CN103778853B - Segregative electronic installation - Google Patents
Segregative electronic installation Download PDFInfo
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- CN103778853B CN103778853B CN201210398037.5A CN201210398037A CN103778853B CN 103778853 B CN103778853 B CN 103778853B CN 201210398037 A CN201210398037 A CN 201210398037A CN 103778853 B CN103778853 B CN 103778853B
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- capsule
- viscose glue
- stickum
- utricule
- segregative
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Abstract
The invention discloses a kind of segregative electronic installation and comprise backlight module, panel and combined type adhesive tape.Described panel is pasted on described backlight module by described combined type adhesive tape.Described combined type adhesive tape comprises base material, the first bonding coat and the second bonding coat.The first surface that described first bonding coat is formed at described base material is pasted on described panel, and described second bonding coat be formed at described base material second surface on and be pasted on described backlight module, wherein said first surface is relative with described second surface.Described first bonding coat comprises the first viscose glue and multiple first capsule, and described first capsule comprises the first utricule and first can reduce stickum, and described first can reduce stickum and be coated in described first utricule.When described first utricule destroyed and disengage described first can reduce stickum time, described first can reduce stickum with described first viscose glue contacts, thus reduces the viscosity of described first viscose glue.
Description
Technical field
The present invention relates to a kind of electronic installation, particularly relate to a kind of segregative electronic installation.
Background technology
Now, display device is utilize housing (bezel) to be fixed on backlight module by display panel mostly.In order to pursue lightness and slimming, some display device can omit housing, and changes and utilize adhesive tape to be pasted on the glue frame of backlight module by display panel.Owing to lacking the fixing of housing, the adhesive tape being used for pasting must have certain viscosity, to be pasted on firmly on the glue frame of backlight module by display panel.Need display panel to disassemble when pasting inaccurate or display panel and breaking down when carrying out heavy industry or change, because display panel can be pasted on the glue frame of backlight module by existing adhesive tape firmly, display panel is made to be not easy to be removed, if remove display panel by force, the damage of display panel and/or backlight module probably can be caused.
Summary of the invention
Technical matters to be solved by this invention is: in order to make up the deficiencies in the prior art, provides a kind of segregative electronic installation, to solve the problem.
Segregative electronic installation of the present invention is by the following technical solutions:
Described segregative electronic installation comprises backlight module, panel and combined type adhesive tape.Described panel is pasted on described backlight module by described combined type adhesive tape.Described combined type adhesive tape comprises base material, the first bonding coat and the second bonding coat.The first surface that described first bonding coat is formed at described base material is pasted on described panel, and described second bonding coat be formed at described base material second surface on and be pasted on described backlight module, wherein said first surface is relative with described second surface.Described first bonding coat comprises the first viscose glue and multiple first capsule, and described first capsule comprises the first utricule and first can reduce stickum, and described first can reduce stickum and be coated in described first utricule.When described first utricule destroyed and disengage described first can reduce stickum time, described first can reduce stickum with described first viscose glue contacts, thus reduces the viscosity of described first viscose glue.
Described multiple first capsule shape is formed on described first surface, and described first viscose glue is formed on described multiple first capsule.
Described multiple first capsule and described first viscose glue mix.
The grain size of described first capsule is between 5 microns and 100 microns.
The material of described first utricule is that external force can destroy material, and described first can to reduce stickum be organic solvent.
Described first utricule is by pressurization, heating or irradiate destroyed with the light of specific wavelength.
Described second bonding coat comprises the second viscose glue and multiple second capsule, and described second capsule comprises the second utricule and second can reduce stickum, and described second can reduce stickum and be coated in described second utricule.When described second utricule destroyed and disengage described second can reduce stickum time, described second can reduce stickum with described second viscose glue contacts, thus reduces the viscosity of described second viscose glue.
Described multiple second capsule shape is formed on described second surface, and described second viscose glue is formed on described multiple second capsule.
Described multiple second capsule and described second viscose glue mix.
The grain size of described second capsule is between 5 microns and 100 microns.
The material of described second utricule is that external force can destroy material, and described second can to reduce stickum be organic solvent.
Described second utricule is by pressurization, heating or irradiate destroyed with the light of specific wavelength.
Described panel is display panel, contact panel or touch-control display panel.
