CN103472964A - Flexible capacitive screen and production process thereof - Google Patents
Flexible capacitive screen and production process thereof Download PDFInfo
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- CN103472964A CN103472964A CN201310405467XA CN201310405467A CN103472964A CN 103472964 A CN103472964 A CN 103472964A CN 201310405467X A CN201310405467X A CN 201310405467XA CN 201310405467 A CN201310405467 A CN 201310405467A CN 103472964 A CN103472964 A CN 103472964A
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Abstract
The invention discloses a production process of a flexible capacitive screen. The production process comprises cutting copper foil or an ITO (Indium Tin Oxide) film into different sizes of flexible sheets to produce a substrate; drawing patterns on the substrate through silk-screen printing; etching the patterns on the substrate and forming an electrode; arranging an FPC (Flexible Printed Circuit) and binding the FPC on the substrate to form a sample. According to the production process of the flexible capacitive screen, the copper foil or the ITO film is utilized as the substrate of the capacitive screen, so that the design and manufacturing of the bendable or foldable capacitive screen can be achieved, the process is simple, the arrangement is reasonable, the usable range of products is improved without cost increase, and the effective popularization and utilization can be achieved. The invention also discloses the flexible capacitive screen which satisfies the production process. The flexible capacitive screen has the advantages of being capable of satisfying the application of an oversize projection screen or combining with a flexible display screen to satisfy the application of a small precision electronic product, ensuring the quality and achieving the high quality and high accuracy quality assurance.
Description
Technical field
The present invention relates to flexible capacitance plate designing technique, relate in particular to a kind of flexible capacitance plate manufacture craft, more relate to a kind of flexible capacitance plate that meets this technique.
Background technology
The capacitive touch screen technology is to utilize the electric current induction of human body to carry out work.Capacitive touch screen is four layers of compound glass screen, the inside surface of glass screen and interlayer respectively scribble one deck ITO, outermost layer is skim silicon soil glassivation, interlayer ITO coating is as workplace, draw four electrodes on four angles, internal layer ITO is that screen layer is to guarantee good working environment, current capacitance plate SENSOR is rigid, can't be crooked or folding, limited the general layout that its large scale is made, well satisfying the market is required, in the application of some miniature precision electronic products, as flexible or folding wrist-watch, mobile phone etc., restriction due to hardness, also can't receive rational application.
Summary of the invention
The object of the invention is to, for the deficiencies in the prior art, provide a kind of flexible capacitance plate manufacture craft, using Copper Foil or ITO film as the capacitance plate substrate, realize design and the manufacture of flexible or collapsible capacitance plate; The present invention also provides a kind of flexible capacitance plate that meets this technique, can meet the oversize projection screen or coordinate the application that can curling display screen meets the miniature precision electronic product.
For effectively addressing the above problem, the technical scheme that the present invention takes is as follows:
A kind of flexible capacitance plate manufacture craft, this technique comprises the following steps:
(1) adopt Copper Foil or ITO film to be made into substrate by the flexible sheet that is cut into different size;
(2) draw out pattern by serigraphy on substrate;
(3) described pattern is etched on described substrate, and forms electrode;
(4) FPC is set, and it is tied on described substrate and forms sample.
Especially, described step (1) is further comprising the steps of:
When Copper Foil being set being substrate, be opaque structure, when the ITO film being set being substrate, be transparent configuration, described substrate is that the flexible material with conducting function forms.
Especially, described step (2) is further comprising the steps of:
PATTERN pattern and the edge cabling lines of described pattern for matching with external IC, when for copper clad laminate, this pattern comprises edge cabling lines, does not comprise edge cabling lines when for PTO film substrate.
Especially, described step (3) is further comprising the steps of:
When described pattern forms electrode by etching, complete the path composition that wiring etching and microetch form turning circuit in the panel wiring zone of substrate by the model specification, when being copper clad laminate, just the direct etching of pattern and edge cabling lines forms electrode, when being ITO film substrate, the direct etching of pattern is formed to electrode, and complete the edge cabling by serigraphy and get final product.
