CN103974564B - The production method and PCB coaxial cables of PCB coaxial cables - Google Patents
The production method and PCB coaxial cables of PCB coaxial cables Download PDFInfo
- Publication number
- CN103974564B CN103974564B CN201310027419.1A CN201310027419A CN103974564B CN 103974564 B CN103974564 B CN 103974564B CN 201310027419 A CN201310027419 A CN 201310027419A CN 103974564 B CN103974564 B CN 103974564B
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- dielectric layer
- groove
- core wire
- metal
- metal foil
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 134
- 229910052751 metal Inorganic materials 0.000 claims abstract description 134
- 238000005530 etching Methods 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000011888 foil Substances 0.000 claims description 60
- 239000000758 substrate Substances 0.000 claims description 34
- 238000007747 plating Methods 0.000 claims description 19
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 3
- 239000010931 gold Substances 0.000 claims 3
- 229910052737 gold Inorganic materials 0.000 claims 3
- 238000003754 machining Methods 0.000 abstract description 3
- 238000001465 metallisation Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
- 238000004826 seaming Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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Abstract
The present invention provides a kind of production method of PCB coaxial cables and PCB coaxial cables, including：The dielectric layer of package core wire is made, and is produced on the two linear metal connectors for being located at the core wire both sides in the dielectric layer；Wherein, the metal connector and the core wire are without intersecting；From the surface etching of the dielectric layer, at least two grooves of exposed described two metal connectors are formed；Wherein, in dielectric layer of the core wire between the groove；The dielectric layer surface to metallize between the groove and the groove forms the metal screen layer for wrapping up the dielectric layer between the groove, obtains PCB coaxial cables.Due to using the technique for etching dielectric layer between two grooves, filling groove and metallized groove in dielectric layer, can it is simple, metal screen layer is quickly formed around core wire, obtain the coaxial cable with shielded layer.Compared with prior art, technique is few, high in machining efficiency.
Description
Technical field
The present invention relates to PCB production fields, coaxial in particular to the production method and PCB of a kind of PCB coaxial cables
Cable.
Background technology
In the fields PCB, need to transmit signal using coaxial cable.In the outer surface of coaxial cable, coated metal foil, with screen
Cover the interference of outer signals.
The prior art is during making coaxial cable, using the groove for first making metallization, be subsequently filled core wire and
The mode of insulator forms coaxial cable in the groove of metallization.After multiple metallization and repeatedly filling, wrapped up
The coaxial cable of metal foil.This manufacturing process needs repeatedly to fill, and processing step is cumbersome, and producing efficiency is relatively low.
Invention content
It is above-mentioned coaxial to solve the present invention is intended to provide the production method and PCB coaxial cables of a kind of PCB coaxial cables
The manufacturing process technique of cable is cumbersome, the low problem of producing efficiency.
The present invention provides a kind of production methods of PCB coaxial cables, including：
The dielectric layer of package core wire is made, and is produced on linear two for being located at the core wire both sides in the dielectric layer
A metal connector；Wherein, it is formed in plane projection in PCB, the metal connector and the core wire are without intersecting；
From the surface etching of the dielectric layer, at least two grooves of exposed described two metal connectors are formed；Wherein,
The core wire is in the dielectric layer between the groove；
The dielectric layer surface to metallize between the groove and the groove forms the medium wrapped up between the groove
The metal screen layer of layer, obtains PCB coaxial cables.
The present invention also provides a kind of production methods of PCB coaxial cables, including：
On the surface of metal foil substrate, the dielectric layer of package core wire is made；
From the surface etching of the dielectric layer, two grooves of the exposed metal foil are formed；Wherein, the core wire is in institute
It states between two grooves in dielectric layer；
The dielectric layer surface to metallize between the groove and the groove forms the medium wrapped up between the groove
The metal screen layer of layer, obtains PCB coaxial cables.
