CN103914116A - Electronic device - Google Patents
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- CN103914116A CN103914116A CN201410086111.9A CN201410086111A CN103914116A CN 103914116 A CN103914116 A CN 103914116A CN 201410086111 A CN201410086111 A CN 201410086111A CN 103914116 A CN103914116 A CN 103914116A
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- access memory
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Abstract
The invention discloses an electronic device which is designed for solving the problem that the existing electronic device is low in electro-magnetic interference (EMI) testing pass rate. The electronic device comprises a metal radiating plate and a random access memory. The metal radiating plate is arranged in a first plane. The random access memory is arranged in a second plane. The projection of the metal radiating plate in the second plane in the first direction is not overlapped with the random access memory. The first plane is parallel to the second plane. The first direction is perpendicular to the first plane and the second plane. A coupling effect between the metal radiating plate and the random access memory is small, concentrated radiation of radiated energy of the random access memory through the metal radiating plate is reduced, increasing of EMI testing rate and health of users are facilitated.
Description
Technical field
The present invention relates to electronic device field, relate in particular to a kind of electronic equipment.
Background technology
As shown in Figure 1, electronic equipment generally includes processor 103, metal fin 102, random access memory 101 and random access memory 104.Metal fin 102 covers the top of described processor 103 conventionally, in order to reduce the temperature of processor 103.Conventionally metal fin 102 utilizes the characteristic of metal heat absorption and rapid heat dissipation, and the heat of dispersing of the processor 103 that can well leave can be protected processor 103 persistent high efficiency operations.Random access memory 101 and random access memory 104 are arranged on the side of processor 103 conventionally, with thinking that processor provides storage space.
The frequency of operation of random access memory is higher, and by causing, the energy of radiation is higher.Random access memory and metal fin form coupling (as shown in Figure 1), the energy of 101,104 radiation of random access memory will be gone out by the metal sheet 102 radiation concentrated radiations that fall apart, and now metal fin 102 also serves as the antenna that random access memory 101,104 emittance are radiate.But this by emittance concentrated radiation, the electromagnetic interference (EMI) (Electromagnetic Interference, EMI) that causes product be can't pass, and also will have a negative impact to user's health.
Summary of the invention
In view of this, the invention reside in the electronic equipment that a kind of EMI of raising test percent of pass is provided and is conducive to user's body health.
Technical scheme of the present invention is achieved in that
The invention provides a kind of electronic equipment, comprise metal fin and random access memory;
Described metal fin is arranged in the first plane;
Described random access memory is arranged in the second plane;
Described metal fin is the projection on first direction in the second plane, with described random access memory non-overlapping copies;
Wherein, described the first plane parallel is in described the second plane;
Described first direction is perpendicular to described the first plane and described the second plane.
Preferably, described electronic equipment also comprises ground pin; Described ground pin is connected with described metal fin.
Preferably, described electronic equipment also comprises processor;
Described processor is positioned at described the second plane;
Described metal fin is projection on first direction in described the second plane, covers on described processor.
Preferably, described metal fin is aluminum thermal fin.
Preferably, described metal fin is non-rectangle heat radiator.
Preferably, described random access memory is Double Data Rate synchronous dynamic shorthand storer.
Electronic equipment described in the present embodiment, be arranged in the first plane, random access memory is arranged in the second plane metal fin is set, and metal fin is not overlapping with the projection of random access memory in parallel the first plane and the second plane, reduce the coupling of metal fin and random access memory, avoided the antenna concentrated radiation energy of metal fin as described random access memory energy emission; Thereby be conducive to the lifting of EMI test percent of pass, the infringement of the high radiation that has simultaneously reduced concentrated radiation to user health.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiments of the invention, for those of ordinary skills, do not paying under the prerequisite of creative work, other accompanying drawing can also be provided according to the accompanying drawing providing.
Fig. 1 is a kind of structural representation of electronic equipment;
Fig. 2 is one of electronic devices structure schematic diagram described in the embodiment of the present invention;
Fig. 3 is two of electronic devices structure schematic diagram described in the embodiment of the present invention;
Fig. 4 is three of electronic devices structure schematic diagram described in the embodiment of the present invention;
Fig. 5 is four of electronic devices structure schematic diagram described in the embodiment of the present invention.
