CN103885177B - Fiber amplifier dynamic gain slope equalizer and its preparation technology - Google Patents
Fiber amplifier dynamic gain slope equalizer and its preparation technology Download PDFInfo
- Publication number
- CN103885177B CN103885177B CN201210563947.4A CN201210563947A CN103885177B CN 103885177 B CN103885177 B CN 103885177B CN 201210563947 A CN201210563947 A CN 201210563947A CN 103885177 B CN103885177 B CN 103885177B
- Authority
- CN
- China
- Prior art keywords
- micro
- optical
- reflector
- optics
- mems
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000835 fiber Substances 0.000 title claims abstract description 64
- 238000005516 engineering process Methods 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 230000003287 optical effect Effects 0.000 claims abstract description 112
- 230000033001 locomotion Effects 0.000 claims abstract description 38
- 230000003595 spectral effect Effects 0.000 claims abstract description 36
- 239000013307 optical fiber Substances 0.000 claims abstract description 30
- 238000003780 insertion Methods 0.000 claims abstract description 23
- 230000037431 insertion Effects 0.000 claims abstract description 23
- 238000006073 displacement reaction Methods 0.000 claims abstract description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 37
- 229910052710 silicon Inorganic materials 0.000 claims description 37
- 239000010703 silicon Substances 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 30
- 230000003068 static effect Effects 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 23
- 238000005530 etching Methods 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 7
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 5
- 239000005297 pyrex Substances 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000001459 lithography Methods 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 2
- 239000012212 insulator Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 230000017105 transposition Effects 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 9
- 239000006185 dispersion Substances 0.000 abstract description 7
- 230000008901 benefit Effects 0.000 abstract description 4
- 230000008859 change Effects 0.000 description 16
- 238000001914 filtration Methods 0.000 description 7
- 238000001228 spectrum Methods 0.000 description 7
- 238000011161 development Methods 0.000 description 6
- 230000018109 developmental process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 4
- 238000011982 device technology Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000001069 Raman spectroscopy Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000006855 networking Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003483 aging Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 210000000170 cell membrane Anatomy 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000005713 exacerbation Effects 0.000 description 1
- 238000007380 fibre production Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000004038 photonic crystal Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
Present invention is disclosed a kind of fiber amplifier dynamic gain slope equalizer and its preparation technology, the balanced device includes the MEMS optical micromirrors driver chip and double-fiber collimator by optical package；MEMS optical micromirrors driver chip includes the first optics micro-reflector, the second optics micro-reflector, micro-displacement adjustment unit；Horizontal direction or/and the microbit shifting movement of vertical direction of the micro-displacement adjustment unit to control the first optics micro-reflector or/and the second optics micro-reflector, realize MZI splitting ratios and interfere arm planet phasing, and dynamic control inputs the spectral slope of wdm optical signal.Dynamic gain slope equalizer proposed by the present invention is made using MEMS technology, have the advantages that insertion loss is low, balanced range is wide, small volume, tuned speed are fast, driving power is small, it can be directly integrated into EDFA and realize that dynamic gain slope is balanced, moreover it is possible to the unbalanced problem of DWDM interchannel signal powers caused applied to solution Transmission Fibers, optical fiber dispersion compensation module, optical fiber SRS effects etc..
Description
Technical field
The invention belongs to MEMS and technical field of optical fiber communication, it is related to a kind of dynamic gain slope equalizer, more particularly to
A kind of fiber amplifier dynamic gain slope equalizer；Meanwhile, the invention further relates to above-mentioned fiber amplifier dynamic gain slope
The preparation technology of balanced device.
Background technology
The implementation of " broadband China strategy " and " broadband access network speed acceleration project " will greatly accelerate China's broadband light networking,
" light entering and copper back " turns into broadband network technology development trend, and China's broadband light networking investment will more than hundred billion yuan scales.Pass
The point-to-point Optical Transmission Network OTN of system can not adapt to optical access port number and the great-leap-forward of access bandwidth increases, and light is exchanged based on automatic
The ASON of network (ASON) technology is inevitable development trend.ASON will not only solve high capacity transmission, broadband
Access problem, more crucially the intelligentized lifting of optical-fiber network, with crossing over, realizes that wavelength is automatically configured and Bandwidth Dynamic Allocation,
Set up dynamic reconfigurable, extension is flexible, operation is efficient, the broadband optical-fiber network of economic and reliable.
ASON is that reconstructable OADM (ROADM) is utilized in dense wave division multipurpose (DWDM) technical foundation
The new optical-fiber network built with the node device such as optical cross connect (OXC), its single channel rate will be lifted and arrive 40-400Gb/s, list
The lifting of fiber optic wavelength port number extends to thousands of or even 10,000 kilometers to 40 or even 160 ripples, transmission range, to DWDM multi-channel opticals
The Power Control and OSNR of signal（OSNR）Propose higher requirement.Erbium-doped fiber amplifier（EDFA）It is dwdm system
Without electric light relay transmission key technology, dwdm system design does not require nothing more than EDFA high-gains, low noise, while requiring in multichannel
Flat and unrelated with input optical power gain is provided under environment, to ensure that each wavelength channel has identical OSNR.But,
EDFA gain spectral has static uneven characteristic and the dynamic characteristic changed with the change of input optical power parameter, because
This practical EDFA needs to carry out static gain planarization and Dynamic Gain Equalizer.In ASON, due to DWDM ripples
Long dynamic configuration, Wavelength routing cause the change of EDFA input optical powers, the change of wavelength channel number to turn into normality, and the speed of change
Millisecond is reached, therefore dynamically uneven compensation proposes higher technical requirements to EDFA gain spectral, as urgently solving
Key technical problem certainly.
EDFA gain spectrals unevenness has static and two kinds of characteristics of dynamic, it is necessary to which static gain planarization and dynamic increase
Beneficial balancing technique carries out equilibrium.EDFA in dwdm system is configured with GFF (GFF), its wavelength-loss
Curve is just opposite with EDFA to be compensated static gain spectrum, it is possible to achieve the good compensation of the static uneven characteristics of EDFA.
Static gain planarization includes thin-film interference filterses, LPFG, chirp grating, blazed fiber bragg grating, level
Join the multiple technologies such as Fiber-M-Z interferometer, photonic crystal, its remaining gain unevenness degree is within ± 0.5dB, added losses
<1dB, and cost is low, small volume.Just because of GFF performances are good, price is low, therefore each EDFA is integrated with GFF devices,
Solve the static uneven compensation problem of EDFA gains.But GFF flexibility is not enough, it is impossible to compensate the dynamic of EDFA gain spectrals
Change.
