CN104050445A - Fingerprint identification device, packaging method for fingerprint identification device and intelligent terminal - Google Patents
Fingerprint identification device, packaging method for fingerprint identification device and intelligent terminal Download PDFInfo
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- CN104050445A CN104050445A CN201410138447.5A CN201410138447A CN104050445A CN 104050445 A CN104050445 A CN 104050445A CN 201410138447 A CN201410138447 A CN 201410138447A CN 104050445 A CN104050445 A CN 104050445A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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Abstract
The invention provides a fingerprint identification device, a packaging method for the fingerprint identification device and an intelligent terminal. The fingerprint identification device comprises a fingerprint sensing chip, a first flexible circuit board, a second flexible circuit board, a metal welding ball and a metal shell, wherein the fingerprint sensing chip comprises a plurality of pins, and the fingerprint sensing chip is welded to the first printed circuit board through the multiple pins; the second flexible printed circuit board is fixed to and electrically connected with the first flexible printed circuit board through the metal welding ball to fix the fingerprint sensing chip between the first flexible printed circuit board and the second flexible printed circuit board; the fingerprint sensing chip, the first flexible printed circuit board and the second flexible printed circuit board are packaged in the metal shell. The strength of the fingerprint identification device can be improved, so that the service life of the mobile terminal is prolonged.
Description
Technical field
The present invention relates to fingerprint identification technology, relate in particular to method for packing and the intelligent terminal of a kind of fingerprint identification device, fingerprint identification device.
Background technology
Fingerprint identification technology is a kind of Measurement for Biotechnique that the feature of arranging of human finger's fingerprint two-story valley and ridge is identified, be widely used in various for example need to carrying out, in the field of authentication: fingerprint gate lock, utilize fingerprint recognition to open the mobile terminal etc. of operation.
The applied fingerprint identification device of fingerprint identification technology adopts capacitive induction device to respond to the feature of fingerprint conventionally, and generates corresponding electric signal and send to processor to carry out feature identification.Existing fingerprint identification device generally includes the parts such as lens, button, basic ring, fingerprint Identification sensor, flexible member and back up pad, wherein, basic ring is used for clamping lens, this fingerprint identification device is the packaged type that adopts basic ring, button, fingerprint recognition sensing flexible member and back up pad to stack gradually, its encapsulating structure and packaging technology are more complicated, affect the encapsulation yield of product, and then reduced the quality of product.
Summary of the invention
The invention provides method for packing and the intelligent terminal of a kind of fingerprint identification device, fingerprint identification device, structure that can simplification device, and simplify encapsulating structure and packaging technology.
The embodiment of the present invention provides a kind of fingerprint identification device, comprising: fingerprint induction chip, the first flexible PCB, the second flexible PCB, metal welding are received and metal shell; Wherein,
Described fingerprint induction chip comprises some pins, and described fingerprint induction chip is welded on the first flexible PCB by described some pins;
Described the second flexible PCB is received and is fixed and be electrically connected with described the first flexible PCB by described metal welding, so that described fingerprint induction chip is fixed between described the first flexible PCB and the second flexible PCB;
Described fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal solder ball sealing are contained in metal shell.
In an embodiment, described fingerprint induction chip comprises semiconductor wafer and is arranged on the fingerprint sensing element on described semiconductor wafer therein;
The output terminal of described fingerprint sensing element is as described some pins.
In an embodiment, described fingerprint induction chip is connected with described the first flexible PCB by metal coupling therein;
One end of described metal coupling is fixed on described semiconductor wafer, and is connected with some pins of described fingerprint sensing element, and the other end is fixed on described the first flexible PCB, and is electrically connected with described the first flexible PCB.
In an embodiment, described metal solder bag is drawn together therein: upper circuit board, lower circuit board and Metal Ball;
Described upper circuit board is welded on described the first flexible PCB, described lower welding circuit board on described the second flexible PCB, described Metal Ball respectively with described upper circuit board and lower welding circuit board.
In an embodiment, between described fingerprint induction chip and the second flexible PCB, be filled with buffering colloid therein.
In an embodiment, between described fingerprint induction chip and described metal shell, be filled with megohmite insulant therein.