Therefore, according to technique scheme, segregative electronic installation of the present invention at least has following advantages and beneficial effect: the present invention adds multiple capsule in bonding coat, and stickum can be reduced be coated in the utricule of capsule, when capsule utricule because of pressurization, heating or with the light of specific wavelength (such as, electromagnetic wave) irradiate and destroy time, can reduce stickum will disengage and contact with viscose glue from utricule, thus reduction viscose glue viscosity.Now, because the viscosity of viscose glue reduces, the panel be pasted on backlight module by bonding coat just can be removed easily, to carry out heavy industry or replacing.It should be noted that, combined type adhesive tape of the present invention also can be used for pasting other object, and combined type adhesive tape can easily be removed from other object, is not limited to be used for sticking panel and backlight module.In addition, the viscose glue in bonding coat can separate or mix, depending on practical application with capsule.
Accompanying drawing explanation
Fig. 1 is the diagrammatic cross-section of the combined type adhesive tape of first embodiment of the invention.
Fig. 2 is the diagrammatic cross-section of the combined type adhesive tape of second embodiment of the invention.
Fig. 3 is the diagrammatic cross-section of the combined type adhesive tape of third embodiment of the invention.
Fig. 4 is the diagrammatic cross-section of the combined type adhesive tape of fourth embodiment of the invention.
Fig. 5 is the partial cutaway schematic of the segregative electronic installation of fifth embodiment of the invention.
Fig. 6 is the partial cutaway schematic of the segregative electronic installation of sixth embodiment of the invention.
Wherein, description of reference numerals is as follows:
1, the segregative electronics of 2,3,4 combined type adhesive tape 5,6
Device
10 base material 12 first bonding coats
14 first release film 16 second bonding coats
18 second release film 50 backlight modules
52 panel 100 first surfaces
102 second surface 120 first viscose glues
122 first capsule 160 second viscose glues
162 second capsule 500 glue frames
1220 first utricules 1,222 first can reduce sticky
Property material
1620 second utricules 1,622 second can reduce sticky
Property material
Embodiment
Please refer to Fig. 1, Fig. 1 is the diagrammatic cross-section of the combined type adhesive tape 1 of first embodiment of the invention.As shown in Figure 1, combined type adhesive tape 1 comprises base material 10, first bonding coat 12 and the first release film 14.First bonding coat 12 is formed on the first surface 100 of base material 10, and the first release film 14 is formed on the first bonding coat 12.In the present embodiment, the first bonding coat 12 comprises the first viscose glue 120 and multiple first capsule 122, and wherein multiple first capsule 122 is formed on the first surface 100 of base material 10, and the first viscose glue 120 is formed on multiple first capsule 122.Each first capsule 122 comprises the first utricule 1220 and first can reduce stickum 1222, and first can reduce stickum 1222 and be coated in the first utricule 1220.In the present embodiment, base material 10 can be foamed cotton, and the material of the first utricule 1220 can be that external force can destroy material, such as plastics, and first can to reduce stickum 1222 can be organic solvent, such as alcohol.Preferably, the grain size of the first capsule 122 can between 5 microns and 100 microns.In the present embodiment, the first utricule 1220 is by pressurizeing, heating or irradiate with the light of specific wavelength (such as, electromagnetic wave) destroyed.
In time manufacturing combined type adhesive tape 1, can, by base material 10 fixed placement, the first capsule 122 be coated on the first surface 100 of base material 10, the first viscose glue 120 be coated on the first capsule 122, then the first release film 14 is covered on the first viscose glue 120.In addition, in time manufacturing combined type adhesive tape 1, roller set also can be utilized to be pulled out by base material 10, the first capsule 122 is coated on the first surface 100 of base material 10, first viscose glue 120 is coated on the first capsule 122, then the first release film 14 is covered on the first viscose glue 120.It should be noted that, the manufacture of combined type adhesive tape 1 of the present invention can design according to practical application, is not limited with above-described embodiment.
When utilizing combined type adhesive tape 1 of the present invention to carry out substrates, the first release film 14 must first remove by user, then is pasted on by object on the first viscose glue 120 of the first bonding coat 12.When user is for removing object from combined type adhesive tape 1, pressurization, heating can be utilized or irradiate the first utricule 1220 destroying the first capsule 122 with the light of specific wavelength (such as, electromagnetic wave).When the first utricule 1220 destroyed and disengage first can reduce stickum 1222 time, first can reduce stickum 1222 can contact with the first viscose glue 120, thus reduces the viscosity of the first viscose glue 120.Now, because the viscosity of the first viscose glue 120 reduces, the object be pasted on the first bonding coat 12 just can be removed easily.
