CN103676487B - A kind of workpiece height measurement mechanism and bearing calibration thereof - Google Patents
A kind of workpiece height measurement mechanism and bearing calibration thereof Download PDFInfo
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- CN103676487B CN103676487B CN201210328886.3A CN201210328886A CN103676487B CN 103676487 B CN103676487 B CN 103676487B CN 201210328886 A CN201210328886 A CN 201210328886A CN 103676487 B CN103676487 B CN 103676487B
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Abstract
A kind of workpiece height measurement mechanism and bearing calibration thereof, comprise light source injection light and be divided into slit beam by slit, oblique incidence forms incident beam to workpiece, then is mapped to and measures hot spot and reflect to form folded light beam by catoptron group formation parallel beam through workpiece; Spectroscope is divided into first, second measuring beam parallel beam; First, second measuring beam is received by first, second linear charge-coupled array respectively by after first, second detection mirror group, forms first, second image respectively.When workpiece is positioned at zero-bit, by first, second image mosaic, calculate the zero-bit spacing of sub-hot spot; During workpiece out of focus, by first, second image mosaic obtained, calculate the out of focus spacing of sub-hot spot; According to the zero-bit spacing of sub-hot spot, the displacement of out of focus distance computation each sub-hot spot, using its mean value as spot displacement mean value calculation workpiece defocusing amount.Measuring accuracy of the present invention is high, and Technological adaptability is strong.
Description
Technical field
The present invention relates to object height and survey field, school, particularly a kind of device and bearing calibration thereof utilizing light measuring workpieces height.
Background technology
Exposure device is the device projected to by projection objective by the pattern on mask on surface of the work.In apparatus for projection exposure, the thickness deviation of workpiece, face shape rise and fall and the inaccuracy of projection objective focal plane position and the factor such as not repeated can cause workpiece to produce out of focus or inclination relative to focal plane, if the out of focus of workpiece or inclination make some region in exposure field be in outside effective depth of focus, measuring accuracy will be had a strong impact on.
US Patent No. 5118957 proposes a kind of contactless optical Electric Measurement Technology, the focusing that the light beam that this technology utilizes higher source luminance to send throws light on multiple pin hole after condenser marks, pin hole focusing mark is through imaging system and transfer mirror projection on workpiece, pin-hole image measurement point on workpiece is positioned at exposure field center, and other measurement points are distributed in surrounding.After workpiece reflection, by imaging system amplification imaging on area array CCD (charge-coupled image sensor).When workpiece is in projection objective focal plane, focusing mark forms optical conjugate relation through twice imaging and area array CCD, then the out of focus of workpiece and inclination can cause the incoming position of pin-hole imaging light beam on CCD to change, and can be obtained defocusing amount and the tilt quantity of workpiece by signal transacting.But, because CCD is subject to the restriction of resolution, cannot accurately calculate defocusing amount and tilt quantity.
Summary of the invention
The technical problem to be solved in the present invention is the constraint of charge-coupled image sensor resolution to workpiece defocusing amount measuring accuracy.In order to solve the problems of the technologies described above, the invention provides a kind of workpiece height measurement mechanism, comprising:
Light source, illuminated mirror group, slit, projection lens's group, the light that described light source sends is successively by after described illuminated mirror group and described slit, be divided into some bundle light, described some bundle light is incided by described projection lens group rear-inclined and is positioned on the workpiece of work stage, form incident ray, described incident ray, after described workpiece reflection, forms reflection ray;
It is characterized in that, also comprise:
Catoptron group, described reflection ray is by forming some bundle parallel beams after described catoptron group;
Spectroscope, is divided into the first measuring beam and second measuring beam vertical with described first measuring beam described parallel beam;
First detection mirror group and First Line array charge-coupled device, First Line array charge-coupled device receives by the first measuring beam after the first detection mirror group, obtains the first image;
Second detection mirror group and the second linear charge-coupled array, the second linear charge-coupled array receives the second measuring beam after the second detection mirror group, obtains the second image;
Described first detection mirror group and described second detection mirror group with spectroscopical apart from identical, described First Line array charge-coupled device is identical with the distance of described second linear charge-coupled array and described second detection mirror group with described first detection mirror group, described first detection mirror group is identical with the enlargement ratio of described second detection mirror group, described First Line array charge-coupled device is identical with the parameter of described second linear charge-coupled array, and described second linear charge-coupled array is oppositely placed relative to described First Line array charge-coupled device.