In ASON, wavelength dynamic configuration causes EDFA wavelength channels gain difference, wavelength channel number dynamically to become
Change, cause the dynamic of EDFA gain spectrals uneven, by the OSNR of severe exacerbation dwdm system, the multispan of particularly many EDFA cascades
Long distance, extra long distance optical communication system.At the same time, Transmission Fibers and other optical devices（Such as dispersion compensation module）Light
Signal attenuation changes with signal wavelength, optical fiber stimulated Raman scattering（SRS）Effect causes signal power from short wavelength to long wavelength
The factor such as passage transfer and EDFA agings can also make each interchannel signal power of dwdm system unbalanced.Light caused by these factors
Power spectrum signal, gain spectral change, typically exhibit optical signal power spectrum, gain spectral with the linear change of wavelength, referred to as gain
Tilt, as shown in Figure 1.When without electronic relay is apart from more than 1000km, span more than 10 sections, the spectrum of transmission line formation inclines
Tiltedly in more than 12dB, the error code of channel significantly deteriorates.In the urgent need to a kind of dynamically adapting optical fiber link and change in gain of being capable of
Dynamic Gain Equalizer (DGE) technology carrys out compensating gain spectrum dynamic unevenness, and this is to extra long distance, vast capacity optical transport and light
The dynamic configuration of network is most important.
Major optical device producers have realized DGE commercialization both at home and abroad at present, but there is many deficiencies, and such as cost is high, body
Product is big, insertion loss is high, seriously limits DGE extensive use.In various DGE device technologies, the ratio of performance to price, application
Difficulty or ease etc. turn into the key factor for determining its success or failure.It is more much higher than EDFA price because DGE holds at high price, normally only exist
The intermediate point of DWMD systems（mid-point）, ROADM nodes just use.Therefore, be badly in need of employ new technology reduction DGE cost,
Reduce volume, can be equally integrated into each EDFA with GFF, preferably meet the requirement of ASON construction.
In order to reduce the cost of Dynamic Gain Equalizer, current EDFA production firm（Such as JDS Uniphase, Photon, hold high
Receive）An integrated quick response variable optical attenuator（VOA）With input optical signal power of decaying inside to EDFA, the program is sacrificial
Domestic animal more than 3dB luminous powers, and noise coefficient increase.Another scheme is regulation pump power to adjust inclining for EDFA gain spectrals
Tiltedly, but the program can cause increase pumping light power and noise coefficient.Because EDFA dynamic gain unevenness is mainly shown as
Gain tilt, it is balanced using dynamic gain slope（Dynamic gain slope equalization, DGSE）It is to have the most
Effect, most economical compensation way, therefore low cost, high-performance DGSE research and commercialization are equal to the dynamic gain for solving EDFA
Weighing apparatus problem is significant, it may have wide application prospect.
MEMS（MEMS）Micrometer-Nanometer Processing Technology, can be with batch micro operations high speed, accurate, miniature movable member or sensitivity
Part.The MOEMS that MEMS technology is combined to form with optical technology（MOEMS）Technology, it has also become intelligence, tunable optical
The mainstream technology of communication device.This patent has invented a kind of dynamic gain slope equalizer based on MEMS technology, realize low cost,
High performance DGSE devices, with important practical value and broad mass market prospect.
DGE devices its be substantially one have wavelength selectivity Variable Optical Attenuator（VOA）Array, it realizes skill
Art is broadly divided into work in series and the class of concurrent working two.The DGE of work in series uses the serial mode of multiple filter, Ke Yishi
Existing medium spectral resolution（Several nanometers）Gain balance, including serial harmonic filter and serial specific wavelength section wave filter two
Kind.The serial mode of the 6-8 grades of optical filters of use of serial harmonic filter, realizes that technology includes liquid crystal harmonic synthesizer, magnetic
Light overtone synthesizer, waveguide MZI harmonic synthesizers and waveguide transversal filter, its common feature are to enter the curve of spectrum to be compensated
Row Harmonic Decomposition, is then synthesized using light overtone wave filter.Device insertion loss is 3.4-4.5dB, balancing error ±
Within 0.5dB, its spectral balanced algorithm is extremely complex, causes to regulate the speed very slow（About 1 second）, device cost height.It is domestic military
The Chinese Institute of Post and Telecommunication Sciences has carried out liquid crystal harmonic wave DGE research and development, and Zhejiang University has carried out the research work of backoff algorithm.Serial specific wavelength
The decay of the single-section filter of section wave filter is limited to specific wavelength section, and desired filter is obtained by the wave filter of plural serial stage
Wave property, its main implementation technique is all -fiber acousto-optic tunable filter（AOTF）, machinery and thermal tuning optical fiber long period light
Grid（LPG）, its advantage is that all-fiber devices, insertion loss are relatively low, but its backoff algorithm is complicated, and using hand assembled, technique
Complicated, cost is high, while driving power is higher, device size is big, it is difficult to practical.
The DGE of concurrent working is combined using grating beam splitting with photokinesis modulator, and directly optical signal is entered in spectral domain
Mobile state is controlled, and backoff algorithm is simple, and it realizes that technology includes two kinds of technical schemes of Free Space Optics and planar waveguide optical.
Free Space Optics DGE realizes that array VOA uses liquid crystal or MEMS actuator part using body grating and array VOA（DMD, grating
Modulator, F-P modulators）, compensation error is within ± 0.25dB, but insertion loss is up to 6-7dB.Planar waveguide optical DGE
Using array waveguide grating（AWG）Realized with the hot light attenuator array of waveguide or waveguide thermo-optic phase shifter array, its small volume, but
Driving power consumption is higher, and its same insertion loss is big, cost is high.The DGE of highest spectral resolution can independently regulate and control each passage
Luminous power, also known as channel optical power balanced device（DCE）Or wavelength blocker（WB）.The DGE of concurrent working can realize high speed, height
The dynamic compensation of spectral resolution, but costly, insertion loss is high, and price is far above EDFA, is of limited application.
Dynamic gain slope equalizer（DGSE）The adjustable Dynamic Gain Equalizer of spectral slope is provided, to EDFA input light work(
The inclination of gain spectral can realize direct, better compensation caused by rate, pump power change, and cost is low, volume
It is small, the DGE devices of spectral slope compensation are exclusively used in, are the important development trend of DGE devices.DGSE main implementation technique includes
Magneto-optic wave filter, waveguide M-Z wave filters（Such as Fig. 2）Optical modulator is switched with MEMS antireflectives（MARS）.The magnetic that T.Naito is proposed
Light DGSE is constituted using birefringent prism, birefringent crystal plates and Faraday circulators, such as Fig. 2 (a), and insertion loss is about
1.7dB, driving power 200mW.The magneto-optic DGSE that N.Mitamura is proposed is similar to T.Naito, the difference is that being situated between using polarization
Plasma membrane and double Faraday circulators are constituted, and such as Fig. 2 (b), insertion loss is 1.8dB, and driving power is tens of mW.K.Inoue etc.
