CN103633033B - Image Sensor module and taken module - Google Patents
Image Sensor module and taken module Download PDFInfo
- Publication number
- CN103633033B CN103633033B CN201210302138.8A CN201210302138A CN103633033B CN 103633033 B CN103633033 B CN 103633033B CN 201210302138 A CN201210302138 A CN 201210302138A CN 103633033 B CN103633033 B CN 103633033B
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- image sensor
- ceramic substrate
- module
- container
- circuit board
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Abstract
The present invention provides a kind of Image Sensor module, it includes a ceramic substrate, an Image Sensor, a conducting resinl, a flexible circuit board and a reinforcing plate.The ceramic substrate includes a upper surface and a lower surface opposite with the upper surface.A container is offered on the lower surface, a loophole being connected with the container is offered on the upper surface.The Image Sensor is housed in the container, and is electrically connected by chip package mode and the ceramic substrate.The lower surface of the ceramic substrate is electrically connected by the conducting resinl and the flexible circuit board.The reinforcing plate is fixed on opposite side where the relatively described ceramic substrate of the flexible circuit board.The present invention by flexible circuit board side fix a reinforcing plate, the reinforcing plate effectively raises the intensity and flatness of the flexible circuit board, so that being connected on the flexible circuit board of can stablizing of the ceramic substrate.The present invention also provides a kind of taken module.
Description
Technical field
A kind of taken module the present invention relates to Image Sensor module and using the Image Sensor module.
Background technology
Traditional Image Sensor module includes a ceramic substrate, an Image Sensor and a flexible circuit board, the shadow
As sensor is electrically connected to the ceramic substrate in a manner of chip package, the ceramic substrate is electrically connected by conducting resinl
On the flexible circuit board.However, since the mechanical strength and flatness of the flexible circuit board are relatively low, this this may result in
What the ceramic substrate can not be stablized is connected on the flexible circuit board, so that the Image Sensor module is reliable
Property is relatively low.
The content of the invention
In view of this, it is necessary to a kind of Image Sensor module that can improve package reliability is provided and uses the image sense
Survey the taken module of device module.
A kind of Image Sensor module, it includes a ceramic substrate, an Image Sensor, a conducting resinl, a flexible circuit
Plate and a reinforcing plate.The ceramic substrate includes a upper surface and a lower surface opposite with the upper surface.The lower surface
On offer a container, a loophole being connected with the container is offered on the upper surface.The image sensing
Device is housed in the container, and is electrically connected by chip package mode and the ceramic substrate.The ceramic substrate
Lower surface is electrically connected by the conducting resinl and the flexible circuit board.The reinforcing plate is fixed on the flexible circuit board phase
To opposite side where the ceramic substrate.
A kind of taken module, it includes an Image Sensor module and a camera lens module.The Image Sensor module bag
Include a ceramic substrate, an Image Sensor, a conducting resinl, a flexible circuit board and a reinforcing plate.The ceramic substrate includes one
Upper surface and a lower surface opposite with the upper surface.A container is offered on the lower surface, is opened on the upper surface
Equipped with a loophole being connected with the container.The Image Sensor is housed in the container, and passes through flip
Packaged type is electrically connected with the ceramic substrate.The lower surface of the ceramic substrate passes through the conducting resinl and the soft electricity
Road plate is electrically connected.The reinforcing plate is fixed on opposite side where the relatively described ceramic substrate of the flexible circuit board.The mirror
Head mould group includes a camera lens and a microscope base.The camera lens is housed in the microscope base, and the microscope base is fixed on the ceramic substrate
Upper surface.
By relatively described on the flexible circuit board in Image Sensor module and taken module provided by the invention
Opposite side where ceramic substrate fixes a reinforcing plate, and the reinforcing plate effectively raises the intensity peace of the flexible circuit board
Whole degree, so that being connected on the flexible circuit board of can stablizing of the ceramic substrate.
Brief description of the drawings
Fig. 1 is the schematic perspective view for the taken module that embodiment of the present invention provides.
Fig. 2 is the decomposition diagram of the taken module provided in Fig. 1.
Fig. 3 is decomposition diagram of the taken module along another angle in Fig. 1.
Fig. 4 is the sectional view along IV-IV lines of the taken module in Fig. 1.
Main element symbol description
| Taken module | 100 |
| Image Sensor module | 200 |
| Reinforcing plate | 10 |
| Flexible circuit board | 20 |
| First surface | 21 |
| Weld pad | 211 |
| Second surface | 22 |
| Earth point | 221 |
| Conducting resinl | 30 |
| Ceramic substrate | 40 |
| Upper surface | 41 |
| Loophole | 411 |
| Lower surface | 42 |
| Container | 421 |
| Joint face | 422 |
| First tie point | 423 |
| Second tie point | 424 |
| Image Sensor | 50 |
| Sensing face | 51 |
| Pin | 52 |
| Obturator | 60 |
| Optical filter | 70 |
| Camera lens module | 300 |
| Microscope base | 80 |
| Pedestal | 81 |
| Resettlement section | 82 |
| Camera aperture | 821 |
| Camera lens | 90 |
Following embodiment will combine above-mentioned attached drawing and further illustrate the present invention.