In an embodiment, described metal shell comprises housing and capping therein;
Described the first flexible PCB is fixed on the top of described housing;
Described capping is fixed on described the second flexible PCB, and welds with described housing.
In an embodiment, described metal coupling comprises aluminium block, gold bullion and the block tin of stacked setting therein;
Described aluminium block is fixed on described semiconductor wafer, and described block tin is welded on described the first flexible PCB.
Another embodiment of the present invention provides a kind of method for packing of fingerprint identification device, and described fingerprint identification device comprises that fingerprint induction chip, the first flexible PCB, the second flexible PCB, metal welding receive and metal shell; Described method for packing comprises:
Fingerprint induction chip is welded on the first flexible PCB by the some pins in described fingerprint induction chip;
Described the first flexible PCB is received and is fixed on the second flexible PCB by metal welding, and be electrically connected with described the second flexible PCB;
Described fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal solder ball sealing are contained in described metal shell.
In an embodiment, described fingerprint induction chip comprises semiconductor wafer and is arranged on the fingerprint sensing element on described semiconductor wafer therein;
The output terminal of described fingerprint sensing element is as described some pins.
In an embodiment, fingerprint induction chip is welded on the first flexible PCB by the some pins in described fingerprint induction chip therein, comprises:
On described semiconductor wafer, form metal coupling, described metal coupling is connected with some pins of described fingerprint sensing element;
Described metal coupling is fixed on described the first flexible PCB, and is electrically connected with described the first flexible PCB.
In an embodiment, described metal solder bag is drawn together therein: upper circuit board, lower circuit board and Metal Ball;
Described the first flexible PCB is received and is fixed on the second flexible PCB by metal welding, and be electrically connected with described the second flexible PCB, comprising:
Described upper circuit board is welded on described the first flexible PCB;
By described lower welding circuit board on described the second flexible PCB;
Described Metal Ball is welded with described upper circuit board and second circuit board respectively.
In an embodiment, the method for packing of fingerprint identification device also comprises therein:
Between described fingerprint induction chip and the second flexible PCB, fill buffering colloid.
In an embodiment, the method for packing of fingerprint identification device also comprises therein:
Between described fingerprint sensing element and described metal shell, fill megohmite insulant.
In an embodiment, described metal shell comprises housing and capping therein;
Described fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal solder ball sealing are contained in described metal shell, comprise:
Described the first flexible PCB is fixed on to the top of described housing;
Described capping is fixed on described the second flexible PCB;
By described capping and the welding of described housing.
Further embodiment of this invention provides a kind of intelligent terminal, comprises fingerprint identification device as above.
The technical scheme that the embodiment of the present invention provides is by being fixed on fingerprint induction chip on the first flexible PCB, adopt metal welding to receive electrical connection is fixed and realized to the first flexible PCB and the second flexible PCB, then fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal welding are received to overall package in metal shell, encapsulating structure and packaging technology are simplified, improve the encapsulation yield of product, and then improved the quality of product.
Brief description of the drawings
The structural representation of the fingerprint identification device that Fig. 1 provides for the embodiment of the present invention one;
The process flow diagram of the method for packing of the fingerprint identification device that Fig. 2 provides for the embodiment of the present invention two;
In the method for packing that Fig. 3 provides for the embodiment of the present invention two, form the structural representation of fingerprint sensing element;
In the method for packing that Fig. 4 provides for the embodiment of the present invention two, form the structural representation of metal coupling;
In the method for packing that Fig. 5 provides for the embodiment of the present invention two, fix the structural representation after the first flexible PCB;
In the method for packing that Fig. 6 provides for the embodiment of the present invention two, form the structural representation of fixing colloid;
In the method for packing that Fig. 7 provides for the embodiment of the present invention two, form the structural representation of insulation colloid;
In the method for packing that Fig. 8 provides for the embodiment of the present invention two, form the structural representation of buffering colloid;
In the method for packing that Fig. 9 provides for the embodiment of the present invention two, form the structural representation of Metal Ball;
The structural representation of the first flexible PCB before being connected with the second flexible PCB in the method for packing that Figure 10 provides for the embodiment of the present invention two;
The structural representation of the first flexible PCB after being connected with the second flexible PCB in the method for packing that Figure 11 provides for the embodiment of the present invention two;
The structural representation one of package metals shell in the method for packing that Figure 12 provides for the embodiment of the present invention two;
The structural representation two of package metals shell in the method for packing that Figure 13 provides for the embodiment of the present invention two;
In the method for packing that Figure 14 provides for the embodiment of the present invention two, fix the structural representation of capping.