Embodiment
For making the application's object, technical scheme and advantage clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.In the situation that not conflicting, the combination in any mutually of the feature in embodiment and embodiment in the application.
Embodiment mono-:
As shown in Figure 2, the present embodiment provides a kind of electronic equipment, comprises metal fin and random access memory;
Described metal fin 110 is arranged in the first plane;
Described random access memory 120 is arranged in the second plane;
The projection on first direction in the second plane of described metal fin 110, with described random access memory 120 non-overlapping copies;
Wherein, described the first plane parallel is in described the second plane;
Described first direction is perpendicular to described the first plane and described the second plane.
If described the first plane and described the second plane are surface level, described metal fin 110 be arranged on described memory 120 above or below in the surface level at place.On the first direction of described metal fin 110 in described the second plane, be projected as the vertical projection of described metal fin 110 at surface level, described vertical projection and described random access memory 120 are positioned at two regions of surface level.Metal fin 110 as shown in Figure 2 is positioned at different positions or region from random access memory 120.So just reduce the coupling effect between metal fin 110 and random access memory 120, the energy that can reduce 120 radiation of random access memory distributes by metal fin 110, and then reduce in the time carrying out EMI test, due to electronic equipment metal fin, 110 position EMI are too high, cause the probability of EMI test crash, improved the test percent of pass of electronic equipment EMI; Avoid the excessive infringement to user health causing of concentrated radiation energy simultaneously, be conducive to the healthy of user.
Embodiment bis-:
As shown in Figure 3, the present embodiment provides a kind of electronic equipment, comprises metal fin 110 and random access memory 120;
Described metal fin 110 is arranged in the first plane;
Described random access memory 120 is arranged in the second plane;
The projection on first direction in the second plane of described metal fin 110, with described random access memory 120 non-overlapping copies;
Wherein, described the first plane parallel is in described the second plane;
Described first direction is perpendicular to described the first plane and described the second plane;
Described electronic equipment also comprises ground pin 140; Described ground pin 140 be connected with described metal fin 110 and conducting good.Described ground pin 140 can be one or more, arranges according to demand.Between described ground pin 140 and described metal fin by card and, the structure such as welding or screw is connected.In concrete implementation procedure, in order to simplify manufacturing process, the part that described metal fin 110 can be stretched out, is connected with the earth point in electronic equipment as ground pin.It is concrete as metal fin 110 is connected to earth point or the ground plane of electronic equipment internal for fixing snap fit as ground pin.For another example described screw is threaded with ground connection screw, thereby described screw connects and is connected with metal fin 110 as ground pin.The structure of ground pin 140 has multiple, and the connected mode of ground pin 140 and metal fin 110 also has multiple, has just repeated no longer one by one at this.
In concrete implementation procedure, described ground pin 140 and the tie point of described metal fin 110 can be arranged on the adjacent place of the strength of the strength of described random access memory 120 and metal fin 110 couplings or coupling, are beneficial to the discharge of the emittance that metal fin 110 absorbs.Conventionally the emittance between nearest 2 of metal fin 110 and random access memory 120 is likely the strongest; In concrete implementation procedure, can determine the strong position of coupling according to the position relationship of random access memory 120 and metal fin 110 and the most concentrated point of random access memory 120 energy emissions.
If described the first plane and described the second plane are surface level, described metal fin 110 be arranged on described memory 120 above or below in the surface level at place.Projection on the first direction of described metal fin 110 in described the second plane, for described metal fin 110 is in the vertical projection of surface level, is positioned at two regions of surface level.Described in Fig. 2 and Fig. 3, metal fin 110 is positioned at different positions or region from random access memory 120.So just reduce the coupling between metal fin 110 and random access memory 120, the energy that can reduce 120 radiation of random access memory distributes by metal fin 110, and then avoid carrying out EMI test, due to electronic equipment metal fin, 110 position EMI are too high, cause the probability of EMI test crash, improved the test percent of pass of electronic equipment EMI; Avoid concentrated radiation energy excessive simultaneously, caused the infringement to user health, be conducive to the healthy of user.
The present embodiment is with respect to a upper embodiment, by ground pin 140 is connected with metal fin 110, at least part of energy that can metal fin 110 be absorbed by ground pin 140 is derived, reduce the energy of metal fin 110 to aerial radiation, therefore again promote the percent of pass of EMI test.
