CN103465637A - Laser machine stand lead frame positioning mechanism - Google Patents
Laser machine stand lead frame positioning mechanism Download PDFInfo
- Publication number
- CN103465637A CN103465637A CN2012101876875A CN201210187687A CN103465637A CN 103465637 A CN103465637 A CN 103465637A CN 2012101876875 A CN2012101876875 A CN 2012101876875A CN 201210187687 A CN201210187687 A CN 201210187687A CN 103465637 A CN103465637 A CN 103465637A
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- China
- Prior art keywords
- lead frame
- positioning
- board
- detent mechanism
- machine stand
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Laser Beam Processing (AREA)
Abstract
The invention provides a laser machine stand lead frame positioning mechanism. The mechanism comprises a machine stand, a lead frame and a positioning mechanism. The positioning mechanism comprises a positioning pinch roller and a positioning pin. The positioning pinch roller is arranged on an upper surface of the machine stand. The positioning pin is arranged on an upper surface of a positioning bench A located in the machine stand. The positioning pin is vertically arranged with the upper surface of the machine stand. A top of the positioning pin is higher than the upper surface of the machine stand. A right side of the positioning bench A is arranged horizontally and a positioning bench B is also arranged. Based on the prior art, the positioning bench is added and is used to change the position of the positioning pin so that the position of the lead frame on a laser marking machine stand is changed. A situation that an excessive glue on the lead frame bears against the positioning pinch roller and the positioning pinch roller is in a slanting state so that positioning of the lead frame is not accurate and a product is not qualified is avoided.
Description
Technical field
The present invention relates to a kind of lead frame detent mechanism, especially a kind of board lead frame detent mechanism be applicable in semiconductor package process for radium-shine laser marking machine.
Background technology
As depicted in figs. 1 and 2; the lead frame detent mechanism of the radium-shine laser marking machine board of prior art only includes one group of positioning table and corresponding pilot pin; another location pinch roller for the lead frame location usually can be askew by the excessive glue top of the excessive glue of the frequent appearance on lead frame position, makes the lead frame location be forbidden and then cause product bad.
Summary of the invention
The purpose of this invention is to provide a kind of radium-shine board lead frame detent mechanism addressed the above problem.
Purpose of the present invention is achieved through the following technical solutions:
A kind of radium-shine board lead frame detent mechanism, comprise board, lead frame and detent mechanism, described detent mechanism comprises a location pinch roller and a pilot pin, described location pinch roller is arranged on the upper surface of described board, described pilot pin is arranged on the upper surface of the positioning table A that is positioned at described board inside, described pilot pin and vertical setting of described board upper surface, and the top of described pilot pin exceeds the upper surface of described board, a side horizontal level at described positioning table A, also be provided with positioning table B.
Further, on described positioning table A, be provided with the location needle tray, make being fixed on positioning table A of described pilot pin activity.
Further, be provided with equally the location needle tray on described positioning table B.Can make described pilot pin be arranged on positioning table B upper, thereby change the position of described lead frame on board.
Further, described detent mechanism comprises two groups of detent mechanisms of symmetrical setting, and every group of mechanism comprises a location pinch roller and a pilot pin.Every group of detent mechanism acts on respectively the support body two edges of described lead frame.
Beneficial effect of the present invention is mainly reflected in: by adding on the basis of existing technology a positioning table for changing the position of pilot pin, thereby the position of lead frame on radium-shine laser marking machine board changed, avoided the excessive glue on the lead frame to push up askew location pinch roller and make the lead frame location be forbidden to cause product bad.
The accompanying drawing explanation
Below in conjunction with accompanying drawing, technical solution of the present invention is described further:
Fig. 1 is the top view of the radium-shine board lead frame detent mechanism of prior art.
Fig. 2 is the cutaway view of the radium-shine board lead frame detent mechanism of prior art.
Fig. 3 is the top view of the radium-shine board lead frame of the present invention detent mechanism.
Fig. 4 is the cutaway view of the radium-shine board lead frame of the present invention detent mechanism.
Wherein
| 1 | |
2 | The |
3 | |
| 4 | |
5 | |
6 | |
| 7 | Glue overflows | ? | ? | ? | ? |
The specific embodiment
Refer to Fig. 2, the present invention includes board 1, lead frame, two groups of location pinch rollers 2 and two groups of pilot pins 3, location pinch roller 2 is arranged on the upper surface of board 1, the both sides of lead frame 6, pilot pin 3 is arranged on the upper surface of the positioning table A that is positioned at board 1 inside, positioning table B is arranged on positioning table A right side horizontal level, pilot pin 3 and vertical setting of board 1 upper surface, the top of pilot pin 3 exceeds the upper surface of board 1, its syringe needle, through the locating hole on lead frame, is positioned at lead frame on board 1 together with the pinch roller 2 of location.Owing to being provided with two positioning tables, can be according to the overflow position of different adjustment pilot pin 3 of glue position of lead frame, glue 7 askew location, the top pinch rollers 2 of avoiding overflowing.
