CN103730067A - AMOLED module structure and assembly method thereof - Google Patents

AMOLED module structure and assembly method thereof Download PDF

Info

Publication number
CN103730067A
CN103730067A CN201310595812.0A CN201310595812A CN103730067A CN 103730067 A CN103730067 A CN 103730067A CN 201310595812 A CN201310595812 A CN 201310595812A CN 103730067 A CN103730067 A CN 103730067A
Authority
CN
China
Prior art keywords
amoled
plate glass
cover
ocr
modular structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310595812.0A
Other languages
Chinese (zh)
Inventor
陈俊俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EverDisplay Optronics Shanghai Co Ltd
Original Assignee
EverDisplay Optronics Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EverDisplay Optronics Shanghai Co Ltd filed Critical EverDisplay Optronics Shanghai Co Ltd
Priority to CN201310595812.0A priority Critical patent/CN103730067A/en
Priority to TW102147110A priority patent/TW201521195A/en
Publication of CN103730067A publication Critical patent/CN103730067A/en
Priority to JP2014123645A priority patent/JP2015103519A/en
Priority to KR1020140088419A priority patent/KR20150059586A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Electroluminescent Light Sources (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The invention relates to the technical field of AMOLED display, in particular to an AMOLED module structure and an assembly method thereof. The AMOLED module structure comprises a display module, an OCA layer, an ink layer and a glass cover plate, the display module, the OCA layer, the ink layer and the glass cover plate are arranged in sequence, the ink layer is arranged on the end portion of the back face of the glass cover plate, a defined space is formed by the ink layer and the glass cover plate in a defined mode, the AMOLED module structure further comprises an OCR glue layer which is arranged in the defined space, and the OCA layer is used for bonding the back face of the glass cover plate and the display module. The thickness of the AMOLED module structure can be effectively reduced.

