CN104080311A - Metal/alloy solid-liquid phase change and vapor compression refrigeration cycle combined electronic component radiator and method - Google Patents
Metal/alloy solid-liquid phase change and vapor compression refrigeration cycle combined electronic component radiator and method Download PDFInfo
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- CN104080311A CN104080311A CN201310105599.0A CN201310105599A CN104080311A CN 104080311 A CN104080311 A CN 104080311A CN 201310105599 A CN201310105599 A CN 201310105599A CN 104080311 A CN104080311 A CN 104080311A
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Abstract
The invention provides a metal solid-liquid phase change and vapor compression refrigeration cycle combined radiator which is applied to cooling of a high-heat-flux electronic component, adopts little low-melting-point metal, and can generate phase change below 60 DEG C, so that a large amount of heat is taken away rapidly to cope with sudden rise of power of the electronic component, and the start time is provided for vapor compression refrigeration cycle. After the power of the electronic component is stabilized, liquid metal with high heat conductivity can well transfer the heat from the surface of the electronic component to an evaporator, and then the heat is taken away by liquid-vapor phase change evaporation of a refrigerant. The radiator combines the characteristics of passive cooling of metal phase change and active cooling of the vapor compression refrigeration cycle, meets great power change and high-heat-flux radiation requirements of the high-power electronic component, solves the problem of hysteresis of vapor compression refrigeration cycle start and refrigeration beginning relative to sudden change of the power of the electronic component, and ensures that the working temperature of the electronic component stably changes within a safe range all the time.
Description
Technical field
The present invention relates to a kind of cooling electronic component device and method, be specifically related to cooling electronic component device and method that a kind of metal phase change and steam compression type refrigeration circulation combine.
Background technology
Along with the fast development of micro-electronic mechanical skill, electronic devices and components size is more and more less, and on it, transistorized quantity is more and more, according to Moore's Law: the number of transistors on electronic devices and components is doubled for every 18 months.The heat dissipation problem bringing is therefrom more severe, and the density of heat flow rate on some electronic devices and components surface meets or exceeds
.For so high density of heat flow rate, traditional air cooling way reaches capacity, so new heat dissipation technology is suggested one after another, for example water-cooled, hot pipe technique, thermoelectric cooling, steam compression type refrigeration circulate etc.This wherein, steam compression type refrigeration circulation is subject to ambient temperature restriction minimum, and has the most excellent heat-sinking capability.In theory, need only ambient temperature lower than electronic devices and components temperature, steam compression type refrigeration circulation can leave heat.And this condition is all satisfiable conventionally.
Yet, electronic devices and components power is undergone mutation sometimes, and steam compression type refrigeration circulation is difficult to make response rapidly to this, thereby can cause electronic devices and components temperature to rise rapidly, and temperature abrupt change is equally also disadvantageous for the service behaviour of electronic devices and components.Therefore, need to address this problem.
Summary of the invention
As mentioned above, the thermal control difficult problem that may rise rapidly brought at any time for electronic devices and components temperature, still needs and will solve.The inventor considers, a feasible approach, to play a cushioning effect by other auxiliary cooling meanss, this auxiliary cooling means must be able to leave amount of heat within a short period of time, thereby make steam compression type refrigeration circulation can utilize this period of buffer time to start to start, and when kind of refrigeration cycle starts complete normal operation, this householder method must can also play good conduction of heat, and makes unlikely being restricted of heat-sinking capability of kind of refrigeration cycle excellence; Can reach these requirements, best no more than low-melting-point metal phase transformation, heat radiation requirement when the potential heat value that it is large and high conductive coefficient can satisfied temperature rise sharply, and when kind of refrigeration cycle even running, its good heat conductivility can reach the evaporator kind of refrigeration cycle by heat from electronic devices and components surface again well.When electronic devices and components temperature is down to the following temperature of set point subsequently, phase-change metal is solidified completely, and refrigeration subsystem is out of service, has avoided that the evaporating temperature of refrigerating system is too low may produce condensed water, thereby guarantees the trouble free service of electronic equipment; The a small amount of heat production of electronic devices and components is taken away by the fin of metallic packaging box surrounding by air
In sum, steam compression type refrigeration circulation can meet high heat flux heat radiation requirement, situation about rising sharply for power, only needs a small amount of phase-change metal can play refrigerating system and starts the effect of buffering and can avoid low temperature to cross the cold problem that may produce condensed water.Therefore, the scheme of both combinations has great meaning for instantly developing the heat dissipation problem of high-power microelectronic component rapidly.
On the basis of above-mentioned design, the invention provides a kind of efficient heat-radiating device of electric component, combine metal phase change and steam compression type refrigeration circulation, solved electronic devices and components temperature when smooth working, chugging and remained on the high heat flux heat dissipation problem under the multiple requirements such as OK range and evaporated condensation water generation.
