anti-counterfeiting mark, can affect the sensitivity of chip, chip can be responded to the magnetic field of permanent magnet and output difference sub-signal, thereby reduces the sensitivity of Magnetic Sensor.
Summary of the invention
The technical problem to be solved in the present invention is exactly for the above-mentioned defect existing in Magnetic Sensor, and a kind of high sensitivity Magnetic Sensor is provided, and it can reduce the impact of permanent magnet on chip, thereby highly sensitive.
For this reason, the invention provides a kind of high sensitivity Magnetic Sensor, comprising:
Chip, for responding to the magnetic field of anti-counterfeiting mark in testee;
Permanent magnet, for anti-counterfeiting mark described in premagnetization;
Magnetic conductive part, adopts permeability magnetic material to make, and described magnetic conductive part and described permanent magnet are stacked, and described magnetic conductive part is located near described anti-counterfeiting mark one side;
Described magnetic conductive part comprises bottom, bending part and protuberance, described bending part from described bottom to homonymy bending, described protuberance is located at the inner side of described bending part away from one end, described bottom, described bottom, described bending part and described protuberance form the cavity volume that is provided with opening, described opening is towards described anti-counterfeiting mark, described chip is located at described cavity volume, and the sensitive surface of described chip is towards described anti-counterfeiting mark.
Wherein, described permeability magnetic material is siliconized plate, permalloy or ferrite.
Wherein, described chip comprises magnetic susceptibility film and chip bonding pad, and described chip bonding pad is as input end and the output terminal electrical connection corresponding to described magnetic induction film of described chip.
Wherein, described magnetic susceptibility film is Hall effect film, anisotropic magnetoresistance film, giant magnet resistance film, tunnel magneto resistance film, giant magnetoresistance films or giant Hall effect film.
Wherein, also comprise wiring board, described chip is fixed on described wiring board, and the input of described chip, output terminal electrical connection corresponding to the wiring board pad of being located at described wiring board, and described wiring board is located in described cavity volume.
Wherein, also comprise housing, described chip, described permanent magnet, described magnetic conductive part and described wiring board are located in described housing, and described chip is positioned at detection faces one side of described housing.
Wherein, described housing adopts permeability magnetic material to make; Or adopt non-magnet material to make, and be provided with magnetosphere on its surface;
Detection faces one side at described housing is provided with opening, and the sensitive surface of described chip is relative with described opening.
Wherein, described permeability magnetic material is permalloy, ferrite or silicon steel material.
Wherein, described non-magnet material is metal, nonmetal or polymkeric substance, and described magnetosphere is nickel coating or chromium coating.
Wherein, described housing adopts metal, nonmetal or polymkeric substance making.
The present invention has following beneficial effect:
High sensitivity Magnetic Sensor provided by the invention, utilize magnetic conductive part to retrain the magnetic field of permanent magnet, bending part has reduced the magnetic-field component of the sensitive surface that is parallel to chip, protuberance can make the magnetic-field component of the sensitive surface that is parallel to chip cancel out each other simultaneously, further weaken the magnetic-field component of the sensitive surface that is parallel to chip, chip is located to cavity volume and can reduces the impact of permanent magnet on chip, thus the sensitivity that improves Magnetic Sensor.In addition, magnetic conductive part makes chip only can receive substantially the external magnetic field perpendicular to the sensitive surface of chip, and the magnetic field of other direction is shielded by magnetic conductive part, thereby improves the antijamming capability of Magnetic Sensor.
Brief description of the drawings
Fig. 1 is the structural representation of embodiment of the present invention high sensitivity Magnetic Sensor;
Fig. 2 is the enlarged drawing of magnetic conductive part in high sensitivity Magnetic Sensor.
Embodiment
For making those skilled in the art understand better technical scheme of the present invention, below in conjunction with accompanying drawing, high sensitivity Magnetic Sensor provided by the invention is described in detail.
As shown in Figure 1, the present embodiment high sensitivity Magnetic Sensor comprises chip 11, wiring board 12, permanent magnet 13, magnetic conductive part 14, housing 15 and draws pin 16.Wherein, chip 11 is fixed on wiring board 12, and input end, the output terminal of chip 11 are electrically connected with wiring board 12.Chip 11, wiring board 12, permanent magnet 13, magnetic conductive part 14 are placed in housing 15, and chip 11 is near sensor detection faces (end face of housing 15, the i.e. face relative with a shell nozzle) side.