The waveguide M-Z DGSE that people proposes use the asymmetric M-Z interferometers being made up of adjustable waveguide coupler, using thermo-optic phase shifter
Realize and tune, such as Fig. 2 (c), the insertion loss of best-case is 1.4dB.H.Hatayama et al. is proposed using two-stage concatenation
Asymmetric M-Z interferometers realize waveguide M-Z DGSE technical scheme, tuning, such as Fig. 2 are also realized using thermo-optic phase shifter
(d), device insertion loss 5.4dB, power consumption 225mW.N.Azami realizes DGSE using the Fiber-M-Z interferometer of thermo-optical tunability,
Such as Fig. 2（e）, device insertion loss only 0.2dB, power consumption 250mW, response time 210ms, but need to make special wavelength spy by hand
The fiber coupler of property, technology controlling and process is highly difficult.K.W.Goossen et al. realizes DGSE, device using MEMS MARS devices
Insertion loss>2.5dB, the microsecond of regulating time 10, driving voltage 40V.The country yet there are no the correlative study work for carrying out DGSE.Though
Right DGSE is the optimal selection for realizing EDFA dynamic gain slope compensations, but is not widely applied at present, and its reason is device
Part cost is higher, insertion loss is larger, driving power consumption is higher, and the response speed of thermally-actuated devices is slow.Its technology trends is
Develop the high-performance suitable with GFF equalization performances, cost, low cost DGSE.
In summary, there is big cost height, insertion loss, driving electrical power consumed height, volume in current DGE and DGSE device technologies
It is big to wait not enough, for current DGE and DGSE device technologies it is not enough and practical the problem of, the present invention propose it is novel based on
The DGSE technical schemes of MEMS technology, realize that light splitting ratio, light phase can be independent using MEMS two-freedom micro-displacement drivers
The Free Space Optics M-Z interferometers of tuning, it is possible to achieve low insertion loss（≤0.8dB）, slope tuning range ± 0.2dB/
nm（@40nm）, tuning period≤5ms, low driving power consumption, the cost low cost suitable with GFF, high-performance DGSE devices, can
It is directly integrated into together with GFF in EDFA, so that EDFA Dynamic Gain Equalizers are solved the problems, such as, while can also be applied to solve to mend
Repay the DWDM interchannel signal powers that dispersion compensation module, SRS effects etc. cause unbalanced.The present invention will be to optic communication and light net
Network, EDFA Dynamic Gain Equalizers technology and MEMS technology development all have important scientific meaning and practical value, with wide
Application prospect.
The content of the invention
The technical problems to be solved by the invention are：A kind of fiber amplifier dynamic gain slope equalizer is provided, can be solved
Certainly EDFA Dynamic Gain Equalizers problem, can also be applied to solve the DWDM that compensation dispersion compensation module, SRS effects etc. cause and lead to
Signal power is unbalanced between road.
In addition, the present invention also provides the preparation technology of fiber amplifier dynamic gain slope equalizer, it is possible to resolve EDFA is moved
State gain balance problem.
In order to solve the above technical problems, the present invention is adopted the following technical scheme that：
A kind of fiber amplifier dynamic gain slope equalizer, the balanced device includes MEMS optical micromirror driver chips
And double-fiber collimator；
The MEMS optical micromirrors driver chip and double-fiber collimator constitute miniature Mach- by optical package
Zehnder interferometers（MZI）；
The MEMS optical micromirrors driver chip includes the first optics micro-reflector, the second optics micro-reflector, microbit
Move adjustment unit；
Level of the micro-displacement adjustment unit to control the first optics micro-reflector or/and the second optics micro-reflector
Direction or/and the microbit shifting movement of vertical direction, realize MZI splitting ratios and interfere arm planet phasing, dynamic control input WDM light
The spectral slope of signal；
The micro-displacement adjustment unit controls the microbit shifting movement of the first optics micro-reflector horizontal direction and vertical direction,
The second optics micro-reflector is static simultaneously；Or, the micro-displacement adjustment unit controls the first optics micro-reflector horizontal direction
Or/and the microbit shifting movement of vertical direction, while controlling the microbit of the second optics micro-reflector horizontal direction or/and vertical direction
Shifting movement.
As a preferred embodiment of the present invention, the second optics micro-reflector is fixed on the MEMS optical micromirrors and driven
On the substrate of dynamic device chip；
The first optics micro-reflector is movable MEMS micro mirror, and the MEMS light is suspended on by spring beam supporting mechanism
On the substrate for learning micro mirror driver chip；The spring beam supporting mechanism includes first direction support beam, second direction support beam,
First direction support beam is set in the first direction, and second direction support beam is set in a second direction；
The micro-displacement adjustment unit includes static broach driver, electrostatic plates driver；
The static broach driver is located at the both sides of silicon frame, and hangs on the MEMS light by one group of silicon spring beam
Micro mirror driver chip substrate is learned, and is connected with the MEMS optical micromirrors driver chip substrate；The static broach
Driver realizes that MZI splitting ratios are tuned to control the microbit shifting movement in the first optics micro-reflector horizontal direction；
The electrostatic plates driver includes first electrode plate, second electrode plate；First optics is set on first electrode plate
Micro-reflector, first electrode plate is connected by another group of silicon spring beam with silicon frame, and second electrode plate is that the MEMS optics is micro-
There is an air-gap between the substrate of mirror driver chip, two battery lead plates；The electrostatic plates driver is to control the first optics
Microbit shifting movement in micro-reflector vertical direction, realizes MZI interfere arm planet phasings.
As a preferred embodiment of the present invention, optical reflectance coating is coated with the first electrode plate, described first is formed
Optics micro-reflector；Optical reflectance coating is coated with the second electrode plate, the second optics micro-reflector is formed.
As a preferred embodiment of the present invention, the spring beam supporting mechanism is symmetrical, suppresses the first optics micro- anti-
Penetrate the twist motion mode of mirror.
As a kind of alternative of the present invention, the first optics micro-reflector, the second optics micro-reflector can be equal
For movable MEMS micro mirror, every piece of optics micro-reflector in the horizontal direction or vertical direction single-degree-of-freedom translational motion, two pieces of optics
The direction of motion of micro-reflector is perpendicular to one another；
It is the inputting of the optical signal of the miniature Mach-Zehnder interferometers, defeated as a preferred embodiment of the present invention
It is optical fiber to go out, and can be single mode or multimode fibre.
As a preferred embodiment of the present invention, two interfere arms of the miniature Mach-Zehnder interferometers MZI
It is long, asymmetric Mach-Zehnder interferometer is constituted, the initial optical path difference of two interfere arms is according to EDFA gain slope balanced devices
Spectral characteristic is set, by controlling the vertical microbit shifting movement of MEMS movable optical micro mirrors to exist the optical path difference of two interfere arms
0-2 π carry out dynamic tuning.