Description

A kind of AMOLED modular structure and assemble method thereof
Technical field
The present invention relates to a kind of AMOLED display technique field, espespecially a kind of AMOLED modular structure and assemble method thereof.
Background technology
AMOLED (Active Matrix Organic Light Emitting Diode, active matrix organic LED panel) compares traditional liquid crystal panel, has the features such as reaction velocity is fast, contrast is high, visual angle is wide.AMOLED also has self luminous characteristic in addition, does not need to use backlight, therefore more frivolous than traditional liquid crystal panel, can also save the cost of backlight module.Many-sided advantage makes it have good application prospect.
General OCA (the Optically Clear Adhesive) optical cement that adopts while encapsulating AMOLED module in prior art, and can not use OCR (Optical Clear Resin) glue, because OCR glue need to be used UV (Ultraviolet Rays, ultraviolet light) solidify, but the luminescent material in the display module of AMOLED is to UV photaesthesia, if adopt UV to irradiate, can cause luminescent material to lose efficacy, cause display screen not work.So, when AMOLED module packaging, do not adopt OCR glue.When adopting OCA optical cement that display module (Display Moduel) and cover-plate glass (Cover Lens) are fitted entirely, because OCA optical cement is limited to the absorptivity of the ink thickness on cover-plate glass, cause and need to use thicker OCA glue, finally cause AMOLED module thickness to increase.
Fig. 1 has shown that available technology adopting OCA optical cement carries out the explosive view of full laminating, and Fig. 2 has shown that available technology adopting OCA optical cement carries out the view of full laminating.As depicted in figs. 1 and 2, the back side of cover-plate glass 10 is fitted with ink layer 20, ink layer 20 is located at the end of cover-plate glass 10 and cover-plate glass 10 and is enclosed and be formed with an enclosed space 101, while adopting OCA optics glue-line 30 that cover-plate glass 10 is fit together with demonstration module 40, OCA optics glue-line 30 need be filled and led up enclosed space 101, when ink layer 20 thickness of selecting are 30 microns, need to adopt 0.3 millimeter of OCA optics glue-line 30 more than thickness just can handle the air bubble problem in laminating process well.So adopt OCA optical cement to carry out full laminating, can cause AMOLED module thickness to increase.
Summary of the invention
The object of the invention is to overcome the defect of prior art, a kind of AMOLED modular structure and assemble method thereof are provided, the problem that the AMOLED module that solution OCA optical cement brings thickens.
The technical scheme that realizes above-mentioned purpose is:
A kind of AMOLED modular structure of the present invention, comprises the display module, OCA optics glue-line, ink layer and the cover-plate glass that set gradually, and described ink layer is arranged at the end at the described cover-plate glass back side, encloses and is formed with an enclosed space with described cover-plate glass; Described AMOLED modular structure also comprises an OCR gelatine layer, and described OCR gelatine layer is filled out and is overlying in described enclosed space, and described OCA optics glue-line is bonded together the back side of described cover-plate glass and described display module.
Adopt OCR glue to fill and lead up the enclosed space on cover-plate glass, can be so that the OCA optics glue-line attenuate of follow-up use, only need to use the OCA optical cement of 0.025 millimeters thick just can well fit cover-plate glass and display module, thereby realize the reduced thickness effect of AMOLED modular structure.
The further improvement of a kind of AMOLED modular structure of the present invention is, the thickness of described OCA optical cement is 0.025 millimeter to 0.1 millimeter.
The assemble method of a kind of AMOLED modular structure of the present invention, comprises the steps:
Adopt OCR glue by cover-plate glass and be arranged at the enclosed space forming between the ink layer of described cover-plate glass end and fill up, make the back side of described cover-plate glass smooth;
Adopt OCA optical cement that the back side of described cover-plate glass and display module are bonded together.
The further improvement of the assemble method of a kind of AMOLED modular structure of the present invention is, the thickness of described OCA optical cement is 0.025 millimeter to 0.1 millimeter.
Accompanying drawing explanation
Fig. 1 is the explosive view that available technology adopting OCA optical cement carries out full laminating;
Fig. 2 is the view that available technology adopting OCA optical cement carries out full laminating;
Fig. 3 is the explosive view of a kind of AMOLED modular structure of the present invention;
Fig. 4 is the schematic diagram of a kind of AMOLED modular structure of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described.
Referring to shown in Fig. 3, is the explosive view of a kind of AMOLED modular structure of the present invention.The object of the invention is to solve the problem that thickens in AMOLED module packaging process, because of in full laminating process, OCA optical cement need be filled and led up the enclosed space forming on cover-plate glass, makes to need the OCA optics glue-line thickening of use, and then has increased the thickness of AMOLED module.Below in conjunction with accompanying drawing, a kind of AMOLED modular structure of the present invention is described.
As shown in Figure 3 and Figure 4, a kind of AMOLED modular structure of the present invention comprises a cover-plate glass 10, ink layer 20, OCR gelatine layer 50, OCA optics glue-line 30 and display module 40.
