CN103716994B - The preparation method of a kind of printed circuit board and printed circuit board thereof - Google Patents
The preparation method of a kind of printed circuit board and printed circuit board thereof Download PDFInfo
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- CN103716994B CN103716994B CN201210372013.2A CN201210372013A CN103716994B CN 103716994 B CN103716994 B CN 103716994B CN 201210372013 A CN201210372013 A CN 201210372013A CN 103716994 B CN103716994 B CN 103716994B
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Abstract
The present invention provides the preparation method of a kind of printed circuit board; first make the unit electrostatic protection plate being attached with static protective material; then this unit electrostatic protection plate is embedded in the loading plate being provided with windowed regions; it is being attached with formation change gap above the unit electrostatic protection plate of static protective material after the two being pressed together; described unit electrostatic protection layer is divided into electrostatic protection region and ground area by described change gap, thus forms second intermediate plate with electrostatic protection region；Finally forming at least one in the outside of described second intermediate plate and increase layer, electrically connected with described electrostatic protection region by the circuit treating electrostatic protection in described increasing layer, the ground plane in described increasing layer electrically connects with described electrostatic protection region.A kind of printed circuit board using above-mentioned preparation method to be formed, this printed circuit board not only cost of manufacture is low, and reliability is high.
Description
Technical field
The invention belongs to printed circuit board technology field, be specifically related to a kind of printed circuit board
Preparation method and printed circuit board.
Background technology
Along with the development of production technology, information, communication and consumer electricity in recent years
Sub-product manufacturing had become one of the most quick industry of whole world growth already, and high density interconnects
(High Density Interconnect: be called for short HDI) circuit becomes these electronic industries
In indispensable parts.For traditional printed circuit board, static discharge is to therein
The impact of electronic devices and components is little；But the printed circuit for high density interconnecting integrated circuit
Plate, static discharge can make the voltage on electronic devices and components therein suddenly raise, and causes print
Circuit board processed is damaged, makes the reliability of printed circuit board be affected, ultimately results in and make
Electronic product or equipment with this printed circuit board break down.For avoiding static discharge pair
The impact that printed circuit board is likely to result in, be typically employed on printed circuit board install discrete
The static discharge produced is pressed down by the mode of components and parts (such as: surgesuppressor)
System, thus electronic product or equipment are protected.But, due to discrete component one
As can be only installed at printed circuit board surface, need to occupy certain space, and each
Discrete component can only protect electronic devices and components or a part of circuit, therefore can only select
Select the electronic devices and components that part is special procured or circuit provides protection.According to statistics, electricity is being printed
Plate surface, road is installed discrete component and is only capable of providing electronic product or equipment the electrostatic of about 3%
Protection, it is impossible to the satisfied electronic product using high density interconnecting integrated circuit or equipment are to quiet
The requirement of electric protection.
Along with continuing to bring out of new material, occur in that special electrostatic protection material
Material, such as voltage switchable dielectric material (VSDM:Voltage Switchable
Dielectric Material) and the non-linear polymer etc. that can reset, these materials have
Have protection overvoltage and overcurrent active at least one, with protect electronic devices and components or
Circuit is from the impact of static discharge.
As shown in Figure 6, at use static protective material, printed circuit board is carried out electrostatic to prevent
When protecting, usually arrange one or more by static protective material system in printed circuit board
The electrostatic protection layer 2 become, by needing electronic devices and components to be protected (as shown in Fig. 6
Active component 12, passive element 11 or connector 15) or circuit and electrostatic protection layer 2
Electrical connection, can play electrostatic protective function to it.Concrete, when there being static discharge existing
During as occurring on electronic devices and components or in circuit, electrostatic protection layer 2 is from having insulating properties
It is converted to that there is electric conductivity, so that high-potential voltage is clamped down on as low-potential voltage, final energy
The safe voltage water that the Voltage Cortrol putting on electronic devices and components or circuit can be born to it
Flat, and too much electric current is guided into ground plane.But, at existing printed circuit board
In arrangement, static protective material is usually and is arranged in printed circuit board as flood,
I.e. it is provided with too in the region that the partial circuit being made without electrostatic protection is corresponding
Static protective material, causes the waste of static protective material；And static protective material
Price is general costly, thus causes the cost of printed circuit board to increase substantially, also
Hinder the further genralrlization application of static protective material.
Authorization Notice No. is that the Chinese invention patent of CN 101595769B discloses one portion
Dividing the printed circuit board being integrated with transient protection material, transient protection material therein is main
For static protective material, this patent of invention is dripped or ink-jet by serigraphy, dropped stitch, pin
Transient protection material is selectively deposited in the lamination of printed circuit board by printing type,
Achieve in the middle part of printed circuit board, set up the purpose putting static protective material separately.But,
In this printed circuit board, use and first process change gap, heavy in change gap the most again
Long-pending or covering static protective material process sequence arranges electrostatic protection layer, owing to electrostatic is protected
Protective material is overlapping with the edge of change gap, and change gap is the least (generally less than
10mil), static protective material adding on the out-of-flatness surface with change gap is caused
Work difficulty is big, arrange position is susceptible to skew, once static protective material position is set
Put the lamination occurring skew to be then easy to make originally should to disconnect to be gone out by static protective material
Now connect；Meanwhile, this process sequence is also difficult to be formed the electrostatic protection layer of uniform thickness,
May cause because of static protective material distinctive exchange performance when static discharge phenomenon occurs
There is short circuit phenomenon in partial circuit, affects the reliability of printed circuit board.