Please refer to Fig. 2, Fig. 2 is the diagrammatic cross-section of the combined type adhesive tape 2 of second embodiment of the invention.Combined type adhesive tape 2 is with the main difference part of aforesaid combined type adhesive tape 1, and multiple first capsule 122 of combined type adhesive tape 2 and the first viscose glue 120 mix.In time manufacturing combined type adhesive tape 2, first the first capsule 122 and the first viscose glue 120 can be mixed, then form the first bonding coat 12 by mixed first capsule 122 and the disposable first surface 100 coating base material 10 of the first viscose glue 120.In other words, the first viscose glue 120 in the first bonding coat 12 of the present invention can separate or mix, depending on practical application with the first capsule 122.It should be noted that, the assembly of label identical to those shown in Fig. 1 in Fig. 2, its action principle is roughly the same, does not repeat them here.
Please refer to Fig. 3, Fig. 3 is the diagrammatic cross-section of the combined type adhesive tape 3 of third embodiment of the invention.Combined type adhesive tape 3 is with the main difference part of aforesaid combined type adhesive tape 1, and combined type adhesive tape 3 also comprises the second bonding coat 16 and the second release film 18.Second bonding coat 16 is formed at the second surface 102 of base material 10, and the second release film 18 is formed on the second bonding coat 16, and wherein first surface 100 is relative with second surface 102.In the present embodiment, the second bonding coat 16 comprises the second viscose glue 160 and multiple second capsule 162, and wherein multiple second capsule 162 is formed on the second surface 102 of base material 10, and the second viscose glue 160 is formed on multiple second capsule 162.Each second capsule 162 comprises the second utricule 1620 and second can reduce stickum 1622, and second can reduce stickum 1622 and be coated in the second utricule 1620.In the present embodiment, the material of the second utricule 1620 can be that external force can destroy material, such as plastics, and second can to reduce stickum 1622 can be organic solvent, such as alcohol.Preferably, the grain size of the second capsule 162 can between 5 microns and 100 microns.The manufacture of combined type adhesive tape 3 is roughly the same with the manufacture of combined type adhesive tape 1, does not repeat them here.It should be noted that, the assembly of label identical to those shown in Fig. 1 in Fig. 3, its action principle is roughly the same, does not repeat them here.In the present embodiment, the second utricule 1620 is also by pressurizeing, heating or irradiate with the light of specific wavelength (such as, electromagnetic wave) destroyed.
When utilizing combined type adhesive tape 3 of the present invention to carry out substrates, the first release film 14 must first remove by user, then is pasted on by object on the first viscose glue 120 of the first bonding coat 12.Then, the second release film 18 is removed, then another object is pasted on the second viscose glue 160 of the second bonding coat 16.When user is for removing object from combined type adhesive tape 3, pressurization, heating can be utilized or irradiate with the light of specific wavelength (such as, electromagnetic wave) and destroy the first utricule 1220 of the first capsule 122 and/or the second utricule 1620 of the second capsule 162.When the first utricule 1220 and/or the second utricule 1620 destroyed and disengage first can reduce stickum 1222 and/or second can reduce stickum 1622 time, first can reduce stickum 1222 and/or second can reduce stickum 1622 and can contact with the first viscose glue 120 and/or the second viscose glue 160, thus reduces the viscosity of the first viscose glue 120 and/or the second viscose glue 160.Now, because the viscosity of the first viscose glue 120 and/or the second viscose glue 160 reduces, the object be pasted on the first bonding coat 12 and/or the second bonding coat 16 just can be removed easily.
Please refer to Fig. 4, Fig. 4 is the diagrammatic cross-section of the combined type adhesive tape 4 of fourth embodiment of the invention.Combined type adhesive tape 4 is with the main difference part of aforesaid combined type adhesive tape 3, and multiple first capsule 122 of combined type adhesive tape 4 and the first viscose glue 120 mix and multiple second capsule 162 and the second viscose glue 160 mix.In time manufacturing combined type adhesive tape 4, can first the first capsule 122 and the first viscose glue 120 be mixed and the second capsule 162 and the second viscose glue 160 be mixed, form the first bonding coat 12 by mixed first capsule 122 and the disposable first surface 100 coating base material 10 of the first viscose glue 120 again, and form the second bonding coat 16 by mixed second capsule 162 and the disposable second surface 102 coating base material 10 of the second viscose glue 160.In other words, the first viscose glue 120 in first bonding coat 12 of the present invention can separate or mix with the first capsule 122, and the second viscose glue 160 in the second bonding coat 16 can separate or mix, depending on practical application with the second capsule 162.It should be noted that, the assembly of label identical with shown in Fig. 3 in Fig. 4, its action principle is roughly the same, does not repeat them here.