Ink layer 20 is arranged at the end at cover-plate glass 10 back sides, it is the edge at cover-plate glass 10 back sides, be formed with an enclosed space with cover-plate glass 10, OCR gelatine layer 50 is placed in the enclosed space forming between ink layer 20 and cover-plate glass 10, and fill and lead up this enclosed space, make the back side of cover-plate glass 10 smooth.This OCR glue is filled and led up process and cover-plate glass 10 and ink layer 20 and is completed in same technique, the manufacturer that can be chosen in making cover-plate glass has located the operation of filling and leading up of OCR glue, because OCR glue need solidify with UV, and UV can have damaging influence to the display module 40 of AMOLED, so above-mentioned OCR glue solidification process need complete in advance, avoids the impact of UV on display module 40.Then, with OCA optical cement, display module 40 being bonded on OCR gelatine layer 50 and ink layer 20 is the back side of cover-plate glass 10, has formed OCA optics glue-line 30 and has been placed in the structure between display module 40 and OCR gelatine layer 50.
Because adopting OCR gelatine layer 50 to fill and lead up the enclosed space forming between ink layer 20 and cover-plate glass 10, can be so that cover-plate glass 10 and display module 40 while entirely fitting, be used ultra-thin OCA optical cement.Because the back side of cover-plate glass 10 is smooth, when bonding with OCA optical cement, can not produce air bubble problem, so that OCA optical cement can be accomplished is the thinnest.In contrast, in the prior art, if adopting OCA optical cement directly fits entirely, during the enclosed space at its filling cap glass sheet 10 back sides, can produce bubble because of this offset, this bubble can affect the caking ability of AMOLED modular structure, think the bubble get rid of producing, need to apply thicker OCA optical cement.When the thickness of ink layer 20 is 0.03 millimeter, at least need the OCA optical cement of 0.3 millimeters thick.
The thickness of the enclosed space forming between ink layer 20 and cover-plate glass 10 is 0.03 millimeter, i.e. the thickness of ink layer 20.Adopt OCR glue to fill and lead up this enclosed space, the thickness of the OCR gelatine layer 50 forming after OCR glue solidifies is also 0.03 millimeter.Then only needing to adopt thickness is that the OCA optical cement of 0.025 millimeter can be bonded together cover-plate glass 10 and display module 40.The OCA optical cement that at least needs 0.3 millimeters thick compared to existing technology, gross thickness of the present invention is the thickness sum of OCR gelatine layer 50 and OCA optics glue-line 30,0.055 millimeter, compared with prior art in the present invention, AMOLED module gross thickness can attenuate 0.245 millimeter.
The thickness of OCA optical cement can be 0.025 millimeter to 0.1 millimeter, and the thinnest is 0.025 millimeter.
Below the assemble method of a kind of AMOLED modular structure of the present invention is described:
First, adopt OCR glue by cover-plate glass 10 and be arranged at the enclosed space forming between the ink layer 20 of cover-plate glass 10 ends and fill up, make the back side of described cover-plate glass smooth.In the present embodiment, ink layer 20 is arranged at the end at cover-plate glass 10 back sides, i.e. the edge at cover-plate glass 10 back sides, and be formed with an enclosed space with cover-plate glass 10.Here, the thickness of ink layer 20 has determined the thickness of described enclosed space.In actual applications, the process of filling and leading up of OCR glue comprises: OCR glue is filled out and is overlying on described enclosed space; With UV, OCR glue is solidified, form OCR gelatine layer 50, described OCR gelatine layer 50 can flush with the ink layer 20 at cover-plate glass 10 back sides, thereby makes the back side of cover-plate glass 10 smooth.Above-mentioned steps can have been located in the production firm of cover-plate glass.
Then, then with OCA optical cement the back side of cover-plate glass 10 and display module 40 are bonded together.
So just completed the full laminating encapsulation of AMOLED modular structure.Because adopting OCR glue to fill and lead up the enclosed space forming between ink layer 20 and cover-plate glass 10, can, so that cover-plate glass 10 and display module 40 while entirely fitting, are used ultra-thin OCA optical cement, effectively reduce AMOLED module gross thickness.Because OCR glue is solidificated in display module installation with UV, complete before, can avoid the damaging influence of UV to display module.
Beneficial effect of the present invention is:
Adopt OCR glue to fill and lead up the enclosed space on cover-plate glass, the gross thickness of attenuate AMOLED module effectively, improves the competitive power of product.
Then, OCR glue is solidificated on cover-plate glass in advance with UV, follow-uply at laminating display module, can avoids display module in AMOLED to the light activated characteristic of UV, avoid producing the phenomenon that in the display module causing because of UV light, luminescent material lost efficacy.Have again, curing the marrying again in the manufacturer of cover-plate glass of OCR glue can be provided, can reduce the input cost of OCR curing apparatus.
Below embodiment has been described in detail the present invention by reference to the accompanying drawings, and those skilled in the art can make many variations example to the present invention according to the above description.Thereby some details in embodiment should not form limitation of the invention, the present invention will be usingd scope that appended claims defines as protection scope of the present invention.