Preferably, described light source is LED or Halogen lamp LED.
Present invention also offers a kind of altitude correction method of height measuring device, comprise the following steps:
Step 1, when work stage is positioned at zero-bit, obtains the first image and the second image from First Line array charge-coupled device, the second linear charge-coupled array respectively;
Step 2, according to the first obtained image and the second image, calculates the spacing of sub-spot center on same projection face;
Step 3, obtains the image of the First Line array charge-coupled device in surface of the work generation out of focus situation, the second linear charge-coupled array;
Step 4, according to the first obtained image and the second image, calculates the spacing of sub-spot center on same projection face;
Step 5, according to the half of each sub-spot center spacing changing value, calculates each the corresponding change in location of sub-hot spot, then calculates the mean value of spot displacement;
Step 6, calculates the defocusing amount of surface of the work.
Further, the computing formula of workpiece defocusing amount is
, wherein, Z is described workpiece defocusing amount, and Hccd is described spot displacement mean value,
for the incident angle of described incident ray,
with
be respectively the enlargement ratio of described catoptron group and detection mirror group.
Further, described sub-spot center distance computation comprises the following steps:
By the first image and the second Images uniting image;
Pre-service is carried out to the image after synthesis, comprises disappear image background and the noise to eliminating image itself;
Image is changed into grey scale curve, and according to this curve acquisition hot spot marginal information;
According to hot spot marginal information, location obtains the center of the sub-hot spot on the center of sub-hot spot on First Line array charge-coupled device and the second linear charge-coupled array;
The center of the sub-hot spot of same position in projecting plane is subtracted each other, obtains the spacing of sub-spot center on same projection face;
Further, described in the image background that disappears be image gathering and the background image subtraction of charge-coupled image sensor, the ground unrest of cancellation charge-coupled image sensor is on the impact of image.
The invention has the advantages that the displacement of image by calculating two line array CCDs and every sub-hot spot, decrease the impact of different-shape on defocusing amount of workpiece surface, weaken CCD resolution to the impact of measuring, reduce the error in measuring process, effectively improve the degree of accuracy that defocusing amount is measured.Workpiece height when the present invention only need measure best focal plane, the impact that the workpiece avoiding different-shape equally produces defocusing amount, has good Technological adaptability.
Accompanying drawing explanation
Can be further understood by following detailed Description Of The Invention and institute's accompanying drawings about the advantages and spirit of the present invention.
Fig. 1 is workpiece height measurement mechanism structural representation of the present invention;
Fig. 2 is the distribution plan of hot spot neutron hot spot on projecting plane;
Fig. 3 by measure hot spot on First Line array charge-coupled device the gray-scale value figure of one-tenth image;
Fig. 4 by measure hot spot on the second linear charge-coupled array the gray-scale value figure of one-tenth image;
Fig. 5 is the geometric relationship figure of hot spot change in location and workpiece defocusing amount on linear charge-coupled array;
Fig. 6 becomes by first, second linear charge-coupled array the spliced map of image;
Fig. 7 is workpiece height bearing calibration process flow diagram of the present invention;
Fig. 8 is Fig. 7 neutron spot separation calculation flow chart.
Embodiment
Specific embodiments of the invention are described in detail below in conjunction with accompanying drawing.
Shown in Figure 1, workpiece height measurement mechanism of the present invention is in scan exposure equipment between projection objective 9 and workpiece 22.Mask stage 3 is positioned at above projection objective 9, described mask stage 3 is placed with the mask 21 of band pattern, work stage 8 is placed with described workpiece 22.The pattern of described mask 21 projects to the surface of described workpiece 22 by described projection objective 9.Described workpiece 22 can be silicon chip or glass substrate.
