CN104035019B - Semiconductor circuit test device and interconnecting module thereof - Google Patents
Semiconductor circuit test device and interconnecting module thereof Download PDFInfo
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- CN104035019B CN104035019B CN201310072496.9A CN201310072496A CN104035019B CN 104035019 B CN104035019 B CN 104035019B CN 201310072496 A CN201310072496 A CN 201310072496A CN 104035019 B CN104035019 B CN 104035019B
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Abstract
The embodiment of the present invention provides a kind of semiconductor circuit test device and interconnecting module thereof, and described interconnecting module is for being electrically connected with base plate and the testing single-board of semiconductor circuit test device.Described base plate has the most several connection interface, at least in order to transmission of control signals.Interconnecting module includes the first electrical pin, the second electrical pin and control module.First and second electrical pin is respectively coupled to base plate and testing single-board, and first and second electrical pin has different hardware specifications.Control module is controlled by Semiconductor control signals to drive the test program on testing single-board, and by test program by can the first instruction format of tested veneer identification, being converted into can be by the second instruction format of semiconductor circuit test device identification.Thereby, the interconnecting module that the embodiment of the present invention provides can drive the testing single-board of different size.
Description
Technical field
The present invention is about a kind of semiconductor circuit test device and interconnecting module thereof, especially with regard to a kind of difference of transferring
The semiconductor circuit test device of the testing single-board of specification and interconnecting module thereof.
Background technology
Along with the progress of science and technology, the function of semiconductor circuit is maked rapid progress too, and the function carried is more and more various
Change.Traditionally, semiconductor circuit is before dispatching from the factory, often through a series of test program, to determine in semiconductor circuit
Various functions is the most normal.Described a series of test program generally can be through performing by one or more test device, and institute
State test device measure semiconductor circuit to be measured with can be used to batch.In general, test device can an external computer or
Other persons of being adapted in use to of person input the equipment of instruction, user set the project of test, the parameter of test or other tests
The details of program.Test device is controlled by described computer and performs corresponding test program, and returns the merit in semiconductor circuit
Can be the most normal.
Traditionally, can have some testing single-boards in test device, each testing single-board can perform the test preset
Program, test device is by starting corresponding testing single-board to test semiconductor circuit.But, the test list that Ge Jia manufacturer manufactures
Plate mostly can not be general, and reason is hardware specification and the instruction format difference driving firmware.When user is intended to use different factory
When the test device that business manufactures and testing single-board, generally require external switching cabinet.But, the long-pending Pang of external switching machine casing
Greatly, and not necessarily compatible with test device, use and not convenient.If additionally, user does not purchase switching cabinet, just needing into
That overlaps buys the test device with manufacturer and testing single-board, lacks the elasticity of unrestricted choice.Therefore, industry needs one partly to lead
Body circuit test device and interconnecting module thereof, on the testing single-board of different size can directly directly be transferred by described interconnecting module
Semiconductor circuit test device, thus exempt the inconvenience using switching cabinet.
Summary of the invention
In view of this, the invention reside in proposition a kind of semiconductor circuit test device, there is pluggable interconnecting module, and
Control the testing single-board of different size through described interconnecting module, promote the user facility when testing semiconductor circuit to be measured
Property.
The embodiment of the present invention provides a kind of semiconductor circuit test device, and described semiconductor circuit test device is optionally
Connecting test veneer, testing single-board stores test program.Described semiconductor circuit test device includes base plate (backplane
And interconnecting module board).Described base plate has the most several connection interface, at least in order to transmit a control signal.Described turn
Connection module includes the first electrical pin, the second electrical pin and control module.First electrical pin is in order to optionally to couple
Base plate, the second electrical pin is in order to optionally to couple testing single-board, and the first electrical pin and the second electrical pin have different
Hardware specification.Control module couples base plate and testing single-board, is controlled by described control signal to drive the survey on testing single-board
Examination program, and by test program by can the first instruction format of tested veneer identification, be converted into and can be tested by semiconductor circuit
Second instruction format of device identification.