Especially, described step (4) is further comprising the steps of:
The substrate directly etching completed and described FPC binding, form complete capacitance plate, do not re-use Gold plated Layer or other protective seam covers described capacitance plate, the bending that realizes capacitance plate with fold.
A kind of flexible capacitance plate that meets above-mentioned technique, this flexibility capacitance plate is comprised of substrate, and described substrate is comprised of ITO film substrate or copper clad laminate, the FPC that is respectively equipped with electrode on described substrate and binds with described substrate.
Especially, described electrode is comprised of etched PATTERN pattern and edge cabling lines.
Especially, described ITO film substrate is transparent configuration, and described copper clad laminate is opaque structure.
Especially, described substrate also is provided with supporting with it integrated circuit.
Beneficial effect of the present invention: flexible capacitance plate manufacture craft provided by the invention, using Copper Foil or ITO film as the capacitance plate substrate, realize design and the manufacture of flexible or collapsible capacitance plate, technique is simple, rationally distributed, on the basis that does not increase cost, strengthen the usable range of product, can effectively promote the use of; The present invention also provides a kind of flexible capacitance plate that meets this technique, can meet the oversize projection screen or coordinate the application that can curling display screen meets the miniature precision electronic product, and quality is more guaranteed, accomplishes high-quality, high-precision quality guarantee.
Below in conjunction with accompanying drawing, the present invention is described in detail.
The accompanying drawing explanation
Fig. 1 is flexible capacitance plate fabrication processing figure disclosed by the invention;
Fig. 2 is that flexible capacitance plate disclosed by the invention forms structural representation.
Embodiment
Embodiment:
As shown in Figures 1 and 2, the flexible capacitance plate manufacture craft in the present embodiment comprises the following steps:
(1) adopt Copper Foil or ITO film to be made into substrate by the flexible sheet that is cut into different size; When Copper Foil being set being substrate, be opaque structure, when the ITO film being set being substrate, be transparent configuration, described substrate is that the flexible material with conducting function forms.
(2) draw out pattern by serigraphy on substrate; PATTERN pattern and the edge cabling lines of described pattern for matching with external IC, when for copper clad laminate, this pattern comprises edge cabling lines, does not comprise edge cabling lines when for PTO film substrate.
(3) described pattern is etched on described substrate, and forms electrode; When described pattern forms electrode by etching, complete the path composition that wiring etching and microetch form turning circuit in the panel wiring zone of substrate by the model specification, when being copper clad laminate, just the direct etching of pattern and edge cabling lines forms electrode, when being ITO film substrate, the direct etching of pattern is formed to electrode, and complete the edge cabling by serigraphy and get final product.
(4) FPC is set, and it is tied on described substrate and forms sample.The substrate directly etching completed and described FPC binding, form complete capacitance plate, do not re-use Gold plated Layer or other protective seam covers described capacitance plate, the bending that realizes capacitance plate with fold.
Applicant's statement, the person of ordinary skill in the field is on the basis of above-described embodiment, by above-described embodiment step, combined with the technical scheme of summary of the invention part, thereby the new technique produced, be also one of record scope of the present invention, the application, for making instructions simple and clear, is no longer enumerated other embodiment of these steps.
As shown in Figure 2, a kind of flexible capacitance plate that meets above-mentioned technique, this flexibility capacitance plate is comprised of substrate, and described substrate is comprised of ITO film substrate or copper clad laminate, the FPC that is respectively equipped with electrode on described substrate and binds with described substrate.Described electrode is comprised of etched PATTERN pattern and edge cabling lines.Described ITO film substrate is transparent configuration, and described copper clad laminate is opaque structure.Described substrate also is provided with supporting with it integrated circuit.