Embodiment
As shown in Figs. 1-2, a kind of taken module 100 provided for embodiment of the present invention, it includes an Image Sensor
Module 200 and one is fixed on the camera lens module 300 on the Image Sensor module 200.The Image Sensor module 200 wraps
Include a reinforcing plate 10, a flexible circuit board 20, a conducting resinl 30, a ceramic substrate 40, an Image Sensor 50, an obturator 60
An and optical filter 70.The camera lens module 300 includes a microscope base 80 and a camera lens 90.
The reinforcing plate 10 is made of conductive material, and in present embodiment, the conductive material is copper.The reinforcing plate
10 in the form of sheets, and has preferable mechanical strength and flatness.
The flexible circuit board 20 includes the opposite second surface 22 of a first surface 21 and a first surface 21.Institute
State and multiple weld pads 211 are provided with first surface 21.An earth point 221, present embodiment are provided with the second surface 22
In, the earth point 221 is copper sheet exposed in the flexible circuit board 20.The reinforcing plate 10 is fixed on the flexible circuit
The second surface 22 of plate 20, the reinforcing plate 10 are electrically connected with the earth point 221.
The conducting resinl 30 is anisotropic conductive adhesive paste, it is attached on the flexible circuit board 20.The conducting resinl 30 exists
Turn on the direction of the flexible circuit board 20, be not turned on the direction parallel to the flexible circuit board 20.
The ceramic substrate 40 includes a upper surface 41 and a lower surface 42 opposite with the upper surface 41.The following table
A container 421 is offered on face 42, a loophole being connected with the container 421 is offered on the upper surface 41
411.The container 421 includes a joint face 422 parallel to the upper surface 41, is provided with the joint face 422 more
A first tie point 423, by being provided with multiple second tie points 424 at the position of proximal edge on the lower surface 42, described the
One tie point 423 is electrically connected with second tie point 424 by the conducting wire being embedded in the ceramic substrate 40.
The Image Sensor 50 includes a sensing face 51 and the multiple pins 52 set around the sensing face 51.It is described
Image Sensor 50 is used to the light for being projected to the sensing face 51 being converted into electric signal, and is exported from the pin 52.This
In embodiment, the Image Sensor 50 can be CMOS type or CCD type.
The obturator 60 is in the frame structure of hollow form, it is by the way that black glue to be expelled to the container positioned at solid shape
In, then black glue is cured by the way of baking.
The optical filter 70 is in rectangular-shape, it uses transparent material to be made.The optical filter 70 is used to filter out to be projected to
Infrared light in the light of the optical filter 70.
As shown in Figure 3-4, in the assembling process of the Image Sensor module 200, the Image Sensor 50 houses
In the container 421, the sensing face 51 is toward the loophole 411, the pin 52 and first tie point 423
It is electrically connected.The obturator 60 is contained in the container 421, and is looped around around the Image Sensor 50.This
In embodiment, the obturator 60 is by the way that black glue to be expelled to the Image Sensor in the container 421
Around 50, then black glue baking-curing is formed.The lower surface 42 of the ceramic substrate 40 is fixed by the conducting resinl 30
On the first surface 21 of the flexible circuit board 20, second tie point 424 is led with the weld pad 211 by described
Electric glue 30 is electrically connected.The optical filter 70 is fixed on the upper surface 41 of the ceramic substrate 40, and by 411 envelope of loophole
Close.
The microscope base 80 include a pedestal 81 and one be fixed on the pedestal 81 one end resettlement section 82.The pedestal 81
In hollow rectangular-shape, a camera aperture 821, the camera aperture 821 and 81 phase of pedestal are offered on the resettlement section 82
Connection.The camera lens 90 is fixed in the camera aperture 821, and an eyeglass is at least contained in the camera lens 90.
In the assembling process of the taken module 100, the microscope base 80 for containing the camera lens 90 is fixed on the pottery
On the upper surface 41 of porcelain substrate 40, the pedestal 81 is circumferentially positioned at 411 edge of loophole, and the optical filter 70 is housed in
In the pedestal 81.The optical axis of the camera lens 90 and the optical axis of the Image Sensor 50 are on the same line.
By relatively described on the flexible circuit board in Image Sensor module and taken module provided by the invention
Opposite side where ceramic substrate fixes a reinforcing plate, and the reinforcing plate effectively raises the intensity peace of the flexible circuit board
Whole degree, so that being connected on the flexible circuit board of can stablizing of the ceramic substrate.
It is understood that for those of ordinary skill in the art, it can be conceived with the technique according to the invention and done
Go out other various corresponding changes and deformation, and all these changes and deformation should all belong to the protection model of the claims in the present invention
Enclose.