Please refer to Fig. 5, Fig. 5 is the partial cutaway schematic of the segregative electronic installation 5 of fifth embodiment of the invention.As shown in Figure 5, segregative electronic installation 5 comprises backlight module 50, panel 52 and above-mentioned combined type adhesive tape 3, and wherein panel 52 is pasted on the glue frame 500 of backlight module 50 by combined type adhesive tape 3.In the present embodiment, segregative electronic installation 5 can be display device, contactor control device or touch control display apparatus, and panel 52 can be display panel, contact panel or touch-control display panel, depending on practical application.When utilizing above-mentioned combined type adhesive tape 3 to be pasted on backlight module 50 by panel 52, the first release film 14 must first remove by user, then is pasted on the first viscose glue 120 of the first bonding coat 12 by panel 52.Then, the second release film 18 is removed, then the glue frame 500 of backlight module 50 is pasted on the second viscose glue 160 of the second bonding coat 16.It should be noted that, the assembly of label identical with shown in Fig. 3 in Fig. 5, its action principle is roughly the same, does not repeat them here.
When user is for removing panel 52 from the glue frame 500 of backlight module 50, pressurization, heating can be utilized or irradiate with the light of specific wavelength (such as, electromagnetic wave) and destroy the first utricule 1220 of the first capsule 122 and/or the second utricule 1620 of the second capsule 162.When the first utricule 1220 and/or the second utricule 1620 destroyed and disengage first can reduce stickum 1222 and/or second can reduce stickum 1622 time, first can reduce stickum 1222 and/or second can reduce stickum 1622 and can contact with the first viscose glue 120 and/or the second viscose glue 160, thus reduces the viscosity of the first viscose glue 120 and/or the second viscose glue 160.Now, because the viscosity of the first viscose glue 120 and/or the second viscose glue 160 reduces, panel 52 just can remove from the glue frame 500 of backlight module 50 easily, to carry out heavy industry or replacing.
Please refer to Fig. 6, Fig. 6 is the partial cutaway schematic of the segregative electronic installation 6 of sixth embodiment of the invention.Segregative electronic installation 6 is with the main difference part of aforesaid segregative electronic installation 5, and segregative electronic installation 6 utilizes the combined type adhesive tape 4 in Fig. 4 to be pasted on the glue frame 500 of backlight module 50 by panel 52.
Therefore, according to technique scheme, segregative electronic installation of the present invention at least has following advantages and beneficial effect: the present invention adds multiple capsule in bonding coat, and stickum can be reduced be coated in the utricule of capsule, when capsule utricule because of pressurization, heating or with the light of specific wavelength (such as, electromagnetic wave) irradiate and destroy time, can reduce stickum will disengage and contact with viscose glue from utricule, thus reduction viscose glue viscosity.Now, because the viscosity of viscose glue reduces, the panel be pasted on backlight module by bonding coat just can be removed easily, to carry out heavy industry or replacing.It should be noted that, combined type adhesive tape of the present invention also can be used for pasting other object, and combined type adhesive tape can easily be removed from other object, is not limited to be used for sticking panel and backlight module.In addition, the viscose glue in bonding coat can separate or mix, depending on practical application with capsule.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (12)
1. a segregative electronic installation, is characterized in that, described segregative electronic installation comprises:
Backlight module;
Panel; And
Combined type adhesive tape, described panel is pasted on described backlight module, described combined type adhesive tape comprises base material, first bonding coat and the second bonding coat, the first surface that described first bonding coat is formed at described base material is pasted on described panel, the second surface that described second bonding coat is formed at described base material is pasted on described backlight module, described first surface is relative with described second surface, described first bonding coat comprises the first viscose glue and multiple first capsule, described first capsule comprises the first utricule and first can reduce stickum, described first can reduce stickum is coated in described first utricule,
Wherein, when described first utricule destroyed and disengage described first can reduce stickum time, described first can reduce stickum with described first viscose glue contacts, thus reduces the viscosity of described first viscose glue.
2. segregative electronic installation as claimed in claim 1, is characterized in that, described multiple first capsule shape is formed on described first surface, and described first viscose glue is formed on described multiple first capsule.
3. segregative electronic installation as claimed in claim 1, is characterized in that, described multiple first capsule and described first viscose glue mix.
4. segregative electronic installation as claimed in claim 1, is characterized in that, the grain size of described first capsule is between 5 microns and 100 microns.
5. segregative electronic installation as claimed in claim 1, is characterized in that, the material of described first utricule is that external force can destroy material, and described first can to reduce stickum be organic solvent.