Reference numeral:
1-fingerprint induction chip; 2-the first flexible PCB; 3-the second flexible PCB;
4-metal welding is received; 5-metal shell; 11-semiconductor wafer;
12-fingerprint sensing element; 13-metal coupling; The upper circuit board of 41-;
Circuit board under 42-; 43-Metal Ball; 51-housing;
52-capping; 53-opening; 6-cushions colloid;
7-fixes colloid; The 8-colloid that insulate; 9-protects baffle plate;
14-the first gap; The radium-shine pad of 54-; 131-aluminium block;
132-gold bullion; 133-block tin.
Embodiment
The structural representation of the fingerprint identification device that Fig. 1 provides for the embodiment of the present invention.As shown in Figure 1, this fingerprint identification device can comprise: fingerprint induction chip 1, the first flexible PCB 2, the second flexible PCB 3, metal welding receive 4 and metal shell 5.
Wherein, fingerprint induction chip 1 comprises some pins, and this fingerprint induction chip 1 is welded on the first flexible PCB 2 by some pins.Fingerprint induction chip 1 is identified for the ridge to finger print and paddy, and according to arranging and the difference of the degree of depth of fingerprint two-story valley and ridge, fingerprint induction chip 1 produces induction current and exports by some pins.On the first flexible PCB 2, be provided with hardware circuit, the input end pin of hardware circuit and the corresponding connection of some pins on fingerprint induction chip 1, identify and transmit for the induction current that fingerprint induction chip 1 is sent.
The second flexible PCB 3 is received 4 fixing with the first flexible PCB 2 and be electrically connected by metal welding, fingerprint induction chip 1 is fixed between the first flexible PCB 2 and the second flexible PCB 3.A receive function of 4 of metal welding is for supporting the first flexible PCB 2 and the second flexible PCB 3, another function is to realize the electrical connection of the first flexible PCB 2 and the second flexible PCB 3, metal welding is received 4 quantity can be for multiple, for transmitting different electric signal.
Fingerprint induction chip 1, the first flexible PCB 2, the second flexible PCB 3 and metal welding are received and 4 are encapsulated in metal shell 5.Metal shell 5 can shield external interference, improves the degree of accuracy of fingerprint recognition.
The structure of above-mentioned fingerprint identification device is comparatively simple, its manufacturing process has also been simplified many than prior art, no longer need the stacked setting of multiple devices, but receive and two flexible PCBs are fixed and kept being electrically connected by metal welding, and fingerprint induction chip is fixed between two flexible PCBs, and above-mentioned member is all encapsulated in metal shell, has simplified encapsulating structure and packaging technology, improve the encapsulation yield of product, and then improved the quality of product.
Above-mentioned fingerprint induction chip 1 can adopt in prior art conventional for identifying the device of Fingers wrinkle ridge and paddy.The fingerprint induction chip 1 that the present embodiment adopts specifically comprises semiconductor wafer 11 and is arranged on the fingerprint sensing element 12 on semiconductor wafer 11, and the output terminal of fingerprint sensing element 12 is as some pins of aforesaid fingerprint induction chip 1.
Fingerprint sensing element 12 specifically can be arranged on the first surface of semiconductor wafer 11, can be arranged on the center of first surface.Carry out etching by etching technics conventional in prior art at the first surface of semiconductor wafer 11 and form fingerprint sensing element 12, the arranging rule of fingerprint sensing element 12 can be array format, or is other form, and the present embodiment does not limit.The semiconductor wafer 11 providing in the present embodiment can adopt earth silicon material to make, and its thickness can be between 350 microns to 650 microns, suitably increases thickness and can improve the intensity of semiconductor wafer 11.The output terminal of fingerprint sensing element 12 forms multiple pins, connects, for induction current being transferred to the first flexible PCB 2 with circuit corresponding in the first flexible PCB 2.