As a preferred embodiment of the present invention, the light of two interfere arms of the miniature Mach-Zehnder interferometers MZI
Splitting ratio is dynamic tuning, by the first optics micro-reflector or/and the horizontal microbit shifting movement of the second optics micro-reflector,
The first optics micro-reflector or/and the second optics micro-reflector is controlled to realize light beam splitting to double-fiber collimator hot spot reflection ratio
Compare dynamic tuning.
A kind of preparation technology of above-mentioned fiber amplifier dynamic gain slope equalizer, the preparation technology includes following step
Suddenly：
Step a：Double mask lithographies of insulator substrates silicon SOI device silicon layer are carried out, ICP quarters are carried out using first layer mask
Erosion, about a few micrometers to more than ten microns of etching depth removes first layer mask material；
Step b：ICP etchings, about a few micrometers to more than ten microns of etching depth are carried out using second layer mask, then removes second
Layer mask material；
Step c：Pyrex glass makes patterned optics reflecting film using photoresist stripping process or etching technics,
Prepare the second optics micro-reflector；
Step d：Machined SOI and Pyrex glass are subjected to silicon on glass bonding；
Step e：SOI substrate silicon and intermediate oxide layer is removed, photoetching, ICP etchings make plane broach and discharge structure,
Prepare micro-displacement adjustment unit；
Step f：Optical reflectance coating is deposited in reflector area using hard mask technique on the silicon fiml of driver, prepared
First optics micro-reflector；
Step g：The scribing of MEMS disks is carried out, physically separated single MEMS optical micromirrors driver chip is obtained；
Step h：MEMS optical micromirrors driver chip and double-fiber collimator are subjected to optical package.
As a preferred embodiment of the present invention, in the step h, double-fiber collimator uses double optical fiber of appropriate hot spot
Collimater, its collimation lens uses glass material, is processed using optical microlenses processing technology；
Optical fiber uses single-mode fiber or multimode fibre, and the optical fiber spacing of the double optical fiber head of double-fiber collimator is 0.125mm
Or other special spacing；
MEMS optical micromirrors driver chip is bonded on TO bases by glue, and uses metal lead wire technique by MEMS
The electrode of optical micromirror driver chip is electrically connected with TO base electrodes；
The Metal Packaging sleeve pipe of suitable dimension carries out airtight welding by welding technique and TO bases, is fixed on TO bases
On；
Double-fiber collimator is adjusted on optics micropositioning stage to revolve with the distance of MEMS optical micromirror driver chips, around optical axis
Turn collimater, and it is minimum to output insertion loss is coupled to finely tune its optical axis；
It will be welded, recommended using air-tightness welding between optical fiber collimator and package metals sleeve pipe；Utilize fluid sealant
Collimater is further sealed with encapsulation sleeve pipe, it is ensured that MEMS optical micromirror driver chips are operated in airtight environment, from
The influence of outside air humidity.
The beneficial effects of the present invention are：Dynamic gain slope equalizer proposed by the present invention is made using MEMS technology,
Technical maturity, high yield rate, low cost, it can be mass, with insertion loss is low, small volume, tuned speed be fast, spectral slope
The advantages of balanced range is wide, driving power is small, can be directly integrated into EDFA and realize that dynamic gain slope is balanced, also simultaneously
It can apply to solve the DWDM interchannel signal powers that Transmission Fibers, optical fiber dispersion compensation module, optical fiber SRS effects etc. are caused
Unbalanced problem, has important practical value, with wide market prospects to the development of ASON.
Brief description of the drawings
Fig. 1 is gain tilt schematic diagram of the EDFA gains with the linear change formation of wavelength.
Fig. 2（a）To Fig. 2（e）For the prior art scheme schematic diagram of dynamic gain slope equalizer.
Fig. 3 is MEMS dynamic gains slope equalizer principle schematic of the present invention.
Fig. 4（a）For asymmetric MZI of the invention optical schematic diagram.
Fig. 4（b）For double-fiber collimator outgoing Gaussian spot and the spatial relation figure of two micro-reflectors.
Fig. 4 (c）Schematic diagram for equivalent variation beam than, the asymmetric MZI of waveguide of planet phasing.
Fig. 5 (a）To Fig. 5（c）Spectral filtering performance plot for variation beam than, the asymmetric MZI of planet phasing.
Fig. 6 (a）For the structural representation of micro-displacement MEMS actuator chip of the present invention.
Fig. 6（b）For Fig. 6（a）Sectional view along AA.
Fig. 6（c）For Fig. 6（a）BB to sectional view.
Fig. 7（a）To Fig. 7（f）For MEMS actuator chip technical process figure.
Fig. 8 is the optical package structural representation of dynamic gain slope equalizer of the present invention.
Embodiment
The preferred embodiment that the invention will now be described in detail with reference to the accompanying drawings.
Embodiment one
Have that cost is high, insertion loss is big, driving power consumption is high, volume is big etc. no for current DGE and DGSE device technologies
Foot, the present invention proposes the dynamic gain slope equalizer technical scheme based on MEMS technology, using MEMS two-freedom microbits
Move driver, realize light splitting ratio, light phase can independent tuning Free Space Optics MZI, with low insertion loss, big spectrum
Slope balanced range, quick tuning, low driving power consumption, low cost, the effect of small size, can be directly integrated into together with GFF
In EDFA, so as to solve the problems, such as EDFA Dynamic Gain Equalizers.It can also be applied to solve Transmission Fibers, optical fiber dispersion compensation simultaneously
Module, optical fiber stimulated Raman scattering（SRS）The unbalanced problem of DWDM interchannel signal powers that effect etc. is caused.
Referring to Fig. 3, the fiber amplifier dynamic gain slope equalizer that the present invention is disclosed drives including MEMS optical micromirrors
Dynamic device chip 10 and double-fiber collimator 20.The MEMS optical micromirrors driver chip 10 and double-fiber collimator 20 pass through light
Encapsulation is learned, miniature MZI is constituted.Input optical signal, the output optical signal of the miniature MZI is optical fiber, can be single mode or many
Mode fiber.
The MEMS optical micromirrors driver chip 10 includes the first optics micro-reflector 12, the second optics micro-reflector
11st, micro-displacement adjustment unit；The micro-displacement adjustment unit is to control the first optics micro-reflector 12 or/and the second optics micro-
The horizontal direction of speculum 11 or/and the microbit shifting movement of vertical direction, realize MZI splitting ratios and interfere arm planet phasing, move
The spectral slope of state control input wdm optical signal.
Specifically, the micro-displacement adjustment unit control horizontal direction of the first optics micro-reflector 12 and vertical direction is micro-
Displacement movement, while the second optics micro-reflector 11 is static；Or, the micro-displacement adjustment unit controls the micro- reflection of the first optics
The microbit shifting movement of the horizontal direction of mirror 12 or/and vertical direction, at the same control the horizontal direction of the second optics micro-reflector 11 or/and
The microbit shifting movement of vertical direction.