Claims (5)

1. an AMOLED modular structure, comprises the display module, OCA optics glue-line, ink layer and the cover-plate glass that set gradually, and described ink layer is arranged at the end at the described cover-plate glass back side, encloses and is formed with an enclosed space with described cover-plate glass; It is characterized in that, described AMOLED modular structure also comprises an OCR gelatine layer, and described OCR gelatine layer is filled out and is overlying in described enclosed space, and described OCA optics glue-line is bonded together the back side of described cover-plate glass and display module.
2. a kind of AMOLED modular structure as claimed in claim 1, is characterized in that, the thickness of described OCA optical cement is 0.025 millimeter to 0.1 millimeter.
3. an assemble method for AMOLED modular structure, the method comprises the steps:
Adopt OCR glue by cover-plate glass and be arranged at the enclosed space forming between the ink layer of described cover-plate glass end and fill up, make the back side of described cover-plate glass smooth;
Adopt OCA optical cement that the back side of described cover-plate glass and display module are bonded together.
4. the assemble method of a kind of AMOLED modular structure as claimed in claim 3, is characterized in that: described OCR glue is cured with UV after filling out and being overlying in described enclosed space, forms OCR gelatine layer.
5. the assemble method of a kind of AMOLED modular structure as claimed in claim 3, is characterized in that, the thickness of described OCA optical cement is 0.025 millimeter to 0.1 millimeter.
CN201310595812.0A 2013-11-22 2013-11-22 AMOLED module structure and assembly method thereof Pending CN103730067A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201310595812.0A CN103730067A (en) 2013-11-22 2013-11-22 AMOLED module structure and assembly method thereof
TW102147110A TW201521195A (en) 2013-11-22 2013-12-19 Active matrix organic light emitting diode (AMOLED) module structure and the assembling method thereof
JP2014123645A JP2015103519A (en) 2013-11-22 2014-06-16 Kind of amoled module structure and method for assembling the same
KR1020140088419A KR20150059586A (en) 2013-11-22 2014-07-14 Structure of amoled module and method for assembling the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310595812.0A CN103730067A (en) 2013-11-22 2013-11-22 AMOLED module structure and assembly method thereof

Publications (1)

Publication Number Publication Date
CN103730067A true CN103730067A (en) 2014-04-16

Family

ID=50454117

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310595812.0A Pending CN103730067A (en) 2013-11-22 2013-11-22 AMOLED module structure and assembly method thereof

Country Status (4)

Country Link
JP (1) JP2015103519A (en)
KR (1) KR20150059586A (en)
CN (1) CN103730067A (en)
TW (1) TW201521195A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104269499A (en) * 2014-09-22 2015-01-07 上海和辉光电有限公司 Amoled structure and manufacturing method thereof
CN105529352A (en) * 2015-12-08 2016-04-27 北京橙鑫数据科技有限公司 AMOLED (active-matrix organic light emitting diode) display screen and terminal
CN105528031A (en) * 2015-12-08 2016-04-27 北京橙鑫数据科技有限公司 Wearable terminal
CN106782094A (en) * 2017-01-12 2017-05-31 京东方科技集团股份有限公司 A kind of motherboard and preparation method thereof, cover plate and preparation method thereof, display device
CN107545848A (en) * 2017-08-25 2018-01-05 武汉华星光电半导体显示技术有限公司 Flexible cover plate and preparation method thereof, flexible OLED display
CN107807468A (en) * 2017-11-29 2018-03-16 武汉天马微电子有限公司 Display module and display device
CN110164302A (en) * 2018-02-13 2019-08-23 元太科技工业股份有限公司 Flexible display device and its manufacturing method
CN110571351A (en) * 2019-08-14 2019-12-13 武汉华星光电半导体显示技术有限公司 Flexible display panel structure and manufacturing method
CN110611016A (en) * 2019-09-07 2019-12-24 东莞阿尔泰显示技术有限公司 OCR film packaging process of display module
CN110649010A (en) * 2019-09-07 2020-01-03 东莞阿尔泰显示技术有限公司 OCA film packaging process of display module
CN110853522A (en) * 2019-11-29 2020-02-28 武汉天马微电子有限公司 Display screen device
CN111445790A (en) * 2020-04-27 2020-07-24 武汉华星光电技术有限公司 Display panel, preparation method thereof and display device
CN114822287A (en) * 2022-04-06 2022-07-29 武汉华星光电半导体显示技术有限公司 Display module and manufacturing method thereof
CN115527442A (en) * 2022-01-26 2022-12-27 荣耀终端有限公司 Display module, terminal device and manufacturing method of display module