During the connected mode of above-mentioned fingerprint induction chip 1 and the first flexible PCB 2 has a lot, those skilled in the art can design according to actual structure.The present embodiment provides a kind of implementation: fingerprint induction chip 1 is connected to the first flexible PCB 2 by metal coupling 13.If adopt the above-mentioned fingerprint induction chip 1 being formed by fingerprint sensing element 12 and semiconductor wafer 11, one end of metal coupling 13 is fixed on semiconductor wafer 11, the other end is fixed on the first flexible PCB 2, and metal coupling 13 is connected with the corresponding line in fingerprint sensing element 12 and the first flexible PCB 2 respectively, to realize, fingerprint induction chip 1 is fixedly connected with the first flexible PCB 2, and realizes fingerprint induction chip 1 and the first flexible PCB 2 maintenance electrical connections.
The quantity of metal coupling 13 can be multiple, can be arranged in respectively the both sides of fingerprint sensing element 12, and its arrangement mode can be also other form, and the present embodiment does not limit.The electric signal that multiple metal couplings 13 can be exported fingerprint sensing element 12 is drawn, and is sent to the first flexible PCB 2.
Adopting metal coupling 13 is for supporting and fix the first flexible PCB 2 on the one hand, for realizing, fingerprint sensing element 12 and the first flexible PCB 2 are kept to electrical connection on the other hand, therefore select at the material of metal coupling 13, the present embodiment adopts respectively aluminium, Jin Hexi, make respectively the block structure of thinner thickness, form successively aluminium block, gold bullion and block tin in the corresponding position of semiconductor wafer 11.Wherein, the weight of aluminium block is lighter, and the conductive capability of gold bullion is better, block tin has stronger welding ability in the field of metal solder, adopt three kinds of derbies to combine, metal coupling 13 firmly can either be connected with the first flexible PCB 2, can reach again good conductive effect.
In addition, receive 4 function of metal welding in said structure is the firm connection that realizes the first flexible PCB 2 and the second flexible PCB 3 on the one hand, be the electrical connection that realizes the first flexible PCB 2 and the second flexible PCB 3 on the other hand, its concrete shape and structure can specifically be set by technician.The present embodiment provides a kind of implementation that can reference:
Metal welding is received and 4 is comprised: upper circuit board 41, lower circuit board 42 and Metal Ball 43, and wherein, upper circuit board 41 is welded on the first flexible PCB 2, and is electrically connected with the first flexible PCB 2; Lower circuit board 42 is welded on the second flexible PCB 3, and is electrically connected with the second flexible PCB 3; Metal Ball 43 is welded with upper circuit board 41 and lower circuit board 42 respectively, and realizes electrical connection between upper circuit board 41 and lower circuit board 42.
Receive 4 quantity of metal welding also can, for multiple, be respectively used to transmit different electric signal between the first flexible PCB 2 and the second flexible PCB 3.Upper circuit board 41 is welded on the first flexible PCB 2, achieve a fixed connection on the first flexible PCB 2 on the one hand, on the other hand with the first flexible PCB 2 in certain connection.Lower circuit board 42 is welded on the second flexible PCB 3, achieve a fixed connection on the second flexible PCB 3 on the one hand, on the other hand with the second flexible PCB 3 in certain connection.Upper circuit board 41, lower circuit board 42 and be welded on Metal Ball 43 between the two and jointly realized between the first flexible PCB 2 and the second flexible PCB 3 and transmit electric signal.
In addition, because being easily subject to extraneous strenuous vibration, damages fingerprint induction chip 1, can between fingerprint induction chip 1 and the second flexible PCB 3, fill buffering colloid 6, between second surface that specifically can be relative with first surface in semiconductor wafer 11 and the second flexible PCB 3, fill buffering colloid 6.This buffering colloid 6 can adopt shape conventional in prior art to fix and the good colloid of elasticity, for it being carried out to buffer protection at fingerprint induction chip 1 in the time being subject to extraneous strenuous vibration.
More firm in order to make between fingerprint induction chip 1 and the first flexible PCB 2, can between the two, apply the colloid that viscosity is higher, and dry solidification forms constitutionally stable fixing colloid 7.