In the present embodiment, as shown in figure 3, MEMS optical micromirrors driver chip includes one piece of dynamic optical micromirror（I.e. first
Optics micro-reflector 12）, one piece of quiet optical micromirror（That is the second optics micro-reflector 11）, dynamic and static optical micromirror is located at respectively to be driven
The film surface and substrate surface of dynamic device chip, form Free Space Optics structure, the reflective miniature MZI of light path folding；
The movable micro mirrors of MEMS can realize both horizontally and vertically two-freedom microbit shifting movement under voltage driving, static micro- with MEMS
Mirror is combined, and realizes the tuning of MZI splitting ratios and interfere arm planet phasing.
The second optics micro-reflector 11 is fixed on the substrate of the MEMS optical micromirrors driver chip；Described
One optics micro-reflector 12 is movable MEMS micro mirror, and the MEMS optics is suspended on by symmetrical spring beam supporting mechanism
On the substrate of micro mirror driver chip；The spring beam supporting mechanism includes first direction support beam, second direction support beam, the
One direction support beam is set in the first direction, and second direction support beam is set in a second direction.
The micro-displacement adjustment unit includes static broach driver, electrostatic plates driver.The static broach driving
Device be located at silicon frame both sides, and by one group of silicon spring beam hang on the MEMS optical micromirrors driver chip substrate it
On, and be connected with the MEMS optical micromirrors driver chip substrate；The static broach driver is to control the first optics
Microbit shifting movement in the horizontal direction of micro-reflector 12, realizes that MZI splitting ratios are tuned.The electrostatic plates driver includes first
Battery lead plate, second electrode plate；First electrode plate is low-resistance silicon thin film, and the first optics micro-reflector 12, first electrode are coated with thereon
Plate is connected by another group of silicon spring beam with silicon frame, and second electrode plate is the substrate of the MEMS optical micromirrors driver chip
On gold thin film（Simultaneously as the optical reflection film of the second optics micro-reflector 11）, have an air-gap between two battery lead plates；It is described
Electrostatic plates driver realizes MZI interfere arm phases to control the microbit shifting movement in the first optics micro-reflector vertical direction
Position tuning.In the present embodiment, optical reflectance coating is coated with the first electrode plate, the first optics micro-reflector 12 is formed.
The light splitting ratio of two interfere arms of the miniature Mach-Zehnder interferometers MZI is dynamic tuning, passes through
The horizontal microbit shifting movement of one optics micro-reflector 12 or/and the second optics micro-reflector 11, controls the first optics micro-reflector
12 or/and second optics micro-reflector 11 to double-fiber collimator hot spot reflection ratio realize light splitting ratio dynamic tuning.
The two interfere arm Length discrepancies of the miniature MZI, constitute asymmetric MZI, the initial optical path differences of two interfere arms according to
The spectral characteristic of EDFA gain slope balanced devices（Such as working gain spectral width）Set, by controlling MEMS movable opticals
The vertical microbit shifting movement of micro mirror carries out dynamic tuning to the optical path difference of the interfere arms of MZI two in 0-2 π.
Variation beam ratio, the asymmetric MZI of planet phasing realize optical principle such as Fig. 4（a）To Fig. 4（c）It is shown, Fig. 4（a）It is light
Learn systematic schematic diagram, Fig. 4（b）Represent that the first optics of double-fiber collimator outgoing Gaussian spot and MEMS actuator chip is micro- anti-
Penetrate mirror 12, the spatial relation of the second optics micro-reflector 11；Fig. 4（c）Equivalent variation beam than, planet phasing waveguide
Asymmetric MZI.Its spectral filtering slope tuning optical principle be：The DWDM optical signals of input are collimated through double-fiber collimator to be expanded
Beam, about 150 μm of its Gaussian spot diameter, Gaussian spot is irradiated to the first optics micro-reflector 12 of MEMS actuator chip,
On two optics micro-reflectors 11, the first optics micro-reflector 12 is the fixation micro mirror on substrate, the second optics micro-reflector
11 be the removable micro mirror being located on driver silicon fiml, the first optics micro-reflector 12, the height of the second optics micro-reflector 11
Position differs h, about several to tens μm.A Gaussian spot part（C1）Reflected by the first optics micro-reflector 12, remainder
（C2=1-C1）Reflected by the second optics micro-reflector 11, output single-mode fiber production is coupled in the collimated lens convergence of two beam reflected lights
The third contact of a total solar or lunar eclipse is interfered, and constitutes asymmetric MZI, its optical path difference is about 2h.When the second optics micro-reflector 11 is in the driving of comb drive
Lower horizontal movement（Relative to MEMS chip plane）, change asymmetric MZI splitting ratio C1:C2, the second optics micro-reflector 11 exists
The vertical drive of planar plate drive（Relative to MEMS chip plane）The lower optical path difference for changing asymmetric MZI（That is light phase）.Cause
This, Fig. 4（a）Free space MZI be optically equivalent to Fig. 4（c）Waveguide MZI, pass through the tuning of splitting ratio and phase, realize
The tuning of MZI spectral filtering slopes.
Spectral filtering characteristic of the variation beam than, asymmetric MZI is as shown in figure 5, Fig. 5（a）Represent that initial optical path difference 2h is determined
When 1530-1630nm scopes filter curve, wherein 1530-1570nm is EDFA operating wavelength range, change splitting ratio
C1:C2When, the slope of filter curve occurs to change accordingly, and spectral slope is negative value in the range of 1530-1570nm in figure.Fig. 5
（b）When representing the phase difference of regulation MZI two-arm, centre wavelength position and filter curve are moved, filter curve shape invariance.
Fig. 5（c）Represent by changing centre wavelength position, the rising edge of filter curve is moved to 1530-1570nm scopes, Ke Yishi
Existing positive spectral filtering slope.It can be seen that working as splitting ratio close to 0.5:When 0.5, spectral filtering curved is more tight
Weight, DGSE devices need optimization spectral slope adjustable extent, the free spectral domain of spectral filtering curve when designing（FSR）Size is with
The parameters such as heart wavelength location.
MEMS optical micromirrors driver chip includes two pieces of MEMS optics micro-reflectors, and one of MEMS micromirror is fixed on
In chip substrate, another piece of micro mirror is movable MEMS micro mirror, by symmetrical spring beam supporting construction, by movable MEMS micro mirror
On a chip substrate, one kind realizes double freedom MEMS optical micromirror driver chip structures as shown in fig. 6, using other for suspension
Structure can also realize the function of the MEMS chip.In figure 6, the horizontal microbit shifting movement of MEMS micromirror uses static broach
Type of drive, realizes that MZI splitting ratios are tuned, and comb drive is located at the both sides of silicon frame, and passes through one group of symmetrical silicon
Spring beam is hung on chip substrate, and is linked with chip substrate.The vertical microbit shifting movement of MEMS micromirror is flat using electrostatic
Plate type of drive, realizes MZI interfere arm planet phasings, a battery lead plate of MEMS parallel flat drivers（Optics is coated with thereon
Reflectance coating）It is connected by another group of symmetrical spring beam with silicon frame, another battery lead plate is chip substrate, two battery lead plates
Between have an air-gap.