The present invention also provides a kind of PCB coaxial cables, include the dielectric layer of core wire and package core wire, further include：
The linear metal connector of the core wire both sides, and the groove that is communicated with the metal connector and the dielectric layer surface,
Dielectric layer surface between the groove and groove covers metal, forms the metallic shield for wrapping up the dielectric layer between the groove
Layer.
The present invention also provides the dielectric layers and the medium of a kind of PCB coaxial cables, including core wire and package core wire
The metal foil substrate of layer side, the core wire both sides are at least each there are one groove, are connected to metal foil substrate and the dielectric layer
The other side；Dielectric layer surface between the groove and groove covers metal, is formed and wraps up the dielectric layer between the groove
Metal screen layer.
The present invention is due to using the dielectric layer between two grooves of dielectric layer etching, filling groove and metallized groove
Technique, can it is simple, metal screen layer is quickly formed around core wire, obtain the coaxial cable with shielded layer.With it is existing
Technology is compared, and technique is few, high in machining efficiency.
Description of the drawings
Attached drawing described herein is used to provide further understanding of the present invention, and is constituted part of this application, this hair
Bright illustrative embodiments and their description are not constituted improper limitations of the present invention for explaining the present invention.In the accompanying drawings：
Fig. 1 shows the flow chart of embodiment；
Fig. 2 shows the schematic cross-sections for forming core wire and metal connector in embodiment in the dielectric layer；
Fig. 3 shows the schematic diagram that metal connector L is fabricated into dielectric layer bottom in embodiment；
Fig. 4 A show in embodiment from dielectric layer surface open up groove after schematic cross-section；
Fig. 4 B are shown in embodiment obtains the schematic cross-section of shielded layer after metallization；
The schematic cross-section of etching core wire and metal connector between Fig. 5 is shown in embodiment in the dielectric layer；
Fig. 6 shows the schematic cross-section pressed in embodiment after dielectric layer；
Fig. 7 is shown in embodiment from the schematic cross-section after obverse and reverse sides etched recesses；
Fig. 8 shows the schematic cross-section after metallized groove in embodiment；
Fig. 9 shows the metal foil substrate selected in embodiment；
Figure 10 shows that embodiment processes the schematic cross-section of core wire and metal connector in metal foil substrate；
Figure 11 shows the schematic cross-section after embodiment pressing dielectric layer and metal foil；
Figure 12 is shown in embodiment opens up the schematic cross-section of the opening of groove in two metal foil surfaces；
Figure 13 shows the schematic cross-section after opening up groove in embodiment；
Figure 14 is shown in embodiment in the schematic cross-section of PCB coaxial cable electroplating surface metal layers S2；
Figure 15 shows the schematic cross-section of coaxial cable after etching in embodiment；
Figure 16 is shown in embodiment in the schematic cross-section of processing double wired conductor；
Figure 17 shows the schematic cross-sections of the coaxial cable of double wired conductor in embodiment；
Figure 18 shows that double wired conductor in embodiment forms the front schematic view of criss-cross coaxial cable；
Figure 19 shows the front schematic view after the PCB metallized grooves of Figure 18 in embodiment；
Figure 20 shows the flow chart of another embodiment；
Figure 21 shows the schematic cross-section for making core wire in embodiment on one-sided metallic foil substrate；
Figure 22 shows the schematic cross-section after opening up groove in embodiment；
Figure 23 shows the schematic cross-section after embodiment metallized groove；
Figure 24 shows the schematic cross-section that core wire is formed in the dielectric layer in embodiment between two-side metal foil；
Figure 25 shows the schematic cross-section that the PCB of Figure 24 is opened up to groove in embodiment.
Specific implementation mode
It is below with reference to the accompanying drawings and in conjunction with the embodiments, next that the present invention will be described in detail.The flow of embodiment shown in Figure 1
Figure, includes the following steps：
S11：The dielectric layer of package core wire is made, and is produced in the dielectric layer positioned at the linear of the core wire both sides
Two metal connectors；Wherein, it is formed in plane projection in PCB, the metal connector and the core wire are without intersecting；
S12：From the surface etching of the dielectric layer, at least two grooves of exposed described two metal connectors are formed；
Wherein, in dielectric layer of the core wire between the groove；
S13：The dielectric layer surface to metallize between the groove and the groove is formed between wrapping up the groove
The metal screen layer of dielectric layer obtains PCB coaxial cables.
