CN103961203A - Heat tube radiator for head-mounted miniature semiconductor physical cooling ice belt - Google Patents
Heat tube radiator for head-mounted miniature semiconductor physical cooling ice belt Download PDFInfo
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- CN103961203A CN103961203A CN201310494996.1A CN201310494996A CN103961203A CN 103961203 A CN103961203 A CN 103961203A CN 201310494996 A CN201310494996 A CN 201310494996A CN 103961203 A CN103961203 A CN 103961203A
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Abstract
A heat tube radiator for a head-mounted miniature semiconductor physical cooling ice belt comprises a heat transfer block, heat tubes, and a radiator body; the bottom of the heat transfer block is used for mounting a cooler and in contact with a heating face of the cooler. The heat transfer block is provided with through holes in the longitudinal direction; the through holes are used for plugging the heat tubes. The other ends of the heat tubes are connected with the radiator body; the radiator body is formed by serially connecting a plurality of radiating fins one by one to the heat tubes. The top of the radiator body is provided with a fan for cooling. The heat tube radiator is higher in radiating performance, better in the effect of cold-compress physical cooling, and more comfortable to wear.
Description
Technical field
The present invention relates to domestic, medical human Physical temperature-lowering instrument field, be especially a kind ofly worn on miniature Physical temperature-lowering ice band or the ice cap radiator that human body head utilizes semiconductor refrigerating.
Background technology
Being worn on the miniature Physical temperature-lowering ice band that human body head utilizes semiconductor refrigerating, is a kind of physical hypothermal device that human body head is used, has refrigeration and temperature control performance that is directly worn on itself.It,, for the human body Physical temperature-lowering of having a fever, is used for child colony conventionally.In the structure of this product, a radiator all can be set, with it, the heat of cooling piece hot side is carried out to heat loss through conduction, its heat-sinking capability quality, directly determines refrigeration quality, also just determines ice band cold compress Physical temperature-lowering effect quality.So being one in ice carries product, it causes the important parts in pass.
Be worn on a human body head micro semiconductor Physical temperature-lowering ice band radiator, prior art, is to adopt conventional aluminum Section Bar Heat Sinks.The shortcoming of this radiator: one, it adopts extruding-out process to process, be subject to the restriction of processing technique, the thickness of the density between fin and the size of every fin and fin, capital is subject to certain restrictions, and namely, under certain specification size, area of dissipation can be limited, want area of dissipation large, heat-sinking capability is strong, just must increase fin quantity and area thereof, strengthens the volume and weight of radiator.But this is directly worn on for ice band is this product that human body head is used, volume and weight is all subject to strict restriction, is unpractical.Therefore, on this product of ice band, adopt this radiator, its cold compress Physical temperature-lowering effect, can be subject to certain restricted influence.Two, this aluminum profile heat radiator, its bottom and fin are one, and bottom is used for installing cooling piece, and top is used for provided with fan.From whole, Thickness Ratio is thicker.Radiator and fan all stack again, and weight has concentrated on one.So, it is used on ice band, on the one hand, can make ice carries product thicker at thickness direction, on forehead, an outstanding thick thing, can allow people feel under the weather; On the other hand, the weight of whole ice band, all concentrates on forehead position, equally also can allow people feel under the weather; Also have, fan is also in forehead position, and the noise of fan can be obvious.For ice carries product, the uncomfortable sensation of any people of allowing aspect wearing, all will have a strong impact on the universal problem of its produce market.
Summary of the invention
The object of the invention: be to replace existing radiator with a kind of better radiator, this radiator, will realize on the one hand in constancy of volume or less in the situation that, and area of dissipation is larger, and heat-sinking capability is stronger, thereby makes ice band cold compress Physical temperature-lowering better effects if; The transfer of heat of cooling piece to be dispelled the heat to the place beyond forehead on the other hand, radiator and fan are all shifted out to forehead position, so both can reduce product at the thickness of forehead position, can not make again the weight of whole ice band, all concentrate on forehead position, also have forehead position also there is no the noise of fan, thereby it is more comfortable that ice band is worn.For this reason, the present invention, releases a kind of human body head micro semiconductor Physical temperature-lowering ice band heat-pipe radiator of wearing.