Present invention additionally comprises the manufacture of MEMS micromirror driver chip and the optical package two of dynamic gain slope equalizer
Part, embodiment given here is only a possible specific embodiment, and the scope of authority of the present invention is not influenceed.
The present invention also discloses the preparation of fiber amplifier dynamic gain slope equalizer described in embodiment one and embodiment two
Technique, including MEMS micromirror driver chip manufacturing step, and dynamic gain slope equalizer optical packaging step.Specifically
Step is as follows：
1）MEMS micromirror driver chip manufacturing step
With the movable MEMS micromirror driver of single MEMS micromirror, the i.e. reality of MEMS two-freedoms micro-displacement driver chip
Apply process to illustrate, its MEMS structure is as shown in fig. 6, technical process such as Fig. 7（a）To Fig. 7（f）It is shown.
The main technique of MEMS micromirror driver chip is silicon on glass bonding and translation broach technique, is MEMS body silicon works
Ripe technology in skill.Technical process is as follows：
（a）Double mask lithographies of SOI device silicon layer, ICP etchings, about 6 μm of etching depth are carried out using first layer mask；
（b）First layer mask material is removed, ICP etchings, about 2.5 μm of etching depth, then clearly are carried out using second layer mask
Except second layer mask material；
（c）The glass of Pyrex 7740 makes patterned golden reflective film using photoresist stripping process；
（d）Machined SOI and 7740 glass are subjected to silicon on glass bonding；
（e）SOI substrate silicon and intermediate oxide layer is removed, photoetching, ICP etchings make plane broach and discharge structure；
（f）Au reflectance coatings are deposited in reflector area using hard mask technique on the silicon fiml of driver.
（g）The scribing of MEMS disks is finally carried out, physically separated single MEMS micromirror driver chip is obtained.
2）The optical packaging step of dynamic gain slope equalizer
The specific embodiment of the optical package of dynamic gain slope equalizer uses standard TO encapsulating structures, passes through suitable chi
Very little Metal Packaging sleeve pipe 801 is fixed, as shown in Figure 8.
Double-fiber collimator is using 150 μm of small light spot double-fiber collimators of Ф of customization, and its collimation lens 806 is using refraction
Rate is 1.7447 glass material, and focal length is about 0.75mm, and corresponding C-Lens spherical radius is about 0.55mm, micro- using optics
Lens processing technology is processed.Optical fiber uses standard single-mode fiber, and the spacing of double optical fiber head is 0.125mm.MEMS micromirror is driven
Device chip（That is MEMS chip）10 by adhesive glue 802 on TO bases 805, and using metal lead wire technique by MEMS chip 10
Electrode 804 electrically connected with the electrode of TO bases 805.The Metal Packaging sleeve pipe 801 of suitable dimension passes through parallel seam welding technology and TO
Base carries out airtight welding, is fixed on TO bases 805.Double-fiber collimator and MEMS chip 10 are adjusted on optics micropositioning stage
Distance, around optical axis rotary collimator, and it is minimum to output insertion loss is coupled to finely tune its optical axis.Metal Packaging sleeve pipe 801
Surrounding is designed with welding hole 803, is welded for metal between optical fiber collimator and encapsulation sleeve pipe（Such as soldering, laser welding）,
Recommend using air-tightness welding.Collimater 807 is sealed with encapsulation sleeve pipe using fluid sealant 808, while in weld
Apply fluid sealant, it is ensured that MEMS chip is operated in airtight environment, from the influence of outside air humidity.
Embodiment two
In the present embodiment, the first optics micro-reflector, the second optics micro-reflector are movable MEMS micro mirror.
The micro-displacement adjustment unit includes static broach driver, electrostatic plates driver.
The static broach driver is located at the both sides of silicon frame, and hangs on the MEMS light by one group of silicon spring beam
Micro mirror driver chip substrate is learned, and is connected with the MEMS optical micromirrors driver chip substrate；The static broach
Driver realizes that MZI splitting ratios are tuned to control the microbit shifting movement in the first optics micro-reflector horizontal direction.
In the present embodiment, the electrostatic plates driver includes first electrode plate, second electrode plate；First electrode plate is located at
Under first optics micro-reflector, be coated with the second optics micro-reflector thereon, first electrode plate by another group of silicon spring beam with
Silicon frame is connected, and second electrode plate is to have an air between the substrate of the MEMS optical micromirrors driver chip, two battery lead plates
Gap；The electrostatic plates driver realizes that MZI is done to control the microbit shifting movement in the second optics micro-reflector vertical direction
Relate to arm planet phasing.
The technical characterstic of the present embodiment is：First optics micro-reflector, the second optics micro-reflector are single-degree-of-freedom fortune
It is dynamic, the two completely self-contained motion controls of optics micro-reflector are realized, technological parameter span is wider in MEMS chip design,
The structure of its certain chip, manufacturing process flow are also slightly complicated.
In summary, dynamic gain slope equalizer proposed by the present invention is made using MEMS technology, technical maturity, finished product
The high and low cost of rate, it can be mass, with insertion loss is low, wide spectral slope balanced range, small volume, tuned speed is fast, drive
The advantages of power is small is moved, can be directly integrated into EDFA and realize that dynamic gain slope is balanced, while solution can also be applied to
The unbalanced problem of DWDM interchannel signal powers that certainly Transmission Fibers, optical fiber dispersion compensation module, optical fiber SRS effects etc. are caused,
There is important practical value to the development of ASON, with wide market prospects.
Here description of the invention and application be illustrative, be not wishing to limit the scope of the invention to above-described embodiment
In.The deformation and change of embodiments disclosed herein are possible, real for those skilled in the art
The replacement and equivalent various parts for applying example are known.It should be appreciated by the person skilled in the art that not departing from the present invention
Spirit or essential characteristics in the case of, the present invention can in other forms, structure, arrangement, ratio, and with other components,
Material and part are realized.In the case where not departing from scope and spirit of the present invention, embodiments disclosed herein can be entered
The other deformations of row and change.