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180098890A (en) * 2017-02-27 2018-09-05 삼성전자주식회사 Curved display and electronic device including thereof
CN111653198B (en) * 2020-06-23 2022-02-01 武汉天马微电子有限公司 Display panel and display device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3175653U (en) * 2012-03-02 2012-05-24 志忠 林 Touch control device
CN102991092A (en) * 2012-12-13 2013-03-27 Tcl显示科技（惠州）有限公司 Method for adhering touch screen and display panel
CN103200798A (en) * 2012-01-05 2013-07-10 宏达国际电子股份有限公司 Cover plate, electronic device and manufacturing method of cover plate
CN103294241A (en) * 2012-03-05 2013-09-11 冠伟科技股份有限公司 Method for substrate jointing
CN103325808A (en) * 2012-03-19 2013-09-25 群康科技(深圳)有限公司 Display device and manufacturing method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101896766B (en) * 2007-10-24 2014-04-23 开关电灯公司 Diffuser for LED light sources
GB0821122D0 (en) * 2008-11-19 2008-12-24 Nanoco Technologies Ltd Semiconductor nanoparticle - based light emitting devices and associated materials and methods
JP2013178332A (en) * 2012-02-28 2013-09-09 Toppan Printing Co Ltd Decorative scattering prevention film for image display panel, and image display panel

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103200798A (en) * 2012-01-05 2013-07-10 宏达国际电子股份有限公司 Cover plate, electronic device and manufacturing method of cover plate
JP3175653U (en) * 2012-03-02 2012-05-24 志忠 林 Touch control device
CN103294241A (en) * 2012-03-05 2013-09-11 冠伟科技股份有限公司 Method for substrate jointing
CN103325808A (en) * 2012-03-19 2013-09-25 群康科技(深圳)有限公司 Display device and manufacturing method thereof
CN102991092A (en) * 2012-12-13 2013-03-27 Tcl显示科技（惠州）有限公司 Method for adhering touch screen and display panel