Workpiece height measurement mechanism comprises First Line array charge-coupled device (line array CCD) 1, first detection mirror group 2, second linear charge-coupled array 4, second detection mirror group 5, spectroscope 6, catoptron group 7, projection lens's group 10, slit 11, illuminated mirror group 12, light source 13.The light that light source 13 sends, successively by after illuminated mirror group 12 and slit 11, is divided into some bundle light, and this some bundle light, by will inciding on described workpiece 22 with certain angular slope after projection lens's group 10, forms incident ray.Described light source is LED or Halogen lamp LED.Incident ray, after workpiece 22 reflects, forms reflection ray.Reflection ray, by after catoptron group 7, forms parallel some bundle light.Parallel rays is divided into two groups equably after spectroscope 6, one group is continued along the outgoing of former direction through spectroscope 6, after the first detection mirror group 2, be injected in the first linear array CCD1, after another group incides the second detection mirror group 5 after spectroscope 6 reflects, then inject in the second line array CCD 4.In the present embodiment, the light after spectroscope 6 reflects and the angle of parallel rays are chosen as 90 °.
Wherein, the first described detection mirror group 2 is identical with the enlargement ratio of the second detection mirror group 5, and the first described linear array CCD1 is identical with the second line array CCD 4 parameter, can be chosen as 2048 pixels, and data export as 12bit.Second line array CCD 4 is oppositely placed, and the first linear array CCD1 and the second line array CCD 4 points to be clipped to the first detection mirror group 2 identical with the distance of the second detection mirror group 5, meanwhile, the first and second detection mirror groups are also identical with spectroscopical distance.The principle of work of this workpiece height measurement mechanism is: line array CCD can carry out imaging to light spot image on workpiece, and by above-mentioned hot spot different parts in the picture, calculates the height of workpiece.
Shown in Figure 2, there is shown the facula position on projecting plane, projecting plane is vertical with focusing and leveling (FLS) primary optical axis, the plane residing for slit 11, and Y-axis is the direction of measurement of FLS, and X-axis is the non-measured direction of FLS.Measure hot spot for one group to be made up of three the sub-hot spot of measurements (sub-hot spot u, sub-hot spot c and sub-hot spot d), its direction of measurement size is L, and non-measured direction size is SP, and the center of sub-hot spot is all positioned in Y-axis, and distance is DP.
Fig. 3 shows and measures the gray-scale value of hot spot in the first linear array CCD1 imaging, wherein ordinate is the gray-scale value of image, horizontal ordinate is the pixel on line array CCD, it is once from left to right the paramount pixel of low pixel, Du, Dc, Dd are respectively three positions of sub-spot center on CCD in hot spot, Huc is the distance between hot spot u and hot spot c, and Hcd is the distance between hot spot c and hot spot d.After equidistant slit, in theory, the spacing between sub-hot spot is identical, i.e. Huc=Hcd, but because of the impact of workpiece surface appearance and inclination, result in two sub-hot spots in edge not identical to the distance of middle center hot spot.When work stage is in zero-bit, be namely in optimal focal plane place, middle center hot spot c should at the center of image, i.e. Dc=1024. in the present embodiment
Fig. 4 shows and measures the gray-scale value of hot spot in the second line array CCD 4 imaging, and the second line array CCD 4 is oppositely place, and therefore this figure and Fig. 3 is two reverse images, namely in figure 3, from left to right, the order of sub-hot spot is followed successively by: u, c, d, in the diagram, sub-hot spot order is: d, c, u.
As shown in Figure 5, because workpiece 22 exists defocusing amount, the facula position that line array CCD detects can change, and the relation between facula position change Hccd and the location of workpiece can be expressed as by geometric relationship:
（1）
Above formula characterizes facula position that the defocusing amount Z of workpiece and line array CCD detect and changes relation between Hccd, wherein
for the incident angle of incident ray in projecting light path,
with
be respectively the enlargement ratio of catoptron group 7 and detection mirror group, its value immobilizes.Work as incident angle
during for 75o, when the enlargement factor of detection mirror group and catoptron group 7 is 7, can be considered that the enlargement factor that workpiece defocusing amount detects is 13.523, the defocusing amount that namely 1 pixel is corresponding is 73.95nm.In theory, the facula position change Hccd that the first linear array CCD1 and the second line array CCD 4 detect should be identical, but in practice, because the first and second detection mirror groups can not be identical, the reasons such as spectroscopical angle, can be slightly different.