In above-described embodiment, due to being situated between using between two grooves of dielectric layer etching, filling groove and metallized groove
The technique of matter layer, can it is simple, metal screen layer is quickly formed around core wire, obtain the coaxial cable with shielded layer.
Compared with prior art, technique is few, high in machining efficiency.
Preferably, the coaxial cable in single substrate making embodiment can be used.Single substrate is with a face dielectric layer
With the PCB of one layer of metal foil.Single substrate etch core wire K on one side after, surface makes the dielectric layer of covering core wire K,
The dielectric layer surface stamped metal layer of another side, for making subsequent metal connector L.Form structure as shown in Figure 2.
Metal layer for making connector L is etched, two metal connector L are etched.Etching metal
After connector L, cladding thickness is no more than the dielectric layer of metal connector L thickness, forms structure as shown in Figure 3.
Double-sided substrate making also can be used, single side figure, that is, core section K is first made on substrate, then apply in core wire side
One layer of prepreg of cloth resin layer or compacting, forms structure as indicated with 2, then carry out graphic making and go out connector L, is etching
After metal connector L, cladding thickness is no more than the dielectric layer of metal connector L thickness, forms structure as shown in Figure 3.
Certainly, other than both techniques, metal connector L can be also embedded into dielectric layer there are many implementation,
Exposed surface, or embedded a part of depth, exposed another part.
During processing groove, two grooves can be gone out by laser-induced thermal etching, as shown in Figure 4 A.
After two excess metals, the shielded layer of the dielectric layer between package groove is formed.As shown in Figure 4 B.
In another embodiment, core wire K and metal connector L can be located at the centre position of dielectric layer simultaneously.
Can core wire K and metal connector L be formed in the centre position of dielectric layer in the following manner.
Referring to Fig. 5, the core wire and the metal connector are etched in the metal foil of single substrate surface；
The dielectric layer of the core wire and the metal connector is covered in single substrate surface compacting.Form such as Fig. 6
Shown in dielectric layer centre position formed core wire K and metal connector L structure.
Preferably, in embodiment, the process for forming groove includes：
The obverse and reverse sides of single substrate after the pressing medium layer go out as shown in Figure 7 four using laser-induced thermal etching
Groove.Then, after the dielectric layer surface between metallized groove and groove, PCB coaxial cables as shown in Figure 8 are formed.
It in another embodiment, can also be in metal foil substrate other than making PCB coaxial cables on single substrate
Upper making PCB coaxial cables.In this way, in etched recesses, laser-induced thermal etching both may be used, it can also using plasma
(PLASMA) it etches.In the etching process of plasma, the dielectric layer except groove needs the protection of metal foil.Although increasing
The technique for making metal foil, but the time of the etched recesses of plasma be less than the time of laser-induced thermal etching, can still improve system
Make the efficiency of PCB coaxial cables.
Preferably, metal foil substrate manufacture PCB coaxial cables also can be used, referring to Fig. 9, select two-side metal foil
Substrate.Manufacturing process is as follows：
Referring to Figure 10, core wire K and metal connector L are etched in one side metal foil surface.
Referring to Figure 11, in core wire surface blanket dielectric layer and metal foil, forming obverse and reverse sides has the substrate of metal foil.
Referring to Figure 12, the position according to the groove and width, in the metal foil S1 surface etchings of the obverse and reverse sides,
Exposed dielectric layer.
Referring to Figure 13, according to the position of the groove, using plasma or the exposed dielectric layer of laser-induced thermal etching form four
A groove.
Referring to Figure 14, metallized groove, meanwhile, it is coaxial that the groove of metallization and the metal foil S1 of substrate surface form PCB
The metal screen layer of cable.