Summary of the invention
The technical problem to be solved be for present in prior art above-mentioned not
Foot, it is provided that a kind of part bury underground the printed circuit board of static protective material preparation method and
Its printed circuit board, this printed circuit board not only cost of manufacture is low, and reliability is high.
Solve the technology of the present invention problem and be employed technical scheme comprise that the system of this printed circuit board
Make method, comprise:
Step S10: make the first intermediate plate: described in the first intermediate plate of making include list
Unit's electrostatic protection plate and the loading plate with windowed regions;Described loading plate includes insulating properties
Substrate layer and the second metal level, described second metal level is located at described insulating properties substrate layer
One or both sides, described windowed regions is located on the second metal level;Described unit electrostatic protection
Plate includes unit metal layer and is attached to the unit electrostatic protection on described unit metal layer
Layer；Described unit electrostatic protection plate is embedded in described windowed regions so that described list
Unit's metal level is with described second metal level at grade；
Step S20: make the second intermediate plate: at described unit metal layer and described second
Form circuitous pattern on metal level, and on described unit metal layer, form change gap,
Described unit electrostatic protection layer is divided into electrostatic protection region and ground area；
Step S30: form printed circuit board: formed in the outside of described second intermediate plate
At least one increases layer, makes the circuit treating electrostatic protection in described increasing layer and described unit electrostatic
The electrostatic protection region electrical connection of protective layer, and make the ground plane in described increasing layer and institute
State the ground area electrical connection on unit electrostatic protection plate.
Preferably, in described step S10, form described unit electrostatic protection plate bag
Include:
Step S11: prepare the first metal layer；
Step S12: coat on described the first metal layer or print static protective material,
Or pressing static protective material film on described the first metal layer, to form electrostatic guarantor
Backplate；
Step S13: electrostatic protection plate is cut by the circuit according to treating electrostatic protection,
Obtain described unit electrostatic protection plate.
Preferably, in described step S10, make the first intermediate plate and include:
Step S14: prepare described second metal level and described insulating properties substrate layer；
Step S15: window to form described windowed regions to described second metal level,
The size of the size of described windowed regions and described unit electrostatic protection plate is fitted mutually；
Step S16: second windowed described in arranging in the side of described insulating properties substrate layer
Metal level, and described unit electrostatic protection plate is embedded in described windowed regions；
Step S17: by described unit electrostatic protection plate, described in the second metal level of windowing
With described insulating properties substrate layer phase pressing, wherein, the electrostatic of described unit electrostatic protection plate
Protective layer contacts with described insulating properties substrate layer.
A kind of preferred version is that, in described step S20, described unit metal layer is with described
Second metal level electrically connects completely；Before described step S20, may further comprise:
The side being embedded with unit electrostatic protection plate in described first intermediate plate forms electrodeposited coating,
Described unit metal layer and described second metal level electrically connect with described electrodeposited coating；Described step
Rapid S20 farther includes, at the correspondence position of described electrodeposited coating Yu described unit metal layer
The described change gap of upper formation.
Another kind of preferred version is, before described step S20, to may further comprise:
Etching method is used to make described unit metal layer and described second metal level electric isolution；Or
Person, in step slo, each limit size making the windowed regions of described second metal level is big
Each limit corresponding size 0.2-0.3mm in described unit metal layer.Preferably, described electricity
Coating uses electro-plating method to be formed, and the thickness of described electrodeposited coating is more than or equal to 5 μm.
Preferably, in described step S30, formed in the outside of described second intermediate plate
At least one increases layer particularly as follows: distinguish pressing in the one or both sides of described second intermediate plate
Prepreg and the 3rd metal level, then carried out described prepreg and the 3rd metal level
Boring, plating, figure transfer, thus form the first increasing layer；Or continue according to technique
Sequentially, the second increasing layer is formed, until forming the plurality of increasing layer.
Wherein, in described step S20, described unit metal layer forms change gap
Formed by figure transfer method.
Preferably, described static protective material include voltage switchable dielectric material or
Can be resetted at least one in non-linear polymer.
A kind of printed circuit board, described printed circuit board includes the second intermediate plate and at least
Individual increasing layer: described second intermediate plate includes the loading plate with windowed regions and is embedded in
The unit electrostatic protection plate of described windowed regions, described unit electrostatic protection plate includes unit
Metal level and be attached to the unit electrostatic protection layer on described unit metal layer, described list
Offering change gap on unit's metal level, described change gap is by described unit electrostatic protection
Layer is divided into electrostatic protection region and ground area；Described increasing layer is formed at described second
The outside of intermediate plate, treats in described increasing layer that the circuit of electrostatic protection is protected with described unit electrostatic
Electrostatic protection region electrical connection on backplate, in described increasing layer, ground plane is quiet with described unit
Ground area electrical connection on electric protection plate.
Preferably, the thickness range of described unit electrostatic protection layer is
0.5mil ~ 1.5mil, the width of described change gap is less than or equal to 10mil.
The invention has the beneficial effects as follows: use the making of printed circuit board of the present invention
Method, can significantly reduce the cost of manufacture of printed circuit board, and electrostatic protection layer thickness
Uniformly, improve the reliability of printed circuit board electrostatic protection.