The technical scheme that the present invention takes is: a kind of human body head micro semiconductor Physical temperature-lowering ice band heat-pipe radiator of wearing, it is comprised of heat-conducting block, heat pipe, radiator.The bottom of heat-conducting block is used for installing cooling piece, contacts with cooling piece hot side; Heat-conducting block longitudinally, be provided with through hole, for inserting heat pipe; The other end of heat pipe, connects radiator, and radiator is serially connected on heat pipe by multi-disc fin slices; Radiator top provided with fan dispels the heat.Its heat loss through conduction process: the heat of cooling piece, through heat-conducting block bottom, pass to heat-conducting block, heat-conducting block is passed to again the heat pipe being inserted in its longitudinal hole, passes to again the radiator of the other end after heat pipe absorption heat, finally by fan, is dispelled the heat.Adopt this heat-pipe radiator, on the one hand, the heat of cooling piece, by heat pipe, dispelled the heat in the position that it is transferred to beyond forehead, and radiator and fan, or not forehead position, so not only can make the Thickness Design at ice band forehead position obtain thinner; And weight has been disperseed, be not concentrated in forehead position, and the noise of fan, has also transferred to forehead other position in addition.Can make ice band wear so more comfortable.On the other hand, fin on heat-pipe radiator, to form with very thin aluminium flake punching, sheet and sheet spacing can design closelyer, contrast like this aluminum profile heat radiator, in the situation of identical weight, volume, its area of dissipation can be larger, heat-sinking capability can be stronger, and cold compress cooling-down effect can be better.Instead yet it, in identical area of dissipation situation, can do less gentlyer the volume of ice band, weight.
Described heat pipe, is existing routine techniques, at this, does simple statement, the two ends of heat pipe, and the one end that connects heat-conducting block is evaporation ends, and the one end that connects radiator is condensation end, in pipe, is vacuum, and it is to utilize the evaporation of working fluid and condensation to carry out transferring heat.
On described heat-conducting block, be provided with the through hole being connected with ice band conduction cooling plate screw.
On described fin, the boss-shaped through hole that punching has slotting heat pipe to use, boss inner ring and heat pipe close contact conduct heat; For increasing the area of dissipation of every a slice fin, conventionally can be at its surperficial punching ripple or concavo-convex age spot.
Described heat-pipe radiator, its structure, can make heat pipe and draw from direction of heat-conducting block, connects a radiator, joins a fan; Also can make heat pipe and draw from heat-conducting block left and right both direction, two ends respectively connect a radiator, respectively join a fan.
Beneficial effect of the present invention: heat-sinking capability is stronger, cold compress Physical temperature-lowering better effects if, wears more comfortable.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1, be the structure exploded perspective view of first embodiment of the invention.
Fig. 2, be the structure exploded perspective view of second embodiment of the invention.
1. fin in figure, 1-1. boss-shaped through hole, 2. fan, 3. heat pipe, 4. heat-conducting block, 4-1. through hole, 4-2. through hole.
The specific embodiment
As shown in Figure 1, a kind of human body head micro semiconductor Physical temperature-lowering ice band heat-pipe radiator of wearing, it is comprised of heat-conducting block 4, heat pipe 3, radiator.The bottom of heat-conducting plate 4 is used for installing cooling piece, contacts with cooling piece hot side; Heat-conducting block 4 longitudinally, be provided with through hole 4-2, for inserting heat pipe 3; The other end of heat pipe 3, connects radiator, and radiator is serially connected on heat pipe 3 by multi-disc fin slices; Radiator top provided with fan 2 dispels the heat.Its heat loss through conduction process: the heat of cooling piece, through heat-conducting block 4 bottoms, pass to heat-conducting block 4, heat-conducting block 4 is passed to again the heat pipe 3 being inserted in its longitudinal hole, passes to again the radiator of the other end after heat pipe 3 absorption heats, finally by fan 2, is dispelled the heat.Adopt this heat-pipe radiator, on the one hand, the heat of cooling piece, by heat pipe 3, dispelled the heat in the position that it is transferred to beyond forehead, and radiator and fan, or not forehead position, so not only can make the Thickness Design at ice band forehead position obtain thinner; And weight has been disperseed, be not concentrated in forehead position, and the noise of fan 2, has also transferred to forehead other position in addition.Can make ice band wear so more comfortable.On the other hand, fin 1 on heat-pipe radiator, to form with very thin aluminium flake punching, sheet and sheet spacing can design closelyer, contrast like this aluminum profile heat radiator, in the situation of identical weight, volume, its area of dissipation can be larger, heat-sinking capability can be stronger, and cold compress cooling-down effect can be better.Instead yet it, in identical area of dissipation situation, can do less gentlyer the volume of ice band, weight.
Described heat pipe 3, is existing routine techniques, at this, does simple statement, the two ends of heat pipe 3, and the one end that connects heat-conducting block 4 is evaporation ends, and the one end that connects fin 1 is condensation end, in pipe, is vacuum, and it is to utilize the evaporation of working fluid and condensation to carry out transferring heat.
On described heat-conducting block 4, be provided with the through hole 4-1 being connected with ice band conduction cooling plate screw.
On described fin 1, the boss-shaped through hole 1-1 that punching has slotting heat pipe to use, boss inner ring and heat pipe 3 close contacts conduct heat; For increasing the area of dissipation of every a slice fin 1, conventionally can be at its surperficial punching ripple or concavo-convex age spot.