Claims (9)
1. a kind of Image Sensor module, it includes a ceramic substrate, an Image Sensor, a conducting resinl, a flexible circuit board
An and reinforcing plate；The ceramic substrate includes a upper surface and a lower surface opposite with the upper surface；On the lower surface
A container is offered, a loophole being connected with the container is offered on the upper surface, the container includes
One joint face, is provided with multiple first tie points on the joint face, multiple second tie points, institute is provided with the lower surface
The first tie point is stated to be electrically connected with second tie point；The Image Sensor is housed in the container, and is passed through
Chip package mode is electrically connected with the ceramic substrate；The lower surface of the ceramic substrate by the conducting resinl with it is described soft
Property circuit board be electrically connected；The reinforcing plate is fixed on opposite side where the relatively described ceramic substrate of the flexible circuit board, institute
State Image Sensor module and further include an obturator, which is in the frame structure of hollow form, which is housed in described
In in the container and gap that is filled between the ceramic substrate and the Image Sensor.
2. Image Sensor module as claimed in claim 1, it is characterised in that：The Image Sensor include a sensing face and
The multiple pins set around the sensing face, the pin are electrically connected with first tie point.
3. Image Sensor module as claimed in claim 1, it is characterised in that：The flexible circuit board includes a first surface
And the opposite second surface of the first surface；Multiple weld pads are provided with the first surface, are set on the second surface
It is equipped with an earth point；The weld pad is electrically connected with second tie point.
4. Image Sensor module as claimed in claim 3, it is characterised in that：The reinforcing plate is made of conductive material,
It is electrically connected with the earth point.
5. a kind of taken module, it includes an Image Sensor module and a camera lens module；The Image Sensor module includes
One ceramic substrate, an Image Sensor, a conducting resinl, a flexible circuit board and a reinforcing plate；The ceramic substrate is included on one
Surface and a lower surface opposite with the upper surface；A container is offered on the lower surface, is opened up on the upper surface
There is a loophole being connected with the container；The Image Sensor is housed in the container, and is sealed by flip
Dress mode is electrically connected with the ceramic substrate；The lower surface of the ceramic substrate passes through the conducting resinl and the flexible circuit
Plate is electrically connected；The reinforcing plate is fixed on opposite side where the relatively described ceramic substrate of the flexible circuit board；The camera lens
Module includes a camera lens and a microscope base；The camera lens is housed in the microscope base, and the microscope base is fixed on the ceramic substrate
Upper surface, the Image Sensor module further include an obturator, which is in the frame structure of hollow form, which receives
Hold in the container and in the gap being filled between the ceramic substrate and the Image Sensor.
6. taken module as claimed in claim 5, it is characterised in that：The container includes a joint face, the joint face
On be provided with multiple first tie points, be provided with multiple second tie points on the lower surface, first tie point with it is described
Second tie point is electrically connected.
7. taken module as claimed in claim 6, it is characterised in that：The Image Sensor includes a sensing face and around institute
Multiple pins of sensing face setting are stated, the pin is electrically connected with first tie point.
8. taken module as claimed in claim 6, it is characterised in that：The flexible circuit board includes a first surface and an institute
State the opposite second surface of first surface；Multiple weld pads are provided with the first surface, one is provided with the second surface
Earth point；The weld pad is electrically connected with second tie point.
9. taken module as claimed in claim 8, it is characterised in that：The reinforcing plate is made of conductive material, itself and institute
State earth point electric connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210302138.8A CN103633033B (en) | 2012-08-23 | 2012-08-23 | Image Sensor module and taken module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210302138.8A CN103633033B (en) | 2012-08-23 | 2012-08-23 | Image Sensor module and taken module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103633033A CN103633033A (en) | 2014-03-12 |
| CN103633033B true CN103633033B (en) | 2018-04-20 |
Family
ID=50213907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210302138.8A Active CN103633033B (en) | 2012-08-23 | 2012-08-23 | Image Sensor module and taken module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103633033B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104580856A (en) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | Camera module and camera equipment provided with same |
| CN104580855A (en) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | Camera module |
| CN104717434B (en) * | 2015-03-27 | 2017-09-08 | 有医科技股份有限公司 | CIS System on Chip/SoC and its preparation method with image stabilization function |
| CN114731358B (en) * | 2019-10-21 | 2023-10-27 | 宁波舜宇光电信息有限公司 | Circuit board assembly, photosensitive assembly, camera module and preparation method of circuit board assembly and photosensitive assembly |
| CN112770019B (en) * | 2019-10-21 | 2022-07-12 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, preparation method thereof and camera module |
| CN113141441B (en) * | 2020-01-17 | 2023-12-08 | 晋城三赢精密电子有限公司 | Camera module and electronic device thereof |
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| Publication number | Publication date |
|---|---|
| CN103633033A (en) | 2014-03-12 |
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