Can also between fingerprint induction chip 1 and metal shell 5, fill megohmite insulant, colloid 8 for example insulate.In the gap that specifically can form between fingerprint induction chip 1 and the first flexible PCB 2, fill; and fill between the first flexible PCB 2 and metal shell 5; its function is on the one hand that fingerprint induction chip 1 is protected, and the first flexible PCB 2 can be fixed on the other hand to the top of metal shell 5.This megohmite insulant can also be stupalith, is filled in the gap forming between fingerprint induction chip 1 and the first flexible PCB 2, for fingerprint induction chip 1 is protected.And between the first flexible PCB 2 and metal shell 5, can fill insulation colloid, the first flexible PCB 2 is fixed on to the top of metal shell 5.
Above-mentioned fingerprint induction chip 1, the first flexible PCB 2, the second flexible PCB 3 and metal welding are received to 4 overall package in metal shell 5, and concrete, this metal shell 5 can comprise housing 51 and capping 52.The first flexible PCB 2 is fixed on the top of housing 51, and capping 52 is fixed on the second flexible PCB 3, and welds with housing 51.It will be appreciated by those skilled in the art that, can offer an opening 53 at the crown center of metal shell 5, corresponding, in the first flexible PCB 2, with the corresponding position of fingerprint induction chip 1, perforation is also set, make the top of fingerprint induction chip 1 not have any conductive materials.In addition, planarization operation need be carried out in the surface of insulation colloid 8 applying above fingerprint induction chip 1, avoid occurring raised or sunken, to improve degree of accuracy and the sensitivity of fingerprint recognition.
One end of the second flexible PCB 3, through the side of metal shell 5, is connected with the outer treatment circuit in fingerprint identification device, identifies, and then arranging of the ridge in finger print and paddy carried out to identification with the induction current that fingerprint induction chip 1 is sent.
Technique scheme is by being fixed on fingerprint induction chip on the first flexible PCB, adopt metal welding to receive electrical connection is fixed and realized to the first flexible PCB and the second flexible PCB, then fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal welding are received to overall package in metal shell, encapsulating structure and packaging technology are simplified, improve the encapsulation yield of product, and then improved the quality of product.
Embodiment bis-
The process flow diagram of the method for packing of the fingerprint identification device that Fig. 2 provides for the embodiment of the present invention two.The present embodiment is a kind of method for packing that the fingerprint identification device that provides based on above-described embodiment proposes, and is also that fingerprint identification device comprises that fingerprint induction chip 1, the first flexible PCB 2, the second flexible PCB 3, metal welding receive 4 and metal shell 5.As shown in Figure 2, the method can comprise following several step:
Step 10, fingerprint induction chip 1 is welded on the first flexible PCB 2 by the some pins in fingerprint induction chip 1.
Step 20, the first flexible PCB 2 is received and 4 is fixed on the second flexible PCB 3 by metal welding, and be electrically connected with the second flexible PCB 3.
Step 30, fingerprint induction chip 1, the first flexible PCB 2, the second flexible PCB 3 and metal welding are received and 4 be encapsulated in metal shell 5.
Concrete, in above-mentioned steps 10, fingerprint induction chip 1 can comprise semiconductor wafer 11 and be arranged on the fingerprint sensing element 12 on semiconductor wafer 11, and the output terminal of fingerprint sensing element 12 is as some pins.Therefore, the some pins in fingerprint sensing element 12 can be welded on the first flexible PCB 2.
In step 10, fingerprint induction chip 1 being welded on the first flexible PCB to 2 mode can realize with reference to following steps:
In the method for packing that Fig. 3 provides for the embodiment of the present invention two, form the structural representation of fingerprint sensing element.As shown in Figure 3, first, on the first surface of semiconductor wafer 11, form fingerprint sensing element 12.Specifically can adopt lithographic technique conventional in prior art to form fingerprint sensing element 12, concrete structure and the arrangement mode of the present embodiment to fingerprint sensing element 12 do not limit, and those skilled in the art can set according to implementation conventional in prior art.