According to an aspect of the present invention, the cooling electronic component device that provides a kind of metal solid-liquid phase change and steam compression type refrigeration circulation to combine, is characterized in that comprising:
Phase-change metal encapsulation box, is wherein packaged with low temperature solid-liquid phase change metal,
Steam compression type refrigeration subsystem,
Wherein, described phase-change metal encapsulation box and electronic devices and components thermo-contact to be cooled.
According to another aspect of the present invention, a kind of cooling electronic component method that provides metal phase change and steam compression type refrigeration circulation to combine, is characterized in that comprising:
Make phase-change metal encapsulation box and electronic devices and components thermo-contact to be cooled, described phase-change metal encapsulates in box and is packaged with phase-change metal,
When electronic devices and components power jumps and heat dissipation capacity is increased sharply, now phase-change metal is fused into liquid state, takes away a large amount of heats within a short period of time, starts steam compression type refrigeration subsystem simultaneously,
Wherein,
Described refrigeration subsystem comprises condensation unit and evaporator,
Evaporator is encapsulated in phase-change metal encapsulation box and is immersed in phase-change metal.
Accompanying drawing explanation
Fig. 1 is the cooling electronic component device principle schematic that metal phase change according to an embodiment of the invention and steam compression type refrigeration circulation combine.
Fig. 2 is that the phase-change metal encapsulation box of the cooling electronic component device that combines of metal phase change according to an embodiment of the invention and steam compression type refrigeration circulation is overlooked and cutd open figure.
Embodiment
Below in conjunction with the drawings and specific embodiments, illustrate technical scheme of the present invention.
As shown in Figure 1, the cooling electronic component device that metal phase change of the present invention and steam compression type refrigeration circulation combine comprises two parts, comprises phase-change metal encapsulation box 1 and steam compression type refrigeration subsystem 2.
According to a specific embodiment of the present invention, described phase-change metal encapsulation box 1 comprises that phase-change metal 1-1 and fin 1-2(are shown in Fig. 2).Wherein, phase-change metal 1-1 is encapsulated in phase-change metal encapsulation box 1, and fin 1-2 is arranged on phase-change metal encapsulation box 1 outer wall.
As illustrated in fig. 1 and 2, described refrigeration subsystem 2 comprises condensation unit 2-1 and evaporator 2-2.Wherein, evaporator 2-2 is immersed in phase-change metal 1-1 and is encapsulated in phase-change metal encapsulation box 1.Phase-change metal encapsulation box 1 and electronic devices and components thermo-contact, this contact is general by heat-conducting glue, as shown in Figure 1.
When electronic devices and components low-power operation, heat reaches through solid-state phase-change metal 1-1 and phase-change metal encapsulation box 1 wall the fin 1-2 being arranged on phase-change metal encapsulation box 1 outer wall with the form of heat conduction, then falls apart in environment through fin 1-2 with the form of free convection or forced convection.
When electronic devices and components power raises, when electronic devices and components surface temperature reaches the set point that approaches phase-change metal 1-1 fusing point, as 60 ℃, refrigeration subsystem 2 starts.Along with the lasting rising of electronic devices and components temperature, as 62 ℃, phase-change metal 1-1 fusing, now refrigeration subsystem 2 has entered steady operational status, treats that phase-change metal 1-1 fusing is complete, and heat mainly leaves by refrigeration subsystem 2.
When electronic devices and components power declines, electronic devices and components surface temperature is down to below the fusing point of phase-change metal 1-1, and as 58 ℃, phase-change metal 1-1 solidifies, and refrigeration subsystem 2 is out of service, the radiating mode while being returned to electronic devices and components low power run.
The enabling signal of refrigeration subsystem (2) comes from the temperature sensor that is attached to electronic devices and components surface.
According to one embodiment of present invention, phase-change metal is encapsulated in phase-change metal encapsulation box (1) together with the evaporator (2-2) being immersed in wherein, and phase-change metal encapsulation box (1) outer wall is furnished with fin (1-2).
According to one embodiment of present invention, the start and stop of refrigeration subsystem (2) are that the temperature signal that the temperature sensor by electronic devices and components surface sends is controlled, and start and stop temperature all a little less than the fusing point of phase-change metal (1-1).
In above-described embodiment, phase-change metal 1-1 can adopt Wood's metal, but is not limited to this kind of material.
Below be only a concrete exemplary applications of the present invention, protection scope of the present invention is not constituted any limitation.All employing equivalents or equivalent transformation and the technical scheme that forms, within all dropping on rights protection scope of the present invention.
Claims (8)
1. the cooling electronic component device that metal solid-liquid phase change and steam compression type refrigeration circulation combine, is characterized in that comprising:
Phase-change metal encapsulation box (1), is wherein packaged with low temperature solid-liquid phase change metal (1-1),
Steam compression type refrigeration subsystem (2),
Wherein, described phase-change metal encapsulation box (1) and electronic devices and components thermo-contact to be cooled.