Claims (11)
1. a kind of fiber amplifier dynamic gain slope equalizer, it is characterised in that the balanced device includes MEMS optical micromirrors
Driver chip and double-fiber collimator；
The MEMS optical micromirrors driver chip and double-fiber collimator constitute miniature Mach-Zehnder by optical package
Interferometer MZI；
The MEMS optical micromirrors driver chip includes the first optics micro-reflector, the second optics micro-reflector, microbit transposition
Save unit；
Horizontal direction of the micro-displacement adjustment unit to control the first optics micro-reflector or/and the second optics micro-reflector
Or/and the microbit shifting movement of vertical direction, realize MZI splitting ratios and interfere arm planet phasing, dynamic control input wdm optical signal
Spectral slope；
The micro-displacement adjustment unit includes static broach driver, electrostatic plates driver；
The static broach driver is located at the both sides of silicon frame, and it is micro- by one group of silicon spring beam to hang on the MEMS optics
On mirror driver chip substrate, and it is connected with the MEMS optical micromirrors driver chip substrate；The static broach driving
Device realizes that MZI splitting ratios are tuned to control the microbit shifting movement in the first optics micro-reflector horizontal direction；
The electrostatic plates driver includes first electrode plate, second electrode plate；Set the first optics micro- anti-on first electrode plate
Mirror is penetrated, first electrode plate is connected by another group of silicon spring beam with silicon frame, second electrode plate drives for the MEMS optical micromirrors
There is an air-gap between the substrate of dynamic device chip, two battery lead plates；The electrostatic plates driver is to control the first optics micro- anti-
The microbit shifting movement penetrated in mirror vertical direction, realizes MZI interfere arm planet phasings.
2. fiber amplifier dynamic gain slope equalizer according to claim 1, it is characterised in that：
The micro-displacement adjustment unit controls the microbit shifting movement of the first optics micro-reflector horizontal direction and vertical direction, simultaneously
Second optics micro-reflector is static；Or, the micro-displacement adjustment unit control the first optics micro-reflector horizontal direction or/and
The microbit shifting movement of vertical direction, while controlling the microbit movement of the second optics micro-reflector horizontal direction or/and vertical direction
It is dynamic.
3. fiber amplifier dynamic gain slope equalizer according to claim 1, it is characterised in that：
The second optics micro-reflector is fixed on the substrate of the MEMS optical micromirrors driver chip；
The first optics micro-reflector is movable MEMS micro mirror, is suspended on the MEMS optics by spring beam supporting mechanism micro-
On the substrate of mirror driver chip；The spring beam supporting mechanism includes first direction support beam, second direction support beam, first
Direction support beam is set in the first direction, and second direction support beam is set in a second direction.
4. fiber amplifier dynamic gain slope equalizer according to claim 3, it is characterised in that：
Optical reflectance coating is coated with the first electrode plate, the first optics micro-reflector is formed；
Optical reflectance coating is coated with the second electrode plate, the second optics micro-reflector is formed.
5. fiber amplifier dynamic gain slope equalizer according to claim 3, it is characterised in that：
The spring beam supporting mechanism is symmetrical, suppresses the twist motion mode of the first optics micro-reflector.
6. fiber amplifier dynamic gain slope equalizer according to claim 3, it is characterised in that：
The first optics micro-reflector, the second optics micro-reflector can be movable MEMS micro mirror, the micro- reflection of every piece of optics
In the horizontal direction or vertical direction single-degree-of-freedom translational motion, the direction of motion of two pieces of optics micro-reflectors is perpendicular to one another for mirror.
7. fiber amplifier dynamic gain slope equalizer according to claim 1, it is characterised in that：
Input, the output of the optical signal of the miniature Mach-Zehnder interferometers are optical fiber, can be single mode or multimode light
It is fine.
8. fiber amplifier dynamic gain slope equalizer according to claim 1, it is characterised in that：
Two interfere arm Length discrepancies of the miniature Mach-Zehnder interferometers, constitute asymmetric Mach-Zehnder interferometer,
The initial optical path difference of two interfere arms is set according to the spectral characteristic of EDFA gain slope balanced devices, by controlling MEMS movable
The vertical microbit shifting movement of optical micromirror carries out dynamic tuning to the optical path difference of two interfere arms in 0-2 π.
9. fiber amplifier dynamic gain slope equalizer according to claim 1, it is characterised in that：
The light splitting ratio of two interfere arms of the miniature Mach-Zehnder interferometers MZI is dynamic tuning, passes through the first light
The horizontal microbit shifting movement of micro-reflector or/and the second optics micro-reflector is learned, the first optics micro-reflector or/and second is controlled
Optics micro-reflector realizes light splitting ratio dynamic tuning to double-fiber collimator hot spot reflection ratio.
10. a kind of preparation technology of one of claim 1 to 9 fiber amplifier dynamic gain slope equalizer, its feature
It is, the preparation technology comprises the following steps：
Step a：Double mask lithographies of insulator substrates silicon SOI device silicon layer are carried out, ICP etchings are carried out using first layer mask,
A few micrometers to more than ten microns of etching depth, removes first layer mask material；
Step b：ICP etchings, a few micrometers to more than ten microns of etching depth are carried out using second layer mask, then removes second layer mask
Material；
Step c：Pyrex glass makes patterned optics reflecting film using photoresist stripping process or etching technics, prepares
Go out the second optics micro-reflector；
Step d：Machined SOI and Pyrex glass are subjected to silicon on glass bonding；
Step e：SOI substrate silicon and intermediate oxide layer is removed, photoetching, ICP etchings make plane broach and discharge structure, prepare
Go out micro-displacement adjustment unit；
Step f：Optical reflectance coating is deposited in reflector area using hard mask technique on silicon fiml, the first optics is prepared micro- anti-
Penetrate mirror；
Step g：The scribing of MEMS disks is carried out, physically separated single MEMS optical micromirrors driver chip is obtained；
Step h：MEMS optical micromirrors driver chip and double-fiber collimator are subjected to optical package.