As shown in Figure 2, magnetic conductive part 14 adopts permeability magnetic materials such as siliconized plate, permalloy or ferrite and makes.Magnetic conductive part 14 comprises bottom 141, bending part 142 and protuberance 143, two bending parts 142 from bottom 141 to homonymy bending, bottom 141 and bending part 142 form " U " type structure, and bottom 141 and bending part 142 have formed cavity volume 145, the top of magnetic conductive part 14 and former and later two lateral openings.The opening on the top of magnetic conductive part 14 is defined as cavity volume opening 146 by the present embodiment.Two protuberances 143 are located at respectively the inner side of bending part 142 away from 141 one end, bottom, and protuberance 143 has dwindled cavity volume opening 146, but cavity volume 145 is sealed, thereby form the cavity volume 145 that young tripe is large.Magnetic conductive part 14 and permanent magnet 13 are stacked, and the bottom 141 of magnetic conductive part 14 is towards permanent magnet 13, and cavity volume opening 146 is towards testee.Magnetic conductive part 14 adopts permeability magnetic material to make, the magnetic field that it can attract permanent magnet 13 to produce, make magnetic field in the interior conduction of magnetic conductive part 14, and bending part 142 has reduced the magnetic-field component of the sensitive surface that is parallel to chip 11, protuberance 143 is cancelled out each other the magnetic-field component of the sensitive surface that is parallel to chip, in other words, bending part 142 is the magnetic-field components that weakened on one's own initiative the sensitive surface that is parallel to chip 11, protuberance 143 is the magnetic-field components that weakened passively the sensitive surface that is parallel to chip 11, protuberance 143 has further weakened the magnetic-field component of the sensitive surface that is parallel to chip, thereby reduce in cavity volume 145 and cavity volume opening 146 places are parallel to the magnetic-field component of the sensitive surface of chip 11.Chip 11 is located to cavity volume 145, can reduces the impact of permanent magnet 13 on chip 11 sensitivity, thereby improve the sensitivity of Magnetic Sensor.Bending part 142 and protuberance 143 have weakened in cavity volume 145 and cavity volume opening 146 places are parallel to the magnetic-field component of the sensitive surface of chip 11, and be parallel to the magnetic-field component of sensitive surface of chip 11 at the upper area of cavity volume opening 146 also less.Therefore, the upper surface flush of the sensitive surface of chip 11 and magnetic conductive part 14 or the upper surface higher than magnetic conductive part 14, also can be lower than the upper surface of magnetic conductive part 14.
Chip 11 comprises magnetic induction film and chip bonding pad, and magnetic induction film is for responding to the magnetic field of anti-counterfeiting mark in testee; Chip bonding pad is electrically connected with magnetic induction film as input end and the output terminal of chip 11.Chip 11 can comprise (individual) magnetic induction film, also can comprise two or more magnetic induction films.In the time that chip 11 comprises a magnetic induction film, two chip bonding pads of setting are electrically connected respectively end face and the bottom surface of magnetic induction film, and the electric current that magnetic induction film produces because of induced field flows along the vertical direction of chip 11.In the time that chip 11 comprises two or more magnetic induction films, three chip bonding pads of setting are electrically connected the end of magnetic induction film accordingly, and the electric current that magnetic induction film produces because of induced field flows along the horizontal direction of chip 11.The present embodiment magnetic induction film is Hall effect film, anisotropic magnetoresistance film, giant magnet resistance film, tunnel magneto resistance film, giant magnetoresistance films or giant Hall effect film.
Chip 11 is fixed on wiring board 12, chip bonding pad and the corresponding electrical connection of the first wiring board pad (not shown) of being located at wiring board 12.Draw the input/output terminal of pin 16 as Magnetic Sensor, its one end and the corresponding electrical connection of the second wiring board pad (not shown) of being located at wiring board 12, the other end stretches out from housing 15.In other words, drawing pin 16 is electrically connected the input end of chip, output terminal correspondence by wiring board 12.The first wiring board pad and the second wiring board pad are by being located at the corresponding electrical connection of wiring of wiring board 12.