The present embodiment important technology principle is:
Flexible capacitance plate manufacture craft provided by the invention, using Copper Foil or ITO film as the capacitance plate substrate, realizes design and the manufacture of flexible or collapsible capacitance plate, technique is simple, rationally distributed, on the basis that does not increase cost, strengthen the usable range of product, can effectively promote the use of; The present invention also provides a kind of flexible capacitance plate that meets this technique, can meet the oversize projection screen or coordinate the application that can curling display screen meets the miniature precision electronic product, and quality is more guaranteed, accomplishes high-quality, high-precision quality guarantee.
In the present embodiment, concrete know-why is as described below:
Adopt copper clad laminate: PATTERN pattern that at first will be supporting with IC and edge cabling silk-screen are to Copper Foil.Then etched pattern, etch pattern and edge circuit come, and forms electrode.Finally FPC is tied on Copper Foil, forms final sample.
Adopt ITO film base: PATTERN pattern silk-screen that at first will be supporting with IC is upper to ITO, and then etched pattern, by the pattern etching out, form electrode and complete silk-screen edge cabling, and finally just FPC is tied on ITO, forms final sample.
The another statement of applicant, the present invention illustrates and of the present inventionly realizes technique and apparatus structure by above-described embodiment, but the present invention is not limited to above-mentioned embodiment, does not mean that the present invention must rely on above-mentioned technique and structure could be implemented.The person of ordinary skill in the field should understand, any improvement in the present invention, to the present invention selected realize that technique equivalence is replaced and and the interpolation of step, the selection of concrete mode etc., within all dropping on protection scope of the present invention and open scope.
The present invention is not limited to above-mentioned embodiment, and all employings and analog structure of the present invention and technique thereof realize all modes of the object of the invention, all within protection scope of the present invention.
Claims (9)
1. a flexible capacitance plate manufacture craft, is characterized in that, this technique comprises the following steps:
(1) adopt Copper Foil or ITO film to be made into substrate by the flexible sheet that is cut into different size;
(2) draw out pattern by serigraphy on substrate;
(3) described pattern is etched on described substrate, and forms electrode;
(4) FPC is set, and it is tied on described substrate and forms sample.
2. flexible capacitance plate manufacture craft according to claim 1, is characterized in that, described step (1) is further comprising the steps of:
When Copper Foil being set being substrate, be opaque structure, when the ITO film being set being substrate, be transparent configuration, described substrate is that the flexible material with conducting function forms.
3. flexible capacitance plate manufacture craft according to claim 1, is characterized in that, described step (2) is further comprising the steps of:
PATTERN pattern and the edge cabling lines of described pattern for matching with external IC, when for copper clad laminate, this pattern comprises edge cabling lines, does not comprise edge cabling lines when for PTO film substrate.
4. flexible capacitance plate manufacture craft according to claim 1, is characterized in that, described step (3) is further comprising the steps of:
When described pattern forms electrode by etching, complete the path composition that wiring etching and microetch form turning circuit in the panel wiring zone of substrate by the model specification, when being copper clad laminate, just the direct etching of pattern and edge cabling lines forms electrode, when being ITO film substrate, the direct etching of pattern is formed to electrode, and complete the edge cabling by serigraphy and get final product.
5. flexible capacitance plate manufacture craft according to claim 1, is characterized in that, described step (4) is further comprising the steps of:
The substrate directly etching completed and described FPC binding, form complete capacitance plate, do not re-use Gold plated Layer or other protective seam covers described capacitance plate, the bending that realizes capacitance plate with fold.
6. a flexible capacitance plate that meets the described technique of claim 1, is characterized in that, this flexibility capacitance plate is comprised of substrate, and described substrate is comprised of ITO film substrate or copper clad laminate, the FPC that is respectively equipped with electrode on described substrate and binds with described substrate.
7. flexible capacitance plate according to claim 6, is characterized in that, described electrode is comprised of etched PATTERN pattern and edge cabling lines.
8. flexible capacitance plate according to claim 6, is characterized in that, described ITO film substrate is transparent configuration, and described copper clad laminate is opaque structure.