In the present invention one example embodiment, interconnecting module has more substrate, and substrate definition has upper surface, lower surface, with
And the outer peripheral edge side adjacent with upper and lower surface, the first electrical pin is arranged on side, described outer peripheral edge.Additionally,
The upper surface of substrate is formed with sunk structure, and sunk structure is in order to accommodating testing single-board, and the sidewall of sunk structure is defined as base
The inner peripheral side of plate, the second electrical pin is arranged on described inner peripheral side.
Additionally, the invention reside in a kind of interconnecting module of proposition, described interconnecting module is pluggable is installed in semiconductor circuit
In test device so that semiconductor circuit test device can control the testing single-board of different size through described interconnecting module, carries
Rise the user convenience when testing semiconductor circuit to be measured.
The embodiment of the present invention provides a kind of interconnecting module, and described interconnecting module is for being optionally electrically connected with semi-conductor electricity
Drive test electricity testing device and testing single-board.Semiconductor circuit test device has base plate, and testing single-board stores test program.Described
Interconnecting module includes the first electrical pin, the second electrical pin and control module.First electrical pin is in order to optionally coupling
Connecing base plate, the second electrical pin is in order to optionally to couple testing single-board, and the first electrical pin and the second electrical pin have not
Same hardware specification.Control module couples base plate and testing single-board, is controlled by a control signal to drive on testing single-board
Test program, and by test program by can the first instruction format of tested veneer identification, being converted into can be by semi-conductor electricity drive test
Second instruction format of electricity testing device identification.
In sum, the embodiment of the present invention provides semiconductor circuit test device and interconnecting module thereof are not necessary to use external
Switching cabinet, save arrange switching cabinet space.Additionally, described interconnecting module can change different instruction format, make
Obtain semiconductor circuit test device and can directly control the testing single-board that different vendor manufactures.It addition, the survey that different vendor manufactures
Examination veneer can be connected to interconnecting module, and is set directly in semiconductor circuit test device, promotes the operation of user just
Profit.Because user need not set of purchase and tests device and testing single-board, the present invention with the semiconductor circuit of manufacturer
The semiconductor circuit test device of embodiment offer and interconnecting module thereof more improve the bullet of user unrestricted choice testing single-board
Property.
It is further understood that inventive feature and technology contents for enabling, refers to below in connection with the present invention specifically
Bright and accompanying drawing, but these explanations are only used for institute's accompanying drawings the present invention is described, rather than the interest field of the present invention is made any
Restriction.
Accompanying drawing explanation
Fig. 1 illustrates the schematic perspective view of the interconnecting module according to the present invention one example embodiment.
Fig. 2 illustrates the schematic perspective view of the semiconductor circuit test device according to the present invention one example embodiment.
Fig. 3 illustrates the functional block diagram of the semiconductor circuit test device according to the present invention one example embodiment.
[symbol description]
1: interconnecting module
10: substrate
10a: upper surface
10b: lower surface
10c: side, outer peripheral edge
102: sunk structure
102a: inner peripheral side
12: the first electrical pins
14: the second electrical pins
16: control module
18: the three electrical pins
20: switch element
162: transformator
3: semiconductor circuit test device
30: base plate
32: cell body
4: testing single-board
5: support plate
6: semiconductor circuit to be measured
Detailed description of the invention
Refer to Fig. 1, Fig. 1 and illustrate the schematic perspective view of the interconnecting module according to the present invention one example embodiment.Such as Fig. 1 institute
Showing, interconnecting module 1 has the electrical pin of substrate 10, first 12, second electrical pin 14, the electrical pin of control module the 16, the 3rd
18 and switch element 20.Substrate 10 has upper surface 10a, lower surface 10b and side, outer peripheral edge 10c, side, outer peripheral edge 10c
Adjacent with upper surface 10a and lower surface 10b respectively.In an example, substrate 10 is a rectangular thin plate, upper surface 10a
It is parallel to lower surface 10b, and side, outer peripheral edge 10c is perpendicular to upper surface 10a and lower surface 10b.As shown in Figure 1, switching model
Side, the outer peripheral edge 10c of block 1 refers to the side outside substrate 10, and the present embodiment is not limiting as the first electrical pin 12 and is provided in base
Long side outside plate 10 or short side, can unrestricted choice in person of ordinary skill in the field.
