CN104035853B - Temperature monitoring system and temperature monitoring method - Google Patents
Temperature monitoring system and temperature monitoring method Download PDFInfo
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- CN104035853B CN104035853B CN201310073199.6A CN201310073199A CN104035853B CN 104035853 B CN104035853 B CN 104035853B CN 201310073199 A CN201310073199 A CN 201310073199A CN 104035853 B CN104035853 B CN 104035853B
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Abstract
The invention provides a kind of temperature monitoring system and temperature monitoring method.The temperature monitoring system is used to carry out monitoring temperature at least one temperature control object, and the temperature monitoring system includes：Light source, for sending incident light；At least one hot mating plate, is formed by thermoluminescent material, is set respectively against in each temperature control object, and each hot mating plate is used to receive the incident light and forms optical signal；At least one detector, is correspondingly arranged with the hot mating plate respectively, carries out opto-electronic conversion to obtain electric signal for detecting the optical signal formed by corresponding hot mating plate, and to the optical signal detected；Controller, the temperature for calculating each temperature control object respectively according to the electric signal, wherein the temperature control object is the kernel in the central processing unit using light network technology.The temperature monitoring system and temperature monitoring method of the present invention can accurately, timely and effectively detect and control temperature.
Description
Technical field
The present invention relates to a kind of temperature monitoring system and method, more particularly to enter trip temperature inspection using photo-thermal variation relation
The temperature monitoring system and method for survey.
Background technology
As computing power is stronger and stronger, central processing unit（CPU）Integrated level and the speed of service improve constantly, work(
Consumption constantly increase, timely and effectively detects and controls CPU running temperature to turn into the bottleneck that technology develops.
The method for detecting CPU running temperatures by attaching thermistor outside CPU existing at present（Prior art
One）.However, this method has the disadvantage that：
1st, thermistor is contact temperature-measuring element, the temperature detected using this method be CPU surface temperatures rather than
Core cpu temperature.However, due to core cpu（die）The heat sent can be shed from chip package to outside, therefore, CPU
15 DEG C to 30 DEG C of the temperature difference is there are about between surface temperature and core cpu temperature, and the temperature difference is because chip package form is different and ring
Border temperature is different and is difficult to determine.Also, the temperature detected using this method is the resistance by monitoring chip according to thermistor
Value changes are calculated, if the contact defective tightness between thermistor and CPU, then CPU heat cannot be effectively
It is transferred to thermistor so that detected temperature has very big error.
2nd, need to be through can just be delivered to CPU surfaces after a while after due to core cpu temperature change so that CPU surfaces temperature
Degree change is very blunt, and programming rate is far away from core cpu temperature, and therefore, the change of CPU surface temperatures can not reflect in time
The problem of going out the change of core cpu temperature and form time lag, causes reaction insensitive, can not play sometimes timely and effective
Protective effect.
3rd, because the reaction of this method is insensitive, protect CPU in time again, accordingly, it is possible to often occur because closing by force
CPU and the phenomenon for causing loss of vital data.
In addition, also there is the method for detecting CPU running temperatures by being implanted into thermal diode in CPU（Prior art
Two）.However, this method is compared with prior art one, detection promptness makes moderate progress, but still has the disadvantage that：
1st, temperature detecting precision need to be improved.
2nd, multi-core CPU can not be applied to.Reason is, in the three-dimensional stacking structure of multinuclear and light network, on light network
Many optical devices can also generate heat, and Temperature Distribution extremely uneven and temperature may complicate, and this method may be inadequate because of draw property
And there is error, it is impossible to the stable operation of safeguards system.
The content of the invention
In view of this, the embodiment of the present invention provides a kind of temperature monitoring system and method, can exactly, timely and effectively
Detect and control temperature.
In a first aspect, the embodiments of the invention provide a kind of temperature monitoring system, for entering at least one temperature control object
Trip temperature is monitored, and the temperature monitoring system includes：Light source, for sending incident light；At least one hot mating plate, by thermoluminescent material
Formed, set respectively against in each temperature control object, each hot mating plate is used to receive the incident light and forms optical signal；
At least one detector, is correspondingly arranged with the hot mating plate respectively, for detecting the optical signal formed by corresponding hot mating plate, and
The optical signal detected is carried out opto-electronic conversion to obtain electric signal；Controller, for being calculated respectively according to the electric signal
The temperature of each temperature control object, wherein the temperature control object is the kernel in the central processing unit using light network technology.
With reference in a first aspect, in the first possible embodiment, the optical signal is the incident light via described
The transmitted light that hot mating plate is transmitted.
