CN103753756B - A kind of EMC packaging system for LED support - Google Patents
A kind of EMC packaging system for LED support Download PDFInfo
- Publication number
- CN103753756B CN103753756B CN201410001911.6A CN201410001911A CN103753756B CN 103753756 B CN103753756 B CN 103753756B CN 201410001911 A CN201410001911 A CN 201410001911A CN 103753756 B CN103753756 B CN 103753756B
- Authority
- CN
- China
- Prior art keywords
- main body
- dozzle
- encapsulation main
- cast gate
- encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
- 238000005538 encapsulation Methods 0.000 claims abstract description 53
- 239000003822 epoxy resin Substances 0.000 abstract description 8
- 229920000647 polyepoxide Polymers 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 4
- 238000012797 qualification Methods 0.000 abstract description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
- B29C2045/0032—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks sequential injection from multiple gates, e.g. to avoid weld lines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
- B29C2045/2709—Gates with a plurality of mould cavity inlets in close proximity
Abstract
The invention discloses a kind of EMC packaging system for LED support, including central feeding body (1) and encapsulation main body (3), the two ends of described central feeding body (1) are equipped with two sub-runners (2), the end of described sub-runner (2) has cast gate (5), the upper connection of described encapsulation main body (3) has the dozzle (4) of the wide degree of lip-rounding relative with cast gate (5), described cast gate (5) is connected with encapsulation main body (3) by dozzle (4), the degree of depth of described cast gate (5) is more than the height of encapsulation main body (3), the height of described encapsulation main body (3) is more than the height of dozzle (4).The structure that the present invention is combined by the dozzle of encapsulation main body, cast gate and the wide degree of lip-rounding designs, make epoxy resin can be the most large-area to encapsulation main body filling through dozzle, decrease the bad problems such as the filling in EMC encapsulation process is discontented, loosen, improve the qualification rate of product.
Description
Technical field
The present invention relates to a kind of EMC packaging system for LED support.
Background technology
Under low-carbon economy, the overall background of energy-conserving and environment-protective, China's LED industry quickly grows, and LED industry development prospect enjoys good, and EMC encapsulation is one of current high-end developing direction of LED industry.Capsulation material owing to using when EMC support encapsulates is epoxy resin, this material has the advantages such as uv-resistant, hot conditions stability inferior is good, the coefficient of expansion is low, in production capacity, the EMC encapsulation also far LED product more than traditional employing PPA Plastic Package, and the equipment of EMC encapsulation takes up an area little, the availability of equipment is high, the when of Develop new product, the second investment is little, a very long time being had been developed in American-European and Japan's EMC encapsulation, domestic many LED manufacturer are the most gradually introducing EMC encapsulation technology and equipment.EMC encapsulation has high density, highly integrated, the feature of packaged article thickness ultrathin, this feature of EMC encapsulation determines the compact conformation of its mould, on mould, each fixing core is exactly the rim of a cup of a product, two adjacent core spacing are the least, existing single gate design is difficult to closely knit for the position filling at the core back side epoxy resin filling when, often occur loose during encapsulation, filling is discontented with, after runner separates, residual is big, and after impact, the problem such as road cutting, reduces the conforming product rate of EMC encapsulation.
Summary of the invention
It is an object of the invention to provide a kind of EMC packaging system for LED support, improve the conforming product rate of EMC encapsulation.
The technical solution used in the present invention is: a kind of EMC packaging system for LED support, including central feeding body and encapsulation main body, the two ends of described central feeding body are equipped with two sub-runners, the end of described sub-runner has cast gate, connect in described encapsulation main body and have the dozzle of the wide degree of lip-rounding relative with cast gate, described cast gate is connected with encapsulation main body by dozzle, and the degree of depth of described cast gate is more than the height of encapsulation main body, and the height of described encapsulation main body is more than the height of dozzle.
As a further improvement on the present invention, the face that described dozzle contacts with encapsulation main body is arc.
As a further improvement on the present invention, the degree of depth of described cast gate is 0.25mm～0.3mm, and the height of described dozzle is 0.15mm, and the height of described encapsulation main body is 0.2mm.
The present invention uses and provides the benefit that: the structure that the present invention is combined by the dozzle of encapsulation main body, cast gate and the wide degree of lip-rounding designs, make epoxy resin can be the most large-area to encapsulation main body filling through dozzle, decrease the bad problems such as the filling in EMC encapsulation process is discontented, loosen, improve the qualification rate of product.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the partial enlarged drawing in A portion in Fig. 1；
Shown in figure: 1, central feeding body, 2, sub-runner, 3, encapsulation main body, 4, dozzle, 5, cast gate.
Detailed description of the invention
Below in conjunction with Fig. 1, Fig. 2, the present invention is described further.