Described heat-pipe radiator, its structure, can make heat pipe 3 and draw from 4 one directions of heat-conducting block, connects a radiator 1, joins a fan 2; Also can make heat pipe 3 and draw from heat-conducting block 4 left and right both directions, two ends respectively connect a radiator 1, respectively join a fan 2.
As shown in Figure 2, be second embodiment of the invention, in this embodiment, heat pipe 3 is to draw from heat-conducting block 4 left and right both directions, two ends respectively connect a radiator 1, respectively join a fan 2.Adopting the benefit of this scheme, is to consider based on ice band outward appearance, and ice band can be made to strip-like-shaped, weight is more disperseed.
Claims (4)
1. wear a human body head micro semiconductor Physical temperature-lowering ice band heat-pipe radiator, it is comprised of heat-conducting block, heat pipe, radiator.The bottom of heat-conducting block is used for installing cooling piece, contacts with cooling piece hot side; Heat-conducting block longitudinally, be provided with through hole, for inserting heat pipe; The other end of heat pipe, connects radiator, and radiator is serially connected on heat pipe by multi-disc fin slices; Radiator top provided with fan dispels the heat.
2. a kind of human body head micro semiconductor Physical temperature-lowering ice band heat-pipe radiator of wearing according to claim 1.It is characterized in that: on described heat-conducting block, be provided with and connect ice band conduction cooling plate screw through-hole.
3. a kind of human body head micro semiconductor Physical temperature-lowering ice band heat-pipe radiator of wearing according to claim 1.It is characterized in that: on described fin, the boss-shaped through hole that punching has slotting heat pipe to use, boss inner ring and heat pipe close contact conduct heat; For increasing the area of dissipation of every a slice fin, conventionally can be at its surperficial punching ripple or concavo-convex age spot.
4. a kind of human body head micro semiconductor Physical temperature-lowering ice band heat-pipe radiator of wearing according to claim 1.It is characterized in that: described heat-pipe radiator, its structure, can make heat pipe and draw from direction of heat-conducting block, connects a radiator, joins a fan; Also can make heat pipe and draw from heat-conducting block left and right both direction, two ends respectively connect a radiator and respectively join a fan.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310494996.1A CN103961203A (en) | 2013-10-21 | 2013-10-21 | Heat tube radiator for head-mounted miniature semiconductor physical cooling ice belt |
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CN201310494996.1A CN103961203A (en) | 2013-10-21 | 2013-10-21 | Heat tube radiator for head-mounted miniature semiconductor physical cooling ice belt |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN2634654Y (en) * | 2003-06-25 | 2004-08-18 | 珍通科技股份有限公司 | Heat radiator structure of central processing unit |
US20080046047A1 (en) * | 2006-08-21 | 2008-02-21 | Daniel Jacobs | Hot and cold therapy device |
CN201115210Y (en) * | 2007-06-22 | 2008-09-10 | 深圳市顶星数码网络技术有限公司 | Heat radiation fin |
CN201142813Y (en) * | 2008-01-09 | 2008-10-29 | 讯凯国际股份有限公司 | Heat pipe side direction extending heat radiating device |
CN101721273A (en) * | 2009-12-14 | 2010-06-09 | 郑宝华 | Miniature electronic temperature-decreasing ice belt capable of being worn on heads |
CN202920444U (en) * | 2012-11-27 | 2013-05-08 | 郝武斌 | Physical therapy instrument for headache and insomnia |
CN204379525U (en) * | 2013-10-21 | 2015-06-10 | 深圳天赋健医疗器械科技有限公司 | One wears human body head micro semiconductor Physical temperature-lowering ice bank heat-pipe radiator |
-
2013
- 2013-10-21 CN CN201310494996.1A patent/CN103961203A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2634654Y (en) * | 2003-06-25 | 2004-08-18 | 珍通科技股份有限公司 | Heat radiator structure of central processing unit |
US20080046047A1 (en) * | 2006-08-21 | 2008-02-21 | Daniel Jacobs | Hot and cold therapy device |
CN201115210Y (en) * | 2007-06-22 | 2008-09-10 | 深圳市顶星数码网络技术有限公司 | Heat radiation fin |
CN201142813Y (en) * | 2008-01-09 | 2008-10-29 | 讯凯国际股份有限公司 | Heat pipe side direction extending heat radiating device |
CN101721273A (en) * | 2009-12-14 | 2010-06-09 | 郑宝华 | Miniature electronic temperature-decreasing ice belt capable of being worn on heads |
CN202920444U (en) * | 2012-11-27 | 2013-05-08 | 郝武斌 | Physical therapy instrument for headache and insomnia |
CN204379525U (en) * | 2013-10-21 | 2015-06-10 | 深圳天赋健医疗器械科技有限公司 | One wears human body head micro semiconductor Physical temperature-lowering ice bank heat-pipe radiator |
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Application publication date: 20140806 |