Preferably, after the groove of metallization is merged with metal foil S1, in the position being in contact, there can be coarse connection not
Close seam.In order to eliminate the rough surface of these seaming positions, further include, positive and negative the two of the PCB coaxial cables
Face, plating metal foil S2.
For the PCB coaxial cables in Fig. 4 in embodiment or Fig. 8, one layer of metal foil of re-plating can also be distinguished on two sides,
Form PCB coaxial cables as shown in figure 14.
Preferably, according to the interval between groove, coaxial cable is etched, it is coaxial to form PCB as shown in figure 15
Cable.
Preferably, in above-described embodiment, the quantity of the core wire is one or more；It, both can phase between a plurality of core wire
Mutually parallel, there may also be joints, can also either way have.
By the method for the above embodiments, PCB coaxial cables are obtained, including：The dielectric layer of core wire and package core wire, into
One step includes：The linear metal connector of the core wire both sides, and with the metal connector and the dielectric layer surface phase
Logical groove, the dielectric layer surface between the groove and groove cover metal, form the dielectric layer wrapped up between the groove
Metal screen layer.
As shown in Figure 16, Figure 17, during etching core wire, two core wires being mutually parallel are etched.
Referring to Figure 18, the core wire K of etching is two and intersects the core wire with joint.To form one of signal transmission
Input, the transfer mode of multiple outputs.It is of course also possible to be the core wire of three intersections, there are two the figures of joint for the tool of formation
Shape, such as a horizontal core wire and two vertical core wires form two joints, have the endpoint of 6 core wires in this way, can be formed
One input, five outputs.
After core wire in Figure 18 completes, blanket dielectric layer is formed after opening up groove and metallizing shown in Figure 19
Figure, surface are shielded layer S1.
In the above embodiments, manufacturing process is simple, and obtained PCB coaxial cables yields is high.In the above embodiments
Using the form of setting metal connector, groove is opened up, this mode is beneficial to the deeper PCB of depth of groove, since metal connects
The presence of junctor, can be from obverse and reverse sides towards metal connector etched recesses.For shallower groove, following reality can also be used
It applies example and makes PCB coaxial cables.
Referring to Figure 20, which includes the following steps：
S21：On the surface of metal foil substrate, the dielectric layer of package core wire is made；
S22：From the surface etching of the dielectric layer, two grooves of the exposed metal foil are formed；Wherein, the core wire
Between described two grooves in dielectric layer；
S23：The dielectric layer surface to metallize between the groove and the groove is formed between wrapping up the groove
The metal screen layer of dielectric layer obtains PCB coaxial cables.
Using the step in the embodiment, it can be achieved that not etching metal connector, also can etched recesses, make PCB it is coaxial
Cable reduces technical process, improves producing efficiency.
It is given an account of using laser-induced thermal etching on the surface of dielectric layer after the dielectric layer for making package core wire referring to Figure 21
The surface of matter layer forms two grooves as described in Figure 22；
Dielectric layer between metallized groove and plating trenches forms PCB coaxial cables shown in Figure 23.
To improve the efficiency of etched recesses, plasma etching groove also can be used, but need as in embodiment above-mentioned
Scheme, the metal foil protective dielectric layer for increasing plating is not damaged in plasma etch process.
Referring to Figure 24, after the dielectric layer for making package core wire, in the dielectric layer surface, plating metal foil；It is formed double
There is the substrate of metal foil in face.
Position according to the groove and width etch, exposed dielectric layer in the metal foil surface of the plating；
According to the position of the groove, using plasma or laser-induced thermal etching go out the groove, obtain recessed shown in Figure 25
Slot.Then metallized groove obtains PCB coaxial cables.
By the method and step in the above embodiments, obtained PCB coaxial cables include：Jie of core wire and package core wire
Matter layer and the metal foil substrate of the dielectric layer side, the core wire both sides are at least each, and there are one grooves, are connected to metal foil-based
The other side of plate and the dielectric layer；Dielectric layer surface between the groove and groove covers metal, and it is described recessed to form package
The metal screen layer of dielectric layer between slot.