Accompanying drawing explanation
Fig. 1 is the flow chart of the preparation method of printed circuit board of the present invention；
Fig. 2 is the making step exploded view of printed circuit board in the embodiment of the present invention 1；
Wherein:
Fig. 2 A is the part system in embodiment 1 in step S10 in corresponding diagram 1 flow chart
Make schematic diagram；
Fig. 2 B is the part system in embodiment 1 in step S10 in corresponding diagram 1 flow chart
Make schematic diagram；
Fig. 2 C is the making signal of step S20 in embodiment 1 in corresponding diagram 1 flow chart
Figure；
Fig. 2 D is the making signal of step S30 in embodiment 1 in corresponding diagram 1 flow chart
Figure；
Fig. 2 E is the top view of corresponding diagram 2B；
Fig. 3 is the plane signal of change gap and electrostatic protection area type in embodiment 1
Figure；
Wherein:
Fig. 3 A is circular electrostatic protection area schematic；
Fig. 3 B is semicircle electrostatic protection area schematic；
Fig. 3 C is linear pattern electrostatic protection area schematic；
Fig. 3 D is double-lined type electrostatic protection area schematic；
Fig. 3 E is broken line type electrostatic protection area schematic；
Fig. 4 is the making step exploded view of printed circuit board in the embodiment of the present invention 2；
Wherein:
Fig. 4 A is the part system in embodiment 2 in step S10 in corresponding diagram 1 flow chart
Make schematic diagram；
Fig. 4 B is the part system in embodiment 2 in step S10 in corresponding diagram 1 flow chart
Make schematic diagram；
Fig. 4 C is the making signal of step S20 in embodiment 2 in corresponding diagram 1 flow chart
Figure；
Fig. 4 D is the making signal of step S30 in embodiment 2 in corresponding diagram 1 flow chart
Figure；
The signal dredging the flow direction of electrostatic induced current when Fig. 5 is printed circuit board static discharge
Figure；
Wherein:
When Fig. 5 A is printed circuit board static discharge in embodiment 1, electrostatic induced current dredges stream
To schematic diagram；
When Fig. 5 B is printed circuit board static discharge in embodiment 2, electrostatic induced current dredges stream
To schematic diagram；
Fig. 6 is the schematic diagram of printed circuit board generation static discharge in prior art.
In figure: 1-the first metal layer；2-electrostatic protection layer；20-unit electrostatic protection plate；
3-the second metal level；The second metal level that 30-windows；4-insulating properties substrate layer；5-electroplates
Layer；6-change gap；7-prepreg；8-the 3rd metal level；9-metal aperture；10-is quiet
Electric protection region；11-passive element；12-active component；13-ground area；14-opens
Window region；15-connector.
Detailed description of the invention
For making those skilled in the art be more fully understood that technical scheme, knot below
Close the drawings and specific embodiments the present invention is described in further detail.
The present invention provides the preparation method of a kind of printed circuit board, comprises the steps:
Step S10: make the first intermediate plate: described in the first intermediate plate of making include list
Unit's electrostatic protection plate and the loading plate with windowed regions;Described loading plate includes insulating properties
Substrate layer and the second metal level, described second metal level is located at described insulating properties substrate layer
One or both sides, described windowed regions is located on the second metal level;Described unit electrostatic protection
Plate includes unit metal layer and is attached to the unit electrostatic protection on described unit metal layer
Layer；Described unit electrostatic protection plate is embedded in described windowed regions so that described list
Unit's metal level is with described second metal level at grade；
Step S20: make the second intermediate plate: at described unit metal layer and described second
Form circuitous pattern on metal level, and on described unit metal layer, form change gap,
Described unit electrostatic protection layer is divided into electrostatic protection region and ground area；
Step S30: form printed circuit board: formed in the outside of described second intermediate plate
At least one increases layer, makes the circuit treating electrostatic protection in described increasing layer and described unit electrostatic
The electrostatic protection region electrical connection of protective layer, and make the ground plane in described increasing layer and institute
State the ground area electrical connection on unit electrostatic protection plate.
Divide specific embodiment that above-mentioned embodiment is explained below.
Embodiment 1:
The preparation method of a kind of printed circuit board, comprises the steps of:
Step S10: make the first intermediate plate: described in the first intermediate plate of making include list
Unit's electrostatic protection plate and the loading plate with windowed regions;Described loading plate includes insulating properties
Substrate layer and the second metal level, described second metal level is located at described insulating properties substrate layer
One or both sides, described windowed regions is located on the second metal level;Described unit electrostatic protection
Plate includes unit metal layer and is attached to the unit electrostatic protection on described unit metal layer
Layer；Described unit electrostatic protection plate is embedded in described windowed regions so that described list
Unit's metal level is with described second metal level at grade.
Wherein, the step forming described unit electrostatic protection plate in this step includes:
Step S11: prepare the first metal layer.
Described the first metal layer uses conductive Copper Foil, aluminium foil or silver foil etc., the most often
Use Copper Foil.
Step S12: coat on described the first metal layer or print static protective material,
Or pressing static protective material film on described the first metal layer, to form electrostatic guarantor
Backplate.
Such as Fig. 2 A(1) shown in, in this step, forming electrostatic protection plate has different
Mode, a kind of mode is for relying on conductive the first metal layer 1, use coat or
Mode of printing forms electrostatic protection layer 2 on the first metal layer 1.Concrete, can be by being coated with
Cover machine or printing machine coat on the first metal layer 1 or print certain thickness electrostatic protection
Material；A kind of mode is static protective material to use certain technique be initially formed have one
Determine the electrostatic protection film of thickness, then by conductive the first metal layer 1 and this electrostatic
Protective film uses the mode of pressing to be formed together, electrostatic protection film i.e. electrostatic protection
Electrostatic protection layer 2 in plate.At the present embodiment, due to the first metal layer 1 opposed flattened,
Therefore any one above-mentioned mode is used all can be formed on electrostatic protection in uniform thickness
Layer 2, and manufacture craft is the simplest, easy.