Figure 6 shows that the image of the image mosaic that the first and second line array CCDs detect, the image that left side is detected for the first linear array CCD1, right side is the image that the second line array CCD 4 detects.In figure solid line for work stage when original position detect the image obtained, dotted line be as work stage in Fig. 5 move down Z after detect the image obtained, distance when H1 is original position between sub-hot spot c, H2 is the distance that work stage moves between latter two sub-hot spot c, therefore can obtain following relation:
（2）
The Hccd that above formula calculates is actual be two line array CCDs detect facula position change mean value.When the original position of work stage is in zero-bit, formula (2) can be exchanged into:
（3）
Wherein,
for the pixel value of line array CCD, be fixing parameter, in the present embodiment
=2048.When work stage moves down, the distance between formed two pictures of the identical sub-hot spot in projecting plane increases, and when work stage is moved, the distance between formed two pictures of the identical sub-hot spot in projecting plane reduces.
Shown in Figure 7, workpiece height bearing calibration of the present invention comprises the following steps:
Step 1, when work stage zero-bit, obtains the image now in two line array CCDs;
Step 2, by two accessed width image mosaic, calculates the spacing Hu0 of identical sub-hot spot on projecting plane, Hc0, Hd0.When work stage is in zero-bit in theory, middle center hot spot will be in the center of image, but can not realize in actual device, need calculate the spacing of actual sub-hot spot at work stage zero measurement;
Step 3, obtain the image of the line array CCD in surface of the work generation out of focus situation, wherein said out of focus can cause by work stage being moved or moving down;
Step 4, by two obtained width image mosaic, calculates the spacing Hu1 of identical sub-spot center on projecting plane, Hc1, Hd1;
Step 5, can calculate 3 corresponding change in location Hccdu of sub-hot spot, Hccdc, Hccdd according to formula (2), its formula is:
（4）
Then the mean value Hccd of spot displacement can be calculated, namely
（5）
Step 6, according to formula (1), can calculate the defocusing amount of surface of the work:
（6）
The present embodiment adopts three sub-hot spots to be preferred embodiment, and the quantity measuring hot spot neutron hot spot in the present invention is at least 2.
In above-mentioned bearing calibration, the spacing of the identical sub-hot spot of described measurement comprises the following steps:
Step 1, the Images uniting that two line array CCDs are obtained image;
Step 2, carries out pre-service to the image after synthesis, comprises the image background and to the smoothing filtering of image two steps of disappearing.The background that disappears is the background image subtraction the image gathered and CCD, with the impact of the ground unrest of cancellation CCD on image.And smothing filtering is the noise of eliminating image itself, and retain the characteristic of image, this step can noise decrease and background on the impact of image, reduce measuring error;
Step 3, changes into grey scale curve as shown in Figure 6 by image, and according to the information at this curve acquisition hot spot edge, has the region of grey scale change in namely adjacent in curve pixel;
Step 4, according to the hot spot fringe region in step 3, can locate center Du ', Dc ', the Dd ' of the sub-hot spot on center Du, Dc, Dd of the sub-hot spot obtained on the first line array CCD and the second line array CCD;
Step 5, the spacing that can obtain identical sub-hot spot on same projection face is subtracted each other in the center of sub-hot spot identical in projecting plane:
(5)
Just preferred embodiment of the present invention described in this instructions, above embodiment is only in order to illustrate technical scheme of the present invention but not limitation of the present invention.All those skilled in the art, all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (4)
1. an altitude correction method for height measuring device, is characterized in that, comprises the following steps:
Step 1, when work stage is positioned at zero-bit, obtains the first image and the second image from First Line array charge-coupled device, the second linear charge-coupled array respectively;
Step 2, according to the first obtained image and the second image, calculates the spacing of sub-spot center on same projection face;
Step 3, obtains the image of the First Line array charge-coupled device in surface of the work generation out of focus situation, the second linear charge-coupled array;
Step 4, according to the first obtained image and the second image, calculates the spacing of sub-spot center on same projection face;
Step 5, according to the half of each sub-spot center spacing changing value, calculates each the corresponding change in location of sub-hot spot, then calculates the mean value of spot displacement;
Step 6, calculates the defocusing amount of surface of the work.
