CN103317200A - Welding method and jig for adhering lead on circuit board - Google Patents
Welding method and jig for adhering lead on circuit board Download PDFInfo
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- CN103317200A CN103317200A CN 201310245947 CN201310245947A CN103317200A CN 103317200 A CN103317200 A CN 103317200A CN 201310245947 CN201310245947 CN 201310245947 CN 201310245947 A CN201310245947 A CN 201310245947A CN 103317200 A CN103317200 A CN 103317200A
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- lead
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- wiring board
- circuit board
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Abstract
The invention discloses a welding method and a jig for adhering a lead on a circuit board. The welding method comprises the following steps of: step 1, preparing a carrier plate, and forming a plurality of circuit board grooves used for the placement of the circuit board and a plurality of lead grooves for the placement of leads in the surface of the carrier plate; step 2, fixing the circuit board in the circuit board grooves of the carrier plate; step 3, adding solder paste of a welding disk for pre-welding the leads on the circuit board until the amount of the solder paste is satisfied with the requirements of full welding; step 4, placing the leads in the lead grooves of the carrier plate; enabling the welding ends of the leads to be in contact with the welding disk for pre-welding the leads on the circuit board; step 5, carrying out reflow soldering for the carrier plate so as to weld the leads on the circuit board. The welding method for adhering the lead on the circuit board and a jig applicable for the method, disclosed by the invention, achieve high efficiency and easy quality control as manual welding is replaced by machine welding.
Description
Technical field
The present invention relates to welding technology field, in particular, relate to a kind of welding method and welding fixture that mounts lead-in wire at wiring board.
Background technology
Along with the development of modern science and technology, people are growing to the demand of electronic equipment, so the automatization level of electronic product is also more and more higher.In the past, the welding that mounts lead-in wire on the wiring board relies on manually mostly to be finished with the flatiron welding, and production efficiency is low, and difficult quality is control.
Summary of the invention
The present invention provides the welding method and the tool that mount lead-in wire on a kind of wiring board for solving the technical problem that exists in the above-mentioned prior art, replaces artificial welding with the machine welding, the efficient height, and quality is controlled easily.
For achieving the above object, the technical solution adopted in the present invention is as follows:
Mount the welding method of lead-in wire on a kind of wiring board, comprise that step is as follows:
Step 1: prepare a support plate, several lead-in wire grooves that is used for placing the circuit board slot of wiring board and places lead-in wire are offered on the support plate surface;
Step 2: wiring board is fixed in the circuit board slot on the support plate;
Step 3: with the tin cream dosage of the pad of pre-welding lead-in wire on the wiring board, to satisfy abundant requirement of welding;
Step 4: in the lead-in wire groove of lead placement on support plate, the pad of pre-welding lead-in wire on the welding ends of the lead-in wire contact wiring board;
Step 5: with support plate by Reflow Soldering, thereby with wire bonds in the circuit board.
The circuit board slot of described step 1 is through-hole groove, described step 2 with the method that wiring board is fixed in the circuit board slot on the support plate is: the lower surface at support plate is placed a vacuum cup, vacuum cup is against in the circuit board slot at the projection that the position of corresponding each circuit board slot arranges, and by vacuumizing wiring board is fixed in the circuit board slot.
The circuit board slot of described step 1 is through hole, and described step 2 is: be provided with jump ring at the groove inwall wiring board is fixed.
Have platform in the circuit board slot of described step 1, described step 2 method is: be placed on the platform wiring board also fixing.
The method of described step 3 is: cover the support plate surface with a steel mesh, offer through hole at the wiring board pad locations place of corresponding pre-welding lead-in wire on the steel mesh; Carry out the paste solder printing operation at steel mesh then.
The lead-in wire groove of described step 1 is for rising as high as the banks, the method of described step 4 is: will go between and arch upward near the part bending of termination, the wire bonds termination is overlapped on the wiring board pad naturally, makes the spacing that exists between the pad on wire bonds termination and the wiring board with the influence that overcomes owing to the lead-in wire external insulation layer.
The lead-in wire groove of described step 1 is skewed slot, the inclination angle of skewed slot arranges according to the spacing size that exists between the pad on wire bonds termination and the wiring board, the method of described step 4 is: in described skewed slot, the wire bonds termination is overlapped on the wiring board pad naturally with lead placement.