Wherein, at when static protective material has the property that and works under normal voltage
In state of insulation, when voltage exceedes its critical voltage, become conduction from state of insulation
State, when voltage drops under critical voltage, reverts to again state of insulation.Commonly use
Static protective material has: voltage switchable dielectric material (VSDM:Voltage
Switchable Dielectric Material), or the non-linear polymer that can reset
Etc. having ejusdem generis material.In the present embodiment, the thickness range of electrostatic protection layer 2
For 0.5mil ~ 1.5mil.
Step S13: electrostatic protection plate is cut by the circuit according to treating electrostatic protection,
Obtain described unit electrostatic protection plate.
Concrete, can be by laser cutting, machine cuts or any one mode pair die-cut
Described electrostatic protection plate is split, stand-by to form multiple unit electrostatic protection plate 20,
The size of the unit electrostatic protection plate 20 wherein split is by electronics unit to be protected device
Part and the quantity of circuit and allowable voltage thereof determine.In short, need electronics to be protected unit
The quantity of device and circuit is many, then the area of unit electrostatic protection plate is relatively large, otherwise
Then area is relatively small；The allowable voltage needing electronic devices and components to be protected and circuit is relatively big,
Then the area of unit electrostatic protection plate is relatively large, otherwise then area is relatively small.
The step forming the loading plate with windowed regions in this step includes:
Step S14: prepare described second metal level and described insulating properties substrate layer.
Described second metal level 3 uses conductive Copper Foil, aluminium foil or silver foil etc., at present
Frequently be Copper Foil.Described insulating properties substrate layer 4 uses prepreg, and described half admittedly
Changing sheet and include resin and reinforcing material, wherein, described reinforcing material can use epoxy resin
Glass-fiber-fabric, aromatic polyamide resin fiber weaving cloth or epoxy resin non-woven fabrics, described
Resin can use polyimide resin, polyflon, polyphenylene oxide resin, polyphenyl
Ether resin, cyanate ester resin or bi-maleimide modified cyanate resin.
Step S15: window to form described windowed regions to described second metal level,
The size of the size of described windowed regions and described unit electrostatic protection plate is fitted mutually.
Such as Fig. 2 A(2) shown in, laser cutting, machinery milling or die-cut can be passed through
A kind of mode forms windowed regions 14 on described second metal level 3, windows with formation
Second metal level 30, the size of the windowed regions 14 in described second metal level and described list
The size of unit's electrostatic protection unit 20 adapts, so that unit electrostatic protection plate 20 energy
Just bury underground in windowed regions 14.
In above process, described unit electrostatic protection plate is formed and with windowed regions
The step of the second metal level each independent, do not have in the manufacturing process of printed circuit board
Fixing sequencing, can be ready to stand-by in advance according to actual conditions.
Forming said units electrostatic protection plate and the loading plate with windowed regions
On the basis of, form the first intermediate plate further, comprise the steps:
Step S16: second windowed described in the overlapping of the side of described insulating properties substrate layer
Metal level, and described unit electrostatic protection plate is embedded in described windowed regions.
In this step, as shown in Figure 2 B, by the second metal level 30 windowed and insulation
Property substrate layer 4 is superimposed together.Concrete, can be in the side of described insulating properties substrate layer
The second metal level 3 windowed described in arranging, and/or opposite side arrange described in window second
Metal level or the second metal level do not windowed, then bury underground in above-mentioned windowed regions 14
Unit electrostatic protection plate 20.If the side of insulating properties substrate layer 4 in printed circuit board,
As downside does not exist the object treating electrostatic protection, then the second metal level of downside in Fig. 2 B
3(or the second metal level 30 windowed) can also omit, the i.e. first intermediate plate is asymmetric
Lamination.
Step S17: by described unit electrostatic protection plate, described in the second metal level of windowing
With described insulating properties substrate layer phase pressing, wherein, the electrostatic of described unit electrostatic protection plate
Protective layer contacts with described insulating properties substrate layer.
In this step, unit electrostatic protection plate is provided with the side of electrostatic protection layer with
Insulating properties substrate layer is adjacent, embeds the inside of insulating properties substrate layer in bonding processes, and
Unit metal layer in described unit electrostatic protection plate and described second metal level are formed at same
In one plane.
Step S20: make the second intermediate plate: at described unit metal layer and described second
Form circuitous pattern on metal level, and on described unit metal layer, form change gap,
Described unit electrostatic protection layer is divided into electrostatic protection region and ground area.
As shown in Figure 2 C, in this step, particularly use figure transfer method described
Form described change gap 6 on unit metal layer, or use laser ablation method at unit gold
Belong to and form described change gap 6 on layer, the part above electrostatic protection layer 2 will be arranged on
Unit metal layer is removed, and to form change gap 6, described change gap makes unit electrostatic
Protective layer is divided into electrostatic protection region 10 and ground area 13.Wherein, described shape
The width of the change gap 6 become determine can the size of Clamping voltages (i.e. threshold voltage),
The width of described change gap to can Clamping voltages value be directly proportional change, i.e. change gap
Width is the least, can Clamping voltages value the least.Can should be more than by Clamping voltages described in generally
In described electronic devices and components and one or more allowable voltages of circuit, described change gap
Width less than or equal to 10mil.Such as, when using certain same static protective material,
For the electrostatic protection layer of 1mil thickness, the threshold voltage of the change gap of 2.5mil width
At the threshold voltage of change gap of below 260V, 3.0mil width at below 310V.