As shown in Figure 1, be provided with through hole 121 on wiring board 12, magnetic conductive part 14 embeds in through hole 121, and part wiring board 12 inserts cavity volume 145, and chip 11 is located at cavity volume 145 and is fixed on wiring board 12.The end face of magnetic conductive part 14 is higher than wiring board 12.In fact,, according to the difficulty or ease of the requirement of sensitivity and assembling, the end face of magnetic conductive part 14 can flush with wiring board 12 or lower than wiring board 12 or higher than wiring board 12.
Housing 15 can be shield shell or non-shield shell.Employing permeability magnetic material is made, as permalloy, ferrite or silicon steel material; Or adopt non-magnet material to make, as metal (copper), nonmetal or polymkeric substance, and be provided with magnetosphere on its surface, as nickel coating or chromium coating, obtain shield shell.For another example directly adopt metal (copper), nonmetal or polymkeric substance making, do not establish magnetosphere on its surface, obtain non-shield shell.In the time that housing 15 is shield shell, window 151 is also set on housing 15.
Chip 11 and wiring board 12 are located in the cavity volume 145 of magnetic conductive part 14, permanent magnet 13 and magnetic conductive part 14 are stacked, again chip 11, wiring board 12, permanent magnet 13 and magnetic conductive part 14 are located in housing 15, and chip 11 is positioned at detection faces one side of housing 15, permanent magnet 13 is located at detection faces one side away from housing 15.In the time that housing 15 is provided with window 151, the sensitive surface of chip 11 is relative with window 151, to respond to extraneous magnetic field by window 151.
The high sensitivity Magnetic Sensor that the present embodiment provides, utilize magnetic conductive part to retrain the magnetic field of permanent magnet, bending part has reduced the magnetic-field component of the sensitive surface that is parallel to chip, protuberance can make the magnetic-field component of the sensitive surface that is parallel to chip cancel out each other simultaneously, further weaken the magnetic-field component of the sensitive surface that is parallel to chip, chip is located to cavity volume and can reduces the impact of permanent magnet on chip, thus the sensitivity that improves Magnetic Sensor.In addition, magnetic conductive part makes chip only can receive substantially the external magnetic field perpendicular to the sensitive surface of chip, and the magnetic field of other direction is shielded by magnetic conductive part, thereby improves the antijamming capability of Magnetic Sensor.
Be understandable that, above embodiment is only used to principle of the present invention is described and the illustrative embodiments that adopts, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a high sensitivity Magnetic Sensor, comprising:
Chip, for responding to the magnetic field of anti-counterfeiting mark in testee;
Permanent magnet, for anti-counterfeiting mark described in premagnetization;
Magnetic conductive part, adopts permeability magnetic material to make, and described magnetic conductive part and described permanent magnet are stacked, and described magnetic conductive part is located near described anti-counterfeiting mark one side;
It is characterized in that, described magnetic conductive part comprises bottom, bending part and protuberance, described bending part from described bottom to homonymy bending, described protuberance is located at the inner side of described bending part away from one end, described bottom, described bottom, described bending part and described protuberance form the cavity volume that is provided with opening, described opening is towards described anti-counterfeiting mark, and described chip is located at described cavity volume, and the sensitive surface of described chip is towards described anti-counterfeiting mark.
2. high sensitivity Magnetic Sensor according to claim 1, is characterized in that, described permeability magnetic material is siliconized plate, permalloy or ferrite.
3. high sensitivity Magnetic Sensor according to claim 1, is characterized in that, described chip comprises magnetic susceptibility film and chip bonding pad, and described chip bonding pad is as input end and the output terminal electrical connection corresponding to described magnetic induction film of described chip.
4. high sensitivity Magnetic Sensor according to claim 3, is characterized in that, described magnetic susceptibility film is Hall effect film, anisotropic magnetoresistance film, giant magnet resistance film, tunnel magneto resistance film, giant magnetoresistance films or giant Hall effect film.
5. high sensitivity Magnetic Sensor according to claim 1, it is characterized in that, also comprise wiring board, described chip is fixed on described wiring board, and the input of described chip, output terminal electrical connection corresponding to the wiring board pad of being located at described wiring board, described wiring board is located in described cavity volume.