Embodiment tri-:
As shown in Figure 2 or Figure 3, the present embodiment provides a kind of electronic equipment, comprises metal fin 110, random access memory 120 and processor 130;
Described metal fin 110 is arranged in the first plane;
Described random access memory 120 is arranged in the second plane;
The projection on first direction in the second plane of described metal fin 110, with described random access memory 120 non-overlapping copies;
Wherein, described the first plane parallel is in described the second plane;
Described first direction is perpendicular to described the first plane and described the second plane;
Described processor 130 is positioned at described the second plane;
Described metal fin 110 is projection on first direction in described the second plane, covers on described processor 130.
The present embodiment is with respect to the difference of embodiment mono-and embodiment bis-, described electronic equipment also comprises processor 130 in the present embodiment, and processor 130 is arranged in same plane with described random access memory 120, and metal fin 110 projection on first direction in the second plane covers on described processor 130, be oppositely arranged with described processor 130 by described metal fin 110, be conducive to like this heat distributing when metal fin absorption processor 130 as much as possible moves, to maintain processor in comparatively stable working temperature, promote the operational efficiency of processor.Described processor 120 can be central processing unit, single-chip microcomputer, digital information processor or the programmable logic array etc. of multinuclear or monokaryon.Described random access memory 120 can be one or more, is distributed near of described processor 130, for described processor 130 provides storage medium.
As further improvement of this embodiment, facilitate the dissipation of absorbed energy on metal fin, as shown in Figure 3, described electronic equipment is ground pin 140 also; Described ground pin 140 be connected with described metal fin and conducting good.
Electronic equipment described in comprehensive above-mentioned the present embodiment, to have EMI test percent of pass high, when being conducive to user's body health, also has the good heat dissipation effect of metal fin 110, the operational efficiency advantages of higher of processor 130.
Embodiment tetra-:
As shown in Figure 2 or Figure 3, the present embodiment provides a kind of electronic equipment, comprises metal fin 110, random access memory 120 and processor 130;
Described metal fin 110 is arranged in the first plane;
Described random access memory 120 is arranged in the second plane;
The projection on first direction in the second plane of described metal fin 110, with described random access memory 120 non-overlapping copies;
Wherein, described the first plane parallel is in described the second plane;
Described first direction is perpendicular to described the first plane and described the second plane;
Described processor 130 is positioned at described the second plane;
Described metal fin 110 is aluminum thermal fin.
Aluminum thermal fin adopts aluminium to make, make simple, quality light, good heat dissipation effect, stable performance and the advantage such as cost of manufacture is low.Can also be substituted by the heat radiator of the heat radiator of iron material matter or copper material at aluminum thermal fin described in concrete implementation procedure.
As further improvement of this embodiment, described aluminum thermal fin is also connected with ground pin or earth point in described electronic equipment, by ground pin or earth point, the energy absorbing on aluminum thermal fin is further eliminated, further to promote the percent of pass of EMI test.
As further improvement of this embodiment, described metal fin 110 is projection on first direction in described the second plane, covers on described processor 130.Be the top that described aluminum thermal fin covers described processor 130 by described metal fin 110, be conducive to processor 130 and maintain work in stable temperature range, be conducive to promote effective work efficiency of processor.
Embodiment five:
As shown in Figure 4, the present embodiment provides a kind of electronic equipment, comprises metal fin and random access memory;
Described metal fin 110 is arranged in the first plane;
Described random access memory 120 is arranged in the second plane;
The projection on first direction in the second plane of described metal fin 110, with described random access memory 120 non-overlapping copies;
Wherein, described the first plane parallel is in described the second plane;
Described first direction is perpendicular to described the first plane and described the second plane;
The loose sheet 110 of described metal is rectangular radiator.
If described the first plane and described the second plane are surface level, described metal fin 110 be arranged on described memory 120 above or below in the surface level at place.Projection on the first direction of described metal fin 110 in described the second plane, for described metal fin 110 is in the vertical projection of surface level, is positioned at two regions of surface level.Metal fin 110 as shown in Figure 2 is positioned at different positions or region from random access memory 120.So just reduce the coupling between metal fin 110 and random access memory 120, the energy that can reduce 120 radiation of random access memory distributes by metal fin 110, and then reduce and carried out EMI test, due to electronic equipment metal fin, 110 position EMI are too high, cause the probability of EMI test crash, improved the test percent of pass of electronic equipment EMI; Avoid concentrated radiation energy excessive simultaneously, caused the infringement to user health, be conducive to the healthy of user.