The groove width of described lead-in wire groove is than the big 0.2 ~ 0.5mm in line footpath of lead-in wire.
After described wiring board is placed in the circuit board slot, PCB surface apart from the distance of support plate upper surface less than 1mm.
Mount the welding fixture of lead-in wire on a kind of wiring board, be applicable to the welding method that mounts lead-in wire on arbitrary above-mentioned wiring board, comprise the support plate that offers several circuit board slots and lead-in wire groove on it.
Beneficial effect of the present invention is as follows:
Welding method of the present invention and welding fixture are applicable to the situation of welding lead on all SMT elements.Adopt the automation mode, having realized going between pasting is welded on the wiring board, has overcome of poor quality, the inefficient problem that the manual welding lead-in wire brings, and can carry out large-scale industrial production.
Description of drawings
Fig. 1 is the flow chart of welding method disclosed by the invention;
Fig. 2 is the STRUCTURE DECOMPOSITION figure of welding fixture one embodiment disclosed by the invention;
Fig. 3 is the structural representation of support plate among Fig. 2;
Fig. 4 be among Fig. 2 lead placement the lead-in wire groove structural representation.
The specific embodiment
Below by the drawings and specific embodiments the welding method and the welding fixture that mount lead-in wire on the wiring board provided by the present invention are done a detailed explanation.
Shown in Figure 1 is welding method flow chart provided by the present invention, and concrete steps are as follows:
Step 1: prepare a support plate, several lead-in wire grooves that is used for placing the circuit board slot of wiring board and places lead-in wire are offered on the support plate surface;
Step 2: wiring board is fixed in the circuit board slot on the support plate;
Step 3: with the tin cream dosage of the pad of pre-welding lead-in wire on the wiring board, to satisfy abundant requirement of welding;
Step 4: in the lead-in wire groove of lead placement on support plate, the pad of pre-welding lead-in wire on the welding ends of the lead-in wire contact wiring board;
Step 5: with support plate by Reflow Soldering, thereby with wire bonds in the circuit board.
Fig. 2 is the STRUCTURE DECOMPOSITION figure of welding fixture one embodiment disclosed by the invention.The welding fixture of this embodiment is applicable to the disclosed welding method of Fig. 1.Concrete structure is: have certain thickness support plate 1, support plate 1 surface evenly offers several penetrating circuit board slot 1-1 and non-penetrating lead-in wire groove 1-2.Circuit board slot 1-1 and lead-in wire groove 1-2 communicate carrying board structure schematic diagram as shown in Figure 3.The shape of circuit board slot 1-1 and size match with wiring board 4.Wiring board 4 is placed among the circuit board slot 1-1, and the degree of depth of placement is no more than 1mm place, support plate surface for the wiring board upper surface.One vacuum cup 5 is installed below support plate 1, and vacuum cup 5 surfaces are provided with a plurality of projection 5-1 in the position of corresponding each circuit board slot 1-1, have a cavity in the middle of the vacuum cup 5, seal below by vacuum cup base 5-2.With the projection 5-1 on the vacuum cup 5 and circuit board slot 1-1 corresponding installing one by one, by the Pneumatic quick connector 5-3 on the vacuum cup 5 cavity is evacuated, thereby wiring board 4 is fixed among the circuit board slot 1-1.Cover a steel mesh 7 above support plate 1, the pad locations that pre-welding goes between on the corresponding line plate 4 on the steel mesh 7 offers corresponding through hole 7-1, among the embodiment shown in Figure 2, offers the through hole of corresponding welding lead and welding SMT element on the steel mesh 7.Carry out paste solder printing at steel mesh 1 then, tin cream adheres in the circuit board the respective pad by through hole 7-1.Remove steel mesh 7 and vacuum cup 5, will go between 8 is placed among the lead-in wire groove 1-2, and makes the pad 4-1 on contact wire road, the welding termination plate of lead-in wire 8.Owing to the thickness of lead-in wire external insulation layer and the influence of lead-in wire nature distortion, the spacing of 0.15 ~ 0.5mm is arranged between wire bonds termination and the pad, though can weld like this, solder joint is defective.For addressing this problem, as shown in Figure 4, adopt and before lead-in wire 8 is placed, do the shaping processing, upwards slightly do crooked in the part near the termination lead-in wire 8, can make being overlapped on the pad of welding termination nature like this, and lead-in wire 8 can be placed among the lead-in wire groove 1-2, as shown in Figure 4.In order not make lead-in wire moving in the translation of lead-in wire trough inner water, also convenient in order to place lead-in wire simultaneously, the groove width of lead-in wire groove 1-2 is than the big 0.2 ~ 0.5mm in line footpath of lead-in wire.At last, by Reflow Soldering, will go between 8 is welded on the wiring board 4 with support plate 1, and solder joint is smooth mellow and full, and spot size meets the requirements.Also be provided with air vent 1-3 on the support plate 1, air vent 1-3 can make the heat of support plate surrounding environment even.