With reference in a first aspect, in second of possible embodiment, the optical signal is the incident light via described
The reflected light that hot mating plate is reflected back.
With reference in a first aspect, in the third possible embodiment, the temperature monitoring system also includes：Detection heat
Mating plate, is formed by thermoluminescent material, is provided separately with the temperature control object, for receiving the incident light and forming optical signal；Inspection
Survey detector, is correspondingly arranged with the detection with hot mating plate, and the optical signal formed with hot mating plate is detected by described for detecting,
And opto-electronic conversion is carried out to obtain electric signal to the optical signal detected, wherein, the controller is by the way that the detection is used
The electric signal that the electric signal that detector is obtained is obtained with the detector is contrasted, to determine to be caused by incident light change
Temperature change.
With reference to the third possible embodiment of first aspect, in the 4th kind of possible embodiment, the detection
With hot mating plate by being formed with the hot mating plate identical thermoluminescent material, the controller is additionally operable to utilize the detection detector
Result of detection the result of detection of the detector is corrected.
Any of first to fourth kind of possible embodiment with reference to first aspect and first aspect, at the 5th kind
In possible embodiment, the temperature monitoring system also includes beam splitter, and the beam splitter is used to the incident light being divided into
Multi beam, to correspond to each hot mating plate and the hot mating plate of the detection respectively.
Any of the first to five kind of possible embodiment with reference to first aspect and first aspect, at the 6th kind
In possible embodiment, the temperature monitoring system also includes lenticule, and the lenticule is arranged at the light source and described
Between hot mating plate, for converging the incident light.
Any of the first to six kind of possible embodiment with reference to first aspect and first aspect, at the 7th kind
In possible embodiment, the temperature monitoring system also include at least one waveguide, the waveguide be arranged at the light source with
Between the hot mating plate, for the incident light to be guided to each hot mating plate.
Any of the first to seven kind of possible embodiment with reference to first aspect and first aspect, at the 8th kind
In possible embodiment, the temperature monitoring system also includes：Display, the temperature for showing the temperature control object；Report
Alert device, for when the temperature of the temperature control object is higher than predetermined threshold, sending alarm.
Any of the first to eight kind of possible embodiment with reference to first aspect and first aspect, at the 9th kind
In possible embodiment, the hot mating plate is attached at each temperature control object respectively.
Any of the first to eight kind of possible embodiment with reference to first aspect and first aspect, at the tenth kind
In possible embodiment, the hot mating plate is silicon chip, by growing a layer thickness in the surface precipitation method of each kernel
The hot mating plate is formed for 10um to 20um silicon chip.
Second aspect, the embodiments of the invention provide a kind of temperature monitoring method, for entering trip temperature prison to temperature control object
Control, the temperature monitoring method comprises the following steps：The incident light sent by light source is received by hot mating plate and optical signal is formed,
Wherein, the hot mating plate is formed by thermoluminescent material, and is close proximity to the temperature control object setting；Photoelectricity is carried out to the optical signal to turn
Change to obtain electric signal；The temperature of the temperature control object is calculated according to the electric signal, wherein the temperature control object is to use light
Kernel in the central processing unit of interconnection technique.
With reference to second aspect, in the first possible embodiment, the optical signal is to be transmitted by the hot mating plate
Transmitted light or the reflected light that is reflected back by the hot mating plate.
With reference to the first possible embodiment of second aspect or second aspect, in second of possible embodiment
In, the electric signal is filtered and phase enhanced processing is locked.
With reference to second aspect, in the third possible embodiment, also comprise the following steps：According to the temperature to institute
State temperature control object and carry out cooling processing.
Because the hot mating plate for being used to transmit heat in the present invention is close proximity to the setting of temperature control object, and the present invention is become using photo-thermal
Change relation calculates the temperature of temperature control object, and therefore, detected temperature is more accurate.Also, because the present invention utilizes light
Signal rather than electrical signal for transmission temperature information, accordingly, it is capable to more timely and effectively carry out temperature detection.
Brief description of the drawings
Fig. 1 shows the structural representation of temperature monitoring system 100 according to embodiments of the present invention.
Absorption and reflective schematic diagram according to embodiments of the present invention is shown respectively in Fig. 2A, Fig. 2 B.
Fig. 3 shows the structural representation of temperature monitoring system 300 according to another embodiment of the present invention.
Fig. 4 shows the structural representation of the temperature monitoring system 400 according to further embodiment of this invention.
Fig. 5 shows the structural representation of temperature monitoring system 500 according to yet another embodiment of the invention.
Fig. 6 shows the Organization Chart being integrated into temperature monitoring system according to embodiments of the present invention in the CPU of computer.