Wherein, change gap can treat electrostatic according to concrete with the form in electrostatic protection region
Protection Properties of Objects, shapes and sizes determine, Fig. 3 shows common several turns
Change the floor map of the type in gap and electrostatic protection region, its specifically include circle,
The change gap 6 of semicircle, linear pattern, double-lined type or broken line type, and form corresponding shape
The electrostatic protection region 10 of shape.The most corresponding circular, semicircle, the straight line of Fig. 3 A ~ Fig. 3 E
Type, double-lined type and broken line type change gap and corresponding electrostatic protection region.Its
In, electrostatic protection layer is divided into electrostatic protection region 10 and ground area by change gap 6
13, ground area 13 is connected with insulating properties substrate layer 4, is connected to printed circuit the most at last
The ground plane of plate.Need exist for explanation, the electrostatic protection region 10 in Fig. 3 with connect
Region 13, ground is the part in unit electrostatic protection plate, and the differentiation of the two is and increases
The difference that in Ceng, functional layer connects, and each play during electrostatic protection is protected
Function is different, in order to relatively significantly illustrate the boundary of the two in Fig. 3, therefore have employed not
Same hatching pattern is to show difference.
Above-mentioned change gap is applicable to make various types of circuit or various electronic devices and components
For the electrostatic protection of electrostatic protection object, can design according to side circuit or print in the application
The change gap type selecting to be suitable for shape that needs of circuit board space processed arrangement completes circuit
Design.When the static discharge voltage being subjected to is bigger, can arrange and there is long length
(unit electrostatic protection plate area is relatively big, the change gap that typically can arrange for change gap
Length is longer), in the case of the width of change gap is certain, the length of change gap
The longest, the electricity of the static discharge that can dredge is bigger, is more effective to ensure that electrostatic protection
Layer does not haves punch-through in the transfer process of insulating properties to electric conductivity.At printed circuit
After plate completes, the circuit electrically connected with this electrostatic protection region 10 or electronic devices and components (
Before unwelded electronic devices and components, this region can be considered weld zone) can be by effective
Electrostatic discharge (ESD) protection.
As shown in Figure 2 E, after process for pressing, unit electrostatic protection plate 20 and windowing
The second metal level 30 between there may be the least gap, and gap may be filled
There is resin material, i.e. unit metal layer and the second metal windowed in unit electrostatic protection plate
Although layer 30 is at grade, but is probably therebetween being also likely to be not of connection
Connect, i.e. loading plate and unit electrostatic protection plate with windowed regions presents one seemingly
The state of Lian Feilian.And in printed circuit board, this state like Lian Feilian may be
Make the two electrically connect in some cases, and make the two electrically insulate in some cases, from
The reliability and stability of circuit consider, this uncertain state is not allow to exist,
Therefore, the unit metal layer in unit electrostatic protection plate 20 is necessary with described second metal level
Electrically insulate completely or electrically connect completely, treating electrostatic protection with prevention unit electrostatic protection layer
The electrostatic protection of object lost efficacy.
The present embodiment be employed technical scheme comprise that to make described unit metal layer and described second
Metal level electrically insulates completely.That is, before step S20, use Etching method, make
Gap between described unit metal layer and described second metal level is strengthened, thus ensures list
Unit metal layer and the second metal level 30 windowed in unit's electrostatic protection plate 20 are the most disconnected
Open；Or, in step slo, make each limit of the windowed regions of described second metal level
Size is more than each limit corresponding size 0.2-0.3mm of described unit metal layer.
Step S30: form printed circuit board: formed in the outside of described second intermediate plate
At least one increases layer, makes the circuit treating electrostatic protection in described increasing layer and described unit electrostatic
Electrostatic protection region electrical connection on protective layer, and make ground plane in described increasing layer with
Ground area electrical connection on described unit electrostatic protection plate.
In this step, the outside at described second intermediate plate forms at least one and increases layer tool
Body is, as shown in Figure 2 D: in the one or both sides of described second intermediate plate difference pressing half
Cured sheets 7 and the 3rd metal level 8 form laminate, then bore described laminate
Hole, plating, figure transfer, thus form the first increasing layer；Or continue suitable according to technique
Sequence, forms the second increasing layer, until forming the plurality of increasing layer, to complete whole printing electricity
The making of road plate.Wherein, described increasing layer is generally individually provided with ground connection (Ground) layer,
Ground plane in described increasing layer is electrically connected with the ground area 13 in described unit electrostatic protection plate
Connect, the non-functional circuit welded electrically connected with described electrostatic protection region in described increasing layer
Or the electronic devices and components in weld zone are by electrostatic discharge (ESD) protection；In described increasing layer the 3rd
Metal level 8 is electrically connected by metal aperture 9 with unit metal layer.Wherein, the 3rd metal level
8 use conductive Copper Foils, aluminium foil or silver foil etc., at present frequently be Copper Foil.
Lamination in printed circuit board manufacturing process shown in Fig. 2 D, pressing, boring,
The concrete steps such as plating, figure transfer, welding, in printed circuit board making field be
Known technology, repeats no more here.Wherein, boring, plating step make surface in increasing layer
Circuit region or weld zone be connected with electrostatic protection layer 2.The described electronics treating electrostatic protection
Components and parts include passive element 11 and active component 12, and wherein passive element includes connecting
Device 15(is as shown in Figure 6), resistance, electric capacity, the electronic devices and components such as inductance, active
Element includes the electronic devices and components such as diode, transistor, silicon controlled rectifier (SCR), valve.