Be the original residing position of metal fin 110 in the represented position of the frame of dotted line described in Fig. 4, by changing the position of described metal fin 110, make metal fin 110 in the second plane the projection on first direction and described random access memory 120 not overlapping, thereby reduce the coupling of random access memory 120 and metal fin 110.Described metal fin is rectangular radiator in the present embodiment; Rectangular radiator regular shape, simple for production.
The present embodiment is the further restriction on embodiment mono-to embodiment tetra-; In concrete implementation procedure, on described metal fin 110, also can be connected with ground pin etc.; It is high that electronic equipment described in the present embodiment has EMI test percent of pass, when being conducive to user health, also has advantages of simple in structure and simple for production.
Embodiment six:
As shown in Figure 5, the present embodiment provides a kind of electronic equipment, comprises metal fin and random access memory;
Described metal fin 110 is arranged in the first plane;
Described random access memory 120 is arranged in the second plane;
The projection on first direction in the second plane of described metal fin 110, with described random access memory 120 non-overlapping copies;
Wherein, described the first plane parallel is in described the second plane;
Described first direction is perpendicular to described the first plane and described the second plane;
The loose sheet 110 of described metal is rectangular radiator.
If described the first plane and described the second plane are surface level, described metal fin 110 be arranged on described memory 120 above or below in the surface level at place.Projection on the first direction of described metal fin 110 in described the second plane, for described metal fin 110 is in the vertical projection of surface level, is positioned at two regions of surface level.Metal fin 110 as shown in Figure 2 is positioned at different positions or region from random access memory 120.So just reduce the coupling between metal fin 110 and random access memory 120, the energy that can reduce 120 radiation of random access memory distributes by metal fin 110, and then reduce and carried out EMI test, due to electronic equipment metal fin, 110 position EMI are too high, cause the probability of EMI test crash, improved the test percent of pass of electronic equipment EMI; Avoid concentrated radiation energy excessive simultaneously, caused the infringement to user health, be conducive to the healthy of user.
Metal fin 110 in the present embodiment is non-rectangle heat radiator; The position represented at the frame of dotted line described in Fig. 5 was originally provided with metal fin 110 equally, by changing the change of shape of described metal fin 110, make metal fin 110 in the second plane the projection on first direction and described random access memory 120 not overlapping, thereby reduce the coupling of random access memory 120 and metal fin 110.In the present embodiment by the alteration of form of metal fin 110, easy realization the reducing of coupling between random access memory 110 and metal fin 110, the each structure of electronic equipment internal further changes without doing, realize easy, to produce and the change of design little.
Described non-rectangle heat radiator is to have excised a rectangular block in the direction of the contiguous described random access memory 120 of rectangular radiator in the present embodiment, in concrete implementation process, the shape of described excision can also be fan-shaped other shapes such as grade, and concrete can further determine according to size and the distribution situation of the number of random access memory 120 and distribution and metal fin 110.
The present embodiment is the further restriction on embodiment mono-to embodiment tetra-; In concrete implementation procedure, on described metal fin 110, also can be connected with ground pin etc.; It is high that electronic equipment described in the present embodiment has EMI test percent of pass, when being conducive to user health, also have advantages of realize easy.
Embodiment seven:
As shown in Figure 2, the present embodiment provides a kind of electronic equipment, comprises metal fin and random access memory;
Described metal fin 110 is arranged in the first plane;
Described random access memory 120 is arranged in the second plane;
The projection on first direction in the second plane of described metal fin 110, with described random access memory 120 non-overlapping copies;
Wherein, described the first plane parallel is in described the second plane;
Described first direction is perpendicular to described the first plane and described the second plane;
Described random access memory 120 can be any one in dynamic RAM and static RAM; Described random access memory is preferably Double Data Rate synchronous dynamic shorthand storer in the present embodiment.Because Double Data Rate synchronous dynamic shorthand memory operation frequencies is high, energy consumption is high, the energy emission causing is also high, if adopt between the coupling between existing structure metal fin and random access memory very strong, to cause large-tonnage product to can't pass EMI test, and the distributed architecture between metal fin 110 and random access memory 120 in employing the present embodiment, by the coupling reducing between metal fin 110 and random access memory 120, significantly promote the percent of pass of EMI test, and be conducive to user health.