Fig. 7 shows the structural representation being integrated into temperature monitoring system according to embodiments of the present invention in multi-core CPU.
Fig. 8 shows the flow chart of temperature monitoring method 800 according to embodiments of the present invention.
Embodiment
Embodiments of the invention will be provided with detailed reference below.Although the present invention is explained by these embodiments
State and illustrate, but should be noted that the present invention is not merely confined to these embodiments.On the contrary, the present invention covers right
It is required that all substitutes, variant and equivalent in defined spirit and invention scope.
In addition, in order to better illustrate the present invention, numerous details are given in embodiment below.
It will be understood by those skilled in the art that without these details, the present invention can equally be implemented.It is right in other example
It is not described in detail in known method, formality, element and circuit, in order to highlight the purport of the present invention.
As described above, CPU temperature rises not only influence the further development of CPU technologies, also directly affect CPU stability and make
Use the life-span.But so far, also can guarantee that and never fail without a kind of CPU cooling systems.Losing cooling system, this is protected
" core " of umbrella is protected, often stops " bounce " forever in seconds, causes system not run normally.Timely and effectively carry out
Monitoring temperature becomes particularly important.And absorption meeting of the thermoluminescent material to light is utilized according to the temperature monitoring system and method for the present invention
Variation with temperature and the attribute changed, the photo-thermal variation relation based on thermoluminescent material is come detection temperature, so as to have more in time
Effect ground carries out temperature detection.Describe the structure of the temperature monitoring system of the present invention in detail below with reference to specific embodiment.
Fig. 1 shows the structural representation of temperature monitoring system 100 according to embodiments of the present invention.As shown in figure 1, temperature is supervised
Control system 100 can be used for carrying out monitoring temperature to temperature control object 1.Temperature monitoring system 100 includes：Light source 101, hot mating plate 102,
Detector 103 and controller 104.Wherein, it is optical coupling, detector between light source 101, hot mating plate 102 and detector 103
Connected between 103 and controller 104 by electric signal.
Light source 101 can be the luminescent devices such as lasing light emitter or light emitting diode, for sending incident light.
Hot mating plate 102 is formed by thermoluminescent material, and is close proximity to temperature control object 1 and is set, for entering of receiving that light source 101 sends
Penetrate light and form optical signal.Wherein, the optical signal that hot mating plate 102 is formed can be：Incident light is transmitted via hot mating plate 102
Transmitted light（It is hereinafter referred to as absorption）, or the reflected light that incident light is reflected back via hot mating plate 102（It is hereinafter referred to as reflective）.
The thermoluminescent material for forming hot mating plate 102 can be GaAs, CdTe, monocrystalline silicon or other thermo-optical coeffecients than larger polymer.
In principle, it is reflective be with absorption effect as, but because absorption light requirement is once by hot mating plate,
And reflective need light to pass twice through hot mating plate（That is, returned into hot mating plate and by hot mating plate）, therefore, absorption structure phase
To simple, and reflective technique is relative complex, it is reflective in hot mating plate need it is thinner.Basis is shown respectively in Fig. 2A, Fig. 2 B
The absorption and reflective schematic diagram of the embodiment of the present invention.
Because the transmissivity of hot mating plate 102 can change with its temperature change, and hot mating plate 102 is close proximity to temperature control object 1
Set, the heat of temperature control object 1 can be transmitted, therefore, intensity and the temperature control object 1 of the transmitted light transmitted from hot mating plate 102
There is corresponding variation relation between temperature.The variation relation will be described in detail after.
Detector 103 detects the optical signal formed by hot mating plate 102, for example, the transmitted light transmitted from hot mating plate 102,
And the optical signal is carried out opto-electronic conversion to obtain electric signal.Thus, between the temperature of the electric signal and temperature control object 1
There is corresponding variation relation.
Controller 104 is obtained using the corresponding relation between the transmissivity and temperature of hot mating plate 102 according to by detector 103
The electric signal obtained calculates the temperature of hot mating plate 102.Also, controller 104 can also be carried out according to the temperature to temperature control object 1
Cooling processing.If for example, the temperature exceedes predetermined threshold value, carrying out cooling processing.The predetermined threshold value
Temperature during progress cooling processing can be needed to determine based on temperature control object 1.Due to forming the thermoluminescent material of hot mating plate 102
Species and the distance between hot mating plate 102 and temperature control object 1 may influence the temperature between temperature control object 1 and hot mating plate 102
Degree relation, therefore, it is determined that needing during the threshold value to consider above-mentioned factor.The cooling processing includes but is not limited to：Plus
Fast rotation speed of the fan, the operating voltage of the reduction central processing unit and working frequency close central processing unit etc..In detailed below
Illustrate that controller 104 calculates the principle of temperature according to the electric signal.