Shown in Figure 2 is one embodiment of the present of invention, under the prerequisite that does not break away from the inventive method, is applicable to that the tool of the inventive method can have various deformation and conversion, but all due in protection scope of the present invention.For example, above-described embodiment is to adopt vacuum cup that wiring board is fixed in the circuit board slot, also can not pass through vacuum cup, adopts jump ring or buckle are installed in the circuit board slot, and wiring board is fixed.Perhaps in the circuit board slot platform is set, perhaps the circuit board slot is non through hole, is placed on wiring board on the platform or is placed on bottom land and fix, and can realize that all wiring board is fixing.Above-described embodiment is to adopt steel mesh to carry out paste solder printing so that the tin cream amount abundance on the wiring board pad also can not adopt steel mesh paste solder printing mode, is that pad adds tin cream and adopt the method for spot welding.The lead-in wire groove is to rise as high as the banks in above-described embodiment, and the groove that also can will go between according to the thickness of lead-in wire external insulation layer is offered and is skewed slot, and like this, lead placement does not need shaping in the lead-in wire groove, and lead ends just can be overlapped on the pad naturally.
Claims (10)
1. mount the welding method of lead-in wire on the wiring board, comprise that step is as follows:
Step 1: prepare a support plate, several lead-in wire grooves that is used for placing the circuit board slot of wiring board and places lead-in wire are offered on the support plate surface;
Step 2: wiring board is fixed in the circuit board slot on the support plate;
Step 3: with the tin cream dosage of the pad of pre-welding lead-in wire on the wiring board, to satisfy abundant requirement of welding;
Step 4: in the lead-in wire groove of lead placement on support plate, the pad of pre-welding lead-in wire on the welding ends of the lead-in wire contact wiring board;
Step 5: with support plate by Reflow Soldering, thereby with wire bonds in the circuit board.
2. mount the welding method of lead-in wire on the wiring board according to claim 1, it is characterized in that, the circuit board slot of described step 1 is through-hole groove, the method of described step 2 is: the lower surface at support plate is placed a vacuum cup, vacuum cup arranges projection in the position of corresponding each circuit board slot and is against in the circuit board slot, by vacuumizing wiring board is fixed in the circuit board slot.
3. mount the welding method of lead-in wire on the wiring board according to claim 2, it is characterized in that, the circuit board slot of described step 1 is through hole, and the method for described step 2 is: at circuit board slot inwall jump ring is set wiring board is fixed.
4. mount the welding method of lead-in wire on the wiring board according to claim 1, it is characterized in that, in the circuit board slot of described step 1 platform is set, the method for described step 2 is: be placed on the platform wiring board fixing.
5. mount the welding method of lead-in wire on the wiring board according to claim 1, it is characterized in that, the method of described step 3 is: cover the support plate surface with a steel mesh, offer through hole at the wiring board pad locations place of corresponding pre-welding lead-in wire on the steel mesh, carry out the paste solder printing operation at steel mesh then, be the tin cream dosage of pad.
6. mount the welding method of lead-in wire on the wiring board according to claim 1, it is characterized in that, the lead-in wire groove of described step 1 is for rising as high as the banks, the method of described step 4 is: will go between and arch upward near the part bending of termination, the wire bonds termination is overlapped on the wiring board pad naturally, makes the spacing that exists between the pad on wire bonds termination and the wiring board with the influence that overcomes owing to lead-in wire external insulation layer thickness.