The present invention still has multiple concrete embodiment, and all employings are equal to replacement or equivalent transformation and all technical schemes of forming, within all dropping on the scope of protection of present invention.
Claims (4)
1. a radium-shine board lead frame detent mechanism, comprise board (1), lead frame and detent mechanism, described detent mechanism comprises a location pinch roller (2) and a pilot pin (3), described location pinch roller (2) is arranged on the upper surface of described board (1), described pilot pin (3) is arranged on and is positioned at the inner positioning table A(4 of described board (1)) upper surface, described pilot pin (3) and vertical setting of described board (1) upper surface, the top of described pilot pin (3) exceeds the upper surface of described board (1), it is characterized in that: at described positioning table A(4) a side horizontal level, also be provided with positioning table B(5).
2. radium-shine board lead frame detent mechanism according to claim 1 is characterized in that: be provided with the location needle tray described positioning table A(4), make described pilot pin (3) movable be fixed on positioning table A(4) on.
3. radium-shine board lead frame detent mechanism according to claim 2, is characterized in that: described positioning table B(5), be provided with equally the location needle tray.
4. radium-shine board lead frame detent mechanism according to claim 3, it is characterized in that: described detent mechanism comprises two groups of detent mechanisms of symmetrical setting, every group of mechanism comprises a location pinch roller (2) and a pilot pin (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101876875A CN103465637A (en) | 2012-06-08 | 2012-06-08 | Laser machine stand lead frame positioning mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101876875A CN103465637A (en) | 2012-06-08 | 2012-06-08 | Laser machine stand lead frame positioning mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103465637A true CN103465637A (en) | 2013-12-25 |
Family
ID=49790781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101876875A Pending CN103465637A (en) | 2012-06-08 | 2012-06-08 | Laser machine stand lead frame positioning mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103465637A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5838361A (en) * | 1996-01-11 | 1998-11-17 | Micron Technology, Inc. | Laser marking techniques |
| CN2815615Y (en) * | 2005-08-24 | 2006-09-13 | 上海晨兴电子科技有限公司 | Assembling tool for assembling touch screen and iron frame support |
| CN101661896A (en) * | 2008-08-25 | 2010-03-03 | 南茂科技股份有限公司 | Overflow glue removing mechanism and method thereof |
| CN201440406U (en) * | 2009-05-05 | 2010-04-21 | 坤远科技股份有限公司 | Lead frame member and inking rework tool thereof |
| CN201449997U (en) * | 2009-06-30 | 2010-05-05 | 佛山市联动科技实业有限公司 | Full automatic ic marking machine |
| CN201881651U (en) * | 2010-10-19 | 2011-06-29 | 格兰达技术（深圳）有限公司 | Pin type locating device for high-precision locating system of marking machine stock bar |
| CN102380832A (en) * | 2010-08-31 | 2012-03-21 | 鸿富锦精密工业（深圳）有限公司 | Sliding positioning mechanism |
| CN102456536A (en) * | 2010-10-19 | 2012-05-16 | 格兰达技术（深圳）有限公司 | High-accuracy position system for bar of marking machine |
| CN202702898U (en) * | 2012-06-08 | 2013-01-30 | 矽品科技（苏州）有限公司 | Laser cabinet lead rack positioning mechanism |
-
2012
- 2012-06-08 CN CN2012101876875A patent/CN103465637A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5838361A (en) * | 1996-01-11 | 1998-11-17 | Micron Technology, Inc. | Laser marking techniques |
| CN2815615Y (en) * | 2005-08-24 | 2006-09-13 | 上海晨兴电子科技有限公司 | Assembling tool for assembling touch screen and iron frame support |
| CN101661896A (en) * | 2008-08-25 | 2010-03-03 | 南茂科技股份有限公司 | Overflow glue removing mechanism and method thereof |
| CN201440406U (en) * | 2009-05-05 | 2010-04-21 | 坤远科技股份有限公司 | Lead frame member and inking rework tool thereof |
| CN201449997U (en) * | 2009-06-30 | 2010-05-05 | 佛山市联动科技实业有限公司 | Full automatic ic marking machine |
| CN102380832A (en) * | 2010-08-31 | 2012-03-21 | 鸿富锦精密工业（深圳）有限公司 | Sliding positioning mechanism |
| CN201881651U (en) * | 2010-10-19 | 2011-06-29 | 格兰达技术（深圳）有限公司 | Pin type locating device for high-precision locating system of marking machine stock bar |
| CN102456536A (en) * | 2010-10-19 | 2012-05-16 | 格兰达技术（深圳）有限公司 | High-accuracy position system for bar of marking machine |
| CN202702898U (en) * | 2012-06-08 | 2013-01-30 | 矽品科技（苏州）有限公司 | Laser cabinet lead rack positioning mechanism |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131225 |