Because the thermoluminescent material in the present invention is semi-conducting material, therefore, photo-thermal change that can be based on semi-conducting material is closed
It is to calculate the temperature change of hot mating plate.In view of silicon thermo-optic effect substantially, therefore below using silicon chip as hot mating plate exemplified by,
Illustrate according to detector measurement to transmitted light intensity, using 4 following expression formulas calculate the process of silicon temperature：
Wherein, t is the transmission coefficient of hot mating plate, and R is the reflectance factor of hot mating plate, and x is the thickness of hot mating plate, and α is hot light
The absorption coefficient of piece.Also, there is following relation between transmission coefficient t and reflection R：t=1-R.
Wherein, E0=1.17eV, i.e. silicon energy gap, A=4.73 × 10-4EV/K, B=636K.
α(E,T2)=α[E+k(T2-T1),T1]（3）
Wherein, k=1.2e-3eV/K E>1.7eV
Wherein, I0(λ) is light source intensity, and I (λ) is transmitted light intensity.
According to above-mentioned expression formula（1）Extremely（4）Understand, measure the measurement that corresponding transmitted light intensity achieves that corresponding temperature.
As described above, transmission-type be light once by hot mating plate, and it is reflective pass twice through hot mating plate for light, therefore, though
Right above-mentioned Computing Principle is described as an example with absorption, but those skilled in the art are on this basis, should be able to manage
How solution is calculated when using reflective.
Fig. 3 shows the structural representation of temperature monitoring system 300 according to another embodiment of the present invention.As shown in figure 3, warm
Monitoring system 300 is spent in addition to including light source 101, hot mating plate 102, detector 103 and controller 104, can also be included：
Detection hot mating plate 301 and detection detector 302.
Detection is formed with hot mating plate 301 by thermoluminescent material, and is provided separately with temperature control object 1, is sent out for receiving light source 101
The incident light that goes out simultaneously forms optical signal, wherein the optical signal incident light is transmitted via detection with hot mating plate 301
The reflected light that transmitted light or the incident light are reflected back via detection with hot mating plate 301.Detection detector 302 and detection heat
Mating plate 301 is correspondingly arranged, and is entered for detecting by detecting the optical signal formed with hot mating plate 301, and to the optical signal detected
Row opto-electronic conversion is to obtain electric signal.Wherein, controller 104 passes through the electric signal for obtaining detection detector 302 and detection
The electric signal that device 103 is obtained is contrasted, to determine the temperature change caused by incident light change, so as to avoid measurement error.
More specifically, due to lasing light emitter or light emitting diode may because of power jitter and caused by incident light change, and
The intensity that incident light change may result in the transmitted light transmitted from hot mating plate 102 is changed, and therefore, controller 104 is counted
The temperature calculated there may be error, and can not reflect the temperature of temperature control object 1 exactly.In other increase and temperature control object 1
The detection being provided separately is with after hot mating plate 301, and controller 104 can be based on the change for detecting the transmitted light that transmitted with hot mating plate 301
Change the change of monitoring incident light, and in the case where incident light changes, invalid calculated temperature and in time to light
Source 101 is made adjustment, so as to prevent measurement error.
According to another embodiment of the invention, detection with hot mating plate 301 can by with the hot identical thermoluminescent material of mating plate 102
Formed.In this case, school is carried out to the testing result of detector 302 with the testing result of detector 302 using detection
Just, so as to eliminate because of temperature change caused by incident light change, measurement error is prevented.
In addition, as shown in figure 3, temperature monitoring system 300 can also include being arranged between light source 101 and hot mating plate 102
Waveguide 303 and/or lenticule 304.Waveguide 303 is used for incident light transmission to hot mating plate 102.Lenticule 304 is used to converge
Incident light.The incident light that light source 101 is sent can reach heat after waveguide 303 or free space are converged by lenticule 304
Mating plate 102.Thereby, it is possible to increase to the light quantity for reaching hot mating plate 102, the power consumption of reduction light source.
Wherein, temperature control object 1 can be the computing engines in the CPU of computer（Kernel）, and temperature monitoring system 100 can
It is integrated in the lump in the central processing unit with the kernel.In this case, the cooling processing that controller 104 is carried out
Including but not limited to：Accelerate rotation speed of the fan, the operating voltage of the reduction central processing unit and working frequency or close centre
Manage device etc..
Temperature monitoring system 100,300 according to the above embodiment of the present invention can be accurately in time to temperature control object 1
Temperature is detected and monitored, and carries out radiating treatment to temperature control object 1 based on testing result.