11. preparation technology according to claim 10, it is characterised in that：
In the step h, double-fiber collimator uses the double-fiber collimator of appropriate hot spot, and its collimation lens uses glass material
Material, is processed using optical microlenses processing technology；
Optical fiber uses single-mode fiber or multimode fibre, and the optical fiber spacing of the double optical fiber head of double-fiber collimator is 0.125mm or big
In 0.125mm setting spacing；
MEMS optical micromirrors driver chip is bonded on the coaxial bases of transistor outline TO by glue, and uses metal lead wire
Technique electrically connects the electrode of MEMS optical micromirror driver chips with TO base electrodes；
The Metal Packaging sleeve pipe of suitable dimension carries out airtight welding by welding technique and TO bases, is fixed on TO bases；
Double-fiber collimator is adjusted on optics micropositioning stage and rotates standard with the distance of MEMS optical micromirror driver chips, around optical axis
Straight device, and it is minimum to output insertion loss is coupled to finely tune its optical axis；
It will be welded, recommended using air-tightness welding between optical fiber collimator and package metals sleeve pipe；
Collimater is further sealed with encapsulation sleeve pipe using fluid sealant, it is ensured that MEMS optical micromirror driver chips are operated in gas
In close environment, from the influence of outside air humidity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210563947.4A CN103885177B (en) | 2012-12-21 | 2012-12-21 | Fiber amplifier dynamic gain slope equalizer and its preparation technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210563947.4A CN103885177B (en) | 2012-12-21 | 2012-12-21 | Fiber amplifier dynamic gain slope equalizer and its preparation technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103885177A CN103885177A (en) | 2014-06-25 |
| CN103885177B true CN103885177B (en) | 2017-09-12 |
Family
ID=50954155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210563947.4A Active CN103885177B (en) | 2012-12-21 | 2012-12-21 | Fiber amplifier dynamic gain slope equalizer and its preparation technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103885177B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6480091B1 (en) | 2017-07-06 | 2019-03-06 | 浜松ホトニクス株式会社 | Mirror unit and optical module |
| CN108061884B (en) * | 2017-11-10 | 2021-12-03 | 无锡英菲感知技术有限公司 | Shared window laser radar system based on micro-mirror |
| CN112688166B (en) * | 2019-10-18 | 2022-10-18 | 华为技术有限公司 | Chaotic laser and laser radar |
| JP7387149B2 (en) * | 2019-10-29 | 2023-11-28 | 湖北工業株式会社 | gradient gain equalizer |
| CN112993745B (en) * | 2019-12-13 | 2022-06-10 | 潍坊华光光电子有限公司 | Pin structure for improving TO packaging airtightness and sintering method |
| CN111721971B (en) * | 2020-06-29 | 2022-08-16 | 中国科学院空天信息创新研究院 | High-sensitivity MEMS resonant acceleration sensor |
| WO2022103997A1 (en) * | 2020-11-15 | 2022-05-19 | Naiqian Han | Optical mems based intracranial pressure and intracranial temperature monitor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1538654A (en) * | 2003-10-23 | 2004-10-20 | 武汉光迅科技有限责任公司 | Mixed type dynamic light gain equilibrium method used in WDM system |
| CN101408645A (en) * | 2008-11-25 | 2009-04-15 | 中国科学院上海微系统与信息技术研究所 | Ellipse light spot optical fiber collimator and application thereof |
| CN102834764A (en) * | 2010-03-09 | 2012-12-19 | 斯维尔系统 | Technique to determine mirror position in optical interferometers |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8351789B2 (en) * | 2007-07-23 | 2013-01-08 | Nistica, Inc. | High resolution digital optical encoder/decoder |
| JP4895052B2 (en) * | 2008-06-10 | 2012-03-14 | 横河電機株式会社 | Delay interferometer |
-
2012
- 2012-12-21 CN CN201210563947.4A patent/CN103885177B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1538654A (en) * | 2003-10-23 | 2004-10-20 | 武汉光迅科技有限责任公司 | Mixed type dynamic light gain equilibrium method used in WDM system |
| CN101408645A (en) * | 2008-11-25 | 2009-04-15 | 中国科学院上海微系统与信息技术研究所 | Ellipse light spot optical fiber collimator and application thereof |
| CN102834764A (en) * | 2010-03-09 | 2012-12-19 | 斯维尔系统 | Technique to determine mirror position in optical interferometers |
Non-Patent Citations (3)
| Title |
|---|
| 低电压驱动的MEMS F-P可调光学滤波器研究;翟雷应;《光电子激光》;20110731;第22卷(第7期);第965-971页 * |
| 基于MEMS静电微棱镜驱动器的光纤相位调制器;翟雷应;《光电子激光》;20120930;第23卷(第9期);第1635-1643页 * |
| 掺饵光纤放大器的动态增益均衡;周亚凌;《电子器件》;20030630;第26卷(第2期);第186-189页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103885177A (en) | 2014-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103885177B (en) | Fiber amplifier dynamic gain slope equalizer and its preparation technology | |
| Lin et al. | Opportunities and challenges for MEMS in lightwave communications | |
| US7529444B2 (en) | Optical steering element and method | |
| Wu et al. | Optical MEMS for lightwave communication | |
| CN103885122B (en) | MEMS array electric tunable optical attenuator and preparation method thereof | |
| US6618519B2 (en) | Switch and variable optical attenuator for single or arrayed optical channels | |
| US20020164114A1 (en) | Reconfigurable free space wavelength cross connect | |
| CN106772752A (en) | Based on MEMS tunable wave length FP optical fiber filters and preparation method thereof | |
| WO2015010468A1 (en) | Optical switch and optical switch array | |
| US7289262B2 (en) | Optical attenuator element, and variable optical equalizer and optical amplifier that use this optical attenuator element | |
| US6897995B2 (en) | Method and device for variable optical attenuator | |
| CN110780506A (en) | All-optical tunable filter based on silicon-based micro-ring | |
| JP4158895B2 (en) | Functional optical fiber connector | |
| EP1841277A2 (en) | Multiport switch for an optical performance monitor | |
| US20050068612A1 (en) | Pre-programmable optical filtering / amplifying method and apparatus | |
| Sumriddetchkajorn et al. | A reconfigurable thin-film filter-based 2 x 2 add-drop fiber-optic switch structure | |
| CN102313985B (en) | Two-circuit integrated variable optical attenuator with teeterboard structure and manufacturing method thereof | |
| KR100441560B1 (en) | Apparatus for obtaining variable optical attenuation using photonic crystal structures | |
| JP5151794B2 (en) | Optical module, optical module optical control method, optical switch, and optical switch method | |
| JP2004317642A (en) | Optical attenuator and light attenuator array | |
| KR100442831B1 (en) | Optical switch and manufacturing method thereof | |
| Wu et al. | Microelectromechanical systems for lightwave communication | |
| JP2005321711A (en) | Variable optical attenuator | |
| JP2004077708A (en) | Optical attenuator | |
| CN113534353A (en) | Wavelength selective switch and debugging method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20151231 Address after: 201815 Shanghai City, Jiading District Xing Xian Lu building 3157, No. 1368 3 Applicant after: Shanghai Xirui Technology Co., Ltd. Address before: Hongkong Chinese Gloucester Road No. 128 Xiang Feng building 15 building A-B room Applicant before: MEMS TECHNOLOGY (HONG KONG)LIMITED |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180413 Address after: 201200 A-522, room 188, Yasheng Road, China (Shanghai) free trade pilot area, Pudong New Area, Shanghai. Patentee after: Shanghai Ying Ao core network partnership enterprise (limited partnership) Address before: 201815 Shanghai City, Jiading District Xing Xian Lu building 3157, No. 1368 3 Patentee before: Shanghai Xirui Technology Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210707 Address after: Room 307, 3rd floor, 1328 Dingxi Road, Changning District, Shanghai 200050 Patentee after: Shanghai Silicon Technology Co.,Ltd. Address before: Room a-522, 188 Yesheng Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai, 201200 Patentee before: Shanghai Yingaoxin Internet of Things Partnership (L.P.) |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Room 307, 3rd floor, 1328 Dingxi Road, Changning District, Shanghai 200050 Patentee after: Shanghai Sirui Technology Co.,Ltd. Address before: Room 307, 3rd floor, 1328 Dingxi Road, Changning District, Shanghai 200050 Patentee before: Shanghai Silicon Technology Co.,Ltd. |