It is connected with ground area 13 owing to increasing the ground plane (not shown) in layer, once goes out
Existing static discharge phenomenon, electric charge can be dredged by the electrostatic protection layer 2 being attached thereto
In ground plane.I.e. voltage arrive electrostatic protection layer critical voltage (threshold voltage) time,
Electrostatic protection layer is changed on conduction state, circuit or electronic devices and components by state of insulation
Electrostatic charge is by unit metal layer or by the second metal electrically connected with unit metal layer
Layer arrives electrostatic protection layer, then arrives ground plane by ground area 13 so that increase in layer
The electronic devices and components of the circuit region corresponding with electrostatic protection region or weld zone welding bear
Static discharge voltage or static discharge current significantly reduce, so that circuit region or electronics unit
Device is effectively protected.
A kind of printed circuit board, described printed circuit board includes the second intermediate plate and at least
Individual increasing layer: described second intermediate plate includes the loading plate with windowed regions and is embedded in
The unit electrostatic protection plate of described windowed regions, described unit electrostatic protection plate includes unit
Metal level and be attached to the unit electrostatic protection layer on described unit metal layer, described list
Offering change gap on unit's metal level, described change gap is by described unit electrostatic protection
Layer is divided into electrostatic protection region and ground area；Described increasing layer is formed at described second
The outside of intermediate plate, treats in described increasing layer that the circuit of electrostatic protection is protected with described unit electrostatic
Electrostatic protection region electrical connection on backplate, in described increasing layer, ground plane is quiet with described unit
Ground area electrical connection on electric protection plate.In the present embodiment, electrostatic electricity during static discharge
The signal dredging the flow direction of stream is as shown in Figure 5A.
In the present embodiment, be there is the electrostatic protection layer of uniform thickness by making in advance
Unit electrostatic protection plate, is partly embedded into this unit electrostatic protection plate in loading plate, and leads to
Unit electrostatic protection layer is divided into ground area and electrostatic guarantor by the formation crossing change gap
Protect region；Meanwhile, use printed circuit board manufacture craft commonly used in the prior art, make
Unit metal layer above unit electrostatic protection layer thoroughly breaks with the second metal level 3 of surrounding
Open, and form increasing layer, the ground plane in described increasing layer and ground area 13 on this basis
Connect, increase the circuit region to be protected in layer or the electronic devices and components in weld zone are protected with electrostatic
Protect region 10 to electrically connect, so that treat that electrostatic protection object obtains effective electrostatic protection,
Reach to prevent by the purpose of electrostatic discharges.
Embodiment 2:
The present embodiment is with the difference of embodiment 1, in described step S20 of the present embodiment
In, unit metal layer (in the first metal layer in described unit electrostatic protection plate
Point) electrically connect completely with described second metal level.That is, for the gap shown in Fig. 2 E,
The present embodiment be employed technical scheme comprise that to make described unit metal layer and described second metal
Layer electrically connects completely.That is, use galvanoplastic, utilize the electrodeposited coating 5(that galvanoplastic are formed such as
Shown in Fig. 4 B), make unit metal layer in unit electrostatic protection plate 20 and window the
The two fully effective connections of metal level 30.
As described in Example 1, the second metal windowed buried underground by unit electrostatic protection plate 20
Layer 30 in time, because of between unit electrostatic protection plate 20 and the second metal level 30 windowed not
Certain gap can be there may be with avoiding, in order to eliminate this situation like Lian Feilian,
Ensure to treat that the electrostatic protection validity of electrostatic protection object, the present embodiment make described unit gold
Belong to layer electrically connect completely with described second metal level, particularly as follows: described step S20 it
Before, may further comprise:
The side being embedded with unit electrostatic protection plate in described first intermediate plate forms plating
Layer 5, described unit metal layer and described second metal level electrically connect with described electrodeposited coating；Phase
Answer, in described step S20, in described unit metal layer and described electrodeposited coating and institute
State and on the correspondence position of unit metal layer, form described change gap 6, as shown in Figure 4 C.
Galvanoplastic are the known common technology in printed circuit board making field, therefore have
Body step repeats no more, and in printed circuit board makes, typical electrodeposited coating is copper electroplating layer.
In the present embodiment, the thickness of described electrodeposited coating is more than or equal to 5 μm.
Fig. 4 show the making exploded view of printed circuit board in the present embodiment.Wherein, figure
4A(1) and Fig. 4 A(2) in formed and be attached with the unit electrostatic protection plate of electrostatic protection layer
It is and step with the second metal level of windowed regions is same as in Example 1, same,
The making step of the two is each independent, can be ready to stand-by in advance according to actual conditions.
As shown in Figure 4 B, by galvanoplastic at the second metal level 30 windowed and unit gold
Belong to and form one layer of electrodeposited coating on layer, this electrodeposited coating can guarantee that the second metal level 30 of windowing with
Unit metal layer forms electrical connection reliably, now directly forms circuit on this electrodeposited coating
District or weld zone, it is ensured that the electronic devices and components in this circuit region or weld zone obtain effectively
Electrostatic protection.
Accordingly, as shown in Figure 4 C, in described step S20, electrodeposited coating and described list
Same change gap is formed on the correspondence position of unit's metal level.Certainly, in this step
Also it is not excluded for using other can make the unit metal layer in unit electrostatic protection plate 20 and window
The second metal level 30 can the method for fully effective electrical connection, such as: can use the coating can
The method of conductive material is at the second metal level 30 windowed and unit electrostatic protection plate 20
Effective connection is formed, so that the second metal level 30 windowed is with single between burial place
Unit's metal level forms reliable electrical connection.