2. bearing calibration according to claim 1, is characterized in that, the computing formula of workpiece defocusing amount is
, wherein, Z is described workpiece defocusing amount, and Hccd is described spot displacement mean value,
for the incident angle of incident ray,
with
be respectively the enlargement ratio of catoptron group and detection mirror group.
3. bearing calibration according to claim 2, is characterized in that, described sub-spot center distance computation comprises the following steps:
By the first image and the second Images uniting image;
Pre-service is carried out to the image after synthesis, comprises the noise of disappear image background and eliminating image itself;
Image is changed into grey scale curve, and according to this curve acquisition hot spot marginal information;
According to hot spot marginal information, location obtains the center of the sub-hot spot on the center of sub-hot spot on First Line array charge-coupled device and the second linear charge-coupled array;
The center of the sub-hot spot of same position in projecting plane is subtracted each other, obtains the spacing of sub-spot center on same projection face.
4. bearing calibration according to claim 3, described in the image background that disappears be image gathering and the background image subtraction of charge-coupled image sensor, the ground unrest of cancellation charge-coupled image sensor is on the impact of image.
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| CN104165596B (en) * | 2014-09-02 | 2017-01-25 | 南京中科神光科技有限公司 | Method and system for measuring defocusing amount |
| CN108106561B (en) * | 2016-11-25 | 2020-02-18 | 上海微电子装备（集团）股份有限公司 | Line scanning surface topography measuring device |
| CN108663908B (en) * | 2017-03-31 | 2019-11-22 | 上海微电子装备（集团）股份有限公司 | Laser interferometer reflecting mirror topography measurement method and lithographic equipment |
| CN109273380B (en) * | 2017-07-17 | 2022-02-15 | 上海微电子装备（集团）股份有限公司 | Scanning alignment device and scanning method thereof |
| CN109059897B (en) * | 2018-05-30 | 2021-08-20 | 上海懒书智能科技有限公司 | AGV trolley based real-time operation attitude acquisition method |
| CN108931188A (en) * | 2018-09-10 | 2018-12-04 | 苏州亿拓光电科技有限公司 | Optical position detection device and method |
| CN109443210A (en) * | 2018-12-13 | 2019-03-08 | 苏州亿拓光电科技有限公司 | Optical position detection device and method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5602400A (en) * | 1992-08-19 | 1997-02-11 | Canon Kabushiki Kaisha | Surface position detecting method and apparatus including detection and correction of errors, such as surface position errors or tilt, in exposure regions |
| CN1527026A (en) * | 2004-02-27 | 2004-09-08 | 哈尔滨工业大学 | Differential confocal scanning detection method with high spatial resolution |
| CN101201546A (en) * | 2007-11-28 | 2008-06-18 | 上海微电子装备有限公司 | Device for automatically focusing and leveling |
| CN102566295A (en) * | 2010-12-31 | 2012-07-11 | 上海微电子装备有限公司 | Lithography device and method for measuring multi-light spot zero offset |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2870593B2 (en) * | 1997-02-03 | 1999-03-17 | 日本電気株式会社 | Focus error detector |
| JP2000208391A (en) * | 1999-01-11 | 2000-07-28 | Canon Inc | Aligner, aligning method and fabrication of device |
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2012
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5602400A (en) * | 1992-08-19 | 1997-02-11 | Canon Kabushiki Kaisha | Surface position detecting method and apparatus including detection and correction of errors, such as surface position errors or tilt, in exposure regions |
| CN1527026A (en) * | 2004-02-27 | 2004-09-08 | 哈尔滨工业大学 | Differential confocal scanning detection method with high spatial resolution |
| CN101201546A (en) * | 2007-11-28 | 2008-06-18 | 上海微电子装备有限公司 | Device for automatically focusing and leveling |
| CN102566295A (en) * | 2010-12-31 | 2012-07-11 | 上海微电子装备有限公司 | Lithography device and method for measuring multi-light spot zero offset |
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