In the method for packing that Fig. 4 provides for the embodiment of the present invention two, form the structural representation of metal coupling.As shown in Figure 4, form metal coupling 13 on semiconductor wafer 11, this metal coupling 13 is connected with some pins of fingerprint sensing element 12.Metal coupling 13, for to make respectively block structure by aluminium, gold, three kinds of metals of tin, can adopt the mode of metal deposition, on the first surface of semiconductor wafer 11, first forms aluminium block 131, with reference to Fig. 3 in the both sides of fingerprint sensing element 12.Then above aluminium block 131, form successively gold bullion 132 and block tin 133, aluminium block 131, gold bullion 132 and block tin 133 are jointly as metal coupling 13.
In the method for packing that Fig. 5 provides for the embodiment of the present invention two, fix the structural representation after the first flexible PCB.As shown in Figure 5, metal coupling 13 is fixed on the first flexible PCB 2, and is electrically connected with the first flexible PCB 2.Specifically the first flexible PCB 2 can be welded on the block tin 133 in metal coupling 13.And according to the circuit connecting relation of setting between fingerprint sensing element 12 and the first flexible PCB 2, carry out circuit connection by metal coupling 13.
In the first flexible PCB 2, be provided with the rectangle opening matching with position and the size of fingerprint sensing element 12, to guarantee sensitivity and the degree of accuracy of fingerprint sensing element 12 to fingerprint induction.For fingerprint sensing element 12 is protected, can first in rectangle opening, fix a block protection baffle plate 9 here, the material of this protection baffle plate 9 can be set by technician, selects the material with certain physical strength.Between rectangle opening in the first flexible PCB 2 and fingerprint sensing element 12, form the first gap 14.
In the method for packing that Fig. 6 provides for the embodiment of the present invention two, form the structural representation of fixing colloid.As shown in Figure 6, between semiconductor wafer 11 and the first flexible PCB 2, in all the other regions except above-mentioned the first gap 14, fill fixing colloid 7.The effect of fixing colloid 7 is that semiconductor wafer 11 is protected on the one hand, prevents because vibration damages semiconductor wafer 11, and be that semiconductor wafer 11 is firmly connected with the first flexible PCB 2 on the other hand.Fixing colloid 7 can be selected glue material conventional in this area according to its function.
In the method for packing that Fig. 7 provides for the embodiment of the present invention two, form the structural representation of insulation colloid.As shown in Figure 7; first the protection baffle plate 9 in the first flexible PCB 2 is removed; then in the first gap 14, fill insulation colloid 8, insulation colloid 8 fills up the first gap 14, and can also be coated in the first flexible PCB 2 and want to be fixed on the surface at metal shell 5 tops.In addition, also need the flattening surface of insulation colloid 8, avoid occurring raised or sunken, to improve induction sensitivity and the degree of accuracy of fingerprint sensing element 12 when the finger touches insulation colloid 8.Above-mentioned insulation colloid 8 can be also stupalith or other insulating material, can select the material that intensity is higher and scratch resistance is rubbed.
The structure that adopts above step to form, wherein fingerprint sensing element 12 to the distance on insulation colloid 8 surfaces can be less than 50 microns, distance than the fingerprint identification device existing in prior art is much smaller, dwindle the volume of fingerprint identification device, the space that has reduced to take in intelligent terminal, is conducive to intelligent terminal and realizes ultrathin design.
In addition, in order further fingerprint induction chip 1 to be protected, can between fingerprint induction chip 1 and the second flexible PCB 3, fill buffering colloid 6.Therefore, before step 20, can be in advance buffering colloid 6 be formed on the second flexible PCB 3, as shown in Figure 8, in the method for packing that Fig. 8 provides for the embodiment of the present invention two, forms the structural representation of buffering colloid.
Then perform step 20, that is: the first flexible PCB 2 is received and 4 is fixed on the second flexible PCB 3 by metal welding, and be connected with the second flexible PCB electricity 3.
For metal welding 4 implementations that comprise upper circuit board 41, lower circuit board 42 and Metal Ball 43 of receiving, can respectively upper circuit board 41 be soldered on the first flexible PCB 2, and be electrically connected with the first flexible PCB 2, as shown in Figure 7; Lower circuit board 42 is soldered on the second flexible PCB 3, as shown in Figure 8; Then one end of Metal Ball 43 and upper circuit board 41 are welded, the other end and lower circuit board 42 weld, and as shown in Figure 9, form the structural representation of Metal Ball in the method for packing that Fig. 9 provides for the embodiment of the present invention two.