Fig. 4 shows the structural representation of temperature monitoring system 400 according to embodiments of the present invention.Temperature monitoring system 400
Monitoring temperature is carried out simultaneously available for multiple temperature control objects 4.Temperature monitoring system 400 includes：Light source 401, multiple hot mating plates
402nd, the multiple detectors 403 and controller 404 being correspondingly arranged respectively with multiple hot mating plates 402.Wherein, light source 401, hot light
Piece 402, detector 403 and controller 404 and light source 101, hot mating plate 102, detector 103 and the controller 104 in Fig. 1
Setting and effect be essentially identical.The difference of temperature monitoring system 400 and temperature monitoring system 100 is essentially consisted in, temperature
Monitoring system 400 includes multiple hot mating plates 402 and the multiple detectors 403 being correspondingly arranged respectively with multiple hot mating plates 402, and
Multiple hot mating plates 402 are set respectively against in multiple temperature control objects 4.Controller 404 can be detected according to by multiple detectors 403
To, the intensity of transmitted light that transmits respectively from multiple hot mating plates 402, to calculate the temperature of each temperature control object 4.
Light source 401 is used to send incident light.According to one embodiment of present invention, light source 401 can be multiple and multiple
Light source 401 is correspondingly arranged to increase the intensity of incident light with multiple hot mating plates 402.Multiple hot mating plates 402 are formed by thermoluminescent material,
And set respectively against in multiple temperature control objects 4, each hot mating plate 402 is used to receive incident light and the shape that light source 401 is sent
Into optical signal.The optical signal is the transmitted light that the incident light is transmitted via the hot mating plate.Multiple detectors 403 are distinguished
It is correspondingly arranged with multiple hot mating plates 402, for detecting the optical signal formed by corresponding hot mating plate 402, and to being detected
Optical signal carries out opto-electronic conversion to obtain electric signal.Controller 404 by according to multiple detectors 403 obtain electric signal respectively based on
Calculate the temperature of multiple temperature control objects 4.Controller 404 is used to also dissipate multiple temperature control objects 4 respectively according to the temperature
Hot cooling treatment.Cooling processing for multiple temperature control objects 4 can be identical or different.According to electric signal meter
The principle for calculating temperature is above having been carried out describing in detail, will not be repeated here.
In addition, Fig. 5 shows the structural representation of temperature monitoring system 500 according to another embodiment of the present invention.Such as Fig. 5 institutes
Show, temperature monitoring system 500 except including light source 401, multiple hot mating plates 402, multiple detectors 403 and controller 404 it
Outside, detection hot mating plate 501, detection detector 502, beam splitter 503 and display 504 and alarm can also be included
505。
Detect and detected with hot mating plate 501 and detection detector 502 with the hot mating plate 301 of the detection in Fig. 3 and detection
The setting and effect of device 302 are essentially identical, be will not be repeated here.Beam splitter 503 is used for the incident light for sending light source 401
It is divided into multi beam, to be incident to multiple hot mating plates 402 respectively and detect with hot mating plate 501, so as to not increase the feelings of light source 401
Under condition, it is ensured that the intensity of incident light, light source is saved.Display 504 and alarm 505 are connected with controller 404.Display
504 temperature for showing temperature control object 4.Alarm 505 is used for when the temperature of temperature control object 4 is higher than predetermined threshold value, hair
Go out alarm.Thus, the user of temperature control object 4 can also understand the temperature of temperature control object 4 in time, and make corresponding processing.
Temperature monitoring system 400,500 according to the above embodiment of the present invention can accurately, in time to multiple temperature controls
The temperature of object 1 is detected and monitored simultaneously, and carries out radiating treatment respectively to multiple temperature control objects 4 based on testing result.
Temperature monitoring system according to embodiments of the present invention can apply to the CPU of the computer using light network technology, and
Temperature control is carried out to the kernel in the CPU.
With the development of cpu chip semiconductor technology, cpu chip integrated level is improved constantly, and only improves monokaryon chip
Speed can produce excessive heat, and can not bring corresponding performance improvement, and then engineers have developed polycaryon processor.It is many
Core processor refers to two or more integrated complete computing engines (kernel) in one piece of processor.Calculated high performance
In machine, the number of CPU centers can be more and more, and the internuclear data movement efficiency of multi-core CPU can turn into restriction processor chips
The key factor of overall performance.Light network technology transmits data using waveguide mode, and the loss that signal is transmitted is low, speed is fast, prolong
Small late, it can reach very high bandwidth density by using wavelength-division multiplex (WDM) technology, help to solve the bottle of chip-on communication
Neck problem.It is right using strengthening on the range and complexity of multinuclear and the cpu temperature region of variation of light network technology than existing CPU
Its temperature, which carries out accurate monitoring in time, becomes more important.Temperature monitoring system according to embodiments of the present invention can be to using light
The multi-core CPU of the computer of interconnection technique carries out accurate and temperature control and radiating treatment in time.