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104269499A (en) * 2014-09-22 2015-01-07 上海和辉光电有限公司 Amoled structure and manufacturing method thereof
CN105529352A (en) * 2015-12-08 2016-04-27 北京橙鑫数据科技有限公司 AMOLED (active-matrix organic light emitting diode) display screen and terminal
CN105528031A (en) * 2015-12-08 2016-04-27 北京橙鑫数据科技有限公司 Wearable terminal
WO2018129901A1 (en) * 2017-01-12 2018-07-19 京东方科技集团股份有限公司 Mother board and preparation method therefor, cover board and preparation method therefor, and display device
CN106782094A (en) * 2017-01-12 2017-05-31 京东方科技集团股份有限公司 A kind of motherboard and preparation method thereof, cover plate and preparation method thereof, display device
US10643503B2 (en) 2017-01-12 2020-05-05 Boe Technology Group Co., Ltd. Motherboard and manufacturing method thereof, cover plate and manufacturing method thereof, and display device
CN107545848A (en) * 2017-08-25 2018-01-05 武汉华星光电半导体显示技术有限公司 Flexible cover plate and preparation method thereof, flexible OLED display
WO2019037220A1 (en) * 2017-08-25 2019-02-28 武汉华星光电半导体显示技术有限公司 Flexible cover plate and fabrication method therefor and flexible oled display device
CN107807468A (en) * 2017-11-29 2018-03-16 武汉天马微电子有限公司 Display module and display device
CN110164302A (en) * 2018-02-13 2019-08-23 元太科技工业股份有限公司 Flexible display device and its manufacturing method
CN110164302B (en) * 2018-02-13 2021-08-06 元太科技工业股份有限公司 Flexible display device and manufacturing method thereof
CN110571351B (en) * 2019-08-14 2021-01-15 武汉华星光电半导体显示技术有限公司 Flexible display panel structure and manufacturing method
CN110571351A (en) * 2019-08-14 2019-12-13 武汉华星光电半导体显示技术有限公司 Flexible display panel structure and manufacturing method
US11404663B2 (en) 2019-08-14 2022-08-02 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Flexible display panel structure having optical clear resin in space formed by quadrilateral anti-flow barrier and cover plate and fabricating method thereof
WO2021027098A1 (en) * 2019-08-14 2021-02-18 武汉华星光电半导体显示技术有限公司 Flexible display panel structure and manufacturing method
CN110611016A (en) * 2019-09-07 2019-12-24 东莞阿尔泰显示技术有限公司 OCR film packaging process of display module
CN110611016B (en) * 2019-09-07 2020-09-11 东莞阿尔泰显示技术有限公司 OCR film packaging process of display module
CN110649010B (en) * 2019-09-07 2020-08-11 东莞阿尔泰显示技术有限公司 OCA film packaging process of display module
CN110649010A (en) * 2019-09-07 2020-01-03 东莞阿尔泰显示技术有限公司 OCA film packaging process of display module
CN110853522A (en) * 2019-11-29 2020-02-28 武汉天马微电子有限公司 Display screen device
CN111445790A (en) * 2020-04-27 2020-07-24 武汉华星光电技术有限公司 Display panel, preparation method thereof and display device
CN115527442A (en) * 2022-01-26 2022-12-27 荣耀终端有限公司 Display module, terminal device and manufacturing method of display module
CN114822287A (en) * 2022-04-06 2022-07-29 武汉华星光电半导体显示技术有限公司 Display module and manufacturing method thereof

Also Published As

Publication number Publication date
JP2015103519A (en) 2015-06-04
KR20150059586A (en) 2015-06-01
TW201521195A (en) 2015-06-01

Similar Documents

Publication Publication Date Title
CN103730067A (en) AMOLED module structure and assembly method thereof
CN203360361U (en) Display device and optical glue belt thereof
JP5424964B2 (en) Display device
CN103426904B (en) A kind of flexible organic light emitting diode display and preparation method thereof
CN104157799A (en) OLED package method and OLED package structure
CN203850302U (en) Organic light-emitting display device
CN101681040A (en) Display device and method for manufacturing thereof
US9581755B2 (en) Reflective display apparatus and manufacturing method of reflective display apparatus
CN104681577B (en) Organic LED display panel and preparation method thereof
CN102903735B (en) Organic electroluminescence optical diode display and polaroid method for sticking and covering thereof
TWI470704B (en) Encapsulation method of environmental sensitive element
TW201509677A (en) Electronic device
TWI486680B (en) Liquid crystal display device and manufacturing method thereof
CN105045436A (en) Display panel and preparation method thereof, and display device
JP2011209470A (en) Liquid crystal display device and method of manufacturing the same, and electronic equipment
WO2010110587A3 (en) Method for producing a solar cell module, and solar cell module produced by the method
CN102981301B (en) Manufacture method of display equipment
CN103365022A (en) Electronic ink display device and manufacturing method thereof
CN110649010B (en) OCA film packaging process of display module
JPWO2014123165A1 (en) Transparent surface material and display device using the same
TW201516530A (en) Display device and assembling method of display device and adhesive
CN104216193A (en) Electronic paper module, electronic paper display device and electronic paper module manufacturing method
CN110611016B (en) OCR film packaging process of display module
JPWO2006088185A1 (en) EL display device and manufacturing method thereof
CN101315960B (en) LED module and production method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140416