7. mount the welding method of lead-in wire on the wiring board according to claim 1, it is characterized in that, the lead-in wire groove of described step 1 is skewed slot, the inclination angle of skewed slot arranges according to the spacing size that exists between the pad on wire bonds termination and the wiring board, the method of described step 4 is: in described skewed slot, the wire bonds termination is overlapped on the wiring board pad naturally with lead placement.
8. mount the welding method of lead-in wire on the wiring board according to claim 1, it is characterized in that, the groove width of described lead-in wire groove is than the big 0.2 ~ 0.5mm in line footpath of lead-in wire.
9. mount the welding method of lead-in wire on the wiring board according to claim 1, it is characterized in that, after described wiring board is placed in the circuit board slot, PCB surface apart from the distance of support plate upper surface less than 1mm.
10. mount the tool of lead-in wire on the wiring board, be applicable to the welding method that mounts lead-in wire in the claim 1 ~ 9 on arbitrary described wiring board, comprise the support plate that offers several circuit board slots and lead-in wire groove on it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310245947 CN103317200A (en) | 2013-06-20 | 2013-06-20 | Welding method and jig for adhering lead on circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310245947 CN103317200A (en) | 2013-06-20 | 2013-06-20 | Welding method and jig for adhering lead on circuit board |
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| CN103317200A true CN103317200A (en) | 2013-09-25 |
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| CN 201310245947 Pending CN103317200A (en) | 2013-06-20 | 2013-06-20 | Welding method and jig for adhering lead on circuit board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105215600A (en) * | 2015-10-14 | 2016-01-06 | 华东光电集成器件研究所 | A kind of discrete lead apparatus for welding and positioning |
| CN105374553A (en) * | 2015-12-02 | 2016-03-02 | 益阳市格林电子元件有限公司 | Sucker-type chip capacitor |
| CN106914671A (en) * | 2017-03-13 | 2017-07-04 | 南京日托光伏科技股份有限公司 | A kind of MWT photovoltaic modulies draw welding method |
| CN107592753A (en) * | 2017-08-14 | 2018-01-16 | 信利半导体有限公司 | Localization tool, welding method and the lamp bar preparation method of a kind of wiring board and bending pin |
| CN109936928A (en) * | 2017-12-18 | 2019-06-25 | 东莞文殊电子科技有限公司 | A kind of pcb board welding method |
| CN112045274A (en) * | 2020-09-28 | 2020-12-08 | 中国电子科技集团公司第五十四研究所 | Carbon brush welding tool and carbon brush welding method |
| CN113070541A (en) * | 2021-04-01 | 2021-07-06 | 安徽同佳电子科技有限公司 | Positioning mechanism for tin coating of motor coil end |
| CN114309855A (en) * | 2022-03-08 | 2022-04-12 | 深圳市捷豹自动化设备有限公司 | Vacuum welding system |
-
2013
- 2013-06-20 CN CN 201310245947 patent/CN103317200A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105215600A (en) * | 2015-10-14 | 2016-01-06 | 华东光电集成器件研究所 | A kind of discrete lead apparatus for welding and positioning |
| CN105374553A (en) * | 2015-12-02 | 2016-03-02 | 益阳市格林电子元件有限公司 | Sucker-type chip capacitor |
| CN105374553B (en) * | 2015-12-02 | 2020-11-17 | 益阳市格林电子元件有限公司 | Sucking disc formula paster condenser |
| CN106914671A (en) * | 2017-03-13 | 2017-07-04 | 南京日托光伏科技股份有限公司 | A kind of MWT photovoltaic modulies draw welding method |
| CN107592753A (en) * | 2017-08-14 | 2018-01-16 | 信利半导体有限公司 | Localization tool, welding method and the lamp bar preparation method of a kind of wiring board and bending pin |
| CN109936928A (en) * | 2017-12-18 | 2019-06-25 | 东莞文殊电子科技有限公司 | A kind of pcb board welding method |
| CN112045274A (en) * | 2020-09-28 | 2020-12-08 | 中国电子科技集团公司第五十四研究所 | Carbon brush welding tool and carbon brush welding method |
| CN113070541A (en) * | 2021-04-01 | 2021-07-06 | 安徽同佳电子科技有限公司 | Positioning mechanism for tin coating of motor coil end |
| CN114309855A (en) * | 2022-03-08 | 2022-04-12 | 深圳市捷豹自动化设备有限公司 | Vacuum welding system |
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Application publication date: 20130925 |
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