Internal memory, processor are generally included using the CPU of light network technology（Kernel）And between internal memory and processor
Light belt etc., wherein light belt is used to be that the optical fiber connecting element such as exterior light interconnection element provides interface and is for example
The inner member of internal memory etc. provides the interconnection of low-power, specifically may be referred to U.S. Patent application US2009/0103854A1.
Fig. 6 shows to be integrated into temperature monitoring system according to embodiments of the present invention into the computer using light network technology
Organization Chart in CPU.As shown in fig. 6, the framework includes internal memory 601, temperature monitoring system 602, processor（Kernel）603 and
Radiator 604.Wherein, the hot mating plate in temperature monitoring system 602 is close proximity to processor（Kernel）603 and the light in the CPU
Take.Temperature monitoring system 602 is used for the temperature of measurement processor 603, and controls radiator 604 to dissipate processor 603
Heat treatment.Radiator 604 can be the heat abstractors such as fan.
Fig. 7 shows to be integrated into temperature monitoring system according to embodiments of the present invention into the multi-core CPU using light network technology
In, so that multiple kernels 7 in multi-core CPU are carried out with the structural representation of radiating treatment, i.e. by using the multinuclear of light network technology
Multiple kernels 7 in CPU as multiple temperature control objects temperature monitoring system 700.Although according in the multi-core CPU of the present embodiment
With 3 kernels, it will be appreciated by a person skilled in the art that the number of kernel can be not limited to 3.
As shown in fig. 7, there is a hot mating plate 702 against its setting each lower section of kernel 7, such as hot mating plate 702 can be pasted
Invest the surface of kernel 7.Wherein, it is contemplated that the thermo-optic effect of silicon is obvious, the compatibility and in CPU is high, therefore, hot mating plate
702 can be 10um to 20um silicon chip form by growing on the surface of corresponding kernel a layer thickness with the precipitation method.
The incident light sent by light source 701 after the beam splitting of beam splitter 705,（Waveguide or free space can be passed through, and through micro-
It is not shown after lens convergence）It is incident to hot mating plate 702.With the rise of the temperature of kernel 7, the temperature of corresponding hot mating plate 702
Rise, its transmissivity changes and causes the light intensity for transmiting the transmitted light of hot mating plate 702 to change.Detector 703 is visited
The transmitted light is surveyed, and optical signal is subjected to opto-electronic conversion and electric signal is obtained.703 pairs of electric signals of detector are filtered
The mutually processing such as amplification of ripple, lock, to remove the interference such as noise, and is sent to controller 704 by the signal after processing.Controller 704
Calculate the temperature of hot mating plate 702 according to received signal, and by the temperature calculated and predetermined threshold value be compared with
Judge whether to cooling processing.In the case where the temperature calculated is more than or equal to predetermined threshold value, controller
704 controls carry out the processing such as quickening rotation speed of the fan, the operating voltage and/or working frequency that reduce CPU to reduce CPU power consumption,
To reach the effect of cooling.If temperature is still higher than threshold value, task is transferred to other kernels to handle or close CPU.By
This, senses the distributed monitoring in real time of temperature realization to kernel 7, so that temperature detection is more accurate and timely using light wave.
Detect the setting and effect with hot mating plate 706, detection detector 707 and the hot mating plate 501 of detection, detection detector 502
It is identical.
It should be noted that in temperature monitoring system 700 according to embodiments of the present invention, light source 701, hot mating plate 702,
The light belt of light network is intercoupled and formed between detector 703 by light, light source 701 can be located on light belt or light belt
Outside.Due in the CPU using light network technology, having been formed with carrying out the light belt of light network between the element in the CPU, because
This, it is possible to use existing light belt forms temperature monitoring system according to embodiments of the present invention in the CPU, for example, hot mating plate
Light in 702 reception CPU on existing light belt or on existing light belt to carry out photothermal deformation and with the place in CPU
Reason device is used as controller 704 etc..So, by forming the temperature according to the present embodiment based on these existing elements and light belt etc.
Monitoring system, can simplify processing procedure and save cost.
Fig. 8 shows the flow chart of radiation cooling method 800 according to embodiments of the present invention.Radiation cooling method 800 passes through
Following step S801 to S804 detects the temperature of temperature control object and carries out cooling processing.The temperature control object can be
Using the kernel in the CPU of light network technology.