Additionally, the substrate 10 that Fig. 1 illustrates carries the first electrical electrical pin 14 of pin 12, second, control module the 16, the 3rd
Electrically pin 18 and switch element 20, but the present invention is not limiting as component kind or the quantity of substrate 10 carrying.Citing comes
Saying, substrate 10 more may be used to carry plural switch element 20 or other suitable elements.Although note that Fig. 1 is also
Do not illustrate the electrical connection between each element, but control module 16 at least can be electrically connected with the first electrical pin
12, the second electrical electrical pin 18 of pin the 14, the 3rd and switch element 20.
Continuing with seeing Fig. 1, the upper surface 10a of substrate 10 is formed with sunk structure 102, and sunk structure 102 is in order to accommodating
Testing single-board (is not illustrated in Fig. 1).In practice, described testing single-board at least stores a test program, works as testing single-board
Driven and when starting, described test program can be used to test semiconductor circuit to be measured (not being illustrated in Fig. 1).Here, depression
Structure 102 is depressed in upper surface 10a to I haven't seen you for ages, and described testing single-board can be placed in sunk structure 102.The present embodiment does not limits
Testing single-board processed must be completely placed in sunk structure 102, and in other words, sunk structure 102 can also only house part
Testing single-board.
In an example, sunk structure 102 can be defined as a hollow space of substrate 10, i.e. sunk structure 102
It is through to lower surface 10b from the upper surface 10a of substrate 10.As shown in Figure 1, the sidewall of sunk structure 102 may be defined as substrate 10
Inner peripheral side 102a, and inner peripheral side 102a and aforesaid outer peripheral edge side 10c are not continuous print side.Here, the
Two electrical pins 14 are arranged on the 102a of inner peripheral side, and the first electrical pin 12 has different from the second electrical pin 14
Hardware specification.For example, the first electrical pin 12 is used to optionally be electrically connected with the end of semiconductor circuit test device
Plate (backplane board) (not being illustrated in Fig. 1).Described base plate has the most several connection interface, at least can transmit a control
Signal processed, and the first electrical pin 12 can be electrically connected with on base plate the most several connection interfaces one of them.Second electrical pin 14
Should be optionally to couple the testing single-board manufactured by different vendor.Therefore, the first electrical pin 12 is connected interface tool with described
There is same hardware specification, and the default hardware specification of manufacturer that corresponding can manufacture semiconductor circuit test device is (the most special
, non-common specification).The hardware specification of the testing single-board that the second electrical pin 14 can corresponding be transferred, such as PXI,
The hardware specifications such as PCI, PXI-e or PCI-e.Certainly, the present embodiment is not intended to the first electrical pin 12 and is electrically connected with second at this
Hardware specification corresponding to foot 14, as long as the first electrical pin 12 is different, i.e. with the hardware specification of the second electrical pin 14
Belong to the category disclosed in the embodiment of the present invention.
The base plate of control module 16 coupling semiconductor circuit test device and testing single-board.Additionally, control module 16 is controlled
In semiconductor circuit test device to drive the test program on testing single-board, and by test program by can tested veneer identification
The first instruction format, be converted into can by semiconductor circuit test device identification the second instruction format.In practice, control mould
Block 16 can be preset with a function library, the instruction lattice that described function library the most common predeterminable testing single-board is applied
Formula.Thus when the connected upper interconnecting module 1 of the testing single-board of different vendor, control module 16 can be with Fast Identification testing single-board
Type, and call out be suitable for control described testing single-board function.Thereby, control module 16 just can be by various different tests
The instruction format of veneer is integrated into one can be by the instruction format of semiconductor circuit test device identification so that user can descend to refer to
Make and test device to semiconductor circuit, and directly drive or control testing single-board.From the perspective of practical operation, interconnecting module
1 can integrate third-party testing single-board, and third-party testing single-board is converted into one of semiconductor circuit test device
Point so that the process of test is more rapid, be easier to operate to.