Preferably, further include：In the obverse and reverse sides of the PCB coaxial cables, plating metal foil；Such as previous embodiment
Middle increase metal foil S2 is the same.Coaxial cable after plating can eliminate the rough surface on surface and gap during excess metal,
Convenient for subsequently making figure.
The quantity of core wire in the embodiment is one or more；Between a plurality of core wire, can both it be mutually parallel, it can also
There are joints, can also either way have.
Preferably, in the above embodiments, various resin coated substrates (RCC), copper can be used in the substrate with metal foil
The materials such as foil substrate (CCL).
Preferably, in the above embodiments, dielectric layer can be used the modes such as compacting prepreg, coated with resins layer and make.
Preferably, in the above embodiments, excess metal can be used plating mode, fill out copper mode, plating combination plug tree
Fat, plating combine the modes such as tin cream, or the directly modes such as filling conductive material to make.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of production method of PCB coaxial cables, which is characterized in that including：
The dielectric layer of package core wire is made, and is produced on the two linear gold for being located at the core wire both sides in the dielectric layer
Belong to connector；Wherein, it is formed in plane projection in PCB, the metal connector and the core wire are described to be produced on institute without intersecting
Stating two linear metal connectors in dielectric layer positioned at the core wire both sides includes：It is etched in the metal foil of substrate surface
The core wire and the metal connector cover the dielectric layer of the core wire and the metal connector in the substrate surface；
In the dielectric layer surface plating metal foil of making, forming obverse and reverse sides has the substrate of metal foil；
Position according to groove and width etch, exposed dielectric layer in the metal foil surface of the obverse and reverse sides；
According to the position of the groove, using plasma forms exposed described two gold from the surface etching of the dielectric layer
Belong at least two grooves of connector；Wherein, in dielectric layer of the core wire between the groove；
The dielectric layer surface to metallize between the groove and the groove forms and wraps up the dielectric layer between the groove
Metal screen layer obtains PCB coaxial cables；
In the obverse and reverse sides of the PCB coaxial cables, plating metal foil.
2. manufacturing method according to claim 1, which is characterized in that the dielectric layer for making package core wire and the gold
Belong to connector process include：
Metal foil on double-sided substrate surface etches the core wire and the metal connector；
The dielectric layer of the core wire and the metal connector is covered on the double-sided substrate surface.
3. manufacturing method according to claim 1, which is characterized in that the exposed described two metal connectors of formation
At least two grooves, including：
Form four grooves of exposed described two metal connectors.
4. manufacturing method according to claim 1, which is characterized in that the quantity of the core wire is one or more；
It is mutually parallel between a plurality of core wire, or, with one or more joints.
5. a kind of production method of PCB coaxial cables, which is characterized in that including：
On the surface of metal foil substrate, the dielectric layer of package core wire is made；
After the dielectric layer for making package core wire, in the dielectric layer surface, plating metal foil；
Position according to groove and width etch, exposed dielectric layer in the metal foil surface of plating；
According to the position of the groove, using plasma forms the two of bare metal foil from the surface etching of the dielectric layer
A groove；Wherein, the core wire is between described two grooves in dielectric layer；
The dielectric layer surface to metallize between the groove and the groove forms and wraps up the dielectric layer between the groove
Metal screen layer obtains PCB coaxial cables；
In the obverse and reverse sides of the PCB coaxial cables, plating metal foil.
6. production method according to claim 5, which is characterized in that further include：
The quantity of the core wire is one or more；
It is mutually parallel between a plurality of core wire, or, with one or more joints.
7. a kind of PCB coaxial cables include the dielectric layer of core wire and package core wire, which is characterized in that further include：The core
The linear metal connector of line both sides, and the groove that is communicated with the metal connector and the dielectric layer surface, it is described recessed
Dielectric layer surface between slot and groove covers metal, forms the metal screen layer for wrapping up the dielectric layer between the groove,
In, the core wire and the metal connector in the metal foil of substrate surface by etching to obtain, wherein the metal screen layer
It obtains in the following manner：In dielectric layer surface, plating metal foil；Position according to groove and width, in the metal foil of plating
Surface etching, exposed dielectric layer；According to the position of the groove, using plasma is from the surface etching of the dielectric layer, shape
At two grooves of bare metal connector；Wherein, the core wire is between described two grooves in dielectric layer；Also, institute
The obverse and reverse sides for stating PCB coaxial cables are electroplate with metal foil.