As shown in Figure 4 D, formed on the basis of the second intermediate plate shown in Fig. 4 C and increase layer,
Thus complete the making of printed circuit board, the present embodiment is formed each step and the reality increasing layer
Execute each step of formation increasing layer in example 1 identical, repeat no more here.
A kind of printed circuit board, including the second intermediate plate and at least one increase layer, described the
Two intermediate plates include the loading plate with windowed regions and are embedded in described windowed regions
Unit electrostatic protection plate, described unit electrostatic protection plate includes unit metal layer and attachment
Unit electrostatic protection layer on described unit metal layer, described unit metal layer is offered
Having change gap, described unit electrostatic protection layer is divided into electrostatic and protects by described change gap
Protect region and ground area；Described increasing layer is formed at the outside of described second intermediate plate,
Described increasing layer being treated, the circuit of electrostatic protection is protected with the electrostatic on described unit electrostatic protection plate
Protect region 10 to electrically connect, in described increasing layer on ground plane and described unit electrostatic protection plate
Ground area electrically connects.In the present embodiment, during static discharge, electrostatic induced current dredges the flow direction
Signal as shown in Figure 5 B.
In the present embodiment, by making the list of the electrostatic protection layer with uniform thickness in advance
Unit's electrostatic protection plate, is partly embedded into this unit electrostatic protection plate in loading plate；Meanwhile,
Use galvanoplastic commonly used in the prior art to form electrodeposited coating, make in unit electrostatic protection layer
The unit metal layer of side thoroughly electrically connects with the second metal level 3 of surrounding (i.e. by plating
Layer sets up effectively connecting between the second metal level 30 and the unit electrostatic protection plate 20 windowed
Connect), then by the formation of change gap, unit electrostatic protection layer is divided into ground area
And electrostatic protection region；And form increasing layer, the ground connection in described increasing layer on this basis
Layer is connected with ground area 13, increases the circuit region to be protected in layer or the electronics in weld zone
Components and parts electrically connect with electrostatic protection region, so that treat that electrostatic protection object is had
The electrostatic protection of effect, reaches to prevent by the purpose of electrostatic discharges.
In the present embodiment, the preparation method of printed circuit board is particularly suited for needing electronics unit
Device is welded on unit metal layer in unit electrostatic protection plate 20 with the printed circuit board of layer
In situation.
The invention has the beneficial effects as follows, owing to have employed part embedding manner setup cost relatively
High static protective material, therefore can reduce the use of static protective material largely
Amount, thus reduce the cost of manufacture of the printed circuit board with electrostatic protection function；And,
Owing to have employed the mode on smooth metal level that electrostatic protection layer is previously formed in, because of
This manufacture craft is relatively simple, makes electrostatic protection layer flatness and thickness evenness all simultaneously
Preferably, improve the reliability of electrostatic protection；Meanwhile, in printed circuit board electrical connection with
Electric isolution state is clearly demarcated, it is ensured that the validity of electrostatic protection and stability.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present
And the illustrative embodiments used, but the invention is not limited in this.For ability
For those of ordinary skill in territory, in the situation without departing from spirit and substance of the present invention
Under, various modification and improvement can be made, these modification and improvement are also considered as the present invention's
Protection domain.
Claims (10)
1. the preparation method of a printed circuit board, it is characterised in that comprise:
Step S10: make the first intermediate plate: described first intermediate plate made includes list
Unit's electrostatic protection plate and the loading plate with windowed regions；Described loading plate includes insulating properties
Substrate layer and the second metal level, described second metal level is located at described insulating properties substrate layer
One or both sides, described windowed regions is located on the second metal level；Described unit electrostatic protection
Plate includes unit metal layer and is attached to the unit electrostatic protection on described unit metal layer
Layer；Described unit electrostatic protection plate is embedded in described windowed regions so that described list
Unit's metal level is with described second metal level at grade；
Step S20: make the second intermediate plate: at described unit metal layer and described second
Form circuitous pattern on metal level, and on described unit metal layer, form change gap,
Described unit electrostatic protection layer is divided into electrostatic protection region and ground area；
Step S30: form printed circuit board: formed in the outside of described second intermediate plate
At least one increases layer, makes the circuit treating electrostatic protection in described increasing layer and described unit electrostatic
The electrostatic protection region electrical connection of protective layer, and make the ground plane in described increasing layer and institute
State the ground area electrical connection on unit electrostatic protection plate.
Preparation method the most according to claim 1, it is characterised in that in described step
In rapid S10, form described unit electrostatic protection plate and include:
Step S11: prepare the first metal layer；
Step S12: coat on described the first metal layer or print static protective material,
Or pressing static protective material film on described the first metal layer, to form electrostatic guarantor
Backplate；
Step S13: electrostatic protection plate is cut by the circuit according to treating electrostatic protection,
Obtain described unit electrostatic protection plate.
Preparation method the most according to claim 2, it is characterised in that described step
In S10, make the first intermediate plate and include:
Step S14: prepare described second metal level and described insulating properties substrate layer；
Step S15: window to form described windowed regions to described second metal level,
The size of the size of described windowed regions and described unit electrostatic protection plate is fitted mutually；
Step S16: second windowed described in arranging in the side of described insulating properties substrate layer
Metal level, and described unit electrostatic protection plate is embedded in described windowed regions；
Step S17: by described unit electrostatic protection plate, described in the second metal level of windowing
With described insulating properties substrate layer phase pressing, wherein, the electrostatic of described unit electrostatic protection plate
Protective layer contacts with described insulating properties substrate layer.