Although note that the present embodiment depicts control module 16 can be a wafer, and is arranged on interconnecting module 1
On substrate 10.But, actually control module 16 can also be disconnected from each other with substrate 10.For example, control module 16 also may be used
To be the equipment being arranged on outside semiconductor circuit test device, and couple base plate and testing single-board by cable.Accordingly,
As long as there being an electronic component can change conversion instruction form between semiconductor circuit test device and testing single-board, all should
Belong to the category of control module 16 disclosed in the present embodiment.
Continuing with seeing Fig. 1, side, the outer peripheral edge 10c of substrate 10 more can have the 3rd electrical pin 18, the 3rd is electrical
Pin 18 is in order to couple support plate (load board) (not being illustrated in Fig. 1), and can be provided with at least one on support plate and to be measured partly lead
Body circuit (is not illustrated in Fig. 1).For example, the 3rd electrical pin 18 can have the probe of the most several protrusion, and described many
The metallic conduction sheet that individual probe can directly be resisted against on support plate so that interconnecting module 1 can be electrically connected with through support plate and to be measured partly lead
Body circuit.Here, the present embodiment is not intended to the coupling mode of the 3rd electrical pin 18 and support plate, those of skill in the art
Member can freely design.
On the other hand, interconnecting module 1 more can have at least one switch element 20, and switch element 20 is defeated in order to choose whether
Go out the signal in interconnecting module 1 to semiconductor circuit to be measured.In an example, switch element 20 can be relay or its
The element that he is suitable.In practice, owing to a support plate can be simultaneously connected with the interconnecting module 1 of many or is not necessary to the survey of switching
Examination veneer, is electrically connected with these interconnecting modules 1 simultaneously and may make the test result of semiconductor circuit to be measured with testing single-board
Become interference.Accordingly, if the test program corresponding to interconnecting module 1 is not performed, then user can be by controlling switch element
20 to cut off the electric connection of interconnecting module 1 and semiconductor circuit to be measured, to avoid the test result of semiconductor circuit to be measured to be subject to
Circuit or the interference of different test programs to redundancy.
It is each that semiconductor circuit in order to make this person of ordinary skill in the field be easier to understand the present invention tests device
Mutual relation between element, please also refer to Fig. 1 and Fig. 2.Fig. 2 illustrates the semi-conductor electricity according to the present invention one example embodiment
The schematic perspective view of drive test electricity testing device.As it can be seen, semiconductor circuit test device 3 is optionally through interconnecting module 1 electricity
Property connecting test veneer 4, semiconductor circuit test device 3 there is base plate 30 and at least one pluggable interconnecting module 1.Figure
Interconnecting module 1 depicted in 2 is generally identical with Fig. 1, and the present embodiment does not repeats them here.As shown in Figure 2, on base plate 30
Should have at least one and corresponding with the first electrical pin 12 connect interface (not illustrating) so that the first of interconnecting module 1 is electrical
Pin 12 can be plugged on one of them one to one and connect on interface.It is electrically connected with additionally, testing single-board 4 also should have one second
The corresponding slot of foot 14 or plug so that testing single-board 4 can couple interconnecting module 1.
In practice, semiconductor circuit test device 3 can be electrically connected with the computer of an outside, and user can be by operation
Described computer, to export described control signal, thereby controls semiconductor circuit test device 3.It is to say, described computer is permissible
Being preset with set of system program, described system program is can be by the second instruction format of semiconductor circuit test device 3 identification, can
It is used for calling the testing single-board 4 being embedded on interconnecting module 1.Then, by the letter preset in the control module 16 of interconnecting module 1
Number storehouses, dynamically change described second instruction format become can the first instruction format of tested veneer 4 identification, allow testing single-board
4 can advantageously be controlled by user.
Continuing with seeing Fig. 2, semiconductor circuit test device 3 has the cell body 32 of an accommodating interconnecting module 1, and transfers
The electrical pin 18 of the 3rd of module 1 is exposed to the opening part of cell body 32 so that the 3rd electrical pin 18 is suitable to be electrically connected with support plate.
Generally, the thickness of testing single-board 4 is suitable with substrate 10 thickness of interconnecting module 1 so that testing single-board 4 is contained in sunk structure
When 102, testing single-board 4 will not protrude from the upper surface 10a and lower surface 10b of substrate 10.
In order to make this person of ordinary skill in the field be easier to understand semiconductor circuit test device, support plate and treat
Survey the relation of semiconductor circuit, please also refer to Fig. 2 and Fig. 3.Fig. 3 illustrates the semi-conductor electricity according to the present invention one example embodiment
The functional block diagram of drive test electricity testing device.As it can be seen, semiconductor circuit test device 3 has base plate 30 and is plugged on base plate 30
On interconnecting module 1.Owing to the 3rd electrical pin 18 of interconnecting module 1 is exposed to cell body 32 so that support plate 5 can coupling easily
Connect each interconnecting module 1 (or other are not necessary to the testing single-board of switching), and to be measured half more than on support plate 5, can be coupled
Conductor circuit 6.In practice, support plate 5 can distribute the interconnecting module 1 specified to the semiconductor circuit to be measured 6 specified so that no
Same semiconductor circuit to be measured 6 can perform test program simultaneously.Specifically, different semiconductor circuits to be measured 6 can be same
Mono-identical test program of Shi Zhihang (corresponding same interconnecting module 1 or be not necessary to the testing single-board of switching), or permissible
Perform different test program (corresponding different interconnecting module 1 or be not necessary to the testing single-board of switching) simultaneously.Accordingly, the present embodiment
Semiconductor circuit test device 3 can the plural semiconductor circuit 6 to be measured of many field testings, to accelerate testing process.
In sum, the embodiment of the present invention provides semiconductor circuit test device and interconnecting module thereof are not necessary to use external
Switching cabinet, save arrange switching cabinet space.Additionally, described interconnecting module can change different instruction format, make
Obtain semiconductor circuit test device and can directly control the testing single-board that different vendor manufactures.It addition, the survey that different vendor manufactures
Examination veneer can be connected to interconnecting module, and is set directly in semiconductor circuit test device, promotes the operation of user just
Profit.Because user need not set of purchase and tests device and testing single-board, the present invention with the semiconductor circuit of manufacturer
The semiconductor circuit test device of embodiment offer and interconnecting module thereof more improve the bullet of user unrestricted choice testing single-board
Property.
By the above detailed description of preferred embodiments, it would be desirable to more clearly describe inventive feature and spirit, and
Not with above-mentioned disclosed preferred embodiment, scope of the invention is any limitation as.On the contrary, its objective is to wish
Can contain in the category being arranged in the scope of the claims that the present invention to be applied for of various change and tool equality.
Claims (10)
1. a semiconductor circuit test device, is optionally electrically connected with a testing single-board, and this testing single-board stores a survey
Examination program, it is characterised in that this semiconductor circuit test device includes:
One base plate, has the most several connection interface, at least in order to transmit a control signal；And
At least one interconnecting module, including:
One first electrical pin, in order to optionally couple those connect interfaces one of them；
One second electrical pin, in order to optionally to couple this testing single-board, this first electrical pin and this second electrical pin
There is different hardware specifications；And
One control module, couples this base plate and this testing single-board, is controlled by this control signal to drive being somebody's turn to do on this testing single-board
Test program, and by this test program by by one first instruction format of this testing single-board identification, be converted into by this semi-conductor electricity
One second instruction format of drive test electricity testing device identification.
2. semiconductor circuit test device as claimed in claim 1, it is characterised in that this interconnecting module has more a substrate,
The definition of this substrate has a upper surface, a lower surface, and an outer peripheral edge side adjacent with this upper surface and this lower surface, should
First electrical pin is arranged on this side, outer peripheral edge.
3. semiconductor circuit test device as claimed in claim 2, it is characterised in that this upper surface of this substrate is formed with
Sunk structure, this sunk structure is in order to this testing single-board accommodating, and the sidewall of this sunk structure is defined as an inner circumferential of this substrate
Edge side, this second electrical pin is arranged on this inner peripheral side.
4. semiconductor circuit test device as claimed in claim 3, it is characterised in that this sunk structure is on this of this substrate
Surface is through to this lower surface.
5. semiconductor circuit test device as claimed in claim 3, it is characterised in that this interconnecting module further includes one the 3rd electricity
Property pin, the 3rd electrical pin, in order to couple a support plate, this support plate is provided with at least one semiconductor circuit to be measured.
6. an interconnecting module, is used for being selectively connected semiconductor circuit test device and a testing single-board, and this is partly led
Body circuit test device has a base plate, and this base plate has the most several connection interface, at least in order to transmit a control signal, and this survey
Examination veneer stores a test program, it is characterised in that this interconnecting module includes:
One first electrical pin, in order to optionally couple those connect interfaces one of them；
One second electrical pin, in order to optionally to couple this testing single-board, this first electrical pin and this second electrical pin
There is different hardware specifications；And
One control module, couples this base plate and this testing single-board, is controlled by this control signal to drive being somebody's turn to do on this testing single-board
Test program, and by this test program by by one first instruction format of this testing single-board identification, be converted into by this semi-conductor electricity
One second instruction format of drive test electricity testing device identification.
7. interconnecting module as claimed in claim 6, it is characterised in that have more a substrate, the definition of this substrate have a upper surface,
A lower surface, and an outer peripheral edge side adjacent with this upper surface and this lower surface, this first electrical pin is arranged on this
On side, outer peripheral edge.
8. interconnecting module as claimed in claim 7, it is characterised in that this upper surface of this substrate is formed with a sunk structure,
This sunk structure is in order to this testing single-board accommodating, and the sidewall of this sunk structure is defined as an inner peripheral side of this substrate, should
Second electrical pin is arranged on this inner peripheral side.
9. interconnecting module as claimed in claim 8, it is characterised in that this sunk structure is through to from this upper surface of this substrate
This lower surface.
10. interconnecting module as claimed in claim 8, it is characterised in that further including one the 3rd electrical pin, the 3rd is electrically connected with
Foot, in order to couple a support plate, this support plate is provided with at least one semiconductor circuit to be measured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310072496.9A CN104035019B (en) | 2013-03-07 | 2013-03-07 | Semiconductor circuit test device and interconnecting module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310072496.9A CN104035019B (en) | 2013-03-07 | 2013-03-07 | Semiconductor circuit test device and interconnecting module thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104035019A CN104035019A (en) | 2014-09-10 |
| CN104035019B true CN104035019B (en) | 2016-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310072496.9A Active CN104035019B (en) | 2013-03-07 | 2013-03-07 | Semiconductor circuit test device and interconnecting module thereof |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113406463A (en) * | 2020-03-16 | 2021-09-17 | 苏州明皜传感科技有限公司 | Semiconductor finished product modularization testing arrangement |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5532612A (en) * | 1994-07-19 | 1996-07-02 | Liang; Louis H. | Methods and apparatus for test and burn-in of integrated circuit devices |
| CN2438174Y (en) * | 2000-08-08 | 2001-07-04 | 华硕电脑股份有限公司 | Test tool switching device |
| CN1321892A (en) * | 2000-04-14 | 2001-11-14 | 株式会社鼎新 | Specific purpose semiconductor memory testing system based on event |
| CN1354503A (en) * | 2000-11-22 | 2002-06-19 | 三菱电机株式会社 | Testing device and method for semiconductor integrated circuit |
-
2013
- 2013-03-07 CN CN201310072496.9A patent/CN104035019B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5532612A (en) * | 1994-07-19 | 1996-07-02 | Liang; Louis H. | Methods and apparatus for test and burn-in of integrated circuit devices |
| CN1321892A (en) * | 2000-04-14 | 2001-11-14 | 株式会社鼎新 | Specific purpose semiconductor memory testing system based on event |
| CN2438174Y (en) * | 2000-08-08 | 2001-07-04 | 华硕电脑股份有限公司 | Test tool switching device |
| CN1354503A (en) * | 2000-11-22 | 2002-06-19 | 三菱电机株式会社 | Testing device and method for semiconductor integrated circuit |
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| CN104035019A (en) | 2014-09-10 |
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