In step S801, the incident light sent by light source is received by hot mating plate and optical signal is formed.Wherein, the heat
Mating plate is formed by thermoluminescent material, and is close proximity to the setting of temperature control object, can transmit the temperature of temperature control object.The optical signal is served as reasons
The transmitted light that the hot mating plate is transmitted.
In step S802, the optical signal formed is carried out opto-electronic conversion to obtain electric signal.Step S802 can be with
The electric signal is filtered and the mutually processing such as amplification is locked, to remove the interference signal in the electric signal.
In step S803, the temperature of temperature control object is calculated according to the electric signal obtained.
In step S804, cooling processing is carried out to temperature control object according to the temperature calculated.
Temperature monitoring system according to embodiments of the present invention and method can at least bring following beneficial effect：
1st, the setting of temperature control object is close proximity to, the temperature detected is more accurate.For example, regarding CPU kernel as temperature control pair
As when, temperature monitoring system of the invention is directly integrated into inside CPU and is close proximity to kernel setting, makes detected temperature more
Close to the temperature of kernel in itself.
2nd, the size of the hot mating plate in temperature monitoring system of the invention is micron level, obvious using thermo-optic effect
The response time of silicon or polymer can reach microsecond rank, and temperature change can be detected more in time.
3rd, the allotment of the processing task of multinuclear can be better achieved, the optimization of resource is realized, makes CPU operations efficient, reliably.
4th, with the introducing of multinucleation and light network in novel high-performance CPU so that the cost of implementation of this scheme is greatly
Reduction, benefit can be reflected more clearly.
Claims (12)
1. a kind of temperature monitoring system, it is characterised in that for carrying out monitoring temperature, the temperature at least one temperature control object
Monitoring system includes：
Light source, for sending incident light；
At least one hot mating plate, is formed by thermoluminescent material, and each temperature control object is attached at respectively, and each hot mating plate is used to connect
Receive the incident light and form optical signal；
At least one detector, is correspondingly arranged with the hot mating plate respectively, for detecting the light letter formed by corresponding hot mating plate
Number, and the optical signal detected is carried out opto-electronic conversion to obtain electric signal；
Controller, the temperature for calculating each temperature control object respectively according to the electric signal,
Wherein described temperature control object is the kernel in the central processing unit using light network technology；
Hot mating plate is used in detection, by being formed with the hot mating plate identical thermoluminescent material, is provided separately, is used for the temperature control object
Receive the incident light and form optical signal；
Detection detector, is correspondingly arranged with the detection with hot mating plate, detects what is formed with hot mating plate by described for detecting
Optical signal, and opto-electronic conversion is carried out to obtain electric signal to the optical signal detected,
Wherein, the electric signal that the controller is obtained by the electric signal for obtaining the detection with detector with the detector
Contrasted, to determine the temperature change caused by incident light change；
The controller is additionally operable to carry out the result of detection of the detector with the result of detection of detector using the detection
Correction.
2. temperature monitoring system according to claim 1, it is characterised in that the optical signal is the incident light via institute
State the transmitted light that hot mating plate is transmitted.
3. temperature monitoring system according to claim 1, it is characterised in that the optical signal is the incident light via institute
State the reflected light that hot mating plate is reflected back.
4. temperature monitoring system according to any one of claim 1 to 3, it is characterised in that the temperature monitoring system
Also include beam splitter, the beam splitter is used to the incident light being divided into multi beam, to correspond to each hot mating plate and institute respectively
State detection and use hot mating plate.
5. temperature monitoring system according to any one of claim 1 to 3, it is characterised in that the temperature monitoring system
Also include lenticule, the lenticule is arranged between the light source and the hot mating plate, for converging the incident light.
6. temperature monitoring system according to any one of claim 1 to 3, it is characterised in that the temperature monitoring system
Also include at least one waveguide, the waveguide is arranged between the light source and the hot mating plate, for the incident light to be drawn
It is directed at each hot mating plate.
7. temperature monitoring system according to any one of claim 1 to 3, it is characterised in that the temperature monitoring system
Also include：
Display, the temperature for showing the temperature control object；
Alarm, for when the temperature of the temperature control object is higher than predetermined threshold, sending alarm.
8. temperature monitoring system according to any one of claim 1 to 3, it is characterised in that the hot mating plate is silicon chip,
By growing on the surface of each kernel a layer thickness with the precipitation method, to be 10um to 20um silicon chip form the hot mating plate.