2. the cooling electronic component device that metal phase change according to claim 1 and steam compression type refrigeration circulation combine, is characterized in that:
Phase-change metal encapsulation box (1) surrounding outer wall and top can be furnished with fin (1-2), and box body, fin are the material of high thermal conductivity coefficient.
3. the cooling electronic component device that metal phase change according to claim 2 and steam compression type refrigeration circulation combine, is characterized in that:
Described refrigeration subsystem (2) comprises condensation unit (2-1) and evaporator (2-2),
Wherein, evaporator (2-2) is encapsulated in phase-change metal encapsulation box (1) and is immersed in phase-change metal (1-1); Evaporator pipeline enters encapsulation box from the direction contrary with gravity.
4. the cooling electronic component device that metal phase change according to claim 3 and steam compression type refrigeration circulation combine, is characterized in that:
When electronic devices and components power jumps, heat dissipation capacity increases sharply, and phase-change metal (1-1) is fused into liquid state, takes away a large amount of heats within a short period of time, and meanwhile refrigeration subsystem (2) starts;
Until electronic devices and components refrigeration subsystem (2), start complete while starting to enter steady-working state, cold-producing medium is through condensation unit (2-1) compression, condensation, throttling, enter evaporator (2-2) evaporation, take away the heat of the generation of electronic devices and components, take away the raw heat of the molten metal solid phase sell of one's property simultaneously, liquid metal is condensed into solid-state, and the cold-producing medium after evaporation is got back to condensation unit (2-1) with gaseous form, completes a steam compression type refrigeration circulation.
5. the cooling electronic component device that metal phase change according to claim 3 and steam compression type refrigeration circulation combine, is characterized in that:
The enabling signal of refrigeration subsystem (2) comes from the temperature sensor that is attached to electronic devices and components surface,
When electronic devices and components temperature reaches the set point that approaches phase-change metal (1) fusing point, refrigeration subsystem (2) starts;
Below electronic devices and components temperature is down to described set point subsequently, during certain temperature, phase-change metal (1-1) is solidified completely, and refrigeration subsystem (2) is out of service, avoids that evaporating temperature is too low may produce condensed water, guarantees the trouble free service of electronic equipment; The a small amount of heat production of electronic devices and components is taken away by the fin of metallic packaging box surrounding by air.
6. the cooling electronic component method that metal phase change and steam compression type refrigeration circulation combine, is characterized in that comprising:
Make phase-change metal encapsulation box (1) and electronic devices and components thermo-contact to be cooled, in described phase-change metal encapsulation box (1), be packaged with phase-change metal (1-1),
When electronic devices and components power jumps and heat dissipation capacity is increased sharply, now phase-change metal (1-1) is fused into liquid state, takes away a large amount of heats within a short period of time, starts steam compression type refrigeration subsystem (2) simultaneously,
Wherein,
Described refrigeration subsystem (2) comprises condensation unit (2-1) and evaporator (2-2),
Evaporator (2-2) is encapsulated in phase-change metal encapsulation box (1) and is immersed in phase-change metal (1-1).
7. method according to claim 6, is characterized in that:
Until refrigeration subsystem (2), start complete while starting to enter steady-working state, cold-producing medium is through condensation unit (2-1) compression, condensation, throttling, enter evaporator (2-2) evaporation, take away the heat of the generation of electronic devices and components, take away the raw heat of the molten metal solid phase sell of one's property simultaneously, liquid metal is condensed into solid-state, and the cold-producing medium after evaporation is got back to condensation unit (2-1) with gaseous form, completes a steam compression type refrigeration circulation.
8. method according to claim 7, is characterized in that:
The enabling signal of refrigeration subsystem (2) comes from the temperature sensor that is attached to electronic devices and components surface,
When electronic devices and components temperature reaches the set point that approaches phase-change metal (1) fusing point, refrigeration subsystem (2) starts;
Below electronic devices and components temperature is down to described set point subsequently during certain temperature, refrigeration subsystem (2) is out of service, and phase-change metal (1-1) is solidified completely, and refrigeration subsystem (2) is out of service, avoid that evaporating temperature is too low may produce condensed water, guarantee the trouble free service of electronic equipment; The a small amount of heat production of electronic devices and components is taken away by the fin of metallic packaging box surrounding by air.
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| CN108200749A (en) * | 2018-02-06 | 2018-06-22 | 联想(北京)有限公司 | A kind of radiator and electronic equipment |
| CN111182767A (en) * | 2019-12-31 | 2020-05-19 | 季华实验室 | Heat radiator |
| CN112696961A (en) * | 2019-10-23 | 2021-04-23 | 北京航空航天大学 | Three-stage phase change heat exchanger |
| WO2022095397A1 (en) * | 2020-11-03 | 2022-05-12 | 深圳市森若新材科技有限公司 | Phase change liquid cooling heat dissipation device |
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