The structural representation of the first flexible PCB before being connected with the second flexible PCB in the method for packing that Figure 10 provides for the embodiment of the present invention two, in the method for packing that Figure 11 provides for the embodiment of the present invention two, the first flexible PCB is connected structural representation afterwards with the second flexible PCB.As shown in FIG. 10 and 11, metal welding is received to 4 by welded together to upper circuit board 41 and lower circuit board 42, realized the first flexible PCB 2 is fixedly connected with the second flexible PCB 3.
After step 20 finishes, can perform step 30.By fingerprint induction chip 1, the first flexible PCB 2, the second flexible PCB 3 and metal welding 4 inside that are encapsulated in metal shell 5 of receiving.Concrete, metal shell 5 comprises housing 51 and capping 52.The fingerprint induction chip being fixedly connected with 1, the first flexible PCB 2, the second flexible PCB 3 and metal welding are received and 4 put into housing 51, the first flexible PCB 2 is towards the top of housing 51, and bond together by colloid and the housing 51 of the first flexible PCB 2 surface coatings, so that the opening 53 that fingerprint induction chip 1 is just arranging housing 51 tops.
Afterwards, capping 52 is fixed on the second flexible PCB 3.Or capping 52 also can just be fixedly connected with the second flexible PCB 3 in step before, as shown in Figure 8.
The structural representation one of package metals shell in the method for packing that Figure 12 provides for the embodiment of the present invention two, Figure 12 shows fingerprint induction chip 1, the first flexible PCB 2, the second flexible PCB 3 and metal welding and receives and 4 be encapsulated in the structural representations of metal shell 5 before inner.The structural representation two of package metals shell in the method for packing that Figure 13 provides for the embodiment of the present invention two, Figure 13 shows fingerprint induction chip 1, the first flexible PCB 2, the second flexible PCB 3 and metal welding and receives and 4 be encapsulated in the structural representations of metal shell 5 after inner.
In the method for packing that Figure 14 provides for the embodiment of the present invention two, fix the structural representation of capping.As shown in figure 14, capping 52 and housing 51 are welded together, can adopt radium-shine welding process, between capping 52 and housing 51, form radium-shine pad 54.
The technical scheme that the present embodiment provides is by being fixed on fingerprint induction chip on the first flexible PCB, adopt metal welding to receive electrical connection is fixed and realized to the first flexible PCB and the second flexible PCB, then fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal welding are received to overall package in metal shell, encapsulating structure and packaging technology are simplified, improve the encapsulation yield of product, and then improved the quality of product.
The present invention also provides a kind of implementation of intelligent terminal, and this intelligent terminal can be mobile phone, panel computer, touch controlling equipment etc., the fingerprint identification device providing comprising above-described embodiment one.This fingerprint identification device is by being fixed on fingerprint induction chip on the first flexible PCB, adopt metal welding to receive electrical connection is fixed and realized to the first flexible PCB and the second flexible PCB, then fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal welding are received to overall package in metal shell, encapsulating structure and packaging technology are simplified, improve the encapsulation yield of product, and then improved the quality of product.
Finally it should be noted that: above each embodiment, only in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to aforementioned each embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or some or all of technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (16)
1. a fingerprint identification device, is characterized in that, comprising: fingerprint induction chip, the first flexible PCB, the second flexible PCB, metal welding are received and metal shell; Wherein,
Described fingerprint induction chip comprises some pins, and described fingerprint induction chip is welded on the first flexible PCB by described some pins;
Described the second flexible PCB is received and is fixed and be electrically connected with described the first flexible PCB by described metal welding, so that described fingerprint induction chip is fixed between described the first flexible PCB and the second flexible PCB;
Described fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal solder ball sealing are contained in metal shell.
2. fingerprint identification device according to claim 1, is characterized in that, described fingerprint induction chip comprises semiconductor wafer and is arranged on the fingerprint sensing element on described semiconductor wafer;
The output terminal of described fingerprint sensing element is as described some pins.