Such as Fig. 1, shown in Fig. 2, a kind of EMC packaging system for LED support, including central feeding body 1 and encapsulation main body 3, the two ends of central feeding body 1 are equipped with two sub-runners 2, sub-runner 2 symmetry is distributed on the two ends of central feeding 1, the end of sub-runner 2 has cast gate 5, connect in encapsulation main body 3 and have the dozzle 4 of the wide degree of lip-rounding relative with cast gate 5, the face that dozzle 4 contacts with encapsulation main body 3 is arc, cast gate 5 is connected with encapsulation main body 3 by dozzle 4, the degree of depth of cast gate 5 is more than the height of encapsulation main body 3, the height of encapsulation main body 3 is more than the height of dozzle 4.The degree of depth of cast gate 5 is 0.25mm～0.3mm, and the height of dozzle 4 is 0.15mm, and the height of encapsulation main body 3 is 0.2mm.
The present invention is in use, cast gate, the dozzle of the wide degree of lip-rounding, encapsulation main body is sequentially connected, the outlet of dozzle is more than the outlet of cast gate, epoxy resin is being changed into heavy in section through dozzle by small bore, can be by the most large-area for epoxy resin to encapsulation main body horizontal sliding, position, the dead angle filling making the core back side in encapsulation main body as far as possible is closely knit, owing to the cross section of cast gate is little, dozzle cross section is big, there is loss in epoxy resin pressure when cast gate flow to dozzle position, the face that dozzle contacts with encapsulation main body uses cambered design, the degree of depth of cast gate is 0.25mm～0.3mm, the height of dozzle is 0.15mm, the height of encapsulation main body is 0.2mm, it is used for equalizing pouring into pressure.Dozzle is stayed when runner separates in LED support encapsulation main body, later process is directly excised together with the frame of encapsulation main body, therefore the height of encapsulation main body is more than the height of dozzle, with prevent cutting time because of put injustice affect cutting accuracy, and when running into the higher epoxy resin of viscosity, sub-runner separates the defect produced and the most only appears on dozzle with encapsulation main body, does not interferes with outward appearance and the performance of product, is effectively improved the qualification rate of product in EMC encapsulation process.
Claims (2)
- null1. the EMC packaging system for LED support，Including central feeding body (1) and encapsulation main body (3)，It is characterized in that the two ends of described central feeding body (1) are equipped with two sub-runners (2)，The end of described sub-runner (2) has cast gate (5)，The upper connection of described encapsulation main body (3) has the dozzle (4) of the wide degree of lip-rounding relative with cast gate (5)，Described cast gate (5) is connected with encapsulation main body (3) by dozzle (4)，The degree of depth of described cast gate (5) is more than the height of encapsulation main body (3)，The height of described encapsulation main body (3) is more than the height of dozzle (4)，The degree of depth of described cast gate (5) is 0.25mm～0.3mm,The height of described dozzle (4) is 0.15mm，The height of described encapsulation main body (3) is 0.2mm.
- A kind of EMC packaging system for LED support the most according to claim 1, it is characterised in that the face that described dozzle (4) contacts with encapsulation main body (3) is arc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410001911.6A CN103753756B (en) | 2014-01-03 | 2014-01-03 | A kind of EMC packaging system for LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410001911.6A CN103753756B (en) | 2014-01-03 | 2014-01-03 | A kind of EMC packaging system for LED support |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103753756A CN103753756A (en) | 2014-04-30 |
| CN103753756B true CN103753756B (en) | 2016-08-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410001911.6A Active CN103753756B (en) | 2014-01-03 | 2014-01-03 | A kind of EMC packaging system for LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103753756B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112848127B (en) * | 2021-01-14 | 2022-09-06 | 佛山市三水江达塑料电器制品有限公司 | Injection molding equipment capable of achieving porous uniform filling |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1264331A (en) * | 1997-05-19 | 2000-08-23 | 卡德爱克斯公司 | Method for making smart cards |
| CN1299313A (en) * | 1998-03-17 | 2001-06-13 | 卡德爱克斯公司 | Method for making smart cards using isotropic thermoset adhesive materials |
| EP2161740A2 (en) * | 1998-03-05 | 2010-03-10 | Fico B.V. | Mould part, mould and method for encapsulating electronic components mounted on a carrier |
| CN203650821U (en) * | 2014-01-03 | 2014-06-18 | 铜陵中发三佳科技股份有限公司 | EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket |
-
2014
- 2014-01-03 CN CN201410001911.6A patent/CN103753756B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1264331A (en) * | 1997-05-19 | 2000-08-23 | 卡德爱克斯公司 | Method for making smart cards |
| EP2161740A2 (en) * | 1998-03-05 | 2010-03-10 | Fico B.V. | Mould part, mould and method for encapsulating electronic components mounted on a carrier |
| CN1299313A (en) * | 1998-03-17 | 2001-06-13 | 卡德爱克斯公司 | Method for making smart cards using isotropic thermoset adhesive materials |
| CN203650821U (en) * | 2014-01-03 | 2014-06-18 | 铜陵中发三佳科技股份有限公司 | EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103753756A (en) | 2014-04-30 |
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