Preparation method the most according to claim 3, it is characterised in that described step
In S20, described unit metal layer electrically connects completely with described second metal level；In described step
Before rapid S20, may further comprise:
The side being embedded with unit electrostatic protection plate in described first intermediate plate forms plating
Layer, described unit metal layer and described second metal level electrically connect with described electrodeposited coating；
Described step S20 farther includes, at described electrodeposited coating and described unit metal layer
Correspondence position on form described change gap.
Preparation method the most according to claim 3, it is characterised in that in described step
Before rapid S20, may further comprise: that employing Etching method makes described unit metal layer
With described second metal level electric isolution；Or,
In step slo, each limit size making the windowed regions of described second metal level is big
Each limit corresponding size 0.2-0.3mm in described unit metal layer.
Preparation method the most according to claim 4, it is characterised in that described plating
Layer uses electro-plating method to be formed, and the thickness of described electrodeposited coating is more than or equal to 5 μm.
Preparation method the most according to claim 3, it is characterised in that described step
In S30, formed in the outside of described second intermediate plate at least one increase layer particularly as follows:
At the one or both sides of described second intermediate plate difference pressing prepreg and the 3rd gold medal
Belong to layer, then described prepreg and the 3rd metal level holed, electroplate, figure
Transfer, thus form the first increasing layer；Or continue according to forming the described first work increasing layer
Skill order, forms the second increasing layer, until forming multiple increasing layer.
8. according to the arbitrary described preparation method of claim 2-7, it is characterised in that institute
State static protective material and include that voltage switchable dielectric material maybe can reset non-linear polymerization
At least one in thing.
9. a printed circuit board, it is characterised in that described printed circuit board includes second
Intermediate plate and at least one increasing layer:
Described second intermediate plate includes the loading plate with windowed regions and is embedded in described
The unit electrostatic protection plate of windowed regions, described loading plate includes insulating properties substrate layer and
Two metal levels, described second metal level is located at the one or both sides of described insulating properties substrate layer,
Described windowed regions is located on the second metal level, and described unit electrostatic protection plate includes unit
Metal level and be attached to the unit electrostatic protection layer on described unit metal layer, described list
Unit's electrostatic protection plate is embedded in described windowed regions, and described unit metal layer is with described
Second metal level at grade, on described unit metal layer and described second metal level
It is formed with circuitous pattern, described unit metal layer offers change gap, described conversion
Described unit electrostatic protection layer is divided into electrostatic protection region and ground area by gap；
Described increasing layer is formed at the outside of described second intermediate plate, treats electrostatic protection in described increasing layer
Circuit electrically connect with the electrostatic protection region on described unit electrostatic protection plate, described increasing
In Ceng, ground plane electrically connects with the ground area on described unit electrostatic protection plate.
Printed circuit board the most according to claim 9, it is characterised in that described list
The thickness range of unit's electrostatic protection layer is 0.5mil～1.5mil, the width of described change gap
Less than or equal to 10mil.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210372013.2A CN103716994B (en) | 2012-09-28 | 2012-09-28 | The preparation method of a kind of printed circuit board and printed circuit board thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210372013.2A CN103716994B (en) | 2012-09-28 | 2012-09-28 | The preparation method of a kind of printed circuit board and printed circuit board thereof |
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| CN103716994B true CN103716994B (en) | 2016-09-07 |
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| CN110536551B (en) * | 2019-07-10 | 2020-08-21 | 广东工业大学 | Preparation method of circuit board |
| CN110446360A (en) * | 2019-07-23 | 2019-11-12 | 河南博美通电子科技有限公司 | A kind of high Precision Aluminium substrate and flexible board alkali etching processing technology |
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| US20060152334A1 (en) * | 2005-01-10 | 2006-07-13 | Nathaniel Maercklein | Electrostatic discharge protection for embedded components |
| CN101189365B (en) * | 2005-02-16 | 2015-09-16 | 三米拉-惜爱公司 | The embedding instantaneous protection layer of the basic continous of printed circuit board (PCB) |
| CN101507129B (en) * | 2005-11-22 | 2013-03-27 | 肖克科技有限公司 | Wireless communication device using voltage switchable dielectric material |
| US20090200063A1 (en) * | 2008-02-08 | 2009-08-13 | Sony Ericsson Mobile Communications Ab | Embedded spark gap |
| US8203421B2 (en) * | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
| JP2011100649A (en) * | 2009-11-06 | 2011-05-19 | Murata Mfg Co Ltd | Substrate with built-in electronic component and electronic module |
| KR101048717B1 (en) * | 2010-01-19 | 2011-07-14 | 삼성전기주식회사 | Pcb strip and manufacturing method for printed circuit board having electro device embedded therein |
| US8379356B2 (en) * | 2011-03-03 | 2013-02-19 | Holy Stone Enterprise Co., Ltd. | Overvoltage protection device and its fabrication |
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Address after: 519175 Doumen Fushan Industrial Zone, Zhuhai City, Guangdong Province Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 519175 Doumen Fushan Industrial Zone, Zhuhai City, Guangdong Province Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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Effective date of registration: 20220915 Address after: 519175 Doumen Fushan Industrial Zone, Zhuhai City, Guangdong Province Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Address before: 519175 Doumen Fushan Industrial Zone, Zhuhai City, Guangdong Province Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |