CN103591492A - Integrally formed light emitting diode light wire and use thereof - Google Patents
Integrally formed light emitting diode light wire and use thereof Download PDFInfo
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- CN103591492A CN103591492A CN201210315967.XA CN201210315967A CN103591492A CN 103591492 A CN103591492 A CN 103591492A CN 201210315967 A CN201210315967 A CN 201210315967A CN 103591492 A CN103591492 A CN 103591492A
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- Prior art keywords
- led
- integrally formed
- light carrier
- led light
- bus element
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D1/00—Woven fabrics designed to make specified articles
- D03D1/0088—Fabrics having an electronic function
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
- H05B47/10—Controlling the light source
- H05B47/165—Controlling the light source following a pre-assigned programmed sequence; Logic control [LC]
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Led Device Packages (AREA)
Abstract
An integrally formed LED light wires is provided, comprising a conductive base comprising a support substrate, wherein the support substrate comprises a first plurality of wires, threads, or a combination thereof, the plurality of wires, threads, or a combination thereof comprises at least one weft element arranged in a first direction and at least two warp elements, each arranged in a second direction such that the at least one weft element and each of the at least two warp elements form plural intersections therebetween; a first bus element and a second bus element, each adapted to distribute power from a power source; a third bus element adapted to distribute a control signal, wherein the first, second, and third bus elements are woven, stitched, or knitted into the support substrate; and a plurality of light emitting diode (LED) modules, each LED module comprising a microcontroller and at least one LED.
Description
The cross reference of related application
The present patent application is the United States serial 12/703 of submitting on February 9th, 2010, 116 part continuation application, United States serial 12/703, 116 is United States serial 12/355 of submitting on January 16th, 2009, 655 (current U.S. Patent number is 8, 052, 303, mandate on November 8th, 2011) part continuation application, United States serial 12/355, 655 is United States serial 11/854 of submitting on September 12nd, 2007, 145 (current U.S. Patent number is 7, 988, 332, mandate on August 2nd, 2011) part continuation application, United States serial 11/854, 145 require the U.S. Provisional Patent Application sequence number 60/844 of submitting on September 12nd, 2006, 184 priority, the integral body of above-mentioned application mode is by reference incorporated to herein.
Run through the application, quoted several pieces of publications.Therefore these disclosures of quoting are incorporated to the application on the whole by reference.
Technical field
The present invention relates to a kind of light carrier bundle, and relate in particular to the application of a kind of integrally formed light carrier bundle that comprises light emitting diode (LED) and these LED light carrier bundles, wherein the associated circuit of LED and LED light carrier bundle is prevented from avoiding mechanical damage and environmental hazard, such as water and dust.
Background technology
Traditional incandescent lamp or LED light carrier bundle are commonly used in various indoor or outdoor decoration or decorative lighting application.For example, these traditional light carrier bundles for create be suitable for red-letter day mark holiday, sketch the contours building structure (such as building or harbour) and car be provided at the bottom of illuminator.These light carrier bundles also can, at night or when the situation that for example has a power failure, soaks and caused a fog by fire and chemical fog causes normal ambient lighting to make insufficient visibility, can be used as emergency lighting to help increase visibility and to exchange.
Compare with using the fluorescent tube of incandescent lamp bulb, traditional LED light carrier bundle power consumption is low, and the life-span is long, and cost is relatively cheap and be easy to installation.Little by little, LED light carrier bundle has been used as the viable substitute of neon light tube.
As shown in Figure 1, traditional light carrier bundle 100 is comprised of a plurality of luminescent devices 102, and such as incandescent lamp bulb or LED, it interconnects and be encapsulated in protection tube 103 by flexible cord 101.Power supply 105 produces the electric current of the flexible cord 101 of flowing through, and causes that luminescent device 102 is luminous and forms the effect of isolychn.Luminescent device 102 can series, parallel or is connected.In addition, luminescent device 102 in the following manner with control electronic device and be connected: independent luminescent device 102 optionally opens or closes to produce the combination of luminous pattern (as stroboscopic, glisten, chase or pulse).
In traditional light carrier bundle, normally hollow, the transparent or semitransparent pipe of protection tube 103, this manages accommodating internal circuit (for example luminescent device 102, flexible cord 101).Owing to having the air gap between protection tube 103 and internal circuit, protection tube 103 mechanical damage that opposing causes because of excessive loads (such as directly putting on the machinery weight of light carrier bundle) for light carrier bundle provides very little protection.In addition, protection tube 103 internal circuit that can not adequately protect is avoided environmental hazard, such as water and dust.Therefore, the light carrier bundle with protection tube 103 100 that these are traditional is found to be unsuitable for outdoor use, particularly when light carrier bundle is exposed to extreme weather and/or machinery abuse.
In traditional light carrier bundle, line is such as flexible cord 101 is for interconnecting luminescent device 102.At manufacture view, these light carrier bundles are used welding or curling method pre-assembled conventionally, and by conventional sheet material or stiff laminate technique, encapsulate in protection tube 103 subsequently.It is labour-intensive and unreliable that this manufacturing process belongs to.In addition, this technique has reduced the flexibility of light carrier bundle.
In order to break through to conventional light guides bundle and to manufacture relevant above-mentioned restriction, developed the LED lamp bar of complexity and the protectiveness with enhancing.These LED lamp bars are by the electric circuit constitute that comprises a plurality of LED, and described a plurality of LED are arranged in the support substrates that comprises printed circuit and are connected to two separated electric conductors or bus element.In the protection packaging body of LED circuit and electric conductor are encapsulated in does not have internal voids (comprising air bubble) or impurity, and be connected to power supply.These LED lamp bars are by comprising what the automated system of complicated LED circuit assembly technology and flexible laminate technique was manufactured.The example of these LED lamp bars and manufacture method thereof is discussed in following patent: the patent No. is 5,848,837,5,927,845 and 6,673,292, title is all the United States Patent (USP) of " Integrally Formed Linear Light Strip With Light Emitting Diode "; The patent No. is 6,113,248, name is called the United States Patent (USP) of " Automated System For Manufacturing An LED Light Strip Having An Integrally Formed Connected "; And the patent No. is 6,673,277, name is called the United States Patent (USP) of " Method of Manufacturing a Light Guide ".
Further, the method for current manufacture conventional light guides bundle also needs extra material and material cost, such as the use of expensive junction film.
Although these LED lamp bars can be protected preferably in order to avoid be mechanically damaged and environmental hazard, yet these LED lamp bars only can provide single illumination direction, and are limited to two separated bus elements in its inner LED circuit.And, because these LED lamp bars at least need not have the protection packaging body of internal voids and impurity, and need to LED connector pin is curling to inner LED circuit, such LED lamp bar therefore manufactured still expensive and time-consuming.In addition, laminating technology makes these LED lamp bars too firmly to such an extent as to can not be crooked.
Summary of the invention
According to more than, there are the needs that further improve prior art.Especially, need a kind of improved integrally formed LED light carrier bundle, it is flexible, has the mechanical strength of enhancing simultaneously, has improved electrical isolation, and provides level and smooth illumination effect uniformly in all directions of integrally formed LED light carrier bundle.Also need a kind of LED light carrier bundle with additional illumination function, its can by have low material cost low cost, there is ageing automation process and manufacture.In addition the LED light carrier bundle that needs, a kind of Intelligent Recognition, response the adaptation variation relevant with installation, maintenance and failure detection.
Consider the problems referred to above, according to an aspect of the present invention, integrally formed LED light carrier bundle comprises: the conductive substrates that (A) comprises support substrates, wherein support substrates comprises more than first line, silk or its combination, wherein a plurality of lines, silk or its combination comprise that at least one parallel element and at least two are through kind of thread elements, this at least one parallel arrangements of components is at first direction, each warp arrangements of components is in second direction, so that at least one parallel element and at least two form a plurality of crosspoints through between each of kind of thread elements; By more than second line, silk or its, be combined to form be suitable for the first bus element from power distribution power, by the 3rd many lines, silk or its, be combined to form be suitable for the second bus element from power distribution power, by the 4th many lines, silk or its 3rd bus elements that are suitable for distributing control signal that are combined to form, wherein the first bus element, the second bus element and the 3rd bus element are by woven, loop bonding or knittingly enter in support substrates; And (B) a plurality of light emitting diodes (LED) module, each of described a plurality of LED modules comprises microcontroller and at least one LED, each LED module has the first electric contact, the second electric contact and the 3rd electric contact that is electrically coupled to respectively the first bus element, the second bus element and the 3rd bus element, with from the first bus element with the second bus element obtains power and from the 3rd bus element reception control signal.
On the other hand, integrally formed LED light carrier bundle further comprises the packaging body that encapsulates conductive substrates and a plurality of LED modules completely, and the plurality of LED module comprises microcontroller separately.
On the other hand, this packaging body further comprises light diffusing particles.
On the other hand, integrally formed LED light carrier bundle further comprises that at least one supports warp, and it comprises the 5th many lines, silk or its combinations that are configured in second direction.
On the other hand, in integrally formed LED light carrier bundle, select the group of free loop bonding, woven, knitting, curling, welding, welding or combinations thereof being connected between each of a plurality of LED modules and at least one bus element.
On the other hand, second, third is made by a plurality of conductor wires and/or silk with the 4th many lines, silk or its combinations.
On the other hand, the 5th many lines, silk or its combinations are made by a plurality of non-conductive lines and/or silk.
On the other hand, conductor wire and/or silk select the group of free nickel wire, steel wire, iron wire, titanium wire, red metal line, brass wire, aluminum steel, solder, silver-colored line, nickel wire, steel wire, iron wire, titanium silk, red metal silk, brass wire, aluminium wire, tin silk, filamentary silver etc. or combinations thereof.
On the other hand, non-conductive line and/or silk select the group of free Kafra fiber (kevlar) line, nylon wire, cotton thread, staple fibre line, polyester line, Yarn having laminated structure, flat filament, silk silk, glass fibre, polytetrafluoroethylene (PTFE) (PTFE), Kafra fiber silk, nylon yarn, staple, artificial cellosilk, polyester capillaries, solid polymer material etc. or combinations thereof.
On the other hand, each of a plurality of LED modules further comprises a plurality of LED, wherein a plurality of LED choosing groups that freely red, blue, green and white LEDs forms.
On the other hand, each of a plurality of LED modules further comprises for exporting the 4th contact of received control signal.
On the other hand, each LED module has for controlling the unique address of LED module.This unique address is static state or dynamic.
In a second aspect of the present invention, integrally formed LED light carrier bundle comprises: the conductive substrates that (A) comprises support substrates, wherein support substrates comprises more than first line, silk or its combination, wherein a plurality of lines, silk or its combination comprise that at least one parallel element and at least two are through kind of thread elements, this at least one parallel arrangements of components is at first direction, each warp arrangements of components is in second direction, so that at least one parallel element and at least two form a plurality of crosspoints through between each of kind of thread elements; The first conductive bus element, the second conductive bus element, the 3rd conductive bus element and the 4th conductive bus element, each conductive bus element respectively by second, third, the 4th and the 5th many lines, silk or its be combined to form, wherein the first conductive bus element, the second conductive bus element, the 3rd conductive bus element and the 4th conductive bus element are by woven, loop bonding or knittingly enter in support substrates; And be configured at least one conductor segment between the first conductive bus element and the second conductive bus element, this at least one conductor segment comprises at least one LED and the 6th many lines, silk or its combination, and wherein this at least one conductor segment is by woven, loop bonding or knittingly enter in support substrates; And at least one sensor that (B) is electrically coupled to the 3rd conductive bus element and the 4th conductive bus element, the 3rd conductive bus element is suitable for from this at least one sensor transmissions signal, and the 4th conductive bus is suitable for providing power to this at least one sensor.
On the other hand, the second conductive bus element ground connection and at least one sensor are electrically coupled to the second conductive bus element extraly.
On the other hand, integrally formed LED light carrier bundle further comprises the packaging body that encapsulates conductive substrates completely and be electrically coupled at least one sensor of the 3rd conductive bus element and the 4th conductive bus element.
On the other hand, this packaging body further comprises light diffusing particles.
On the other hand, in integrally formed LED light carrier bundle, select the group of free loop bonding, woven, knitting, curling, welding, welding or combinations thereof being connected between at least one LED and the 6th many lines.
On the other hand, the exterior contour of packaging body comprises the alignment keys of the opposite sides that is arranged on integrally formed LED light carrier bundle and aims at keyhole.
On the other hand, luminescent panel comprises a plurality of integrally formed LED light carrier bundle that is given in this.
Accompanying drawing explanation
For illustrating object of the present invention, accompanying drawing has reflected current preferred structure.Yet should be appreciated that and the invention is not restricted to concrete structure shown in the drawings.
Fig. 1 is describing of conventional light guides bundle;
Fig. 2 is that diagram is according to the top view of the integrally formed LED light carrier bundle of the embodiment of the present invention;
Fig. 3 is the cutaway view of the integrally formed LED light carrier bundle shown in Fig. 2;
Fig. 4 A is the side view of integrally formed according to another embodiment of the present invention LED light carrier bundle;
Fig. 4 B is the top view of the integrally formed LED light carrier bundle shown in Fig. 4 A;
Fig. 5 A is the cutaway view of the integrally formed LED light carrier bundle shown in Fig. 4 A and 4B;
Fig. 5 B is the cutaway view of integrally formed according to another embodiment of the present invention LED light carrier bundle;
Fig. 6 A is the embodiment of conductive substrates;
Fig. 6 B is the schematic diagram of the conductive substrates of Fig. 6 A;
Fig. 7 A is another embodiment of conductive substrates;
Fig. 7 B is the schematic diagram of the conductive substrates of Fig. 7 A;
Fig. 8 A is another embodiment of conductive substrates;
Fig. 8 B is the schematic diagram of the conductive substrates of Fig. 8 A;
Fig. 9 A is another embodiment of conductive substrates;
Fig. 9 B is the schematic diagram of the conductive substrates of Fig. 9 A;
Figure 10 A is another embodiment of conductive substrates;
Figure 10 B is the schematic diagram of the conductive substrates of Figure 10 A;
Figure 11 A is another embodiment of conductive substrates;
Figure 11 B is the schematic diagram of the conductive substrates of Figure 11 A;
Figure 11 C has described to encapsulate the embodiment that is wrapped in the conductive substrates on core before;
Figure 12 A has described the embodiment of the LED installation region of conductive substrates;
Figure 12 B has described to be arranged on the LED on the LED installation region shown in Figure 12 A;
Figure 13 has described to be engaged to the LED chip of the LED installation region of another embodiment;
Figure 14 A has described according to the optical characteristics of the integrally formed LED light carrier bundle of the embodiment of the present invention;
Figure 14 B has described cutaway view and the optical characteristics thereof of cheese packaging body;
Figure 14 C has described cutaway view and the optical characteristics thereof of flat-top shape packaging body;
Figure 15 A-C has described the cutaway view of three kinds of different surfaces texture of packaging body;
Figure 16 A is the integrally formed LED light carrier bundle schematic diagram according to the embodiment of the present invention;
Figure 16 B has described the embodiment of the integrally formed LED light carrier bundle shown in Figure 16 A;
Figure 16 C is the structure chart of the integrally formed LED light carrier bundle shown in key diagram 16B;
Figure 17 A is the structure chart of integrally formed according to another embodiment of the present invention LED light carrier bundle;
Figure 17 B is the cutaway view of the integrally formed LED light carrier bundle shown in Figure 17 A;
Figure 17 C is according to the structure chart of the integrally formed LED light carrier bundle of the embodiment of the present invention;
Figure 18 is according to the structure chart of the integrally formed LED light carrier bundle that comprises at least one sensor or detector of the embodiment of the present invention;
Figure 19 A is according to the structure chart of the panchromatic integrally formed LED light carrier bundle of the embodiment of the present invention;
Figure 19 B is the structure chart of the embodiment of the integrally formed LED light carrier bundle shown in key diagram 19A;
Figure 20 is the schematic diagram for the control circuit of panchromatic integrally formed LED light carrier bundle;
Figure 21 is the sequential chart about panchromatic integrally formed LED light carrier bundle;
Figure 22 A is the sequential chart about panchromatic integrally formed LED light carrier bundle;
Figure 22 B is the sequential chart about panchromatic integrally formed LED light carrier bundle;
Figure 23 is according to the schematic diagram of the integrally formed LED light carrier bundle that comprises a plurality of LED modules of the embodiment of the present invention;
Figure 24 is the layout of the integrally formed LED light carrier bundle shown in Figure 23;
Figure 25 A is according to the structure chart of luminescent panel comprising of the embodiment of the present invention with a plurality of integrally formed LED light carrier bundle of interlocking alignment system;
Figure 25 B is the cutaway view of the luminescent panel shown in Figure 25 A;
Figure 25 C is the cutaway view that comprises according to another embodiment of the present invention the luminescent panel of a plurality of integrally formed LED light carrier bundles;
Figure 26 is the exploded view that is applicable to the LED module of dynamic addressing in integrally formed LED light carrier bundle described in the application;
Figure 27 is the exploded view that is connected in light carrier bundle structure a plurality of LED modules as shown in figure 26;
Figure 28 A and 28B are respectively the schematic diagrames of exemplary woven pattern and describe;
Figure 28 C and 28D are respectively the schematic diagrames of exemplary loop bonding pattern and describe;
Figure 29 A and 29B are respectively cutaway view and the top perspective views of the conductive substrates of integrally formed according to another embodiment of the present invention LED light carrier bundle;
Figure 30 has the top perspective view that is electrically connected to Figure 29 A of PCB and the integrally formed LED light carrier bundle of 29B of conductive substrates by loop bonding; And
Figure 31 A and 31B have end perspective view and the top perspective view that is electrically connected to Figure 29 A of LED and the integrally formed LED light carrier bundle of 29B of conductive substrates by curling.
The specific embodiment
The present invention relates to a kind of integrally formed LED light carrier bundle, it comprises a plurality of LED, described LED series, parallel or mixing are connected at least one the conductive bus element that forms mounting substrate, or be connected at least two conductive bus elements of substrate, described at least two conductive bus elements are for example arranged on, by insulating materials (plastics) and make to provide in the support substrates of mounting substrate.Mounting substrate is electrically connected and physics mounting platform or mechanical support for LED provides.Mounting substrate also can be used as or comprises the reflective optical system of LED.Mounting substrate and LED are encapsulated in the transparent or semitransparent packaging body that can comprise light diffusing particles.
In one embodiment of the invention, as shown in Figures 2 and 3, integrated LED light carrier bundle comprises sub-assemblies 310, this sub-assemblies 310 comprises at least one LED that is connected to conductive substrates 201 202, this sub-assemblies 310 is encapsulated in packaging body 303, and this conductive substrates 201 comprises by a conductive bus element that can form from the conductive material of power distribution electric power.As shown in Figure 2, LED 202 is connected in series.The present embodiment has represented advantage on the compacting of size, and can allow to have the production of the thin LED light carrier bundle of length of 3mm or less overall diameter.This conductive substrates 201 is connected to power supply 205 effectively with conduction.
In another embodiment, as shown in Fig. 4 A, 4B and 5A, the present invention can be the integrally formed LED light carrier bundle 400 that comprises a plurality of sub-assemblies 510.Each sub-assemblies 510 comprises at least one LED 202 that is connected to conductive substrates 401, and wherein this conductive substrates 401 has two conductive bus element 401A and 401B.This sub-assemblies 510 is encapsulated in packaging body 503.As shown in the figure, LED 202 is connected in parallel.This conductive substrates 401 is connected to power supply 405 effectively to start LED 202.
In another embodiment, as shown in Figure 5 B, the present invention can comprise a plurality of sub-assemblies 750.Each sub-assemblies 750 comprises at least one LED 202 (for example, plate upper surface mounts LED) that is connected to the conductive substrates 94 with at least two conductive bus element 94A and 94B, and wherein this conductive substrates 94 is arranged in support substrates 90.
Alternating current or direct current from for example power supply of power supply 405 can be used for for integrally formed LED light carrier bundle power supply.In addition, can use current source.Can control brightness by numeral or analog controller.
Conductive substrates 94,201,401 is extending longitudinally along the length direction of integrally formed LED light carrier bundle, and as electric conductor and physics mounting platform or the mechanical support of LED 202.Conductive substrates also can be used as or comprises the reflective optical system of LED 202.
Conductive substrates 201,401 is such as can be from metallic plate or paper tinsel punching press, mint-mark, printing, serigraphy or laser cutting etc. so that the basis of circuit to be provided, and have film or flat form.The conductive bus element of conductive substrates 94,201,401 and conductive segment (discussing below) also can be used rigid conductive material (for example hard sill of metal bar, bonding jumper, copper coin, copperplated steel, covering conductive material etc.) or flexible conducting material (for example thin bonding jumper, copper-clad alloy wire, twisted wire, braided wire etc.) to form.Twisted wire or braided wire can be flat or circle, and comprise a plurality of conduction fine rules of being manufactured by red metal, brass, aluminium etc.These fine rules can be exposed, or cover the conductive material that includes but not limited to tin, nickel, silver etc.This section of mentioned metal can comprise red metal, brass, aluminium etc.
In a preferred embodiment, flat braided wire is as conductive bus element or conductive segment, and described conductive bus element or conductive segment are flexible.In the present invention, the use of flat braided wire can promote flexible reinforced in the direction perpendicular to flat conductive bus leement duration.In addition, flat braided wire provide higher thermal conductivity with more effectively from LED heat radiation, therefore allow the present invention to be operated in high power and compare and can realize larger brightness with the conventional light guides bundle that uses solid-state flat.
In addition, in general, the maximum length of LED light carrier bundle is determined by the electrical conductivity of conductive bus element.In traditional LED light carrier bundle, along with LED light carrier bundle is elongated, due to its impedance and by the load of extra LED, increase and cause electric current to increase, the voltage drop of power bus increases.Finally, voltage drop will become too large in the specific maximum length of LED light carrier bundle.In one aspect of the invention, the maximum length of integrally formed LED light carrier bundle can for example, by (increasing conductive bus, increase the specification as the braided wire of conductive bus element or section) cross-sectional area and increase, so can reduce the impedance of its per unit length.
The conductive bus element of conductive substrates 94 can be arranged in support substrates 90 by bonding, lamination, extruding or casting.Support substrates 90 can be formed by rigidity or flexiplast manufacture, for example PETG (PET), polyvinyl chloride (PVC) and thermoplastic polyurethane (TPU).
Extra circuit, for example active or Passive Shape Control component (for example microprocessor, resistance, electric capacity), can be increased and be encapsulated in packaging body to increase the function of integrally formed LED light carrier bundle.These functions can include but not limited to current limliting (for example resistance 10), protection, scintillation properties or brilliance control.For example, can comprise microcontroller or microprocessor so that LED 202 can address separately, thereby it is luminous to form various light patterns to make terminal use can control in LED light carrier bundle selected LED 202, for example stroboscopic, glisten, chase or pulse.In one embodiment, external control circuit is connected to conductive substrates 94,201,401.
The first embodiment of conductive substrates
In the first embodiment of the conductive substrates assembly 600 shown in Fig. 6 A, the base material of conductive substrates 601 is long thin narrow bonding jumper or paper tinsel preferably.In one embodiment, base material is copper.The sectional hole patterns 602 of dash area shown in Fig. 6 A has described from conductive substrates 601, to have removed the region of material.In one embodiment, material is removed by stamping machine.The surplus material of conductive substrates 601 forms circuit of the present invention.Alternatively, circuit can be printed in conductive substrates 601 and use subsequently etching technics to remove region 602.Locating hole 605 in conductive substrates 600 is as the guiding of manufacturing and assembling.
The second embodiment of conductive substrates
For creating series connection and/or parallel circuit, extra material will be removed from conductive substrates.For example, after LED 202 is installed in conductive substrates, between the terminal of LED 202, the extra section of conductive substrates will be removed.Therefore, will create at least two conductors, wherein each conductor is electrically separated, but coupled to each other by LED202.As shown in Figure 7 A, conductor substrate 701 has the optional sectional hole patterns 702 with respect to the sectional hole patterns 602 of describing in Fig. 6 A.Use optional sectional hole patterns 702, LED 202 (for example three shown in Fig. 7 A and 7B) is connected in series in conductive substrates 701.This is connected in series as shown in Figure 7 B, and it is as the schematic diagram of conductive substrates assembly 700 as shown in Figure 7 A.As shown in the figure, the mounting portion of LED 202 is that conductive substrates 701 provides support.
The 3rd embodiment of conductive substrates
In the 3rd embodiment of conductive substrates, as shown in Figure 8 A, conductive substrates assembly 800 is depicted as to have and stamps out or etching is entered the pattern 802 of conductive substrates 801.Pattern 802 has reduced the quantity in the desired gap stamping out, and has increased the space between these gaps.Locating hole 805 is as the guiding of manufacture and assembly technology.As shown in Figure 8 B, LED 202 is short circuit not removing in extra material situation.In one embodiment, after LED 202 is mounted, this material is removed from conductive substrates 801.
The 4th embodiment of conductive substrates
As shown in Figure 9 A, the 4th embodiment of conductive substrates assembly 900 comprises optional sectional hole patterns 902, does not have in one embodiment any locating hole.Compare with the 3rd embodiment, stamp out more spaces to create two current-carrying parts in conductive substrates 901.So, as shown in Figure 9 B, the present embodiment has the operating circuit that LED 202 is connected in series.
The the 5th and the 6th embodiment of conductive substrates
Figure 10 A shows the 5th embodiment of the conductive substrates assembly 1000 of conductive substrates 1001.Shown in be the thin LED light carrier bundle with 3mm or less typical outer diameters.As shown in Figure 10 A, the LED 202 that (1) is connected in conductive substrates 1001 is separated, preferably has specific distance.In typical case's application, except other business, at least depend on that power supply and these LED that LED is used are that top is luminous or side is luminous, LED 202 interval 3cm to 1m.Conductive substrates 1001 shows and does not have any locating hole.The flat rectangular shape of growing up is stretched in the space stamping out that creates the first sectional hole patterns 1014.At LED 202, be mounted to after conductive substrates 1001, LED 202 space 1030 is below stamped out, or alternatively, LED 202 is installed on the space 1030 stamping out.Yet as shown in Figure 10 B, because all LED202 are short circuits, so the final circuit of the present embodiment is unavailable.In operation subsequently, from conductive substrates 1001, remove extra material, thus LED 202 serial or parallel connection as desired.
In the 6th embodiment of conductive substrates assembly 1100, as shown in Figure 11 A, conductive substrates 1101 comprises sectional hole patterns 1118, and its utilization is arranged on the LED the being connected in series 202 building work circuit in conductive substrates 1101 in conductive substrates 1101.The thin LED light carrier bundle that the present embodiment has 3mm or less typical outer diameters for establishment is useful.
Other embodiment of conductive substrates
Figure 29 A and 29B have described to use a plurality of lines and/or silk is woven and/or another embodiment of the knitting conductive substrates forming 4000.As shown in the figure, conductive substrates 4000 comprises the support substrates 4100 with a plurality of lines and/or silk, and wherein a plurality of lines comprise for example, as at least one line of parallel element (parallel element 4510) and/or silk and as at least two lines through kind of thread elements (for example, through kind of thread elements 4511 and 4512) and/or silk.Conductive substrates 4000 can comprise that at least one supports warp (for example supporting warp 4513 and 4514), and it comprises the also parallel to each other substantially through kind of thread elements of a plurality of set.Support warp 4513 and 4514 extra mechanical strength is provided, promote conductive substrates 4000 flexibilities to strengthen simultaneously.
For support substrates, at least one parallel element 4510 can be configured in first direction and at least two and be configured in second direction through kind of thread elements 4511 and 4512, so that parallel element 4510 and form a plurality of crosspoints through between each of kind of thread elements 4511 and 4512.Parallel element 4510 with through each of kind of thread elements 4511 and 4512, in the plurality of crosspoint, be configured to be perpendicular to one another substantially or be other angles (but not parallel).Support substrates can be conduction or nonconducting, and can be by conducting electricity and/or non-conductive line and/or silk are made.Conductor wire or silk include but not limited to flexible conducting material (for example allowing line, twisted wire, braided wire of copper-clad etc.).Twisted wire or braided wire can be flat or circle, and comprise a plurality of by nickel, steel, iron, titanium, red metal, brass, aluminium etc. or the conduction fine rule made such as non-metal conductor or its combination of carbon fiber.These fine rules can be exposed or cover conductive material, include but not limited to tin, nickel, silver etc.The fine rule of being made by tin, nickel, steel, titanium, silver, red metal, brass, aluminium etc. or silk also can be used in support substrates.Non-conductive line or silk include but not limited to Kafra fiber, nylon, cotton thread, staple fibre, polyester fiber, laminated yarn, flat wire, silk line, glass fibre, polytetrafluoroethylene (PTFE) (PTFE), any solid-state polymeric material etc. or its combination.
Except support substrates, conductive substrates 4000 comprises conductive bus element 4061,4062 and 4063, and wherein each of conductive bus element comprises a plurality of lines, and wherein a plurality of lines comprise at least one woven and/or knitting line or silk that enters support substrates.Conductive bus element can mate in the following manner: the first conductive bus element 4061 can be mated to distribute the power from power supply; The second conductive bus element 4062 can be mated to distribute control signal; And the 3rd conductive bus element 4063 can be by coupling for ground connection.Yet coupling listed above can change between conductive bus element.Conductive substrates 4000 also comprises the conductive bus element more than three.
Electronic component such as LED, resistor, diode, transistor, fuse or any integrated circuit can be directly installed in conductive substrates 4000, or be pre-assembled in printed circuit board (PCB) (for example rigidity PCB or flexible PCB) upper and subsequently printed circuit board (PCB) can be arranged in conductive substrates 4000.Installation method includes but not limited to welding, welding, curling, loop bonding, woven, knitting or its combination.
As shown in Figure 30,31A and 31B, LED 202 can be arranged in conductive substrates 4000 by welding, welding, curling, loop bonding, woven, knitting or its combination.For example, LED 202 can be by being used the loop bonding, woven and/or knitting or by curling at least one being electrically connected in conductive bus element 4061,4062,4063 of at least one conductor wire or silk.LED 202 also can be welded at least one in the conductive bus element 4061,4062,4063 of conductive substrates 4000.
The present embodiment of conductive substrates 4000 can be used in all embodiment of the integrally formed LED light carrier bundle that the application discloses.
LED
LED is installed in conductive substrates
As mentioned above, LED 202 is arranged in conductive substrates by comprising the known method of surface installation, LED chip joint, spot welding and laser weld.
In install on surface, as shown in Figure 12 A and 12B, first conductive substrates 1201 is stamped into any one that above-described embodiment supposes, and subsequently by mint-mark to form LED installation region 1220.Shown in LED installation region 1220 be exemplary, and other variations of LED installation region 1220 are possible.For example, LED installation region 1220 can be become can keep LED 202 by mint-mark any shape or not mint-mark.
Welding material 1210 (for example liquid solder, soldering paste, solder paste and known any other welding material) or conductive epoxy resin are placed on LED installation region 1220 by assembly system artificial or able to programme, as shown in Figure 12 A.LED 202 is subsequently by the artificial or able to programme top that is placed on welding material 1210 or suitable conductive epoxy resin with mounting table of picking up.The conductive substrates 1201 with a plurality of LED 202 that are arranged separately in welding material 1210 tops can directly be sent in the curing oven that return passage able to programme that welding material 1210 is melted or conductive epoxy resin be cured.Therefore, as shown in Figure 12 B, LED 202 is engaged to conductive substrates 1201.
As shown in figure 13, LED 202 can be engaged and is arranged in conductive substrates 1301 by LED chip.Conductive substrates 1301 by mint-mark to create LED installation region 1330.LED installation region 1330 shown in Figure 13 is exemplary, and comprises that other variations of LED installation region 1330 of the mint-mark shape of the kept LED as shown in Figure 12 A are expected.LED 202 (preferably LED chip) places it on LED installation region 1330 by the artificial or able to programme placement machine of picking up.Use subsequently line 1340 lines that LED 202 is bonded in conductive substrates 1301.It should be noted that line joint comprises that ball bond, the wedge joint close etc.Alternatively, LED 202 can be used conducting resinl or clip to be arranged in conductive substrates 301.
As mentioned above, as Figure 30,31A and 31B, LED 202 can be by loop bonding, woven, knitting or curling being arranged in conductive substrates 4000.For example, LED 202 can be by being used the loop bonding, woven and/or knitting or by curling at least one being electrically connected in conductive bus element 4061,4062,4063 of at least one conductor wire or silk.LED 202 also can weld or at least one in the conductive bus element 4061,4062,4063 of conductive substrates 4000 of welding on.Pass through example, as shown in figure 30, PCB 1200 (it will have the LED 202 that is electrically connected on this) has at least one eyelet 1320, can be through at least one eyelet 1320 and by least one in loop bonding, the woven and/or knitting conductive bus element that enters conductive substrates 4000, to create and to be electrically connected between LED 202 and conductive substrates 4000 at this at least one conductor wire or silk.In another embodiment being described as Figure 31 A-31B, LED 202 is electrically connected to the PCB 1200 with crimp arms 1211, and this crimp arms 1211 is electrically connected to the first conductive bus 4061.
It should be noted that the conductive substrates in above-described embodiment can be twisted in "S" shape.Subsequently, distortion is inverted the rotation of another predetermined number in contrary direction.Therefore, make conductive substrates form " Z " shape.The packed body of the conductive substrates of this " S-Z " distortion covers subsequently.Owing to having " S-Z " distortion layout, the present embodiment will have the flexibility of enhancing, and the uniformity of luminance that covers 360 °.
In another embodiment, as shown in Figure 11 C, carry electric current to the conductive substrates (as conductive substrates 1101) of LED will be wound in spiral.Spiral technique can be carried out by common screw machine, wherein conductive substrates be placed on turntable and core 9000 through the hole that is positioned at platform central authorities.The spacing of LED depends on the ratio of rotary speed and the linear velocity of screw.Core 9000 can be Arbitrary 3 D shape, for example cylinder, rectangular prism, cube, cone, triangular prism, and can or such as the elastomeric material of silicon rubber, make in one embodiment by the polymeric material such as polyvinyl chloride (PVC), polystyrene, ethylene-vinyl acetate copolymer (EVA), polymethyl-benzene olefin(e) acid methyl esters (PMMA) etc., but be not limited to these materials.Core 9000 also can be solid-state.In one embodiment, carry electric current to the conductive substrates of LED to be wound in spiral on solid plastics core, and be encapsulated in subsequently in transparent elastic packaging body.
Packaging body
Packaging body provides and prevents environmental factor for example water and dust and owing to being placed on the protection of the load infringement on integrated LED light carrier bundle.Packaging body can be flexibility or rigidity, and can be transparent, translucent, opaque and/or colored.Packaging body can or be made such as the elastomeric material of silicon rubber in one embodiment by the polymeric material such as polyvinyl chloride (PVC), polystyrene, ethylene-vinyl acetate copolymer (EVA), polymethyl-benzene olefin(e) acid methyl esters (PMMA) or other analog materials, but is not limited to these materials.
About the manufacturing technology of packaging body, comprise but do not limit extruding, cast, be molded as, lamination, injection moulding or its combination.
Except protection feature, packaging body can help scattering of light and guiding in LED light carrier bundle.As shown in figure 14, from the part light that meets total internal reflection condition of LED 202, will be reflected in the surface of packaging body 1403, and longitudinally transmit along packaging body 1403.In packaging body 1403, can comprise light diffusing particles 1404 so that this part light changes direction as shown in light path 1406, and slacken or eliminate the focus of light.Light diffusing particles 1404 has the size of selecting from the light wavelength of LED according to transmitting.In typical case application, light diffusing particles 1404 has the diameter of nanoscale, and can be before extrusion process or during be added in polymer.In addition, as shown in Figure 14 A, conductive substrates 1401 also can be used as or comprises the reflective optical system of LED light carrier bundle inside.
The concentration of light diffusing particles 1404 can be changed by adding or removing.For example, before extrusion process or during, light diffusing particles 1404 can be added in parent material by the form of adulterant.In addition, bubble or any other internal voids can be used as light diffusing particles 1404.In packaging body 1403, the concentration of light diffusing particles 1404 is subject to spacing, the brightness of LED and the impact of uniformity of light between LED.The higher concentration of light diffusing particles 1404 can increase the spacing between adjacent LED 202 in LED light carrier bundle.By using the light diffusing particles 1404 of high concentration and/or use brighter LED 202, the brightness that can improve LED light carrier bundle in the nearlyer spacing of LED.By increasing the concentration of light diffusing particles 1404, can improve the level and smooth of light in LED light carrier bundle and evenly.
As shown in Fig. 3,5A and 5B, sub-assemblies 310,510 and 750 is positioned in fact the central authorities of packaging body.Sub-assemblies 310,510 and 750 is not limited to this position in packaging body.Sub-assemblies 310,510 and 750 optional positions that can be arranged in packaging body.In addition, the cross-sectional profiles of packaging body is not restricted to circle or ellipse, and can be any shape (for example square, rectangle, trapezoidal, star).And, the cross-sectional profiles of packaging body can optimization, so that narrow or wide visual angle (F is respectively referring to the light path 1450 and 1460 in Figure 14 B (packaging body 222 of cheese profile) and Figure 14 C (packaging body 223 of flat-top shape profile)) and/or the transmitting lens from the light of LED 202 to be provided.Another thin layer that for example, can increase packaging body in the outside of former packaging body is further to control uniformity of luminance of the present invention.
Surface-texturing and lens
For optical effect, the surface of integrated LED light carrier bundle can be by texturing and/or lens.Integrated LED light carrier bundle can be capped (for example having fluorescent material) or comprise that extra layer for example, to control the optical characteristics (sending out diffusion of light and uniformity) of LED light carrier bundle.In addition, can apply in the outside of packaging body mask so that different texture or patterns to be provided.
Also can be by hot moulding, mint-mark, printing and/or cutting technique shape or the pattern in the surface creation different designs of packaging body, so that specific function to be provided, for example lens, focusing and/or scattering effect.As shown in Figure 15 A-C, the present invention includes the formal or organic shape or the pattern (for example dome, ripple, ridge) that affect light 1500 calibrations (Figure 15 A), focus on (Figure 15 B) or scattering/diffusion (Figure 15 C).The surface of packaging body can be during pushing or after extruding by texture or mint-mark to create extra lens.In addition, packaging body 93,303 and 503 can be made to control by the multilayer material with different refractivity the degree of diffusion.
The application of integrally formed LED light carrier bundle
Integrally formed LED light carrier bundle of the present invention finds to have a lot of luminous application.Below some examples, such as LED light carrier bundle, the full color LED light carrier bundle of 360 ° of illuminations, the LED light carrier bundle that there is the LED light carrier bundle of sensor or detector and there is independent control LED.In addition, LED light carrier bundle can walk abreast or stacked arrangement to create luminescent panel.It should be noted that these are only some possible light carrier bundle application.
Three copper cash 161,162,163 to LED 202 conveying electrical power of the formation conductive substrates as shown in Figure 16 B can be wound in spiral (referring to Figure 11 C).LED is connected to conductor by welding, ultrasonic bond or electric resistance welding.Each adjacent LED can be towards identical angle or towards different angles.For example, forward-facing, next LED's LED faces up, the 3rd LED backward-facing, and the 4th face down etc.So, integrally formed LED light carrier bundle can 360 ° illuminates whole environment.
Figure 16 B and 16C show the embodiment of integrally formed LED light carrier bundle.As shown in the figure, there are two continuous conductors of being done conductive bus element 161 and 163 by note here.Zero ohm wire jumper or resistor 10 bonding conductor sections 162 to conductive bus element 161 and 163 to provide power to LED element 202.As shown in Figure 16 B, conductive bus element 161 and 163 is arranged in support substrates 90.In a preferred embodiment, conductive bus element 161 and 163 and support substrates 90 be flexible.In other embodiments, the LED light carrier bundle with flexible support substrate is wound in the spiral (for example, referring to Figure 11 C) that surrounds core 9000, and is encapsulated in packaging body subsequently.
Figure 30 shows another embodiment of the integrally formed LED light carrier bundle with conductive substrates 4000.As shown in the figure, conductive substrates 4000 comprises the support substrates 4100 that contains a plurality of lines and/or silk, wherein a plurality of lines comprise at least one line or silk for example, as parallel element (parallel element 4510) and at least two lines and/or silk as through kind of thread elements (for example, through kind of thread elements 4511 and 4512).In this exemplary embodiment, there is conductive bus element 4061,4062 and 4063, wherein each conductive bus element can be formed by a plurality of lines and/or silk.Conductive substrates 4000 has the warp 4513 and 4514 of support.Conductive substrates 4000 has one or more conductive bus elements and/or one or more support warp.PCB 1200 (having the LED 202 that is electrically connected on this) has at least one eyelet 1320, wherein at least one conductor wire or silk can be through at least one eyelets 1320 and by least one in loop bonding, the woven and/or knitting bus element that enters conductive substrates 4000, to create and to be electrically connected between LED 202 and conductive substrates 4000.At this, PCB 1200 is by loop bonding to the second bus element 4062, and therefore establishment electric connection between LED 202 and conductive substrates 4000.
Figure 31 A and 31B show another embodiment of LED light carrier bundle.In this exemplary embodiment, LED 202 is electrically connected to PCB 1200, and wherein PCB 1200 has crimp arms 1211, and crimp arms 1211 is electrically connected to conductive bus element 4061.
Integrally formed LED light carrier bundle is not limited to monochrome.For panchromatic application, monochromatic LED can be replaced by a plurality of LED or by the LED being comprised of four sub-LED red, blue, green and these four kinds of different colours in vain group as shown in figure 20.The voltage that the brightness of each LED group (pixel) can put on every sub-LED by adjustment is controlled.The brightness of each LED is controlled by all circuit as shown in figure 20.
In Figure 20, L1, L2 and L3 provide three holding wires of electrical power to four LED in each pixel.The color intensity of every sub-LED utilizes the sequential chart that Figure 21 provides to control by μ controller 6000.
As shown in figure 21, due at first paragraph timeline voltage L2 higher than line voltage L1, red LED (R) is opened, on the contrary, interval at one time, therefore other all LED reverses biased also close.Similarly, in second time interval, L2, higher than L3, has therefore opened green LED (G) and has closed every other LED.In the time period subsequently, identical reasoning is followed in opening or closing of other LED.
New color except four kinds of basic colors is as cold white and orange can obtaining by mixing suitable primary colours in switching time in part unit.This microprocessor that can be built in circuit by design is realized.Figure 22 A and 22B show respectively cold white and orange color sequential chart.It should be noted that and can show by the variation of signal L1, L2 and L3 whole chromatogram.
In one embodiment of the invention, integrally formed LED light carrier bundle comprises a plurality of pixels (LED module), wherein each pixel has one or more LED, and each pixel can be used the microcontroller circuit of integrated described one or more LED to control separately.Each pixel is the LED module that comprises microcontroller and at least one or more LED (for example single R, G, B or W LED, three LED (RGB) or four LED (RGBW)).Figure 27 has described exemplary a plurality of pixels (LED module 2100), and each pixel has four LED (RGBW).Each LED module 2100 is assigned with unique address.After this address is triggered, this LED module is luminous.LED module is used the holding wire based on chain link or star bus configuration to be connected in series.Alternatively, LED module 2100 be arranged in parallel.
There are two kinds of modes for each LED module distribution address in this integrally formed LED light carrier bundle.The first approach is static addressing, the address that wherein each pixel is fixed by predistribution during manufacture, and can not monitor any variation, particularly the length about pixel inefficacy or LED light carrier bundle changes.The second approach is dynamic addressing, and wherein each pixel is dynamically allocated the address relevant to himself unique address, and each pixel is characterised in that himself " address " is periodically relevant to triggering signal.Alternatively, when energising, address is dynamically allocated.Reconfigurable their address of the signal that allows LED module to receive based on LED module place due to dynamic addressing, thereby use the integrally formed LED light carrier bundle of this capable of dynamic addressing LED module can realize the flexibility of installation, maintenance, failure detection and maintenance.
In one embodiment, integrally formed LED light carrier bundle comprises pixel (LED module), and wherein the address of pixel is dynamically distributed by pixel self, and need not be preset during manufacture as static state addressing.As shown in Figure 26 and 27, each LED module 2000 preferably includes LED 2004 (R, G, B or W LED or its combination), microcontroller 2002, FPDP (DATA), two I/O ports (one of them be configured to output port (S0) and another is configured to input port (S1)), a power port (VCC) and a grounding ports (GND).Figure 26 shows schematic diagram and the wiring of single led module 2000.
In each LED module 2000, the function of microcontroller 2002 is: (a) from the FPDP of himself, receive data and receive order and figure signal; (b) process dynamic addressing system; And (c) driving the LED in they self LED module, each LED module forms a pixel.
VCC port and GND port are connected to power bus and earth bus respectively;
DATA port is connected to common bus.This common bus can be from LED module transmission of control signals or transmission of control signals to LED module.Control signal can be for example the request that (for example shows data (for example current demonstration information)) from LED module to long-range display-memory 2006 request datas, or to specific LED module, sends the data of current demonstration information from long-range display-memory 2006;
I/O port S0 is output port ground connection, and I/O port S1 is input port and is connected to VCC.As shown in the schematic diagram in Figure 27, the interconnection of the input and output port of adjacent LED modules.In integrally formed LED light carrier bundle, the input port (S1) of last LED module only has to the connection of its output port (S0), and its input port (S1) opens circuit, when LED light carrier bundle is powered, specify this specific LED module as the initial LED module of dynamic addressing.In the embodiment shown, last LED module is dispensed on the position of No.0.
That is to say, the microcontroller of LED module detects the state of its input port, and if this port in not-connected status, thinks that the pixel under it should be assigned with 0 position so.Then, thus the microcontroller that is assigned with the LED module of No.0 position transmits its address by the adjacent LED modules to as No.0 pixel and to distribute its neighbor address be that No.1 starts dynamic addressing.The pixel with the address of distribution like this is communicated by letter with adjacent LED modules below subsequently, in the mode of chain link recursion as shown in figure 27, distributes address.In this way, when when energising, each distributes they self address by the independent pixel of microprocessor control, and if pixel lost efficacy or LED light carrier bundle disconnects, can redistribute the address of self.It should be noted that the port status of being identified by microcontroller is not limited to off state, can be to be also identified as by microcontroller any predetermined state that expression does not connect.
In a preferred embodiment, all LED modules 2000 are shared individual data line, and each LED module for example sends, for example, about the data request of (showing data (current demonstration information)) to long-range display-memory 2006, wherein the shown controller 2008 of these data changes and refreshes.Display controller 2008 typically can be programmed to upgrade the demonstration data in display-memory 2006, and each pixel (LED module) is obtained data separately from display-memory 2006.The function of display controller 2008 is to change and refresh display-memory.Display-memory 2006 and display controller 2008 preferably well known to a person skilled in the art that by use address bus 2010 and data/address bus 2012 communicate with one another.
The integrally formed LED light carrier bundle that comprises LED module can be cut into desired random length, even when energising and operation.If integrally formed LED light carrier bundle or cut in when energising, or cut and energising subsequently when power-off, this cutting formation is opened circuit and cut before the S1 port of LED module do not become connection.Due to the microcontroller of the LED module before cutting now by its S1 port of identification for opening circuit, by self address of distribution, be No.0 so, and become new initial LED module with dynamic addressing by aforesaid process.All LED modules above obtain the new address corresponding with new initial LED module.
Figure 17 A-17C has described the embodiment of the LED light carrier bundle of use series and parallel connections connection.This embodiment allows LED half-twist (horizontally set rather than longitudinal) and installs with nearer spacing.
As shown in Figure 18 to 19B and 24, integrally formed LED light carrier bundle can have a plurality of conductors (for example conductive bus element and conductor segment), it is coupled by zero ohm wire jumper or resistor, LED, sensor, detector and/or microprocessor, and is arranged in support substrates.The functional of LED light carrier bundle increases along with each extra conductor.For example, sensor or the detector of monitoring of environmental condition (for example humidity, temperature and brightness) can be integrated in LED light carrier bundle, and connect can affect the mode of the characteristics of luminescence of LED light carrier bundle.Figure 18 shows the embodiment of the integrally formed LED light carrier bundle with sensor or detector.As shown in the figure, there are four continuous conductors, corresponding conductive bus element 30,32,33 and 34.Zero ohm wire jumper or resistor 10 are coupled to conductive bus element 30 and 32 by conductive segment 31.Conductive bus element 32 is as common ground.When conductive bus element 34 provides power to sensors/detectors 100, conductive bus element 30 provides power to LED 202.Conductive bus element 33 can index signal from sensors/detectors 100 to the power supply of electric power is provided to LED 202.Therefore, allow sensor face to survey the characteristics of luminescence (for example brightness, color, pattern, ON/OFF) that device 100 affects LED 202.
Figure 19 A and 19B show integrally formed full color LED light carrier bundle, and it has corresponding to conductive bus element L1, the L2 of electric power and three continuous conductors of L3 and conductor segment S1 and the S2 that LED 202 is connected to conductive bus element L1, L2 and/or L3 are provided to LED202.In Figure 19 B, LED 202 mounts LED for plate upper surface.
In another embodiment, each pixel (LED module) can be controlled separately.Figure 24 shows the layout of the independent controllable LED light carrier bundle that uses seven conductors and LED module 2120.At this, when conductive bus element 81 is during as voltage entrance, conductive bus element 80 is as power ground connection.Each LED module 2120 comprises that microprocessor, at least one LED, power input and output connection, control signal input and output connection and data input and output connect.In Figure 24, LED module 2120 comprises VCC pin, VDD pin, starts pin, clock pin and data pin.To adjacent LED modules control signal, input is connected the control signal of each LED module with data with data input butt coupling.Photo-coupler can be used so that the control signal wire isolation between each LED module.LED module 2120 (for example can be connected in series, as shown in figure 24) or (be for example connected in parallel, power input butt coupling to the first conductive bus element 81 of each LED module 2120, and power stage butt coupling to the second conductive bus 80 of each LED module 2120).
A plurality of integrally formed LED light carrier bundles (for example LED light carrier bundle 12,13,14) can parallel arranged to form the luminescent panel 3000 as shown in Figure 25 A-25C.Each LED light carrier bundle can comprise interlocking alignment system, it comprises alignment keys 60,62 and aims at keyhole 61, the two can be pre-formed in the packaging body of LED light carrier bundle, and wherein alignment keys 60,62 and aligning keyhole 61 are arranged on the opposite sides of LED light carrier bundle.Alignment keys 60,62 and aligning keyhole 61,63 can longitudinally extend continuously or intermittently extend along the length of LED light carrier bundle.Aiming at keyhole 61,63 can be the form of notch, groove, depression, gap or opening, and alignment keys 60,62 can be to allow friction (being preferably slidably installed) to be installed to the form (including but not limited to track or bolt) of aiming at keyhole 61,63.The width of alignment keys 60,62 can be approximately equal to or be a bit larger tham the width of aiming at keyhole 61,63, is installed on this, so that alignment keys 60,62 can rub as shown in Figure 25 B and 25C.As an example, aim at keyhole 61,63 and can be and be applicable to the groove that rub and install with track shape alignment keys 60,62, groove type aim at keyhole 61,63 and track shape alignment keys 60,62 both along the longitudinally extension continuously of length of LED light carrier bundle.
Although illustrated and illustrated specific embodiment here, those skilled in the art will realize that without departing from the present invention, various changes and/or equivalent realization can be replaced.The application is intended to cover any change and the variation of specific embodiment discussed herein.Therefore, being intended to the present invention is not only limited by claim and equivalent thereof.
Claims (21)
1. an integrally formed LED light carrier bundle, comprising:
(a) conductive substrates, comprising:
Support substrates, wherein this support substrates comprises more than first line, silk or its combination, wherein the plurality of line, silk or its combination comprise that at least one parallel element and at least two are through kind of thread elements, this at least one parallel arrangements of components is at first direction, each warp arrangements of components is in second direction, so that this at least one parallel element and these at least two form a plurality of crosspoints through between each of kind of thread elements;
What by more than second line, silk or its, be combined to form is suitable for the first bus element from power distribution power;
What by the 3rd many lines, silk or its, be combined to form is suitable for the second bus element from power distribution power;
By the 4th many lines, silk or its 3rd bus elements that are suitable for distributing control signal that are combined to form;
Wherein this first bus element, the second bus element and the 3rd bus element are by woven, loop bonding or knittingly enter in this support substrates; And
(b) a plurality of LED modules, each of described a plurality of LED modules comprises microcontroller and at least one LED, each LED module has the first electric contact, the second electric contact and the 3rd electric contact that is electrically coupled to respectively this first bus element, the second bus element and the 3rd bus element, with from this first bus element with the second bus element obtains power and from the 3rd bus element reception control signal.
2. integrally formed LED light carrier bundle as claimed in claim 1, further comprises the packaging body that encapsulates this conductive substrates and a plurality of LED modules completely, and the plurality of LED module comprises microcontroller separately.
3. integrally formed LED light carrier bundle as claimed in claim 2, this packaging body further comprises light diffusing particles.
4. integrally formed LED light carrier bundle as claimed in claim 1, further comprises that at least one supports warp, and this support warp comprises the 5th many lines, silk or its combinations that are configured in second direction.
5. integrally formed LED light carrier bundle as claimed in claim 1, wherein the plurality of LED module each with at least one bus element between be connected the group of selecting free loop bonding, woven, knitting, curling, welding, welding or combinations thereof.
6. integrally formed LED light carrier bundle as claimed in claim 1, wherein this second, third and the 4th many lines, silk or its combinations by a plurality of conductor wires and/or thread make.
7. integrally formed LED light carrier bundle as claimed in claim 4, wherein the 5th many lines, silk or its combinations are made by a plurality of non-conductive lines and/or silk.
8. integrally formed LED light carrier bundle as claimed in claim 6, wherein this conductor wire and/or silk select the group of free nickel wire, steel wire, iron wire, titanium wire, red metal line, brass wire, aluminum steel, solder, silver-colored line, nickel wire, steel wire, iron wire, titanium silk, red metal silk, brass wire, aluminium wire, tin silk, filamentary silver etc. or combinations thereof.
9. integrally formed LED light carrier bundle as claimed in claim 7, wherein this non-conductive line and/or silk select the group of free Kafra fiber line, nylon wire, cotton thread, staple fibre line, polyester line, Yarn having laminated structure, flat filament, silk silk, glass fibre, polytetrafluoroethylene PTFE, Kafra fiber silk, nylon yarn, staple, artificial cellosilk, polyester capillaries, solid polymer material etc. or combinations thereof.
10. integrally formed LED light carrier bundle as claimed in claim 1, wherein each of the plurality of LED module further comprises a plurality of LED, wherein the free group of red, blue, green and white LEDs composition of the plurality of LED choosing.
11. integrally formed LED light carrier bundles as claimed in claim 1, wherein each of the plurality of LED module further comprises for exporting the 4th contact of received control signal.
12. integrally formed LED light carrier bundles as claimed in claim 1, wherein each LED module has for controlling the unique address of this LED module.
13. as the integrally formed LED light carrier bundle of claim 12, and wherein this unique address is static.
14. as the integrally formed LED light carrier bundle of claim 12, and wherein this unique address is dynamic.
15. 1 kinds of integrally formed LED light carrier bundles, comprising:
(a) conductive substrates, comprising:
Support substrates, wherein this support substrates comprises more than first line, silk or its combination, wherein the plurality of line, silk or its combination comprise that at least one parallel element and at least two are through kind of thread elements, this at least one parallel arrangements of components is at first direction, each warp arrangements of components is in second direction, so that this at least one parallel element and these at least two form a plurality of crosspoints through between each of kind of thread elements;
The first conductive bus element, the second conductive bus element, the 3rd conductive bus element and the 4th conductive bus element, each conductive bus element respectively by second, third, the 4th and the 5th many lines, silk or its be combined to form, wherein this first conductive bus element, the second conductive bus element, the 3rd conductive bus element and the 4th conductive bus element are by woven, loop bonding or knittingly enter in this support substrates; And
Be configured at least one conductor segment between this first conductive bus element and the second conductive bus element, this at least one conductor segment comprises at least one LED and the 6th many lines, silk or its combination, and wherein this at least one conductor segment is by woven, loop bonding or knittingly enter in this support substrates; And
(b) be electrically coupled at least one sensor of the 3rd conductive bus element and the 4th conductive bus element, the 3rd conductive bus element is suitable for from this at least one sensor transmissions signal, and the 4th conductive bus is suitable for providing power to this at least one sensor.
16. as the integrally formed LED light carrier bundle of claim 15, and wherein this second conductive bus element ground connection and this at least one sensor are electrically coupled to this second conductive bus element extraly.
17. as the integrally formed LED light carrier bundle of claim 15, further comprises the packaging body that encapsulates this conductive substrates completely and be electrically coupled at least one sensor of the 3rd conductive bus element and the 4th conductive bus element.
18. as the integrally formed LED light carrier bundle of claim 17, and wherein this packaging body further comprises light diffusing particles.
19. as the integrally formed LED light carrier bundle of claim 11, wherein selects the group of free loop bonding, woven, knitting, curling, welding, welding or combinations thereof being connected between at least one LED and the 6th many lines.
20. as the integrally formed LED light carrier bundle of claim 2 or 17, and wherein the exterior contour of this packaging body comprises the alignment keys of the opposite sides that is arranged on this integrally formed LED light carrier bundle and aims at keyhole.
21. 1 kinds of luminescent panels that comprise the integrally formed LED light carrier bundle in a plurality of claims 20.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/584,563 US8807796B2 (en) | 2006-09-12 | 2012-08-13 | Integrally formed light emitting diode light wire and uses thereof |
| US13/584,563 | 2012-08-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103591492A true CN103591492A (en) | 2014-02-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210315967.XA Pending CN103591492A (en) | 2012-08-13 | 2012-08-30 | Integrally formed light emitting diode light wire and use thereof |
| CN2012204383729U Expired - Lifetime CN202733594U (en) | 2012-08-13 | 2012-08-30 | Integrally-formed LED (light-emitting diode) light carrier bundle |
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| CN2012204383729U Expired - Lifetime CN202733594U (en) | 2012-08-13 | 2012-08-30 | Integrally-formed LED (light-emitting diode) light carrier bundle |
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| CN (2) | CN103591492A (en) |
| WO (1) | WO2014026407A1 (en) |
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| CN109244066A (en) * | 2018-10-12 | 2019-01-18 | 深圳市欣上科技有限公司 | Without substrate filament framework, without substrate flexibility filament, light source and manufacturing method without substrate filament framework |
| CN109300888A (en) * | 2018-10-12 | 2019-02-01 | 深圳市欣上科技有限公司 | Filament framework, flexible filament, light source and filament manufacturing method |
| CN110416201A (en) * | 2019-08-28 | 2019-11-05 | 东莞市欧思科光电科技有限公司 | The LED structure of built-in IC |
| CN110582668A (en) * | 2017-05-02 | 2019-12-17 | 昕诺飞控股有限公司 | Elongated flexible lighting device based on solid state lighting technology |
| WO2023245565A1 (en) * | 2022-06-23 | 2023-12-28 | 东莞市欧思科光电科技有限公司 | Led light strip |
| CN109300888B (en) * | 2018-10-12 | 2024-06-04 | 深圳市欣上科技有限公司 | Filament architecture, flexible filament, light source and filament manufacturing method |
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| CN103591492A (en) * | 2012-08-13 | 2014-02-19 | 惠州元晖光电股份有限公司 | Integrally formed light emitting diode light wire and use thereof |
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- 2012-08-30 WO PCT/CN2012/080783 patent/WO2014026407A1/en active Application Filing
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| CN2708092Y (en) * | 2004-05-27 | 2005-07-06 | 徐培鑫 | Water-proof type decorative lamp string |
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| CN109300888B (en) * | 2018-10-12 | 2024-06-04 | 深圳市欣上科技有限公司 | Filament architecture, flexible filament, light source and filament manufacturing method |
| CN110416201A (en) * | 2019-08-28 | 2019-11-05 | 东莞市欧思科光电科技有限公司 | The LED structure of built-in IC |
| WO2023245565A1 (en) * | 2022-06-23 | 2023-12-28 | 东莞市欧思科光电科技有限公司 | Led light strip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN202733594U (en) | 2013-02-13 |
| WO2014026407A1 (en) | 2014-02-20 |
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