9. flexible capacitance plate according to claim 6, is characterized in that, described substrate also is provided with supporting with it integrated circuit.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310405467XA CN103472964A (en) | 2013-09-07 | 2013-09-07 | Flexible capacitive screen and production process thereof |
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| CN201310405467XA CN103472964A (en) | 2013-09-07 | 2013-09-07 | Flexible capacitive screen and production process thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105320352A (en) * | 2014-07-31 | 2016-02-10 | 三星电子株式会社 | Flexible device and interfacing method thereof |
| CN106227025A (en) * | 2016-09-27 | 2016-12-14 | 深圳市奋达科技股份有限公司 | The manufacture method of integral intelligent watch |
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| CN1864124A (en) * | 2003-10-06 | 2006-11-15 | 3M创新有限公司 | Touch input sensing device |
| CN101248411A (en) * | 2005-10-17 | 2008-08-20 | 财团法人工业技术研究院 | Method for making a display with integrated touchscreen |
| CN101738774A (en) * | 2008-11-06 | 2010-06-16 | 北京海维元电子有限公司 | Ultrathin flexible liquid crystal display and manufacturing method thereof |
| US20120299638A1 (en) * | 2011-05-26 | 2012-11-29 | Lg Innotek Co., Ltd. | Touch Window |
| CN102830876A (en) * | 2012-08-15 | 2012-12-19 | 南京汇金锦元光电材料有限公司 | Capacitive touch screen with flexible transparent conductive film and production method thereof |
| CN102958271A (en) * | 2011-08-17 | 2013-03-06 | 富士通电子零件有限公司 | Flexible printed circuit and touchscreen |
| TW201319905A (en) * | 2011-09-30 | 2013-05-16 | 3M Innovative Properties Co | Flexible touch sensor with fine pitch interconnect |
| CN103116433A (en) * | 2013-03-05 | 2013-05-22 | 左富强 | Capacitive touch screen of single layer glass structure or OGS for short and manufacturing technique thereof |
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2013
- 2013-09-07 CN CN201310405467XA patent/CN103472964A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1864124A (en) * | 2003-10-06 | 2006-11-15 | 3M创新有限公司 | Touch input sensing device |
| CN101248411A (en) * | 2005-10-17 | 2008-08-20 | 财团法人工业技术研究院 | Method for making a display with integrated touchscreen |
| CN101738774A (en) * | 2008-11-06 | 2010-06-16 | 北京海维元电子有限公司 | Ultrathin flexible liquid crystal display and manufacturing method thereof |
| US20120299638A1 (en) * | 2011-05-26 | 2012-11-29 | Lg Innotek Co., Ltd. | Touch Window |
| CN102958271A (en) * | 2011-08-17 | 2013-03-06 | 富士通电子零件有限公司 | Flexible printed circuit and touchscreen |
| TW201319905A (en) * | 2011-09-30 | 2013-05-16 | 3M Innovative Properties Co | Flexible touch sensor with fine pitch interconnect |
| CN102830876A (en) * | 2012-08-15 | 2012-12-19 | 南京汇金锦元光电材料有限公司 | Capacitive touch screen with flexible transparent conductive film and production method thereof |
| CN103116433A (en) * | 2013-03-05 | 2013-05-22 | 左富强 | Capacitive touch screen of single layer glass structure or OGS for short and manufacturing technique thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105320352A (en) * | 2014-07-31 | 2016-02-10 | 三星电子株式会社 | Flexible device and interfacing method thereof |
| US11068074B2 (en) | 2014-07-31 | 2021-07-20 | Samsung Electronics Co., Ltd. | Flexible device and interfacing method thereof |
| CN106227025A (en) * | 2016-09-27 | 2016-12-14 | 深圳市奋达科技股份有限公司 | The manufacture method of integral intelligent watch |
| CN106227025B (en) * | 2016-09-27 | 2018-05-18 | 深圳市奋达科技股份有限公司 | The manufacturing method of integral intelligent watch |
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Application publication date: 20131225 |