6. high sensitivity Magnetic Sensor according to claim 5, is characterized in that, also comprises housing, and described chip, described permanent magnet, described magnetic conductive part and described wiring board are located in described housing, and described chip is positioned at detection faces one side of described housing.
7. high sensitivity Magnetic Sensor according to claim 6, is characterized in that, described housing adopts permeability magnetic material to make; Or adopt non-magnet material to make, and be provided with magnetosphere on its surface;
Detection faces one side at described housing is provided with opening, and the sensitive surface of described chip is relative with described opening.
8. high sensitivity Magnetic Sensor according to claim 7, is characterized in that, described permeability magnetic material is permalloy, ferrite or silicon steel material.
9. high sensitivity Magnetic Sensor according to claim 7, is characterized in that, described non-magnet material is metal, nonmetal or polymkeric substance, and described magnetosphere is nickel coating or chromium coating.
10. high sensitivity Magnetic Sensor according to claim 7, is characterized in that, described housing adopts metal, nonmetal or polymkeric substance making.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310177342.6A CN104157069A (en) | 2013-05-14 | 2013-05-14 | High-sensitivity sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310177342.6A CN104157069A (en) | 2013-05-14 | 2013-05-14 | High-sensitivity sensor |
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| Publication Number | Publication Date |
|---|---|
| CN104157069A true CN104157069A (en) | 2014-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310177342.6A Pending CN104157069A (en) | 2013-05-14 | 2013-05-14 | High-sensitivity sensor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107607892A (en) * | 2017-09-30 | 2018-01-19 | 威海华菱光电股份有限公司 | Magnetic image sensor |
| EP3144769B1 (en) * | 2015-09-21 | 2019-12-25 | HOLYGO Corporation | Electronic device |
| CN116996057A (en) * | 2023-09-27 | 2023-11-03 | 江苏多维科技有限公司 | Proximity switch sensor and system for detecting rotation position |
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| CN2788259Y (en) * | 2005-04-15 | 2006-06-14 | 福建省电影机械厂 | Huge magnetic resistance sensor of paper money counter |
| WO2008066118A1 (en) * | 2006-11-30 | 2008-06-05 | Asahi Kasei Kabushiki Kaisha | Thin film laminated body, thin film magnetic sensor using the thin film laminated body and method for manufacturing the thin film laminated body |
| CN102723164A (en) * | 2012-06-04 | 2012-10-10 | 江苏多维科技有限公司 | Groove-shaped permanent magnet and magnetic sensor with same |
| CN102968845A (en) * | 2012-10-31 | 2013-03-13 | 江苏多维科技有限公司 | Magnetic-bias currency detecting magnetic head with sensitive direction parallel to detection face |
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2013
- 2013-05-14 CN CN201310177342.6A patent/CN104157069A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2788259Y (en) * | 2005-04-15 | 2006-06-14 | 福建省电影机械厂 | Huge magnetic resistance sensor of paper money counter |
| WO2008066118A1 (en) * | 2006-11-30 | 2008-06-05 | Asahi Kasei Kabushiki Kaisha | Thin film laminated body, thin film magnetic sensor using the thin film laminated body and method for manufacturing the thin film laminated body |
| CN102723164A (en) * | 2012-06-04 | 2012-10-10 | 江苏多维科技有限公司 | Groove-shaped permanent magnet and magnetic sensor with same |
| CN102968845A (en) * | 2012-10-31 | 2013-03-13 | 江苏多维科技有限公司 | Magnetic-bias currency detecting magnetic head with sensitive direction parallel to detection face |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3144769B1 (en) * | 2015-09-21 | 2019-12-25 | HOLYGO Corporation | Electronic device |
| CN107607892A (en) * | 2017-09-30 | 2018-01-19 | 威海华菱光电股份有限公司 | Magnetic image sensor |
| CN107607892B (en) * | 2017-09-30 | 2024-05-10 | 威海华菱光电股份有限公司 | Magnetic image sensor |
| CN116996057A (en) * | 2023-09-27 | 2023-11-03 | 江苏多维科技有限公司 | Proximity switch sensor and system for detecting rotation position |
| CN116996057B (en) * | 2023-09-27 | 2024-05-03 | 江苏多维科技有限公司 | Proximity switch sensor and system for detecting rotation position |
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Application publication date: 20141119 |
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