9. a kind of temperature monitoring method, it is characterised in that for carrying out monitoring temperature, the temperature monitoring method to temperature control object
Comprise the following steps：
The incident light sent by light source is received by hot mating plate and optical signal is formed, wherein, the hot mating plate is by thermoluminescent material shape
Into, and it is attached at the temperature control object；
Carry out opto-electronic conversion to the optical signal to obtain electric signal by detector；
The temperature of the temperature control object is calculated according to the electric signal,
Wherein described temperature control object is the kernel in the central processing unit using light network technology；
The incident light that is sent by light source is received with hot mating plate and form optical signal by detecting, wherein, hot mating plate is used in the detection
By being formed with the hot mating plate identical thermoluminescent material, it is provided separately with the temperature control object；
Opto-electronic conversion is carried out to obtain electric signal with the optical signal of hot mating plate formation to the detection with detector by detection,
The electric signal that the electric signal that the detection is obtained with detector is obtained with the detector is contrasted, to determine by institute
State temperature change caused by incident light change；
The result of detection of the detector is corrected with the result of detection of detector using the detection.
10. temperature monitoring method according to claim 9, it is characterised in that the optical signal is saturating by the hot mating plate
The transmitted light of injection or the reflected light being reflected back by the hot mating plate.
11. temperature monitoring method according to claim 9, it is characterised in that also comprise the following steps：To the electric signal
It is filtered and locks phase enhanced processing.
12. temperature monitoring method according to claim 9, it is characterised in that also comprise the following steps：According to the temperature
Cooling processing is carried out to the temperature control object.
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| CN201310073199.6A CN104035853B (en) | 2013-03-07 | 2013-03-07 | Temperature monitoring system and temperature monitoring method |
| PCT/CN2014/072664 WO2014135027A1 (en) | 2013-03-07 | 2014-03-03 | Temperature monitoring system and temperature monitoring method |
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| CN201310073199.6A CN104035853B (en) | 2013-03-07 | 2013-03-07 | Temperature monitoring system and temperature monitoring method |
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| CN104849040A (en) * | 2015-05-17 | 2015-08-19 | 成都诚邦动力测试仪器有限公司 | Gearbox testing system based on phase-locked loop control |
| CN107704358A (en) * | 2017-08-30 | 2018-02-16 | 安徽天达网络科技有限公司 | A kind of temperature monitoring and control system based on computer CPU |
| CN108507620A (en) * | 2018-05-15 | 2018-09-07 | 山东新大陆电力股份有限公司 | A kind of power distribution cabinet temperature intelligent monitoring system |
| CN109933169A (en) * | 2019-02-21 | 2019-06-25 | 深圳康佳电子科技有限公司 | A kind of chip and radiator detection processing method, system and storage medium |
| CN113917072A (en) * | 2021-10-11 | 2022-01-11 | 聚光科技(杭州)股份有限公司 | Detection method based on reaction process control |
| CN117469192B (en) * | 2023-12-28 | 2024-03-01 | 苏州元脑智能科技有限公司 | Fan speed regulation control system, method, equipment and medium based on optical signal transmission |
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| CN101762342A (en) * | 2009-12-28 | 2010-06-30 | 华南师范大学 | Parallel multi-point type optical fiber temperature detection method and sensor |
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| US5052820A (en) * | 1987-06-08 | 1991-10-01 | Electric Power Research Institute, Inc. | Thermal refractive materials for optical sensor application |
| US5021731A (en) * | 1989-02-21 | 1991-06-04 | Metricor, Inc. | Thermo-optical current sensor and thermo-optical current sensing systems |
| US6908227B2 (en) * | 2002-08-23 | 2005-06-21 | Intel Corporation | Apparatus for thermal management of multiple core microprocessors |
| JP4761774B2 (en) * | 2005-01-12 | 2011-08-31 | 東京エレクトロン株式会社 | Temperature / thickness measuring device, temperature / thickness measuring method, temperature / thickness measuring system, control system, control method |
| US7584369B2 (en) * | 2006-07-26 | 2009-09-01 | International Business Machines Corporation | Method and apparatus for monitoring and controlling heat generation in a multi-core processor |
| CN100526821C (en) * | 2006-10-20 | 2009-08-12 | 中山大学 | Thin film type optical fiber temperature sensor and its temperature sensing method |
| CN101630178B (en) * | 2008-07-16 | 2011-11-16 | 中国科学院半导体研究所 | Silicon-based integrated optical vector-matrix multiplier |
| CN201716126U (en) * | 2010-07-27 | 2011-01-19 | 武汉光子科技有限公司 | Semiconductor single thin film reflection interference type optical fiber temperature probe and sensing device thereof |
| CN202710196U (en) * | 2012-08-07 | 2013-01-30 | 深圳供电局有限公司 | Heating temperature difference warning device for closed switch cabinet |
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