6. segregative electronic installation as claimed in claim 1, is characterized in that, described first utricule is by pressurization, heating or be destroyed with electromagnetic wave irradiation.
7. segregative electronic installation as claimed in claim 1, it is characterized in that, described second bonding coat comprises the second viscose glue and multiple second capsule, described second capsule comprises the second utricule and second can reduce stickum, described second can reduce stickum is coated in described second utricule, when described second utricule destroyed and disengage described second can reduce stickum time, described second can reduce stickum contacts with described second viscose glue, thus reduces the viscosity of described second viscose glue.
8. segregative electronic installation as claimed in claim 7, is characterized in that, described multiple second capsule shape is formed on described second surface, and described second viscose glue is formed on described multiple second capsule.
9. segregative electronic installation as claimed in claim 7, is characterized in that, described multiple second capsule and described second viscose glue mix.
10. segregative electronic installation as claimed in claim 7, is characterized in that, the grain size of described second capsule is between 5 microns and 100 microns.
11. segregative electronic installations as claimed in claim 7, is characterized in that, the material of described second utricule is that external force can destroy material, and described second can to reduce stickum be organic solvent.
12. segregative electronic installations as claimed in claim 7, is characterized in that, described second utricule is by pressurization, heating or be destroyed with electromagnetic wave irradiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210398037.5A CN103778853B (en) | 2012-10-18 | 2012-10-18 | Segregative electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210398037.5A CN103778853B (en) | 2012-10-18 | 2012-10-18 | Segregative electronic installation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103778853A CN103778853A (en) | 2014-05-07 |
| CN103778853B true CN103778853B (en) | 2015-10-28 |
Family
ID=50571033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210398037.5A Active CN103778853B (en) | 2012-10-18 | 2012-10-18 | Segregative electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103778853B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107526198B (en) * | 2017-08-23 | 2020-07-28 | 京东方科技集团股份有限公司 | Display device |
| CN111128006B (en) * | 2019-12-30 | 2021-11-19 | 华为技术有限公司 | Electronic device |
| CN113035057A (en) * | 2020-12-29 | 2021-06-25 | 奕瑞影像科技（太仓）有限公司 | Flexible screen assembly and method of disassembling same |
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| IE37450L (en) * | 1972-03-29 | 1973-09-29 | Farthingham Developments Ltd | Self-adhesive stamp |
| KR940009077B1 (en) * | 1984-12-21 | 1994-09-29 | 미네소타 마이닝 앤드 매뉴팩츄어링 컴패니 | On page fragrance sampling device |
| CN1383152A (en) * | 2001-04-23 | 2002-12-04 | 日东电工株式会社 | Pressure-sensitive label for hard disk driver |
| CN1771312A (en) * | 2004-01-28 | 2006-05-10 | Lg化学株式会社 | Releasable adhesive composition |
| CN102177538A (en) * | 2008-10-17 | 2011-09-07 | 夏普株式会社 | Display device and method for manufacturing the same |
| CN102232104A (en) * | 2009-06-15 | 2011-11-02 | 住友电木株式会社 | Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5729031A (en) * | 1980-07-28 | 1982-02-16 | Nissan Motor Co Ltd | Liquid crystal display panel |
| JP3853247B2 (en) * | 2002-04-16 | 2006-12-06 | 日東電工株式会社 | Heat-peelable pressure-sensitive adhesive sheet for electronic parts, method for processing electronic parts, and electronic parts |
| JP2006169274A (en) * | 2004-12-13 | 2006-06-29 | Canon Inc | Adhesive tape |
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2907682A (en) * | 1958-05-28 | 1959-10-06 | Ncr Co | Adhesive tape containing pressurerupturable capsules |
| IE37450L (en) * | 1972-03-29 | 1973-09-29 | Farthingham Developments Ltd | Self-adhesive stamp |
| KR940009077B1 (en) * | 1984-12-21 | 1994-09-29 | 미네소타 마이닝 앤드 매뉴팩츄어링 컴패니 | On page fragrance sampling device |
| CN1383152A (en) * | 2001-04-23 | 2002-12-04 | 日东电工株式会社 | Pressure-sensitive label for hard disk driver |
| CN1771312A (en) * | 2004-01-28 | 2006-05-10 | Lg化学株式会社 | Releasable adhesive composition |
| CN102177538A (en) * | 2008-10-17 | 2011-09-07 | 夏普株式会社 | Display device and method for manufacturing the same |
| CN102232104A (en) * | 2009-06-15 | 2011-11-02 | 住友电木株式会社 | Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103778853A (en) | 2014-05-07 |
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