8. a kind of PCB coaxial cables include the metal foil-based of the dielectric layer and the dielectric layer side of core wire and package core wire
Plate, which is characterized in that the core wire both sides are at least each there are one groove, are connected to the another of metal foil substrate and the dielectric layer
Side；Dielectric layer surface between the groove and groove covers metal, forms the metal for wrapping up the dielectric layer between the groove
Shielded layer, wherein the metal screen layer obtains in the following manner：In dielectric layer surface, plating metal foil；According to groove
Position and width etch, exposed dielectric layer in the metal foil surface of plating；According to the position of the groove, using plasma
From the surface etching of the dielectric layer, two grooves of bare metal foil are formed；Wherein, the core wire described two grooves it
Between in dielectric layer；Also, it is electroplate with metal foil in the obverse and reverse sides of the PCB coaxial cables.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310027419.1A CN103974564B (en) | 2013-01-24 | 2013-01-24 | The production method and PCB coaxial cables of PCB coaxial cables |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310027419.1A CN103974564B (en) | 2013-01-24 | 2013-01-24 | The production method and PCB coaxial cables of PCB coaxial cables |
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| CN103974564A CN103974564A (en) | 2014-08-06 |
| CN103974564B true CN103974564B (en) | 2018-11-06 |
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|---|---|---|---|---|
| US4845311A (en) * | 1988-07-21 | 1989-07-04 | Hughes Aircraft Company | Flexible coaxial cable apparatus and method |
| US5357138A (en) * | 1991-02-22 | 1994-10-18 | Nec Corporation | Coaxial wiring pattern structure in a multilayered wiring board |
| CN1347278A (en) * | 2000-10-03 | 2002-05-01 | 日本胜利株式会社 | Printed wiring board and method for mfg. same |
| CN101657068A (en) * | 2009-10-10 | 2010-02-24 | 深南电路有限公司 | Method for preparing coaxial cable |
| CN102123560A (en) * | 2011-03-01 | 2011-07-13 | 梅州博敏电子有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100308871B1 (en) * | 1998-12-28 | 2001-11-03 | 윤덕용 | coaxial type signal line and fabricating method thereof |
| US6388198B1 (en) * | 1999-03-09 | 2002-05-14 | International Business Machines Corporation | Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality |
| JP3384995B2 (en) * | 2000-05-18 | 2003-03-10 | 株式会社ダイワ工業 | Multilayer wiring board and manufacturing method thereof |
| US7288723B2 (en) * | 2003-04-02 | 2007-10-30 | Sun Microsystems, Inc. | Circuit board including isolated signal transmission channels |
| JP4746852B2 (en) * | 2004-06-30 | 2011-08-10 | ソニーケミカル＆インフォメーションデバイス株式会社 | Transmission cable manufacturing method |
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2013
- 2013-01-24 CN CN201310027419.1A patent/CN103974564B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4845311A (en) * | 1988-07-21 | 1989-07-04 | Hughes Aircraft Company | Flexible coaxial cable apparatus and method |
| US5357138A (en) * | 1991-02-22 | 1994-10-18 | Nec Corporation | Coaxial wiring pattern structure in a multilayered wiring board |
| CN1347278A (en) * | 2000-10-03 | 2002-05-01 | 日本胜利株式会社 | Printed wiring board and method for mfg. same |
| CN101657068A (en) * | 2009-10-10 | 2010-02-24 | 深南电路有限公司 | Method for preparing coaxial cable |
| CN102123560A (en) * | 2011-03-01 | 2011-07-13 | 梅州博敏电子有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
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| CN103974564A (en) | 2014-08-06 |
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