Comprehensively above-mentioned, electronic equipment described in the embodiment of the present invention one to embodiment seven, by the position relationship between metal fin and random access memory in change electronic equipment, reduced the coupling effect between metal fin and random access memory, the energy of having avoided the radiation of random access memory institute is low and user health is damaged to large problem to controlling the EMI test passing probability causing take metal fin as antenna concentrated radiation.
In several embodiment that application provides, should be understood that disclosed equipment and method can realize by another way.Apparatus embodiments described above is only schematic, for example, the division of described unit, be only that a kind of logic function is divided, when actual realization, can there is other dividing mode, as: multiple unit or assembly can be in conjunction with, maybe can be integrated into another system, or some features can ignore, or do not carry out.In addition, the coupling each other of shown or discussed each ingredient or direct-coupling or communication connection can be by some interfaces, and the indirect coupling of equipment or unit or communication connection can be electrical, machinery or other form.
The above-mentioned unit as separating component explanation can or can not be also physically to separate, and the parts that show as unit can be or can not be also physical locations, can be positioned at a place, also can be distributed in multiple network element; Can select according to the actual needs part or all of unit wherein to realize the object of the present embodiment scheme.
In addition, the each functional unit in various embodiments of the present invention can all be integrated in a processing module, can be also that each unit is distinguished separately as a unit, also can be integrated in a unit two or more unit; Above-mentioned integrated unit both can adopt the form of hardware to realize, and the form that also can adopt hardware to add SFU software functional unit realizes.
One of ordinary skill in the art will appreciate that: all or part of step that realizes said method embodiment can complete by the relevant hardware of programmed instruction, aforesaid program can be stored in a computer read/write memory medium, this program, in the time carrying out, is carried out the step that comprises said method embodiment; And aforesaid storage medium comprises: various media that can be program code stored such as movable storage device, ROM (read-only memory) (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disc or CDs.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited to this, any be familiar with those skilled in the art the present invention disclose technical scope in; can expect easily changing or replacing, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of described claim.
Claims (6)
1. an electronic equipment, comprises metal fin and random access memory; It is characterized in that,
Described metal fin is arranged in the first plane;
Described random access memory is arranged in the second plane;
Described metal fin is the projection on first direction in the second plane, with described random access memory non-overlapping copies;
Wherein, described the first plane parallel is in described the second plane;
Described first direction is perpendicular to described the first plane and described the second plane.
2. electronic equipment according to claim 1, is characterized in that, described electronic equipment also comprises ground pin; Described ground pin is connected with described metal fin.
3. electronic equipment according to claim 1 and 2, is characterized in that, described electronic equipment also comprises processor;
Described processor is positioned at described the second plane;
Described metal fin is projection on first direction in described the second plane, covers on described processor.
4. electronic equipment according to claim 1 and 2, is characterized in that, described metal fin is aluminum thermal fin.
5. electronic equipment according to claim 1 and 2, is characterized in that, described metal fin is non-rectangle heat radiator.
6. electronic equipment according to claim 1 and 2, is characterized in that, described random access memory is Double Data Rate synchronous dynamic shorthand storer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410086111.9A CN103914116A (en) | 2014-03-10 | 2014-03-10 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410086111.9A CN103914116A (en) | 2014-03-10 | 2014-03-10 | Electronic device |
Publications (1)
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| CN103914116A true CN103914116A (en) | 2014-07-09 |
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| CN201410086111.9A Pending CN103914116A (en) | 2014-03-10 | 2014-03-10 | Electronic device |
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| CN101542453A (en) * | 2005-01-05 | 2009-09-23 | 极端数据公司 | Systems and methods for providing co-processors to computing systems |
| CN200972650Y (en) * | 2006-08-21 | 2007-11-07 | 上海奥索汉泰电子科技有限公司 | Main control plate based on PPC microprocessor and system using the main control plate |
| US20080068796A1 (en) * | 2006-09-20 | 2008-03-20 | Pav Darren B | System and Method for Managing Cooling Airflow for a Multiprocessor Information Handling System |
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Application publication date: 20140709 |