3. fingerprint identification device according to claim 2, is characterized in that, described fingerprint induction chip is connected with described the first flexible PCB by metal coupling;
One end of described metal coupling is fixed on described semiconductor wafer, and is connected with some pins of described fingerprint sensing element, and the other end is fixed on described the first flexible PCB, and is electrically connected with described the first flexible PCB.
4. fingerprint identification device according to claim 3, is characterized in that, described metal solder bag is drawn together: upper circuit board, lower circuit board and Metal Ball;
Described upper circuit board is welded on described the first flexible PCB, described lower welding circuit board on described the second flexible PCB, described Metal Ball respectively with described upper circuit board and lower welding circuit board.
5. fingerprint identification device according to claim 4, is characterized in that, between described fingerprint induction chip and the second flexible PCB, is filled with buffering colloid.
6. fingerprint identification device according to claim 5, is characterized in that, between described fingerprint induction chip and described metal shell, is filled with megohmite insulant.
7. fingerprint identification device according to claim 6, is characterized in that, described metal shell comprises housing and capping;
Described the first flexible PCB is fixed on the top of described housing;
Described capping is fixed on described the second flexible PCB, and welds with described housing.
8. according to the fingerprint identification device described in claim 1-7 any one, it is characterized in that, described metal coupling comprises aluminium block, gold bullion and the block tin of stacked setting;
Described aluminium block is fixed on described semiconductor wafer, and described block tin is welded on described the first flexible PCB.
9. a method for packing for fingerprint identification device, is characterized in that, described fingerprint identification device comprises that fingerprint induction chip, the first flexible PCB, the second flexible PCB, metal welding receive and metal shell; Described method for packing comprises:
Fingerprint induction chip is welded on the first flexible PCB by the some pins in described fingerprint induction chip;
Described the first flexible PCB is received and is fixed on the second flexible PCB by metal welding, and be electrically connected with described the second flexible PCB;
Described fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal solder ball sealing are contained in described metal shell.
10. the method for packing of fingerprint identification device according to claim 9, is characterized in that, described fingerprint induction chip comprises semiconductor wafer and is arranged on the fingerprint sensing element on described semiconductor wafer;
The output terminal of described fingerprint sensing element is as described some pins.
The method for packing of 11. fingerprint identification devices according to claim 10, is characterized in that, fingerprint induction chip is welded on the first flexible PCB by the some pins in described fingerprint induction chip, comprising:
On described semiconductor wafer, form metal coupling, described metal coupling is connected with some pins of described fingerprint sensing element;
Described metal coupling is fixed on described the first flexible PCB, and is electrically connected with described the first flexible PCB.
The method for packing of 12. fingerprint identification devices according to claim 11, is characterized in that, described metal solder bag is drawn together: upper circuit board, lower circuit board and Metal Ball;
Described the first flexible PCB is received and is fixed on the second flexible PCB by metal welding, and be electrically connected with described the second flexible PCB, comprising:
Described upper circuit board is welded on described the first flexible PCB;
By described lower welding circuit board on described the second flexible PCB;
Described Metal Ball is welded with described upper circuit board and second circuit board respectively.
The method for packing of 13. fingerprint identification devices according to claim 12, is characterized in that, also comprises:
Between described fingerprint induction chip and the second flexible PCB, fill buffering colloid.
The method for packing of 14. fingerprint identification devices according to claim 13, is characterized in that, also comprises:
Between described fingerprint sensing element and described metal shell, fill megohmite insulant.
The method for packing of 15. fingerprint identification devices according to claim 14, is characterized in that, described metal shell comprises housing and capping;
Described fingerprint induction chip, the first flexible PCB, the second flexible PCB and metal solder ball sealing are contained in described metal shell, comprise:
Described the first flexible PCB is fixed on to the top of described housing;
Described capping is fixed on described the second flexible PCB;
By described capping and the welding of described housing.
16. 1 kinds of intelligent terminals, is characterized in that, comprise the fingerprint identification device as described in claim 1-8 any one.
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5949655A (en) * | 1997-09-09 | 1999-09-07 | Amkor Technology, Inc. | Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device |
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-
2014
- 2014-04-08 CN CN201410138447.5A patent/CN104050445B/en not_active Expired - Fee Related
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